Class / Patent application number | Description | Number of patent applications / Date published |
451388000 | Vacuum | 11 |
20080227374 | POLISHING HEAD TESTING WITH MOVABLE PEDESTAL - A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed. | 09-18-2008 |
20080287044 | Method of transferring a wafer - A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid. | 11-20-2008 |
20090298402 | Surface grinding machine - It has special application for preparing surfaces of two pieces of a composite material (fiber and resin) which have to be glued by means of an adhesive, establishing a perfect mutual contact between them. The preparation of the surface needs to be uniformed and without damaging the piece. | 12-03-2009 |
20100267317 | Substrate holder and substrate holding method - A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently. | 10-21-2010 |
20110159792 | MULTI-FUNCTIONAL GRINDING APPARATUS - A multi-functional grinding apparatus includes a fixed barrel, a moving barrel, a cutting device, a grinding plate, and an actuator. The fixed barrel defines a chamber therein and includes a number of inner side surfaces, the inner side surfaces are substantially parallel to a central axis of the fixed barrel. Each of the inner side surfaces defines a holding groove therein for holding a workpiece. The moving barrel is received in the chamber and includes a first side surface and a second side surface, the first side surface and second side surface are substantially parallel to the central axis. The cutting device is fixed on the first side surface. The grinding plate is fixed on the second side surface. The actuator is configured for driving the moving barrel to move towards a workpiece, and rotating the moving barrel. | 06-30-2011 |
20110281509 | HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE - A backgrinding machine | 11-17-2011 |
20120184189 | CARRIER HEAD AND CARRIER HEAD UNIT - Provided are a carrier head and a carrier head unit for sucking and securely supporting a substrate during a chemical mechanical polishing process. The carrier head using sucking force to fix a substrate includes a head main body that includes a receiving space in a central portion thereof, the receiving space being opened downward to receive the substrate, a housing part in an edge thereof to surround a side portion of the receiving space, a main passage passing through the head main body to communicate with the receiving space, and a plurality of connecting holes vertically passing through the housing part to communicate with the main passage, a retaining ring coupled to a bottom surface of the housing part of the head main body to close lower portions of the connecting holes, and a cover coupled to a top surface of the head main body to close upper portions of the connecting holes. | 07-19-2012 |
20120244789 | VACUUM DEVICE BY USING CENTRIFUGAL RESOURCES - A wafer holding vacuum for a wafer polishing system and the wafer suction device for CMP (Chemical Mechanical Polishing) by utilizing existing resources provided by the rotating polishing post is provided. The device introduces a channel configured in the wafer suction device. One end of the channel is exposed at downside of the holding block, and another end of the tube is exposed at lateral side of the holding block. By aforementioned configuration, the channel can suck gas and/or liquid between the wafer and the device, and can discharge them to the outer environment at the lateral side using centrifugal force naturally provided by the polishing post. | 09-27-2012 |
20140302755 | SUCTION-HOLDING APPARATUS AND WAFER POLISHING APPARATUS - A suction-holding apparatus includes a suction plate made of an air-permeable material, a holding member formed with a through-hole in which the suction plate is placed, and a base to which the holding member is attached. The suction plate includes a jutting-out portion so that the outer edge of the rear face is disposed outwardly from the outer edge of the front face. The through-hole includes a first edge and a second edge spaced apart from each other in the thickness direction. The first edge is adjacent to the base. The holding member includes an eaved portion so that the second edge of the through-hole is disposed inwardly from the outer edge of the rear face. | 10-09-2014 |
20160052101 | LENS HOLDING TOOL - A lens holding tool includes a head portion and a pin that supports the head portion rotatably. The pin includes: a shaft portion having an exhaust outlet therein; a protruding portion that protrudes outwardly from the shaft portion; a sealing member disposed on the protruding portion; and a supporting portion that has a partially spherical shape and is disposed on a leading end of the shaft portion. The head portion includes: a workpiece receiving portion that holds a workpiece; an internal space that accommodates the protruding portion; an opening that has a diameter larger than a diameter of the shaft portion and smaller than an outer diameter of the protruding portion, the internal space communicating with an outside of the head portion through the opening; a suction hole through which the internal space communicates with the workpiece receiving portion; and an end receiving portion on which the supporting portion abuts. | 02-25-2016 |
20160052105 | AUXILIARY EQUIPMENT FOR VALVE GRINDING - An auxiliary equipment for valve grinding is provided, including a main body, a driving shaft, a first linkage, a second linkage, a third linkage and a driven shaft. The driving shaft defines a first axial direction. The driving shaft is for connecting to a rotating tool. One end of the first linkage is connected to the driving shaft. The second linkage and the other end of the first linkage are connected to a first movable connecting portion. One end of the third linkage and the second linkage are connected to a second movable connecting portion. The driven shaft defines a second axial direction. When the first linkage rotates together with the driving shaft, the first movable connecting portion rotates about the first axial direction, the second linkage swings about the first movable connecting portion, and the second movable connecting portion swings about the second axial direction. | 02-25-2016 |