Class / Patent application number | Description | Number of patent applications / Date published |
451044000 | Edging | 62 |
20080200100 | Substrate Processing Apparatus - A substrate processing apparatus ( | 08-21-2008 |
20080207093 | METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING - Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head including a first channel adapted to apply a first fluid to the edge of the substrate; a second channel adapted to direct a second fluid onto a major surface of the rotating substrate; and a third channel adapted to direct a third fluid at the major surface of the substrate and to prevent the second fluid from diluting the first fluid. Numerous other aspects are provided. | 08-28-2008 |
20080254719 | SUBSTRATE PROCESSING METHOD - In a substrate processing method of polishing a periphery of a substrate, in a state where a first polishing surface to which abrasive grains that include particles having a chemical effect on an oxide-silicon-series or nitride-silicon-series film as a main component have been fixed is brought into contact with the periphery of a semiconductor substrate, polishing the periphery of the substrate by sliding the substrate and the first polishing surface. Moreover, in a state where a second polishing surface to which abrasive grains mainly having a mechanical effect have been fixed is brought into contact with the periphery of the substrate, polishing the periphery of the substrate by sliding the substrate and the second polishing surface. | 10-16-2008 |
20080293336 | METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS - Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to provide a pre-set film profile. Numerous other aspects are provided. | 11-27-2008 |
20080293337 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION - Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch. Numerous other aspects are provided. | 11-27-2008 |
20080311827 | Chamfering apparatus, a grinding wheel, and a chamfering method - A chamfering apparatus for chamfering an outer periphery of a disk-shaped substrate includes a grinding member having a circular hole inside thereof, wherein the hole has a diameter larger than an outer diameter of the substrate. An inner periphery of the grinding member forming the hole is a grinding surface and grinds the outer periphery of the substrate. | 12-18-2008 |
20090004952 | Polishing apparatus and polishing method - A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring the polishing tape into contact with the workpiece, a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point. | 01-01-2009 |
20090017731 | METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE - Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided. | 01-15-2009 |
20090023364 | METHOD OF MAKING A WAFER HAVING AN ASYMMETRIC EDGE PROFILE - A wafer having an asymmetric edge profile is provided. The wafer has a disk-like body. The disc-like body has a first main surface, a second main surface parallel to the first main surface, and an edge region. The disk-like body has a central line defined between the first main surface and the second main surface, the edge region has an edge profile, and the edge profile is asymmetric with respect to the central line of the first main surface and the second main surface. | 01-22-2009 |
20090036033 | METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE - A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided. | 02-05-2009 |
20090061740 | METHOD FOR MANUFACTURING SILICONE WAFERS - A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the edge of the silicon wafer. | 03-05-2009 |
20090081930 | Automatic machine and automatic method for grinding the perimetric edge of glass sheets - An automatic machine and an automatic method for grinding the perimetric edge of rectangular or nonrectangular of glass sheets arranged substantially vertically, comprising at least one conveyor and at least one workhead provided with an abrasive tool for grinding the glass sheet at its edge, following its perimetric profile by way of the relative action of movement of the glass sheet and movement of the at least one workhead. During grinding, the glass sheet is no longer supported and moved by the conveyor but by at least one carriage, to which the glass sheet is coupled by way of at least one sucker. | 03-26-2009 |
20090104853 | METHOD OF MANUFACTURING DISK SUBSTRATE - A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate. | 04-23-2009 |
20090111360 | Polishing Method, Polishing Device, Glass Substrate for Magnetic Recording Medium, and Magnetic Recording Medium - There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate | 04-30-2009 |
20090124174 | SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS - A substrate treating method includes rotating a substrate in a circumferential direction and polishing a peripheral portion of the substrate by pressing a polishing member to it using a pressing mechanism having a pressing pad. An angle of at least a part of the pressing pad with respect to an axial direction, in which the pressing mechanism makes the pressing pad press the peripheral portion of the substrate, is changed by an angle displacement mechanism which actively displaces the angle so that the polishing is performed depending on a surface to be polished in the peripheral portion. | 05-14-2009 |
20090130960 | Method For Producing A Semiconductor Wafer With A Polished Edge - The invention relates to a method for producing a semiconductor wafer with a polished edge, said method comprising the following steps:
| 05-21-2009 |
20090170406 | Wafer Production Method - The present invention is a wafer production method at least comprising a chamfering step of chamfering a wafer sliced from an ingot using a grindstone for chamfering, and a step of obtaining a product wafer thinner than the chamfered wafer by performing at least one or more than one of the following processes on the chamfered wafer: flattening, etching, and polishing, the method at least comprising a correction step of chamfering a dummy wafer equivalent in thickness to the product wafer, measuring the chamfered dummy wafer for its chamfered shape, and correcting the shape of the grindstone for chamfering based on the measured chamfered shape of the dummy wafer, at least before the chamfering step, thereby chamfering the wafer sliced from the ingot using the grindstone for chamfering having its shape corrected. Thus, it is possible to provide a wafer production method allowing a product wafer with a desired chamfered shape to be obtained in a short period of time. | 07-02-2009 |
20090176444 | WAFER POLISHING METHOD AND APPARATUS - A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished. Finally, the polishing unit is lowered to make the lower surface of the polishing member into pressure contact with the peripheral portion of the wafer, thus polishing only the peripheral portion. | 07-09-2009 |
20090247055 | METHODS FOR ETCHING THE EDGE OF A SILICON WAFER - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20090275269 | WAFER POLISHING DEVICE AND METHOD - Disclosed herein is a wafer polishing device including: an abrasive member driving device adapted to run a belt-like abrasive member in a direction crossing an outer circumferential end-edge of a wafer which is a wafer to be polished while bringing a belt-like abrasive member into contact with outer circumferential end-edge of the wafer, the abrasive member having non-abrasive sections disposed on both sides of an abrasive grain section; and a guide member having two guide surfaces shaped to conform to the outer circumferential end-edge of the wafer, the two guide surface being adapted to press, from rear sides of the non-abrasive sections, the respective non-abrasive sections of the abrasive member run by the abrasive member driving device. | 11-05-2009 |
20090291621 | RECLAMATION METHOD OF SEMICONDUCTOR WAFER - Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times. | 11-26-2009 |
20090311948 | METHOD FOR PRODUCING SEMICONDUCTOR WAFER - A semiconductor wafer is produced by a method comprising a slicing step, a fixed grain bonded abrasive grinding step and a beveling step, in which the kerf loss is reduced and the flatness is improved. | 12-17-2009 |
20100105294 | METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING - Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided. | 04-29-2010 |
20100112909 | METHOD OF AND APPARATUS FOR ABRADING OUTER PERIPHERAL PARTS OF A SEMICONDUCTOR WAFER - The invention provides a method of and an apparatus for abrading outer peripheral parts of a semiconductor wafer having a protective sheet adhesively attached to its surface where semiconductor elements are formed. The semiconductor wafer is held horizontally and an abrading tape held inside an abrading head is run and pressed against the outer peripheral part of the semiconductor wafer. The abrading tape has abrading particles attached to a base sheet by electrostatic spraying. | 05-06-2010 |
20100112910 | LINEAR PRESSURE FEED GRINDING WITH VOICE COIL - The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position. | 05-06-2010 |
20100178850 | Techniques for debris reduction when performing edge deletion on coated articles having temporary protective coatings applied thereto - Certain example embodiments of this invention relate to techniques for edge deleting coatings supported by coated articles while a temporary protective coating is applied thereto. More particularly, a stationary, enlarged, and higher powered aspirator is connected to flexible tubing, which itself has an enlarged diameter, that has a nozzle located proximate to a grinding wheel on an edge deletion unit is provided in connection with an edge deletion table. Advantageously, the edge deletion table and aspirator of certain example embodiments are capable of performing edge deletion and removal of a temporary protective coating substantially simultaneously (e.g., from a common area of interest), during which process the debris produced when edge deletion is performed is controlled and removed from the substrate of interest. | 07-15-2010 |
20100178851 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains. | 07-15-2010 |
20100190416 | Device for polishing the edge of a semiconductor substrate - Disclosed are devices and methods for chemical and mechanical polishing of the edge of a semiconductor substrate that includes a protruding residual topography in a peripheral region of the substrate resulting from a layer transfer process based on an ion implantation step, a bonding step and a detachment step, such as Smart-Cut™. To be able to remove this step-like region, exemplary devices include a polishing pad, wherein the polishing pad is arranged and configured such that its cross section in a plane perpendicular to the surface of a substrate holder is curved. The disclosure furthermore relates to a pad holder used certain exemplary devices and methods for polishing a semiconductor substrate that has a protruding residual topography. | 07-29-2010 |
20100279588 | CORNER BEVELLING ASSEMBLY FOR BEVELLING CORNERS OF GLASS SHEETS - The corners of a sheet of glass travelling in a longitudinal direction are ground by a corner bevelling assembly having a fixed frame; a movable frame; a grinding wheel; a supporting arm supporting the grinding wheel and fitted to the movable frame; and an actuating device interposed between the fixed frame and the movable frame, and having a first powered guide-slide assembly for moving the movable frame in a direction parallel to a longitudinal travelling direction of the sheet, and a second powered guide-slide assembly for moving the movable frame with respect to the fixed frame in a transverse direction perpendicular to the longitudinal direction; the corner bevelling assembly also having a reference locator which, in use, is positioned against a longitudinal lateral surface, parallel to the longitudinal direction, of the sheet; a relative-motion assembly for enabling movement, parallel to the transverse direction, of the reference locator with respect to the supporting arm; and a device for detecting the position of the reference locator with respect to the supporting arm. | 11-04-2010 |
20100279589 | GRINDING ASSEMBLY FOR BEVELLING CORNERS OF GLASS SHEETS - The corners of a sheet of glass travelling in a longitudinal direction are ground by a grinding assembly having a fixed frame; a movable frame; a grinding wheel; a supporting arm supporting the grinding wheel and fitted to the movable frame; and an actuating device interposed between the fixed frame and the movable frame, and having a first powered guide-slide assembly for moving the movable frame in a direction parallel to a longitudinal travelling direction of the sheet, and a second powered guide-slide assembly for moving the movable frame with respect to the fixed frame in a direction perpendicular to the longitudinal direction; the grinding assembly also having a locator fixed to the supporting arm and defining a stop to keep the sheet at a distance from the grinding wheel; and a compensating device interposed between the supporting arm and the movable frame, and having a third guide-slide assembly and a flexible controlled-damping device. | 11-04-2010 |
20100291839 | Grinding Method of Strip Glass and a Vacuum Suction Plate Used in the Same - A grinding method of a strip glass comprises: the strip glass to be ground is absorbed to a vacuum suction plate, then the strip glass is transferred to the glass edge chamfering apparatus by the vacuum suction plate. Grinding a side of the strip glass forms a predefined slant. Also, the strip glass is turned over and is absorbed to vacuum suction plate, then the strip glass is transferred to the glass edge chamfering apparatus and grinding the other side of strip glass forms a slant, which is the same as the predefined slant. This invention can grind a strip glass having a width of 10 mm or great smaller. The present method prevents a waste of the strip glass. | 11-18-2010 |
20100304645 | GRINDING ASSEMBLY FOR GLASS SLABS AND GRINDING HEAD FOR A RECTILINEAR GRINDING MACHINE EQUIPPED WITH SUCH ASSEMBLY - A grinding assembly ( | 12-02-2010 |
20100330885 | Method For Polishing The Edge Of A Semiconductor Wafer - A method for polishing the edge of a semiconductor wafer comprises (a) providing a semiconductor wafer which has been polished on its side surfaces and which has a rounded edge; (b) polishing the edge of the wafer by fixing the semiconductor wafer on a centrally rotating chuck, delivering the wafer to a centrally rotating polishing drum, which is inclined with respect to the chuck and to which a polishing pad containing fixedly bonded abrasives is applied, and pressing semiconductor wafer and polishing drum onto one another while a polishing agent solution containing no solids is continuously supplied. | 12-30-2010 |
20110003537 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus according to the present invention includes a substrate holder ( | 01-06-2011 |
20110021116 | METHOD FOR PROCESSING AN EDGE OF A GLASS PLATE - A method for beveling a thin glass plate by simultaneously grinding an edge of the glass using multiple abrasive cup wheels, wherein the edge of the glass plate is extended from the fixturing device. The extension of the glass plate allows the glass plate to bend in response to forces applied by the abrasive cup wheels, thereby reducing the sensitivity of the grinding process to variations in position of the abrasive wheels. The axes of rotation of the abrasive wheels are separated by a distance selected to prevent deflection in the glass plate caused by a first abrasive wheel to influence the deflection in the glass plate caused by a second (adjacent) abrasive wheel. | 01-27-2011 |
20110053466 | GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRICATING METHOD - A glass substrate spacer separating apparatus includes: a cassette adapted to load a plurality of glass substrates with spacers attached thereto in such a state that the plurality of glass substrates are separated piece by piece; a liquid tank adapted to store a liquid in which the cassette is to be submerged; and a bubble generating mechanism configured to generate bubbles which move towards an interior of the cassette which is submerged in the liquid of the liquid tank, wherein the spacers are separated individually from the plurality of glass substrates to which the spacers are attached by bringing the bubbles generated from the bubble generating mechanism into contact with surfaces of the plurality of glass substrates with spacers attached thereto which are loaded in the cassette in the liquid of the liquid tank. | 03-03-2011 |
20110081837 | COMPLEX GEOGRAPHICAL EDGE POLISHING - A complex geographical edge finishing system includes a fixture that holds an external part having a complex three-dimensional edge, a track disposed around the fixture and surrounding the edge of the part held in the fixture, and one or more finishing apparatuses that can sand, polish, buff, paint and/or apply coatings to the complex three-dimensional edge. The finishing apparatuses move about the track such that the three-dimensional edge of the part can be polished. The path of the track can substantially match, mimic or otherwise correspond to the path of the three-dimensional edge, such that special requirements for the finishing apparatuses are not required. | 04-07-2011 |
20110097975 | METHOD FOR PRODUCING A SEMICONDUCTOR WAFER - A method for producing a semiconductor wafer sliced from a single crystal includes rounding an edge using a grinding disk containing abrasives with an average grain size of 20.0-60.0 μm. A first simultaneous double-side material-removing process is performed wherein the semiconductor wafers are processed between two rotating ring-shaped working disks, each working disk having a working layer containing abrasives having an average grain size of 5.0-20.0 μm, wherein the semiconductor wafer is placed in a cutout in one of a plurality of carriers rotatable by a rolling apparatus such that the semiconductor wafer lies in a freely movable manner in the carrier and the wafer is movable on a cycloidal trajectory. A second simultaneous double-side material-removing process is performed including processing the semiconductor wafers between two rotating ring-shaped working disks, each working disk having a working layer containing abrasives having an average grain size of 0.5-15.0 μm. | 04-28-2011 |
20110143639 | GLASS-PLATE WORKING METHOD AND GLASS-PLATE WORKING APPARATUS - A glass-plate working apparatus includes a glass-plate supporting portion | 06-16-2011 |
20110237164 | POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL - A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism | 09-29-2011 |
20120077421 | METHOD AND DEVICE FOR GRINDING THE MUTUALLY PARALLEL EDGES OF GLASS PLATES - During grinding of mutually parallel edges of glass plates every edge of the glass plate is ground using a grinding tool or two grinding tools disposed one behind the other and cooling agent is directed from a side of the glass plate toward the grinding tool and supplied using a supply line divided via a redirection and separating segment into a plurality of fine streams of cooling agent, and a position of the grinding tool can be adjusted such that at least the position of the grinding tools relative to the assigned edge of the glass plate, which is passing through, is calibrated and the corners of the glass plate are ground to form a chamfer. | 03-29-2012 |
20120156972 | GLASS EDGE FINISH SYSTEM, BELT ASSEMBLY, AND METHOD FOR USING SAME - A glass edge finishing system, a belt assembly and a method are described herein for finishing an edge of a glass sheet. The glass edge finishing system comprises: (a) a base; and (b) one or more belt assemblies located on the base, where each belt assembly includes: (i) a support frame; (ii) a motor; (iii) a pair of pulleys rotatably mounted on the support frame and driven by the motor; (iv) a belt engaged to and driven by the pair of pulleys, where the belt contacts and finishes the edge of the glass sheet; (v) a belt cleaning device that removes glass debris from the belt as the belt moves past the belt cleaning device; and (vi) a cleaning containment enclosure within which there is located the belt cleaning device, where the cleaning containment enclosure contains the glass debris removed from the belt by the belt cleaning device. | 06-21-2012 |
20130005222 | GLASS EDGE FINISHING METHOD - A method for finishing an edge of a glass sheet comprising a first grinding step and a second polishing step using different abrasive wheels. The method results in consistent finished edge quality and improved edge quality in term of sub-surface damage (SSD). The method can be advantageously utilized to finish the edges of a thin glass substrate for use as substrates of display devices, such as LCD displays and the like. | 01-03-2013 |
20130130597 | GLASS TREATMENT APPARATUS AND METHODS OF TREATING GLASS - A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet. | 05-23-2013 |
20130344775 | WAFER PROCESSING METHOD - A wafer processing method of processing a wafer having an epitaxial film formed on the front side. The wafer processing method includes a holding step of holding the wafer on a holding table having a holding surface for holding the wafer and a rotational axis extending perpendicularly to the holding surface and passing through the center of the holding surface, and a removing step of pressing a grinding member on a ridge portion formed along the peripheral edge of the wafer held on the holding table and rotating the holding table about the rotational axis, thereby removing the ridge portion. | 12-26-2013 |
20140030959 | LINEAR PRESSURE FEED GRINDING WITH VOICE COIL - The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position. | 01-30-2014 |
20140051336 | GRINDING WHEEL FOR WAFER EDGE TRIMMING - A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming. | 02-20-2014 |
20140073228 | SILICON CARBIDE SINGLE-CRYSTAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A silicon carbide single-crystal substrate includes a first surface, a second surface opposite to the first surface, and a peripheral edge portion sandwiched between the first surface and the second surface, A plurality of grinding traces are formed in a surface of the peripheral edge portion. A chamfer width as a distance from an outermost peripheral end portion of the peripheral edge portion to one of the plurality of grinding traces which is located on an innermost peripheral side of the peripheral edge portion in a direction parallel to the first surface is not less than 50 μm and not more than 400 μm. Thereby, a silicon carbide single-crystal substrate capable of suppressing occurrence of a crack, and a method for manufacturing the same can be provided. | 03-13-2014 |
20140094095 | POLISHING METHOD - A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate. | 04-03-2014 |
20140099866 | DUST PROTECTION METHOD FOR GLASS SUBSTRATE EDGE POLISHING MACHINE - The present invention provides a dust protection method for glass substrate edge polishing machine, which includes (1) providing an edge polishing machine and a glass substrate to be polished, wherein a dust protection board is arranged above a platform bearing a glass substrate to form a first gap therebetween and an air blow tube is provided in front of a grind stone; (2) fixing the glass substrate on the edge polishing machine; (3) introducing cooling water from the dust protection board to form a water curtain at the first gap; (4) activating the air blow tube to form an air curtain region; and (5) activating the grindstone to set out a grinding operation. The dust protection board and the water curtain block particles generated in grinding and the air curtain region blows residual water that contains particles off edges of the glass substrate. | 04-10-2014 |
20140106648 | GLASS-PLATE WORKING METHOD AND GLASS-PLATE WORKING APPARATUS - A glass-plate working apparatus includes a glass-plate supporting portion | 04-17-2014 |
20140187126 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus | 07-03-2014 |
20140206262 | POLISHING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WAFER - An aspect of the present embodiment, there is provided a polishing apparatus, including a stage configured to be placed a semiconductor wafer thereon and to be rotated with the semiconductor wafer, a first polishing unit configured to contact a polishing tape to one portion of the semiconductor wafer on the stage, a second polishing unit configured to contact to other portion of the semiconductor wafer, the other portion being different from the one portion, a feed unit configured to feeding the polishing tape, and a recovery unit configured to recovery the polishing tape. | 07-24-2014 |
20140213152 | Wafer Edge Trimming Tool Using Abrasive Tape - A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process. | 07-31-2014 |
20140213153 | Wafer Polishing Tool Using Abrasive Tape - An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process. | 07-31-2014 |
20140213154 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool. | 07-31-2014 |
20140213155 | WAFER POLISHING APPARATUS AND METHOD - An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool. | 07-31-2014 |
20140295739 | METHOD FOR POLISHING EDGE OF GLASS SUBSTRATE OF DISPLAY PANEL - The present invention provides a method for polishing edge of glass substrate of display panel, which includes (1) conveying a glass substrate of a display panel to be polished to a polishing device and positioning the glass substrate for being subsequently polished by a grindstone of the polishing device; (2) providing first and second stop boards; (3) moving the first stop board to contact an upper surface of the glass substrate and moving the second stop board to contact a lower surface of the glass substrate; and (4) carrying out an edge polishing operation. By arranging the stop boards between the polished area and the non-polished area of the glass substrate, the glass chips generated during the polishing operation are prevented from flying and attaching to the surfaces of the non-polished area of the glass substrate during the polishing operation. | 10-02-2014 |
20140335764 | LINEAR PRESSURE FEED GRINDING WITH VOICE COIL - The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position. | 11-13-2014 |
20150298280 | POLISHING APPARATUS AND POLISHING METHOD - The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. | 10-22-2015 |
20160005593 | METHOD FOR MANUFACTURING A CIRCULAR WAFER BY POLISHING THE PERIPHERY, INCLUDING A NOTCH OR ORIENTATION FLAT, OF A WAFER COMPRISING CRYSTAL MATERIAL, BY USE OF POLISHING TAPE - Provided is a method for producing a circular wafer using a grinding tape to grind the edge of a wafer comprising a crystalline material. A primary grinding step is provided for contacting a grinding body to the peripheral portion of a wafer placed centered on a horizontal stage and rotating the stage, thus grinding the peripheral portion. The radius of the wafer is measured, and a radius is set that is no greater than the measured smallest radius, and the difference Δr between the set radius and the measured wafer radius along the peripheral portion is determined. The portions of the peripheral portion at which Δr is greater than a predetermined value are determined and a secondary grinding step is provided for contacting the peripheral portion and the grinding body, rotating the stage forwards and backwards in a predetermined range of rotational angles, and grinding the peripheral portion. | 01-07-2016 |
20170233626 | HIGH MOLECULAR WEIGHT PAG COOLANT FOR GRINDING GLASS | 08-17-2017 |