Class / Patent application number | Description | Number of patent applications / Date published |
523223000 | Process of forming a composition of a spheroidal material having physical dimension or composition containing same | 16 |
20090062427 | METHOD AND APPARATUS FOR ENHANCED MINIMAL SHEAR MOLDING UTILIZING EXTRUSIONAL, PELLETIZATION, AND MELT RHEOLOGICAL CONTROL OF PELLETS AND MICROPELLETS AND MOLDED OBJECTS MADE THEREFROM - The present invention relates to a method for enhancement of the minimal shear molding process utilizing pellets and/or micropellets produced through controlled extrusional and pelletization processes in combination with nonpowder melt flow rheology that incorporates reduced molding temperature and/or reduced cure time, reduced rotation axis ratios and/or reduced rotation rates. Molding can be uniaxial, biaxial, or multiaxial rotational or oscillatory or both. The molded items produced can be single or multiple layers and can be produced in one or more molding sequences using similar or different chemical compositions. | 03-05-2009 |
20090197990 | Lightweight Structural Finish - A lightweight finish composition, method of production and a method of application are provided. The lightweight finish composition comprises a resin dispersion, alkali metal phosphate, alkylolammonium salt of a polyfunctional polymer, and lightweight aggregate such as silica spheres. The lightweight aggregate has a density and weight that is less than those of sand. The combination of alkali metal phosphate and alkylolammonium salt of a polyfunctional polymer stabilizes the lightweight finish composition by preventing the lightweight aggregate from absorbing water, after production of the lightweight finish composition. | 08-06-2009 |
20100190887 | WATER-BASED MOLDABLE MODELING DOUGH AND METHOD PREPARING THEREFOR - A water-based moldable modeling dough includes polyvinyl alcohol (PVA), vinyl acetate resin, water, maltose, maltitol, and hollow microspheres each with a diameter about 5-100 μm. | 07-29-2010 |
20100204360 | LOW-DENSITY MOLDING COMPOUND - A molding composition formulation includes a thermoset cross-linkable 12 to 45 micron polymeric resin. Hollow glass microspheroids are present from 2 to 12 total weight percent. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations. | 08-12-2010 |
20110105646 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC PART - An epoxy resin composition for encapsulating electronic parts is provided which contains an inorganic filler in a large amount and which has a low viscosity and is flowable at ordinary temperature. The composition reconciles reactivity and storage stability, is excellent in suitability for demolding, molded-object appearance, etc., and is reduced in warpage. The epoxy resin composition comprises: (A) 100 parts by weight of an epoxy resin, (B) 50 to 150 parts by weight of an acid anhydride, and (C) 8 to 40 parts by weight of a curing accelerator of the microcapsule-type which satisfies the following: when 10 parts by weight of the curing accelerator is mixed with 100 parts by weight of the epoxy resin (A) and 100 parts by weight of a methyltetrahydroxy acid anhydride as the acid anhydride (B), the mixture has a viscosity increase ratio through 24 hours standing at 25° C. of 1.0 to 2.0 times. The composition further contains (D) fused spherical silica having an average particle diameter of 20 to 40 μm in an amount of 88 to 92% by weight of the composition. The composition has a viscosity, as measured at 25° C. under a shear rate of 2.5 (1/s), of 1000 Pa·s or lower. | 05-05-2011 |
20110160339 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND DICING DIE-BONDING FILM - An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent. | 06-30-2011 |
20110196065 | COATING, METHOD OF APPLYING THE COATING AND USE THEREOF - The present invention relates to a coating for application to a substrate, comprising: high-molecular-weight, substantially ungelled polyvinyl chloride (PVC) with a K-value of more than 90, a matrix of a substantially gelled PVC material with a K-value of 60 to 80 and/or a gelled vinyl acetate/PVC copolymer with a K-value of 50 to 70, and at least one polymeric plasticiser; and also a method of applying such a coating, and uses thereof. | 08-11-2011 |
20120010327 | COATING COMPOSITION AND METHOD OF MAKING AND USING THE SAME - Compositions include an aqueous continuous liquid phase and core-shell particles dispersed in the aqueous continuous liquid phase. Each core-shell particle includes a polymer core surrounded by a shell consisting essentially of nonporous spherical silica particles disposed on the polymer core, wherein the nonporous spherical silica particles have a volume average particle diameter of 60 nanometers or less. Methods of making and using the compositions to coat a substrate are also disclosed. | 01-12-2012 |
20130123388 | Fiber-Reinforced Thermoplastic Resin Composition and Process for Producing Fiber-Reinforced Thermoplastic Resin Composition - Provided are a fiber-reinforced thermoplastic resin composition excellent in terms of dispersion property, moldability, rigidity, and reinforcing property and a process for producing the resin composition. This fiber-reinforced thermoplastic resin composition comprises (a) a polyolefin, (b) a rubbery polymer, (c) spherical silica having a water content of 1,000 ppm or less, (d) ultrafine fibers of a thermoplastic polymer having amide groups in the main chain, and (e) a silane coupling agent, wherein the ingredient (d) has been dispersed as ultrafine fibers having an average diameter of 1 [mu]m or less in a matrix comprising the ingredients (a), (b), and (c), and the ingredients (a), (b), (c), and (d) have been chemically bonded through the ingredient (e). | 05-16-2013 |
20130143980 | MICROSPHERE BASED WALL REPAIR COMPOUND - The present invention is a drying composition comprising spherical beads and a stable aqueous dispersion of polymer particles and also a dried composition of the spherical beads and a polymer film. The composition is useful as a wall repair formulation. | 06-06-2013 |
20130143981 | RESIN COMPOSITION, MOLDED OBJECT AND SUBSTRATE MATERIAL BOTH OBTAINED FROM THE RESIN COMPOSITION, AND CIRCUIT BOARD INCLUDING THE SUBSTRATE MATERIAL - To provide a resin composition having excellent thermal conductivity and excellent insulation reliability, a molded object, a substrate material, and a circuit board. [Solution] Provided is a resin composition which comprises an epoxy resin, a hardener, and an inorganic filler, wherein the epoxy resin and/or the hardener has a naphthalene structure, the inorganic filler comprises hexagonal boron nitride, and the inorganic filler accounts for 50-85 vol. % of the whole resin composition. Since a naphthalene structure, which imparts the satisfactory ability to wet the hexagonal boron nitride included in the inorganic filler, has been introduced into the epoxy resin and/or the hardener to heighten the inorganic-filler loading characteristics, this resin composition attains excellent heat dissipation properties, heat resistance, insulating properties, etc. | 06-06-2013 |
20130172444 | Thermoplastic Resin Composition Having Improved Thermal Conductivity and Articles Thereof - A thermoplastic resin composition comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the thermal diffusivity of the thermoplastic resin composition in the horizontal or vertical direction is about 0.065 to about 0.20 cm | 07-04-2013 |
20140275335 | CIRCUIT BOARD - The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df. | 09-18-2014 |
20140275336 | LOW-DENSITY MOLDING COMPOUND - A molding composition formulation includes a thermoset cross-linkable 12 to 45 micron polymeric resin. Hollow glass microspheroids are present from 2 to 12 total weight percent. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations. | 09-18-2014 |
20150080495 | SURFACE MODIFIED PARTICULATE AND SINTERED OR INJECTION MOLDED PRODUCTS - Disclosed are interfacially modified particulate and polymer composite material for use in injection molding processes, such as metal injection molding and additive process such as 3D printing. The composite material is uniquely adapted for powder metallurgy processes. Improved products are provided under process conditions through surface modified powders that are produced by extrusion, injection molding, additive processes such as 3D printing, Press and Sinter, or rapid prototyping. | 03-19-2015 |
20160194480 | NANOCOMPOSITES CONTAINING SPHERICAL PYROGENIC SILICA NANOPARTICLES AND COMPOSITES, ARTICLES, AND METHODS OF MAKING SAME | 07-07-2016 |