Entries |
Document | Title | Date |
20080200102 | Polishing pad, use thereof and method for manufacturing the same - The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. | 08-21-2008 |
20080280541 | ABRASIVE FILAMENT AND BRUSH - An abrasive filament including a matrix of thermoplastic polymer; and a plurality of abrasive particles such as eutectic alumina zirconia particles interspersed throughout at least a portion of the matrix. Abrasive brushes including such abrasive filaments are also disclosed. Methods of deburring a substrate having at least one burr, with a brush, the brush having bristles including eutectic alumina zirconia particles and a matrix of thermoplastic polymer, wherein the method includes the steps of: contacting the substrate with at least one bristle of the brush in a contact region; and inducing relative motion between the substrate and the at least one bristle. | 11-13-2008 |
20090047877 | LAYERED-FILAMENT LATTICE FOR CHEMICAL MECHANICAL POLISHING - The polishing pad ( | 02-19-2009 |
20090075568 | POLISHING PAD, METHOD OF PRODUCING THE SAME AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME - The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10. | 03-19-2009 |
20090088050 | CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING - A conductive polishing article is provided. The conductive polishing article at least has a polishing pad, cathodes and anodes. Cathodes and anodes are disposed below the polishing surface of the polishing pad, and an ion exchange membrane at least partially covers the anodes. | 04-02-2009 |
20090104856 | METHOD FOR PRODUCING CHEMICAL MECHANICAL POLISHING PAD - There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy. | 04-23-2009 |
20090124176 | REMOVABLE POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING - The present invention offers a device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon the platen of a CMP polishing apparatus comprising two sheets, the upper sheet attached to the said CMP polishing pad and the lower attached to the said platen, the said two sheets held together by pegs, pins or protrusions fitted to matching holes in the upper surface of the lower sheet and the lower surface of the upper sheet, said pegs or pins attached to either the upper or lower sheet and able to enter the hold on the adjoining sheet when the sheets are brought together and hold the sheets together by means of the sliding friction attendant upon a tight fit with the said holes. The device allows far easier metrology and storage of CMP polishing pads at different stages of use with no damage to the CMP pad, which may be put back into service at any time. The transparency of the upper sheet further allows users to prevent formation of bubbles in the adhesive holding the CMP pad to the upper sheet, thereby avoiding significant degradation of CMP performance. | 05-14-2009 |
20090124177 | Vacuum-assisted sanding block - A vacuum-assisted sanding device removably connectable to a conventional sanding pad of the type used with mechanical sanders. The sanding device may include a swiveling connection tube for connecting dust removal channels and a recess of a handle block of the sanding device to a vacuum system. The manual sanding device may also include a plate system for suctioning away dust and other particulate matter created during the sanding process. | 05-14-2009 |
20090163123 | DUAL SURFACE SANDING BLOCK - A sanding block is disclosed having an elongate shape having a constant cross section along most of its longitudinal axis. The sanding block is formed of a flexible material and has a curved upper surface and a flat lower surface. The curved upper surface has a width less than that of the flat lower surface but has an arc length about equal to the width of the flat lower surface. The sanding block is used by securing strips of sand paper to one or both of the upper and lower surfaces. The width of the lower surface and the arc length of the upper surface are preferably chosen to be about equal to the width of the sandpaper. | 06-25-2009 |
20090170408 | Integrated Circuit Package Contact Cleaning - The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the electrical contacts into engagement with one or more cleaning station. Aspects of the disclosed apparatus include a package transit chute for moving packages from a first position to a second position and one or more cleaning stations between the first and second positions. The cleaning stations further include one or more cleaning mats positioned for cleaning electrical contacts of packages transported in the chute. | 07-02-2009 |
20090170409 | POLISHING PAD AND POLISHING METHOD - A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matrix. | 07-02-2009 |
20090170410 | CHEMICAL-MECHANICAL PLANARIZATION PAD - The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent. | 07-02-2009 |
20090191798 | INTEGRALLY MOLDED BRUSH AND THE METHOD OF MANUFACTURE AND ITS USES THEREOF - An aspect of the present invention comprises an integrally molded brush comprising a base and bristles extending from said base, further comprising a moldable composition that includes a dispersed phase comprising ultra-high molecular weight polyethylene. Another aspect of the present invention is a method of making an integrally molded brush comprising the steps of providing a moldable composition comprising a dispersed phase of ultra-high molecular weight polyethylene; causing said moldable composition to become a flowable material; shaping said flowable material; and hardening said flowable material. Other aspects of the present invention provides a method of refining a planar metal workpiece surface, the method comprising the steps of providing an integrally molded brush or brush assembly, each brush comprising a base and bristles extending from said base, further comprising a moldable composition that includes a dispersed phase comprising ultra-high molecular weight polyethylene, further comprising an attachment means; providing a driving means; providing a planar metal workpiece; coupling said integrally molded brush or brush assembly to said driving means via said attachment means; and rotating said brush or brush assembly while urging said rotating brush or brush assembly against said workpiece. | 07-30-2009 |
20090258579 | FORM TRANSFER GRINDING METHOD - A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition. | 10-15-2009 |
20090264053 | APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE - Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided. | 10-22-2009 |
20090325470 | SANDPAPER WITH NON-SLIP COATING LAYER - A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided. | 12-31-2009 |
20100003900 | ABRASIVE TAPE, METHOD FOR PRODUCING ABRASIVE TAPE, AND VARNISHING PROCESS - There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape | 01-07-2010 |
20100003901 | Burnishing tape and method of manufacturing the same, and method of burnishing magnetic disk - Disclosed is a burnishing tape, a method of producing the same and a method of burnishing a magnetic disk with which a surface of the magnetic disk may be smoothed while contamination of a magnetic disk caused by crushed abrasive grains is prevented. A burnishing tape ( | 01-07-2010 |
20100009604 | LAMINATED FLEXIBLE RESILIENT ABRASIVE ARTICLE - A sheet-like abrasive article includes a resilient backing sheet having opposed major surfaces and a continuous abrasive sheet affixed to the backing sheet. The abrasive sheet includes an abrasive support layer with abrasive particles arranged thereon, thereby defining an abrasive surface. A sanding tool assembly including such a sheet-like abrasive article is also disclosed. | 01-14-2010 |
20100015895 | Chemical mechanical polishing pad having electrospun polishing layer - Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates. | 01-21-2010 |
20100075578 | Abrasive polishing net with a stickable fiber layer - An abrasive polishing net with a stickable fiber layer includes an abrasive polishing net layer and a stickable fiber layer. This abrasive polishing net layer is consisted by metal meshes and has an outer surface, an inner surface and multiple conduits. The adhesive polishing net layer is coated with a wear-resistant coating wrap that includes many tiny wear-resistant particles and an adhering portion. The wear-resistant particle is composed of silicon carbide and zirconia. The stickable fiber laye is composed by fibers. Spaces are disposed among these fibers for allowing needle structures to insert in. The stickable fiber layer further includes a gluing layer for adhering with the abrasive polishing net layer. So, the abrasive polishing net layer has sufficient strength. The fibers provide excellent adhering force. Plus, the stickable fiber layer has many openings for expelling polishing debris. | 03-25-2010 |
20100105296 | ULTRA SMOOTH FACE SPUTTER TARGETS AND METHODS OF PRODUCING SAME - A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium. | 04-29-2010 |
20100178852 | Apparatus and Process for Producing Surface-Treated Granular Product and Surface-Treated Granular Product - It is intended to produce a high-quality purified surface-treated granular substance and processed substance through, without application of excessive pressure or temperature, efficient grinding of a surface layer region of feedstock granular substance by means of simple apparatus and operation to thereby remove unwanted portions, such as surface nonedible portion, oxidizing coating layer and attachment, without denaturation, decomposition or elimination or useful matter. Feedstock granular substance ( | 07-15-2010 |
20100178853 | POLISHING PADS FOR CHEMICAL MECHANICAL PLANARIZATION AND/OR OTHER POLISHING METHODS - Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material. | 07-15-2010 |
20100330887 | ABRASIVE FLAP WHEEL WITH CUSTOM PROFILES - A flap sander is disclosed for use with a workpiece having a nonlinear profile. The flap sander comprises a cylindrical rotary head including a central hub concentric with an axis of rotation of the rotary head, and an inclined surface extending radially outward from the central hub. A plurality of abrasive flaps are detachably secured to the inclined surface of the rotary head and are aligned in a radial array radiating outward from central hub to the periphery of the rotary head. Each of the abrasive flaps comprises an unsecured working edge having a nonlinear profile that substantially matches the profile of the workpiece to provide an even sanding distribution across the workpiece profile independent of the shape of the profile. | 12-30-2010 |
20110177761 | Sanding Tape Clip and Methods of Use - Embodiments of the present invention include methods of use of a clip or other securing device to create a loop of sandpaper that can be slid down a user's arm or wrist when not in use. The apparatus is a clip, adhesive, or other device that is used to maintain a strip of sandpaper in a loop. The loop of sandpaper is held with the abrasive side outward, and is used to sand an object. | 07-21-2011 |
20110256813 | COATED CARRIER FOR LAPPING AND METHODS OF MAKING AND USING - A lapping carrier ( | 10-20-2011 |
20110294405 | WORKPIECE SPINDLES SUPPORTED FLOATING ABRASIVE PLATEN - A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a flat surface of an abrading machine base where the spindle surfaces are in a common plane. Three spindles are positioned to form a three-point triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. The spindles are supported by two-piece spindle-mount devices having a common-radius spherical joint that allows the spindles to be rotated to co-planar align the top flat surfaces of the rotatable spindle-tops and then to be locked into this aligned position. Spindle-mount spherical-action locking devices include mechanical fasteners and stress-free adhesive tabs. Precision-flat platens can be used as an alignment jig for co-planar alignment of the spindles. | 12-01-2011 |
20120034851 | Easy Rinsing Polishing Composition For Polymer-Based Surfaces - A polishing composition and method for polishing polymer-based surfaces that can be rinsed from the polished polymer-based surface using water so as to leave substantially less polishing residue behind as compared to conventional polishing compositions. Polishing compositions according to the invention include abrasive particles and a rinsing agent dispersed in water. Polishing compositions according to the invention can be used to polish all types of polymer-based surfaces including, for example, organic polymer-based ophthalmic substrates and clear-coat automotive finishes. | 02-09-2012 |
20120077422 | POLISHING LIQUID COMPOSITION - A polishing liquid composition that makes it possible to provide a polished substrate surface on which scratches and/or waviness are reduced, without impairing productivity, is provided, and further, a method for manufacturing and polishing a substrate using this polishing liquid composition is provided. The polishing liquid composition contains an abrasive, a water-soluble polymer, and water, wherein the water-soluble polymer has a sulfonic acid group, and has an aromatic ring in each of a main chain and a side chain. The method for manufacturing a substrate, and the method for polishing a substrate, include performing polishing by supplying the above-described polishing liquid composition to a surface to be polished of a substrate to be polished, bringing a polishing pad into contact with the surface to be polished, and moving the polishing pad and/or the substrate to be polished. | 03-29-2012 |
20120135669 | LAPPING CARRIER AND METHOD - Provided is a lapping carrier including a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece. The aperture extends from the first major surface through the base carrier to the second major surface. The base carrier includes a first metal or a polymer. At least a portion of the first major surface or at least a portion of each of the first and the second major surfaces includes a polymeric region. In at least a portion of the polymeric region, at least one adhesion promoting layer is interposed between the polymeric region and the base carrier. The adhesion promoting layer includes an inorganic coating. | 05-31-2012 |
20120164924 | COMPOSITIONS AND METHODS FOR REMOVING SCRATCHES FROM PLASTIC SURFACES - A composition including an abrasive, a suspension agent, a surfactant, and a lubricant, is provided for removing scratches, hazing, discoloration, and other defects from plastic surfaces. The composition is applied to a surface and used to polish the surface. The defects within the surface are removed without the removal of significant amounts of the material. Accordingly, the present invention removes defects from surfaces without creating optical distortion. | 06-28-2012 |
20120171936 | POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY - A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles. | 07-05-2012 |
20120178347 | FORM TRANSFER GRINDING METHOD - A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition. | 07-12-2012 |
20120178348 | POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE - A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed. | 07-12-2012 |
20120196515 | POLISHING PAD - To provide a polishing pad ( | 08-02-2012 |
20120231707 | SANDPAPER WITH NON-SLIP LAYER - The present invention provides an abrasive article, e.g. a sheet of sandpaper, comprising a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and an exposed non-slip coating layer on the first major surface, the non-slip coating layer comprising at least a base resin and a tackifying resin. | 09-13-2012 |
20120231708 | COARSE SANDPAPER WITH NON-SLIP COATING LAYER - A sheet of coarse sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major surface, coarse abrasive particles at least partially embedded in the make coat, thereby defining a coarse abrasive surface, and an exposed non-slip coating layer on the first major surface. Methods of making and using such coarse sandpaper are also provided. | 09-13-2012 |
20120270478 | WAFER PADS FOR FIXED-SPINDLE FLOATING-PLATEN LAPPING - Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers. | 10-25-2012 |
20120295522 | PATTERN SANDER DEVICE, SYSTEM AND METHOD - The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece. | 11-22-2012 |
20120302142 | POLISHING PAD AND METHOD OF PRODUCING THE SAME - The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a plurality of bundles of first long fibers and an elastomer embedded into the bundles. The bundles of first long fibers are entangled with each other. | 11-29-2012 |
20120309274 | APPARATUS AND A METHOD OF SHAPING AN EDGE OF AN AEROFOIL - An apparatus for shaping an edge of an aerofoil, the apparatus having first and second brushes and each brush having a plurality of bristles. A first motor rotates the first brush about a first axis and a second motor rotates the second brush about a second axis. The axes are arranged substantially parallel to the bristles of the respective brush. A support structure holds the first brush such that the first axis intersects a first surface of the edge of the aerofoil and holds the second brush such that the second axis intersects a second surface of the edge of the aerofoil. There are means to produce relative movement the first and second brushes and the aerofoil such that the first and second brushes move longitudinally along the edge of the aerofoil to shape the edge of the aerofoil. | 12-06-2012 |
20120315830 | POLISHING PADS INCLUDING PHASE-SEPARATED POLYMER BLEND AND METHOD OF MAKING AND USING THE SAME - Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer. | 12-13-2012 |
20130012108 | POLISHING PAD AND METHOD OF MAKING THE SAME - The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network. | 01-10-2013 |
20130017766 | POLISHING PAD, POLISHING METHOD AND POLISHING SYSTEMAANM Wang; Yu-PiaoAACI Hsinchu CountyAACO TWAAGP Wang; Yu-Piao Hsinchu County TW - A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring. | 01-17-2013 |
20130040539 | POLISHING PAD, POLISHING METHOD AND METHOD OF FORMING POLISHING PAD - A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree. | 02-14-2013 |
20130059505 | Orbital Smoothing Device - Disclosed are an orbital smoothing device for smoothing a surface of a substrate and a method of smoothing a surface of a substrate using the orbital smoothing device. The orbital smoothing device includes a rotatable plate that is driveable by a motor in at least one of a clockwise or a counterclockwise direction and a plurality of smoothing pad assemblies coupled to said plate. Each of the plurality of smoothing pad assemblies is capable of independent rotation in both clockwise and counterclockwise directions and includes a shaft for coupling each of said smoothing pad assemblies to the rotatable plate, means for providing independent rotation in both clockwise and counterclockwise directions mounted on the shaft and securable in a pad holder and a pad holder for receiving and securing the means for independent rotation. The pad holder has removably mounted thereon a smoothing pad capable of smoothing the surface of the substrate when the rotatable plate is driven by the motor. | 03-07-2013 |
20130059506 | FIXED ABRASIVE PAD WITH SURFACTANT FOR CHEMICAL MECHANICAL PLANARIZATION - A fixed abrasive pad ( | 03-07-2013 |
20130065493 | POLISHING MONITORING METHOD, POLISHING END POINT DETECTION METHOD, AND POLISHING APPARATUS - A method of monitoring a thickness of a conductive film on a substrate during polishing of the substrate with use of an eddy current sensor is provided. This method includes: polishing the conductive film by pressing the substrate against a polishing surface on the rotating polishing table; obtaining output signal of the eddy current sensor during polishing; calculating an amount of output adjustment of the eddy current sensor using the output signal obtained when the substrate is not present above the eddy current sensor; with use of the amount of output adjustment, correcting the output signal obtained when the substrate is present above the eddy current sensor; and monitoring the thickness of the conductive film based on the corrected output signal. | 03-14-2013 |
20130102231 | ORGANIC PARTICULATE LOADED POLISHING PADS AND METHOD OF MAKING AND USING THE SAME - Polishing pads including organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer. | 04-25-2013 |
20130122788 | SYSTEMS AND METHODS FOR SUBSTRATE POLISHING END POINT DETECTION USING IMPROVED FRICTION MEASUREMENT - Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed. | 05-16-2013 |
20130130599 | POLISHING TOOL FOR PLASTIC LENS, POLISHING METHOD OF PLASTIC LENS AND METHOD FOR MANUFACTURING PLASTIC LENS - To provide a polishing tool for a plastic lens, a method of polishing a plastic lens and a method of manufacturing a plastic lens, capable of suppressing a deterioration of a polishing efficiency while reducing a cost required for treating a polishing waste liquid generated during polishing applied to the plastic lens, wherein the polishing tool is used for adjusting and completing an optical surface of the plastic lens, and is composed of a single layer in which abrasive grains made of crystalline alumina are uniformly dispersed and fixed to a substance mainly composed of polyurethane resin having foamability. | 05-23-2013 |
20130130600 | Hybrid Abrasive Hand Pad and Method of Abrading a Surface - An abrasive hand pad includes a coaled abrasive member secured to a nonwoven abrasive member. Methods of abrading a surface of a workpiece are also disclosed. | 05-23-2013 |
20130137345 | COATING REMOVAL APPARATUS - An example coating removal apparatus for a component includes a table having a first platform disposed along an axis. The platform is arranged to receive at least one fixture for holding a corresponding component. The coating removal apparatus also includes a removal device having a web. The table is slidably moveable in an axial direction and configured to move the fixture a pre-determined distance such that at least one portion of the component contacts the web to remove a coating of the component. | 05-30-2013 |
20130157544 | NONWOVEN ABRASIVE WHEEL - A nonwoven abrasive wheel comprising one or more layers of a nonwoven fiber web, a plurality of super abrasive particles having a Vickers hardness greater than 40 GPa, a polyurethane binder adhering the plurality of super abrasive particles to the nonwoven fibers and adhering the layers of the nonwoven fiber web to each other, and wherein the nonwoven abrasive wheel comprises a Flexural Modulus from 4.0 to 128.0 lb/inch of thickness per inch of displacement. | 06-20-2013 |
20130183889 | PROCESS FOR PRODUCING POLISHING LIQUID COMPOSITION - Provided is a process for producing a polishing liquid composition with which it is possible to give a polished work that has a reduced surface roughness and a reduced amount of particles. The process for producing a polishing liquid composition involves a step in which a raw silica dispersion containing colloidal silica having an average primary-particle diameter of 1-100 nm is filtered through a filter including a filter aid, the filter aid having an average pore diameter, as measured by the mercury intrusion method, of 0.1-3.5 μm. | 07-18-2013 |
20130189907 | CHEMICAL-MECHANICAL POLISHING PAD AND CHEMICAL-MECHANICAL POLISHING METHOD - A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour. | 07-25-2013 |
20130217309 | POLISHING PAD AND METHOD FOR PRODUCING SAME - A polishing pad has a polishing layer including a non-foamed polyurethane, wherein the non-foamed polyurethane is a reaction cured body of a polyurethane raw material composition containing an isocyanate-terminated prepolymer obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high-molecular-weight polyol and a low-molecular-weight polyol; an isocyanate modified body polymerized by adding three or more diisocyanates; and a chain extender, and the addition amount of the isocyanate-modified body is 5 to 30 parts by weight with respect to 100 parts by weight of the isocyanate-terminated prepolymer. The polishing pad hardly causes scratches on the surface of an object to be polished and has an improved dressing property. | 08-22-2013 |
20130237131 | System, Method and Apparatus for Polishing Workpieces - A method of polishing workpieces includes final tape polishing (FTP) a media disk by rotating the media disk; applying a liquid that is substantially pure to the media disk adjacent to an FTP tape; applying the FTP tape to the media disk at a pad load to polish the media disk, such that the liquid acts as a transient lubricant between the media disk and the FTP tape; and completing FTP. The FTP process is completely independent of the final disk lubricant, such that the final disk lubricant may be applied before or after FTP. | 09-12-2013 |
20130244548 | CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURAL DOMAINS - An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry. | 09-19-2013 |
20130252516 | POLISHING PAD AND POLISHING METHOD - According to one embodiment, there is provided a polishing pad having a surface for the polishing processing of a polishing workpiece. Here, the polishing pad is made of a plate-shaped thermal shrinking material, and it has a half-cut portion cut to a particular depth from one principal surface. | 09-26-2013 |
20130288577 | METHODS AND APPARATUS FOR ACTIVE SUBSTRATE PRECESSION DURING CHEMICAL MECHANICAL POLISHING - In some aspects, a chemical mechanical polishing (CMP) apparatus is provided that includes a polishing head having (a) a rotatable spindle; (b) a membrane coupled to the rotatable spindle and adapted to press a substrate against a polishing pad during polishing of the substrate; and (c) a retaining ring rotatable coupled to the spindle and adapted to surround a substrate being pressed against a polishing pad during polishing and to limit lateral movement of the substrate relative to the polishing head. The CMP apparatus also includes a drive mechanism coupled to the retaining ring and adapted to drive the retaining ring at a different rate of rotation than the spindle during polishing. Numerous other aspects are provided. | 10-31-2013 |
20130288578 | METHODS AND APPARATUS FOR PRE-CHEMICAL MECHANICAL PLANARIZATION BUFFING MODULE - The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed. | 10-31-2013 |
20130288579 | DEBURRING MACHINE ABRASIVE BELT, CHAMFERING-DEBURRING MACHINE THAT DEBURRS TWICE PER ROTATION, AND DEBURRING METHOD - The present invention relates to a one-circle two-chamfer deburring machine and a deburring method comprising the following steps after starting up: (1) The upper wheelhead motor drives the upper grinding belt to rotate horizontally (2) the lower wheelhead motor drives the lower grinding belt to rotate horizontally and (3) when a deburred workpiece goes through a passage formed by the active feeding roller row and the upper grinding belt, an upper abrasive block elastically contacts surface of the workpiece and, under the drive of the upper wheelhead motor and the upper active drum, polishes and deburrs the front side of the workpiece twice; the lower abrasive block elastically contacts the surface of the workpiece and, under the drive of the lower wheelhead motor and the lower active drum, polishes and deburrs the back side of the workpiece twice. | 10-31-2013 |
20130295821 | ABRASIVE ARTICLE WITH REPLICATED MICROSTRUCTURED BACKING AND METHOD OF USING SAME - An abrasive article is provided that includes a flexible backing having opposed first and second major surfaces. The first major surface includes a plurality of abrasive particles in at least one binder disposed thereon. The second major surface includes replicated microstructures having recesses. The abrasive article also includes adhesive contained substantially in the recesses of the replicated microstructures. A rigid substrate can be in contact with at least a portion of the replicated microstructures. Also provide is a method of polishing a work-piece that uses the provided articles. | 11-07-2013 |
20130309946 | METHOD FOR MANUFACTURING MAGNETIC DISC SUBSTRATE - A magnetic disk substrate production method by which the embedded alumina can be reduced is provided. The magnetic disk substrate production method includes the steps of (1) polishing a polishing surface of a substrate to be polished using a polishing liquid composition A containing alumina particles and water; (2) polishing the polishing surface of the substrate obtained in the step (1) using a polishing liquid composition B containing water and silica particles having an average primary particle size (D50) of 5 to 60 nm and a primary particle size standard deviation of less than 40 nm; (3) cleaning the substrate obtained in the step (2); and (4) polishing the polishing surface of the substrate obtained in the step (3) using a polishing liquid composition C containing silica particles and water. | 11-21-2013 |
20130316620 | RETAINER RING - A retainer ring is provided for use in conjunction with Chemical Mechanical Polishing apparatus which polishing is used to polish a substrate. Particularly, the retainer ring includes an inner surface defining a retainer area, an outer surface, a front surface extending between the inner and outer surface, the front surface being in contact with the polishing pad during polishing and a transition region between the outer surface and the front surface. A CMP apparatus which includes at least a ring having the above features is also provided for. | 11-28-2013 |
20130316621 | CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME - A chemical mechanical polishing pad includes a polishing layer that is formed of a composition that includes a polyurethane, the polishing layer having a specific gravity of 1.1 to 1.3 and a thermal conductivity of 0.2 W/m·K or more. | 11-28-2013 |
20130324015 | POLISHING COMPOSITION - Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m | 12-05-2013 |
20130331006 | METHOD AND APPARATUS FOR CONFORMABLE POLISHING - Methods and apparatus provide for a conformable polishing head for uniformly polishing a workpiece. The polishing head includes an elastic polishing pad mounted on an elastic membrane that seals a cavity in the polishing head. The cavity is pressurized to expand the membrane and press the polishing pad down on the top surface of the workpiece, such that the polishing pad conforms to the surface and applies a substantially uniform pressure distribution across the workpiece and thereby uniformly removes material across high and low spots on the workpiece. | 12-12-2013 |
20130344776 | BURNISHING METHOD AND BURNISHING APPARATUS - An object is to provide a burnishing method in which it is possible to reduce the flying height of a magnetic head by improving the smoothness of the surface of a magnetic disk while suppressing contamination of the magnetic disk due to falling-off or crushing of abrasive grains from a polishing tape. | 12-26-2013 |
20130344777 | POLISHING COMPOSITION, METHOD FOR FABRICATING THEREOF AND METHOD OF CHEMICAL MECHANICAL POLISHING USING THE SAME - Provided are a polishing composition for chemical mechanical polishing, a method of preparing the polishing composition, and a chemical mechanical polishing method using the polishing composition. The polishing composition which is a water-based polishing composition for planarizing a metal compound thin film including two or more metal elements includes nano-diamond particles as a polishing material and poly(sodium 4-styrenesulfonate) as a dispersion stabilizer for the nano-diamond particles in the polishing composition. Since the nano-diamond particles in the polishing composition have hydrophobic surfaces and poly(sodium 4-styrenesulfonate) effectively stabilizes the nano-diamond particles to prevent the nano-diamond particles from aggregating, excellent polishing characteristics for the metal compound thin film may be obtained due to the nano-diamond particles which have a nano size, high hardness, and excellent dispersibility. | 12-26-2013 |
20140030962 | ABRASIVE FILM FABRICATION METHOD AND ABRASIVE FILM - A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization. | 01-30-2014 |
20140045412 | SURFACE POLISHING COMPOSITION - A surface polishing composition is provided that includes a polyhydric alcohol, and a base present to give the composition a pH of between 9 and 12, an oil, an abrasive, and the majority component of the composition being water. The composition is particularly effective at removing water spots from a surface without resort to acid that can damage the finish on the surface or induce corrosion in the substrate beneath the surface. A polishing composition is provided in a kit form with an applicator along with instructions for the respective use of the composition and applicator to remove water spots from the surface. A clay bar is particularly well suited as an applicator. A process provided for removing water spots from a surface that includes applying to the surface the composition and then simultaneously contacting the composition with the substrate and the applicator. | 02-13-2014 |
20140065932 | LAMINATED POLISHING PAD - The purpose of the present invention is to provide a long-lived laminated polishing pad wherein a polishing layer is resistant to detachment from a support layer even when high temperatures are produced by long periods of polishing. This laminated polishing pad is characterized that: a polishing layer and a support layer are laminated together with an adhesive member interposed therebetween; said adhesive member is either an adhesive layer containing a polyester-based hot-melt adhesive or double-sided tape that has one of such adhesive layers on each side of a substrate; and for each 100 weight parts of a polyester-resin base polymer, said polyester-based hot-melt adhesive contains 2 to 10 weight parts of an epoxy resin that has at least two glycidyl groups per molecule. | 03-06-2014 |
20140080383 | ADJUSTABLE PROFILE SANDING AND DUST REMOVAL METHOD AND APPARATUS - The present invention provides a means to increase the efficacy of the sanding of surfaces of contoured or other complex geometries as often found in automotive panels undergoing collision repair. In particular, the present invention provides a means to achieve a flat, convex, or concave sanding surface as required by the site of the work and as adjusted by the operator. Additionally, dust removal facility means are provided for the adjustable profile sander allowing the operator to reduce the release of fine particulates in the immediate work environment. The application of the present invention reduces the occurrence of secondary damage arising from the action of sanding through its surface contour adaptability while also reducing the number of sanding passes required to achieve the level of smoothness desired. Further, the safety of the operator is enhanced through the removal of potentially harmful particulates at the site of the work as generated during the operation of sanding. | 03-20-2014 |
20140120809 | Soft And Conditionable Chemical Mechanical Polishing Pad - A chemical mechanical polishing pad for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided containing a polishing layer, wherein the polishing layer comprises the reaction product of raw material ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm | 05-01-2014 |
20140127977 | SANDPAPER WITH NON-SLIP COATING LAYER AND METHOD OF USING - A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided. | 05-08-2014 |
20140134929 | Retainer Ring - A retainer ring for chemical-mechanical polishing or other processes includes an outside ring and an inside ring that is attached to the outside ring. The inside ring is softer than the outside ring in hardness. | 05-15-2014 |
20140187127 | MODULAR DUAL-ACTION DEVICES AND RELATED METHODS - The invention concerns a module ( | 07-03-2014 |
20140256233 | ABRASIVE ARTICLE AND METHOD OF MAKING THE SAME - An abrasive article and method of making same wherein the abrasive article comprises a mounting assembly and an abrasive attachment assembly wherein the first interlock member of the mounting assembly and the second interlock member of the abrasive attachment assembly are configured to align the central axis of the abrasive attachment assembly and the central axis of the mounting assembly, and the first interlock member releasably engages the second interlock member. The abrasive article is adapted to clean a work surface area around studs using a rotary tool, including, for example, a drills or die grinder. | 09-11-2014 |
20140273765 | Polishing System with Front Side Pressure Control - A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head. | 09-18-2014 |
20140273766 | Polishing System with Front Side Pressure Control - A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head. | 09-18-2014 |
20140295741 | POLYURETHANE FOAM ARTICLE - Herein are disclosed an apparatus and method for reaction injection molding of polyurethane foam. In the method, a recirculation loop containing polyols along with an effective amount of water, and a recirculation loop containing isocyanates, are each partially evacuated. | 10-02-2014 |
20140302753 | POLISHING COMPOSITION - A polishing composition containing at least water and silica and satisfying all of the following conditions (a) through (d) is provided. Condition (a) The specific surface area of the silica contained in the polishing composition is 30 m | 10-09-2014 |
20140335767 | APPARATUS AND METHOD FOR DETERMINISTIC CONTROL OF SURFACE FIGURE DURING FULL APERTURE PAD POLISHING - A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions. | 11-13-2014 |
20140349554 | POLISH PAD, POLISH METHOD, AND METHOD MANUFACTURING POLISH PAD - A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin. | 11-27-2014 |
20140370788 | LOW SURFACE ROUGHNESS POLISHING PAD - The invention provides a polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 μm to about 10 μm. | 12-18-2014 |
20150017887 | POLISHING APPARATUS AND POLISHED-STATE MONITORING METHOD - A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness. | 01-15-2015 |
20150017888 | ABRASIVE BRISTLE, METHOD FOR THE MANUFACTURE THEREOF, BRUSH WITH ABRASIVE BRISTLES AND METHOD FOR THE SURFACE TREATMENT OF A WORKPIECE WITH A BRUSH HAVING ABRASIVE BRISTLES - For the manufacture of an abrasive bristle, a plastic material is melted, and a granular material made of abrasive particles is mixed into the melt. The melt is extruded together with the abrasive particles into a filament, and the filament is subsequently treated and cut up. The plastic material may be a high-temperature-resistant polymer with a continued use temperature of ≧150° C. and for the melt with the abrasive particles to be extruded at a temperature of ≧280° C. A brush equipped with corresponding abrasive bristles can be used for the surface treatment of a workpiece, whereby the brush is rotated with a speed in the range of 3,000 rpm to 12,000 rpm and is brought into contact with the surface to be treated. | 01-15-2015 |
20150044949 | Grinding Device and Method for Grinding Panel - The present invention discloses a grinding device and a grinding method. The grinding device for grinding a panel includes a grinding belt held between an upper surface and a bottom surface of the panel for grinding both surfaces of the panel simultaneously, a transferring mechanism for transferring the grinding belt and a belt pressing mechanism for pressing the grinding belt on the upper surface and the bottom surface of the panel. The grinding device and the grinding method in the present invention save manufacturing cost by reducing numbers of grinding belt in a grinding period because it uses one grinding belt to grind the upper surface and the bottom surface of the panel at the same time. Furthermore, the grinding belt exerting evenly on the upper and bottom surfaces of the panel in use of one grinding belt enhances flatness of two surfaces of the panel. | 02-12-2015 |
20150056895 | ULTRA HIGH VOID VOLUME POLISHING PAD WITH CLOSED PORE STRUCTURE - The invention provides a polishing pad for chemical-mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad. | 02-26-2015 |
20150065016 | DECONTAMINATION DEVICE AND METHOD FOR REMOVING CONTAMINANTS FROM ELECTRICAL APPARATUS - A device for removing contaminants from a bus stab of an electrical enclosure is provided. The electrical enclosure includes an electrical bus member disposed in a first plane. The bus stab extends outwardly from the electrical bus member and is disposed in a second plane perpendicular to the first plane. The device includes a gripping assembly and a scraping assembly coupled thereto, the scraping assembly comprising a number of flexible members structured to scrape and thereby clean the bus stab, the device being structured to move in a direction parallel to the second plane when the flexible members scrape the bus stab. | 03-05-2015 |
20150093970 | SYSTEM AND METHOD OF MAGNETIC ABRASIVE SURFACE PROCESSING - Disclosed are various embodiments for a system and method of processing a surface using a mixture containing magnetic particles. A mixture is disposed on a workpiece and exposed to a dynamic magnetic field. In response to the dynamic magnetic field, the magnetic particles of the mixture may move along the workpiece. The movement of the magnetic particles creates a pattern of grooves on the surface of the workpiece. | 04-02-2015 |
20150111476 | CMP POLISHING PAD HAVING EDGE EXCLUSION REGION OF OFFSET CONCENTRIC GROOVE PATTERN - The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves. | 04-23-2015 |
20150118941 | METHOD AND APPARATUS FOR SHORTENING THE ROTOR BLADES OF A TURBOMACHINE - A method for shortening one or more rotor blade(s) ( | 04-30-2015 |
20150133037 | Devices, Methods and Systems for Restoring Optical Discs - The invention relates to devices, systems and methods for restoring optical discs, including CD's, DVD's and Blu-ray discs. The invention provides an easy to use device for user's to repair optical discs without having to clean or remove rotating pads in the device between uses for the life of the pads of about 84 cycles. | 05-14-2015 |
20150133038 | SUBSTRATE HOLDER, POLISHING APPARATUS, POLISHING METHOD, AND RETAINING RING - A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad and the pad pressing structure has a width in a range of 3 mm to 7.5 mm. | 05-14-2015 |
20150298284 | Polishing System with Front Side Pressure Control - A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface opposite to the first surface, a carrier head to hold a substrate against the polishing pad, and a control assembly adjacent the second surface of the platen and opposite to the carrier head. The platen comprises a platen material having an adjustable rigidity. The control assembly is configured to control the rigidity of the platen material. | 10-22-2015 |
20150306727 | POLISHING METHOD AND HOLDER - A polishing method includes a polishing process of polishing a surface to be polished of an object by relatively rotating a holding fixture and a polishing pad with the surface to be polished of the object held on the holding fixture being pressed against and placed in contact with the polishing pad, while supplying a polishing composition onto the polishing pad. During the polishing process, the object held on the holding fixture turns around with the surface to be polished of the object facing the polishing pad to change the orientation of the object. | 10-29-2015 |
20150314423 | CIRCULAR SUPPORT PLATE, NONWOVEN FABRIC POLISHING ROLL, ROLL ASSEMBLY, AND POLISHING METHOD - A nonwoven fabric polishing roll having a through hole into which a rotating shaft of a polishing machine is inserted, that includes a polishing portion formed by stacking a plurality of circular nonwoven fabrics having an aperture that forms the through hole; and two circular support plates located one at each of both ends in the stacking direction of the polishing portion, having an aperture that forms the through hole, and having an external diameter that is substantially the same as that of the circular non-woven fabric; wherein, the circular support plates include nonwoven fabric that is hardened in a compressed state. | 11-05-2015 |
20150322294 | POLISHING COMPOSITION - Provided is a polishing composition which can suppress scratches on the surface of a metal substrate as an object to be polished, while suppressing dishing of the metal substrate. Disclosed is a polishing composition including functional polishing particles and water, the functional polishing particles containing a surface-modifying group having, at one end, a functional group that suppresses dissolution of a metal substrate by adsorbing to the metal substrate, and metal oxide particles to which the surface-modifying group is immobilized. | 11-12-2015 |
20150343603 | METHOD OF USING AN ABRASIVE ARTICLE INCLUDING SHAPED ABRASIVE PARTICLES - A method of removing material from one or more workpieces including moving a coated abrasive article having a plurality of shaped abrasive particles relative to a surface of the one or more workpieces at high material removal rates. | 12-03-2015 |
20150367477 | A BRUSH UNIT, A DEVICE FOR BRUSH-POLISHING THAT USES THE BRUSH UNIT, A SYSTEM FOR BRUSH-POLISHING, AND A METHOD FOR BRUSH-POLISHING - The purpose of the present invention is to provide a device for brush-polishing by means of a polishing brush that rotates and revolves as in a planetary motion, wherein the conditions to polish can be easily set in accordance with the properties of the workpiece and the purposes to polish. A brush unit has a polishing brush that rotates and revolves. The brush unit includes a mechanism for driving the rotation that rotates the polishing brush and the mechanism for driving the revolution that revolves it. By adjusting the speed of the rotation by the mechanism for driving the rotation the capabilities to polish the workpiece are enhanced. By adjusting the speed of the revolution by the mechanism for driving the revolution the entire workpiece is uniformly polished. | 12-24-2015 |
20150375359 | COMPONENT SURFACE FINISHING SYSTEMS AND METHODS - Methods for finishing a component include providing the component comprising one or more interior surfaces fluidly connected to one or more exterior surfaces, providing a plurality of magnetic particles, and applying a magnetic field so as to repeatedly move the magnetic particles against the interior surfaces and exterior surfaces of the component. | 12-31-2015 |
20160001417 | POLISHING MATERIAL FOR POLISHING HARD SURFACES, MEDIA INCLUDING THE MATERIAL, AND METHODS OF FORMING AND USING SAME - Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields. | 01-07-2016 |
20160016279 | MODIFYING SUBSTRATE THICKNESS PROFILES - A polishing system include a support to hold a substrate having a substrate surface to be polished, a carrier to hold a polishing pad in contact with the substrate surface, and a pressure applicator to apply pressure at a selected region of a back surface of the polishing pad. The back surface is opposite to the polishing surface. The pressure applicator includes an actuator and a body configured to be moved by the actuator into and out of contact with the selected region of the back surface of the polishing pad. | 01-21-2016 |
20160023320 | MACHINING TOOL INCLUDING A PIVOTING MACHINING ARM AND A METHOD OF USING THE SAME - The present disclosure relates generally to a machining tool and method for using said machining tool. The machining tool includes a machining arm including a first arm section, a second arm section, a proximate end, a distal end, and a machining arm longitudinal axis, a belt disposed around the machining arm; and a first motor operably coupled to the machining arm, wherein at least a portion of the machining arm is configured to pivot such that an angle is formed between the distal end and the machining arm longitudinal axis. The method includes the steps of placing the pivotable machining arm in a first orientation, inserting the pivotable machining arm in the desired location, determining whether the belt is in a desired position relative to the raised surface, operating the motor to rotate the belt around the pivotable machining arm, and placing the belt in contact with the raised surface. | 01-28-2016 |
20160052107 | POLISHING METHOD - There is disclosed a method of polishing a peripheral portion of a wafer having a hard film with use of an abrasive film while preventing damage to the abrasive film. The polishing method uses an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive grains held by the binder. The polishing method includes: rotating a silicon substrate having a surface on which a silicon carbide film is formed; and removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low force against the silicon carbide film on the peripheral portion of the silicon substrate. | 02-25-2016 |
20160059374 | LAPPING TOOL - A lapping tool for lapping sealing surfaces of a fitting used in a gas turbine. The tool includes a shaft having first and second ends and a longitudinal axis. A removable handle is attached to the first end and is oriented in a direction transverse to the axis. The tool also includes a removable lapping insert having an outwardly extending attachment portion that is attached to the second end of the shaft. The lapping insert includes a lapping surface which corresponds to the shape of a sealing surface of the fitting. In one embodiment, the lapping insert includes a cavity for receiving a cone portion of a fitting. Alternatively, the lapping insert includes a projection for insertion into a receptacle portion of a fitting. | 03-03-2016 |
20160074982 | PASSIVE BUFFER BRUSH AIR COOLING - In one embodiment, the present invention provides a buffer brush. When rotating, the buffer brush acts as a centrifugal pump. The buffer brush contains a core having a first side and a second side and the brush extends racially from the surface of the core. The first and second sides have at least one opening configured to allow air to flow laterally through the core. Vents on the surface of the cure are configured to allow air flowing laterally through the core to also flow radially through the vents into the brush. | 03-17-2016 |
20160074994 | Polishing Method - A polishing method which can prevent a contamination of a release nozzle for releasing a substrate, such as a wafer, from a polishing head, is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other; moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device; cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position; during cleaning of the substrate, discharging a fluid from a release nozzle located at the substrate transfer device; and after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate. | 03-17-2016 |
20160184958 | WHEEL DEBURRING DEVICE AND DEBURRING METHOD - The present invention provides a wheel deburring device, consisting of a frame, a motor, a guide rail, a swing plate, a cylinder, a servo electric cylinder and a hairbrush and the like. When in use, the device provided by the present invention can adjust the angle of the hairbrush according to the shape of the back cavity of the wheel spoke to adapt to hubs of any style, and the deburring effect is very ideal; and meanwhile, the device has the characteristics of high degree of automation, advanced process, safe and stable performance, etc. | 06-30-2016 |
20160186029 | POLISHING COMPOSITION - [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. | 06-30-2016 |