Class / Patent application number | Description | Number of patent applications / Date published |
324755040 | Force absorption | 57 |
20110128026 | HELICAL SENSOR FOR TESTING A COMPOSITE MEDIUM - A sensor is provided for testing a composite medium. The sensor includes a tube and three or more conductors which are wound in a continuously parallel helix around the tube such that the conductors are interleaved. The tube is non-porous and electrically insulative. Both the proximal end and the distal end of the tube are open. Each turn of each conductor is equally spaced from the adjoining turns of the other conductors, and the conductors have a common helical length. The sensor can also include a first cap which seals the proximal end of the tube and a second cap which seals the distal end of the tube such that the interior of the tube is always filled with air. | 06-02-2011 |
20120038382 | PROBE AND METHOD OF MANUFACTURING SAME - A probe includes a plurality of boards each of which has a plurality of magnets, a plurality of the boards include a first board and a second board laid on the first board, a plurality of the magnets include a plurality of first magnets provided with the first board and a plurality of second magnets provided with the second board and arranged so as to respectively face a plurality of the first magnets, and the first magnet and the second magnet facing each other are provided so that mutually different magnetic poles face each other. | 02-16-2012 |
20130249583 | MULTIPLE RIGID CONTACT SOLUTION FOR IC TESTING - A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body. | 09-26-2013 |
20130265075 | CONTACT AND CONNECTOR - A contact for electrically connecting two electric components, includes a first end portion which contacts an object to be contacted; a second end portion for passing a signal from the first end portion; an elastic portion which connects the first end portion with the second end portion while pushing the first end portion and the second end portion in an opposing direction, the elastic portion having a meandering shape from the first end portion to the second end portion and having a curved/bent structure provided with an open portion where a width of the open portion is different from the maximum inner width of the curved/bent structure of the elastic portion when seen from the opposing direction; and a housing portion which surrounds the elastic portion, wherein the first end portion, the second end portion, the elastic portion and the housing are formed by bending a single conductive plate. | 10-10-2013 |
20140043055 | CONTACT PROBE AND PROBE CARD - A contact probe electrically connects the tester side and an electrode pad of a circuit to be tested. This contact probe has a mounting portion on a base end portion mounted on a probe card, a contact portion on a distal end portion brought into contact with the electrode pad, and an arm portion between them elastically supporting the contact portion. The contact portion is provided on a lower end portion of a base portion integrally mounted on a distal end portion of the arm portion. The arm portion has a one-side arm piece supporting the base portion and allowing vertical movement of the base portion and the other-side arm piece supporting the base portion and adjusting an inclination angle of the base portion to reduce a scrub amount of the contact portion. The probe card uses the above-described contact probe. | 02-13-2014 |
20140218062 | CONTACTOR - A contactor including a bellows body, a fixed portion connected to one end of the bellows body, a movable portion connected to the other end of the bellows body, and a movable touch piece that extending from at least one side edge along the bellows body, where the movable portion is configured to be depressed to compress the bellows body and to bring a movable contact point, located at a free end of the movable touch piece, into contact with the fixed portion. | 08-07-2014 |
20140333337 | CURRENT APPLYING DEVICE - A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact | 11-13-2014 |
20140340105 | TEST ASSEMBLY - A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, an intermediate dielectric board, an intermediate circuit board, a plurality of intermediate conductive elements and a plurality of test probes. The main circuit board includes a surface and a plurality of pads disposed on the surface. The intermediate dielectric board is detachably disposed on the surface of the main circuit board and includes a plurality of through holes. The intermediate circuit board is disposed on the intermediated dielectric board and includes a plurality of first pads, a plurality of second pads, a first surface and a second surface opposite to the first surface. The intermediate conductive elements are disposed in the through holes, respectively. Each of the intermediate conductive elements electrically connects one of the pads of the main circuit board and one of the first pads of the intermediate circuit board. The test probes are disposed on the second surface of the intermediate circuit board and respectively electrically connected to the second pads of the intermediate circuit board. Each of the test probes is electrically connected to the main circuit board through the intermediate circuit board and one of the intermediated conductive elements. | 11-20-2014 |
20150355235 | PROBE AND METHOD FOR MANUFACTURING THE PROBE - A probe for a probe head having lower and upper dies includes a main portion, a conductive portion stacked on at least a part of the main portion, an attachment layer covering the main portion and the conductive portion, a skin effect layer covering the attachment layer, and a stopping portion for being abutted against the lower or upper die. The main portion includes a first material. The conductive portion includes a second material. The skin effect layer includes a third material. The electrical conductivity of the third material is greater than that of the second material. The electrical conductivity of the second material is greater than that of the first material. The hardness of the first material is greater than that of the second material, and also greater than that of the third material. | 12-10-2015 |
20160109481 | Cantilever Microprobes For Contacting Electronic Components - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 04-21-2016 |
324755050 | Spring | 45 |
20110031990 | Socketless Integrated Circuit Contact Connector - A socketless integrated circuit (IC) contact connector is provided with an electrically conductive support post. An electrically conductive spring has a first end connected to the post, and a second end. An electrically conductive first wire has a first end connected to the spring second end, and a second end. An electrically conductive loop with a loop neck is connected to the first wire second end. Typically, the loop is formed in the first wire second end. The spring and loop work in cooperation to engage an IC contact. | 02-10-2011 |
20110050263 | PROBE AND METHOD OF MANUFACTURING PROBE - A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a sheet-metal plate which is bent multiple times, the sheet-metal plate having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together. | 03-03-2011 |
20110057676 | UNIVERSAL SPRING CONTACT PIN AND IC TEST SOCKET THEREFOR - A universal spring contact pin for use in an IC test Socket includes a depressible probe member at one end and a fixed probe member at the other end. The fixed probe member preferably has a projection length chosen to allow z-axis loading of different surface mount package types within the same test socket. It also can have a relatively large tip angle which preferably terminates at a relatively sharp termination point. Preferably, the tip angle is about 90 degrees and the radius of the termination point of the tip is about 0.001 inches (0.0254 millimeters) or less. The large tip angle on the contact pin's fixed probe member provides the pin with a robust probe end that operates reliably over a large number of test cycles, is better adapted for effective use with different surface mount chip packages, and better supports a sharp tip radius. A sharp tip radius will, in turn, provide for better penetration of oxide coatings and/or foreign material on the leads of the chip packages. A test socket can be provided for the universal spring contact pins, which can include an interface wall configuration for retaining the contact pins in a z-axis alignment and for improving the signal performance of the socket at high frequencies. | 03-10-2011 |
20110169516 | PROBE ELEMENT HAVING A SUBSTANTIALLY ZERO STIFFNESS AND APPLICATIONS THEREOF - A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to produce a net stiffness of the tip relative to the base over the predefined displacement range. | 07-14-2011 |
20110175636 | TERMINAL FOR FLAT TEST PROBE - A terminal end for a flat test probe having tapered cam surfaces providing a lead-in angle on the tail of the terminal end which extend to a sharp rear angle to engage detents or projections within a receptacle. The tapered cam surfaces and shape rear angles allow the probe to be inserted into the receptacle with minimal force to retain the flat test probe within the receptacle. | 07-21-2011 |
20110221464 | CONTACT PROBE AND SOCKET, AND MANUFACTURING METHOD OF TUBE PLUNGER AND CONTACT PROBE - A contact probe has a tubular plunger which is not made by press working and rounding so that quality control of gold plating or the like is not necessary or not difficult. The tubular plunger is made of a metal tube with a tip that has a reduced outside diameter and notches spaced from the tip. The tip is bent inside the tube and an outer surface of the metal tube, from a bent part to a bottom side, with a small diameter defining a convex part having a larger diameter. The small diameter part of the metal tube is cut off at the end of the small diameter. | 09-15-2011 |
20110241715 | High Frequency Vertical Spring Probe - A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment. | 10-06-2011 |
20110248736 | PROBE PIN AND AN IC SOCKET WITH THE SAME - The probe pin includes a plunger formed of a sheet metal, and a coil spring unit formed of a metal wire and configured to hold the plunger thereon. In a developed state, the plunger includes first and second portions each of which has an upper contact strip, a wide portion, and a lower contact strip, and which are connected to each other via the wide portions formed in the first and second portions. The plunger is formed in a united manner by folding together the first and second portions along a boundary of the wide portions formed therein to thereby bring at least the wide portions into tight contact with each other. | 10-13-2011 |
20110298485 | SEMICONDUCTOR DEVICE TEST METHOD AND APPARATUS, AND SEMICONDUCTOR DEVICE - A method of testing a semiconductor device includes a conductive foreign matter test step of measuring the resistance value between the first and second conductive patterns to determine whether conductive foreign matter is present between the first and second conductive patterns, a first open circuit test step of measuring the resistance value between two points on the first conductive pattern to determine whether there is an open circuit in the first conductive pattern, and a second open circuit test step of measuring the resistance value between two points on the second conductive pattern to determine whether there is an open circuit in the second conductive pattern. The measurement of the resistance value in each of the test steps is accomplished by pressing probes vertically against the first conductive pattern or the second conductive pattern or both. | 12-08-2011 |
20120001650 | Test Probe - A test probe is configured to provide conductive contact with a surface on application of the probe to the surface. The probe includes a probe body having a proximal and distal end, a probe tip located at the distal end of the probe body, the probe being configured such that, when the probe tip is applied to the surface, the probe tip is moved to rotate about its axis, whereby the shaft tip can rotatably remove oxidation and/or contamination debris from between the shaft tip and the surface. | 01-05-2012 |
20120019277 | SPRING WIRE ROD, CONTACT PROBE, AND PROBE UNIT - A spring wire rod includes a wire core that is made of a conductive material having an electrical resistivity of equal to or lower than 5.00×10 | 01-26-2012 |
20120105089 | SEMICONDUCTOR PACKAGE HAVING TEST PADS ON TOP AND BOTTOM SUBSTRATE SURFACES AND METHOD OF TESTING SAME - A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto. | 05-03-2012 |
20120105090 | PROBE DEVICE FOR TESTING - The present invention relates to a probe device for testing a semiconductor chip, and has the aim of providing a probe device for testing with higher test reliability through an improved structure that enables test current to flow safely, the probe device including a barrel open at the top and bottom thereof and a probe projection formed on a top end to contact a connection terminal of a semiconductor chip, an upper plunger having a lower portion housed in an upper portion of the barrel, and a lower plunger having an upper portion housed in a lower portion of the barrel, wherein a metal ball contained in cylindrical silicon to form a conductive silicon portion that exhibits conductivity and housed inside the band electrically connects the upper plunger and the lower plunger and resiliently supports the downward pressure transferred to the upper plunger during the testing of a semiconductor chip, such that the conductive silicon portion containing the metal ball for exhibiting conductivity and inserted in the barrel resiliently supports the upper plunger during a testing process, thus enabling a test current to flow safely along the conductive silicon portion and improving test reliability. | 05-03-2012 |
20120187971 | HIGH-FREQUENCY VERTICAL SPRING PROBE CARD STRUCTURE - The invention provides a high-frequency vertical spring probe card structure including a plurality of probes. Each of the probes includes at least one conducting layer and at least one insulating layer. The conducting layer includes a first contact end and a second contact end used for electrically contacting an external component while the probe is compressed and includes a probe body including at least one plate portion and at least one resilient portion connected to each other. The plate portion is used for supporting deformation of the resilient portion while the resilient portion is compressed vertically. The insulating layer includes at least one plate member tightly attached to the plate portion of the conducting layer correspondingly. The probe structure of the invention is simple and can be formed as multi-layer stack structure by electroplating through Lithographie GaVanoformung Abformung (LIGA) technology. | 07-26-2012 |
20120249174 | CONTACT PROBE AND SEMICONDUCTOR DEVICE SOCKET INCLUDING CONTACT PROBE - A contact probe having a plunger; a top contacting member which is provided at a tip end of the plunger and is brought into contact with an electrode of a semiconductor device; a bottom contacting member which is brought into contact with an electrode of a testing board; and an elastic member for urging the top contacting member and the bottom contacting member in opposite directions away from each other. The plunger is formed into a cylindrical shape and includes a through-hole which penetrates through the plunger in an axial direction thereof. The top contacting member includes a plurality of mountain-shaped sharp portions at a tip end thereof, and each of the sharp portions is asymmetrical with respect to a straight line that passes through a peak of the sharp portion and extends along an axial direction of the plunger, and is bent toward a center line of the plunger. | 10-04-2012 |
20120268154 | TESTING JIG FOR POGO PIN CONNECTOR - A testing jig of a pogo pin connector for testing a connection between at least one pogo pin and an electrical plug is disclosed. The testing jig includes a first support element, a second support element, and a platform. The first support element has a first groove and at least one opening defined therein. The second support element has a second groove corresponding to the first groove for receiving the electrical plug. The platform is disposed below the first support element, and at least one receiving hole is defined in the platform. The at least one pogo pin is disposed in the at least one receiving hole and exposed in the first groove through the at least one opening. The pogo pin is configured in various tilt angles through the platform with the opening for solving high cost of various mold developments. | 10-25-2012 |
20120313659 | Probe Card for Probing Integrated Circuits - An apparatus includes a metal housing, and a pogo pin penetrating through the metal housing. The pogo pin has a first end extending out of a first surface of the metal housing, and a second end extending out of a second surface of the metal housing, with the first and the second surfaces being opposite surfaces of the metal housing. A membrane is attached to the metal housing, wherein the membrane includes a metal line embedded therein. A metal pad is in physical contact with the pogo pin, wherein at least a portion of the metal pad is inside the membrane. | 12-13-2012 |
20130009658 | INSPECTION JIG AND CONTACT - In an inspection jig ( | 01-10-2013 |
20130049785 | INSPECTION DEVICE FOR GLASS SUBSTRATE - Disclosed is an inspection device for a glass substrate, comprising at least one probe, a holder, a stretch controller and a control circuit. The probe is installed on the stretch controller, the stretch controller is employed to stretch the probe out of the holder as an electrical signal is received; and to retract the probe backward in the holder as the electrical signal stops. The present invention promotes the inspection efficiency for the glass substrate. | 02-28-2013 |
20130057309 | MANUFACTURING METHOD FOR CONTACT FOR CURRENT INSPECTION JIG, CONTACT FOR CURRENT INSPECTION JIG MANUFACTURED USING SAID METHOD, AND CURRENT INSPECTION JIG PROVIDED WITH SAID CONTACT - Disclosed is a manufacturing method which enables manufacturing of an ultra-fine, thin contact for current inspection jigs. After a gold or gold alloy plating layer is formed, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer. | 03-07-2013 |
20130069684 | PROBE FOR INSPECTING ELECTRONIC COMPONENT - A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component. | 03-21-2013 |
20130099814 | CONTACT PROBE AND PROBE UNIT - A contact probe includes a conductive first plunger including, on a same axis, a distal end portion, a flange portion, a boss portion, and a base end portion, a conductive second plunger including, on the same axis, a second distal end portion and a boss portion, and a coil spring including a coarsely wound portion formed by winding at a predetermined pitch with an inner diameter equal to or larger than a diameter of the boss portion of the first plunger and a tightly wound portion formed by tightly winding with an inner diameter substantially equal to a diameter of the boss portion of the second plunger, so that the first plunger and the second plunger are connected to each other on the same axis. | 04-25-2013 |
20130207682 | PROBE PIN AND METHOD OF MANUFACTURING THE SAME - Disclosed are a spring-type probe pin having upper and lower contacts, and a manufacturing method thereof. The spring-type probe pin includes: cylindrical upper and lower sleeves having upper and lower grounded portions, respectively, in which one of the sleeves moves to be guided into the other; and a shock-absorbing operation unit provided between the upper and lower sleeves and containing a pair of shock-absorbing springs having a spiral spring form, which are connected to each other in such a manner that a turn of the upper shock-absorbing spring deviates from a turn of the lower shock-absorbing spring, in which the shock-absorbing operation unit performs an elastic shock-absorbing operation up to a position where the upper and lower shock-absorbing springs overlap each other. The cylindrical upper and lower sleeves and the shock-absorbing operation unit are integrally formed by using a press forming process. | 08-15-2013 |
20130285691 | HIGH-FREQUENCY TEST PROBE DEVICE COMPRISING CENTERING PORTION - A high-frequency test probe device comprising a contact section ( | 10-31-2013 |
20140028339 | SPRING ASSEMBLY AND TEST SOCKET USING THE SAME - Spring assemblies and a test socket using the spring assemblies. The spring assemblies are used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device by contacting the lead terminals and the test terminals, and include: first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; and second springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled, which have outer diameters narrower than inner diameters of the first springs, and are inserted into the first springs. Accordingly, electric resistances and inductances of two spring assemblies coiled in a spiral are reduced to improve electricity transmission characteristic. A height of a test socket is easily adjusted using spring assemblies having desired lengths. Also, since only plating is performed on the springs to form the spring assemblies, the spring assemblies are formed at a very low cost and have a wide range of applications. | 01-30-2014 |
20140077832 | TEST AND CONNECTION APPARATUS ARRANGEMENT, AND CONNECTION APPARATUS - A testing arrangement is provided for testing the electrical circuits of an assembly of terminal blocks arranged in side-to-side relation, each of the terminal blocks including two mutually-insulated collinearly-arranged horizontal bus bar sections that are normally electrically connected by first and second pairs of leaf spring contacts arranged above and below the bus bar sections, respectively. During the testing operation, the testing device may be arranged either above or below the assembly, and an insulating test plug on the testing device is inserted either vertically downwardly from above, or upwardly from below, the terminal block, thereby to disengage one pair of contacts. A dummy plug is vertically inserted in the opposite direction to disengage the other pair of contacts. The remote ends of the bus bar sections are provided with clamping devices for connection with the bare ends of insulated conductors, respectively. | 03-20-2014 |
20140111237 | CONTACT SPRING FOR A TESTING BASE FOR THE HIGH CURRENT TESTING OF AN ELECTRONIC COMPONENT - A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component. | 04-24-2014 |
20140111238 | SPIRAL PROBE AND METHOD OF MANUFACTURING THE SPIRAL PROBE - A spiral probe includes a tapered distal end portion ( | 04-24-2014 |
20140132300 | FINE PITCH PROBES FOR SEMICONDUCTOR TESTING, AND A METHOD TO FABRICATE AND ASSEMBLE SAME - An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes. | 05-15-2014 |
20140176176 | HIGH BANDWIDTH DIFFERENTIAL LEAD WITH DEVICE CONNECTION - A high bandwidth solder-less lead may be connected to an electrical device having land patterns so that signals on the device may be more easily measured through the lead. The lead includes an attachment mechanism to mount the lead on the device, a microspring housing and at least one microspring. The microspring connects one of the particular land patterns on the device to the lead where it may be easier to couple to a measurement device than to the electrical device itself The lead may be coupled to a flexible electrical conduit to make attaching to the testing device even easier. In other versions, a uniform connector may be temporarily attached to the solder-less lead to test the device. Then the connector may be disconnected from the first lead and connected to another lead to test another area of the device. | 06-26-2014 |
20140210504 | TESTING DEVICE FOR ELECTRONIC DEVICE TESTING - A testing device includes a test board, a number of locating pins, a pin holder, a number of metal pins, a connector holder, a connector, a number of elastic elements, and a pressure block. The test board is electrically connected with a testing circuit. The locating pins are fixed on the testing board to guide the connector holder. Bottoms of the number of metal pins are vertically fixed in the pin holder. The elastic elements are arranged between the pin holder and the connector holder for pushing the connector holder back to its original position after testing. The connector is set in the connector holder and connected with an electronic device to be tested. The pressure block is positioned above the connector holder and used to push the connector holder down to the pin holder to make the testing contacts in the connector contact the metal pins. | 07-31-2014 |
20140247065 | PROBE UNIT - The probe unit includes probe groups of two or more contact probes to be in contact with one electrode of a contact target body on a side of one end in a longitudinal direction and the respective contact probes are to be in contact with separate electrodes of a board on a side of another end. The contact probe includes an end portion arranged on the side of one end, having nail portions in a tapered end shape, and brought into contact with the one electrode at the nail portions; a second contact unit arranged on the side of another end, and to be in contact with a corresponding electrode of the board; and a coil spring arranged between the end portion and the second contact unit, and biasing the end portion and the second contact unit. | 09-04-2014 |
20140253163 | INSPECTION PROBE AND AN IC SOCKET WITH THE SAME - An inspection probe | 09-11-2014 |
20140266277 | SEMICONDUCTOR TESTING PROBE NEEDLE - A semiconductor testing probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an inspection end for contacting with the circuit board for inspection. A spring column includes one end electrically connected to the connection end of the conductive shaft and another end abuts the inspection main board. A conductive wire is arranged along the spring column and includes one end electrically connected to the conductive shaft and another end provided to be electrically connected to the inspection main board. | 09-18-2014 |
20140266278 | PROBE NEEDLE - A probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an inspection end for contacting with the circuit board for inspection. An elastic conductive rod is axially connected to the conductive shaft and having two ends of a free end and a fixed end; wherein the free end is connected to the connection end of the conductive shaft and the fixed end abuts the inspection main board. The probe needle has a simplified structure facilitating the manufacturing of parts and assembly thereof. | 09-18-2014 |
20140320159 | PROBE MEMBER FOR POGO PIN - Provided is a probe member for a pogo pin, which is used for testing a semiconductor device, and at least a portion of which is inserted into a cylindrical body to be supported by an elastic member and an upper end of which contacts a terminal of the semiconductor device. | 10-30-2014 |
20140340106 | PROBE MEMBER FOR POGO PIN - Provided is probe member for a pogo pin used for testing a semiconductor device, at least a portion of the probe member being inserted into a cylindrical body and supported by an elastic member and an upper end of the probe member contacting a terminal of the semiconductor device. | 11-20-2014 |
20140361801 | PROBE-CONNECTION-TYPE POGO PIN AND MANUFACTURING METHOD THEREOF - The present invention relates to a pogo pin including a probe part and an elastic part, and more particularly, to a probe-connection-type pogo pin including a cylindrical upper probe part, an elastic part, and a cylindrical lower probe part, which are made in one body, to transmit electrical signals between semiconductor wafers, LCD modules, semiconductor packages, electronic parts such as a variety of sockets, etc. Accordingly, it is possible to reduce the manufacturing process and the manufacturing cost, reduce the outside diameter of the pogo pin by making the elastic part formed to surround the cylindrical lower probe part, and reduce the loss and distortion of electrical signal by allowing the upper probe part and the lower probe part to come in surface contact with each other. | 12-11-2014 |
20150048859 | PROBE AND METHOD OF MANUFACTURING PROBE - A probe for connecting an electrode terminal of an electric circuit or an electric component includes a first spring; a second spring covering the first spring; a cover covering the second spring; a first terminal that is connected to the second spring and is provided at one end of the probe; and a second terminal that is connected to the cover and is provided at another end of the probe. | 02-19-2015 |
20150369840 | TEST SOCKET ASSEMBLY AND RELATED METHODS - A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough. | 12-24-2015 |
20150377925 | SPRING CONTACT - The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion | 12-31-2015 |
20160018440 | Contact Device for Test and Test Socket - Provided are a contact device for tests and an electric test socket. The contact device is used to electrically connect a terminal of a test target device to a pad of an inspection apparatus. The contact device includes a first plate member, second plate members, and a spring supporting the first and second plate members in a relatively slidable manner. | 01-21-2016 |
20160109483 | ELECTRICAL CONTACTING DEVICE - An electrical contacting device for electrical physical contact with a specimen, particularly wafers, taking place in a contacting direction, with at least one conductor substrate which can be electrically connected to a testing device, at least one contact distance transformer and at least one contact head having electrical contact elements, particularly resilient contact elements, preferably serving to compensate different physical contact distances existing in the contacting direction particularly at the contact elements. | 04-21-2016 |
20160187381 | SEMICONDUCTOR TEST APPARATUS HAVING POGO PINS COATED WITH CONDUCTION FILMS - A semiconductor test apparatus includes a pogo pin that is provided on a board and is in contact with an inspected object. The pogo pin includes a barrel fixedly disposed on the board, a plunger movably coupled to the barrel, and a conduction film covering the pogo pin. The conduction film contacts a portion of the plunger to be electrically connected to the plunger while being electrically insulated from the barrel. | 06-30-2016 |
20160187382 | HIGH IMPEDANCE COMPLIANT PROBE TIP - A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element, e.g., a round rod resistor, coupled with the plunger component at one end and with the tip component at the opposite end. | 06-30-2016 |
324755060 | Buckling | 2 |
20140062519 | HIGH-FREQUENCY COBRA PROBE - A test device including cobra probes and a method of manufacturing is disclosed. The test device includes a conductive upper plate having an upper guide hole and a conductive lower plate having a lower guide hole. The test device also includes a conductive cobra probe disposed between the upper guide hole of the upper plate and the lower guide hole of the lower plate. A dielectric material insulates the cobra probe from the upper plate and the lower plate. | 03-06-2014 |
20140239995 | TEST PROBES - The formation of test probe structures is described. One test probe structure includes a tip portion and a handle portion spaced a distance away from the tip portion. The test probe structure also includes a body bend portion positioned between the tip portion and the handle portion, and an intermediate portion positioned between the body bend portion and the handle portion. The body bend portion may include a curved shape extending from the intermediate portion to the tip portion. The tip portion may be formed to be offset from a longitudinal axis defined by the intermediate portion. The test probe structure defines a length and includes a cross-sectional area that is different at a plurality of positions along the length. Other embodiments are described and claimed. | 08-28-2014 |