Entries |
Document | Title | Date |
20100105287 | COMPACT ELECTRIC GRINDING MACHINE - The present invention particularly relates to a hand-held sanding machine with an outer housing ( | 04-29-2010 |
20100203804 | Powder Delivery Rate Control for Air Abrasive Instruments - A micro-abrasive blasting device and method for perturbation control using a plurality of delivery conduits of various lengths and/or apertures. The user is able to individually open and close bypass conduit pinch valve(s) external to micro-abrasive blasting device to affect the perturbation intensity internal to the mixing chamber. By selectively opening and closing flow through delivery conduits it is possible to provide a more consistent perturbation rate and select the perturbation intensity internal to mixing chamber. | 08-12-2010 |
20100248589 | PRECISION GUIDANG DEVICE IN A MACHINE FOR MACHINING CYLINDRICAL COMPONENTS - The part to be machined ( | 09-30-2010 |
20110059679 | METHOD FOR SLICING WORKPIECE - The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slurry to a contact portion between the workpiece and the wire, wherein the workpiece is sliced with an axis direction of the workpiece inclined with respect to a plane formed by the wire row, after the workpiece is inclined in such a manner that a side far from the wire row plane is a side where the wire guides are to be axially expanded. As a result, there is provided a method for slicing that enable wafers having a good Warp shape to be obtained by precisely slicing a workpiece with a wire saw. | 03-10-2011 |
20110076922 | METHOD FOR SURFACE TREATMENT OF METAL PLATE AND VEHICLE TREATED THEREBY - When surface grinding finish for decoration or other purposes is performed by applying a film to the front surface of a metal plate that is welded linearly with penetration from the rear surface side thereof. In this manner, the metal plate can be subjected to the surface grinding finish such that an appearance similar to weld marks is not created. | 03-31-2011 |
20110086578 | APPARATUS AND METHOD FOR OPTICAL MANUFACTURING - An apparatus and method for lens surfacing. The apparatus includes a voice coil, piezo stack and cutter connected by a connection mechanism and regulated by a hierarchical sliding mode control system. The invention allows for both coarse and fine movements of the cutter during surfacing. | 04-14-2011 |
20110223833 | METHOD AND APPARATUS FOR THE MEASUREMENT-AIDED FINE MACHINING OF WORKPIECE SURFACES, AND MEASURING SYSTEM - In the case of a method for the material-removing fine machining of a workpiece surface of a workpiece, in particular for the honing or finishing of workpiece portions having substantially rotationally symmetrically curved workpiece surfaces, at least one fine machining tool machines the workpiece surface and, by means of a measuring system, a measurement of the workpiece surface is performed. In this case, at at least one measuring position, radar radiation is directed onto the workpiece surface, and the radar radiation reflected from the workpiece surface is acquired and evaluated for the purpose of determining at least one surface measurement value. | 09-15-2011 |
20110312246 | Multiple Airfoil Vanes - A vane for a turbine assembly of a turbocharger includes a first airfoil that includes a length between a leading edge and a trailing edge, a second airfoil that includes a length between a leading edge and a trailing edge where the length of the first airfoil optionally differs from the length of the second airfoil, and one or more intra-vane throats defined at least in part by the first airfoil and the second airfoil. Various other examples of devices, assemblies, systems, methods, etc., are also disclosed. | 12-22-2011 |
20120149279 | ABRASIVE ARTICLE WITH ARRAY OF COMPOSITE POLISHING PADS - An abrasive article for polishing a substrate surface. The abrasive article includes a holder pad assembly and an abrasive member held in place with respect to a holder pad. The abrasive member further includes a first surface engaged with the holder pad assembly, and a second surface including an abrasive. A preload mechanism is positioned to bias the second surfaces of the abrasive member toward the substrate surface. One or more fluid bearing features on the second surface of the abrasive member is configured to generate lift forces during relative motion between the abrasive article and the substrate surface. | 06-14-2012 |
20120164916 | METHOD AND APPARATUS FOR MEASUREMENT AND CONTROL OF MAGNETIC PARTICLE CONCENTRATION IN A MAGNETORHEOLOGICAL FLUID - A system for sensing and controlling concentration of magnetic particles in magnetorheological fluid comprising a wire coil and an AC voltage generator that, when energized, creates a magnetic flux field including a fringing field. When the fringing field extends through the magnetorheological fluid, the impedance in the circuit is proportional to the concentration of magnetic particles. A reference wire coil identical to the sensing wire coil is connected therewith. A demodulator is connected to each of the coils sends an impedance difference signal to a feedback controller connected to controllable dispensing apparatus for adding a calculated amount of replenishing fluid to the magnetorheological fluid. The system may be incorporated into an integrated fluid management module having apparatus for receiving and replenishing spent magnetorheological fluid and a sensor system in accordance with the present invention for use in a magnetorheological finishing system having a carrier wheel. | 06-28-2012 |
20120238184 | METHOD FOR PROVIDING AN EDGE PREPARATION ON A CUTTING EDGE OF A TOOL AND A CONTROL AND A PROCESSING MACHINE FOR CARRYING OUT THE METHOD - A method for providing an edge preparation on a cutting edge of a tool by means of an edge processing operation includes clamping the tool in a processing machine for providing the edge preparation, recording as a reference value the position of the cutting edge to be processed by means of a sensor arranged on the processing machine, carrying out an edge processing operation by means of a preparation tool, recording the position of the cutting edge again by means of the sensor arranged on the processing machine and storing the position as an actual value, monitoring the edge processing operation on the basis of a comparison between the reference value and the actual value, and comparing the actual value with a desired value for material removed on the cutting edge. | 09-20-2012 |
20120238185 | METHOD OF PHASING THREADED GRINDING STONE, AS WELL AS DEVICE THEREFOR - Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with high accuracy, with the result that the phasing of the threaded grinding stone can be accurately performed. For the purpose of achieving the above, a threaded grinding stone ( | 09-20-2012 |
20120244784 | CHEMICAL-MECHANICAL POLISHING TOOL AND METHOD FOR PREHEATING THE SAME - A chemical-mechanical polishing tool and a method for preheating the same are disclosed. The chemical-mechanical polishing tool includes: a polishing pad, a deionized water supply channel, a polishing slurry supply channel and a polishing pad conditioner; and the chemical-mechanical polishing tool further includes: a heating apparatus, adapted to heat DI water fed to the DI water supply channel; a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor is equal to or higher than a predetermined temperature, to close the DI water supply channel, control the polishing slurry supply channel to spray polishing slurry to the polishing pad, and startup the polishing pad conditioner to dress the polishing pad. The invention can reduce the consumption of polishing consumables by the chemical-mechanical polishing tool during preheating, thereby reducing production cost. | 09-27-2012 |
20120276813 | Machine Tools And Methods Of Operation Thereof - A machine tool is provided which comprises a machine base; a first support provided on a first rotational machine axis, the first rotational axis being mounted on the base in a fixed position relative to the base; a second support provided on a second rotational machine axis, the second rotational axis being mounted on the base in a fixed position relative to the base, wherein the axis of rotation of the second rotational axis is parallel to and spaced laterally from the axis of rotation of the first rotational axis. A mount is carried by a support arm on the second support, with the support arm being moveable relative to the second support about a rotary axis. A control arrangement is operable to control the orientation of the first support relative to the axis of rotation of the first rotational axis, and the orientation of the mount relative to the axis of rotation of the second rotational axis and its rotational position about the rotary axis, so as to govern the position and orientation of the first support and the mount relative to each other. Combination of motion about three rotational axes in this way facilitates versatile and accurate control of the relative orientations of the first support and the mount on the second support. The machine base may include a central support located between the machine axes, with the machine axes mounted onto opposite sides of the support. | 11-01-2012 |
20130017761 | METHOD FOR DETECTING AND/OR PREVENTING GRIND BURN - The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy current test to detect material buildup on the grinding wheel which could cause grind burn. In addition, the method includes collecting swarf from the gear during the grinding operation and inspecting the swarf for an indication of grind burn. | 01-17-2013 |
20130023185 | Method of Producing Glass Substrate for Information Recording Medium - Disclosed is a method of producing a glass substrate for an information recording medium including a precision polishing step of using a polishing material containing colloidal silica and performing precision polishing, under acidic conditions, on a glass material in which the amount of iron adhered on the surface is 0.5 ng/cm | 01-24-2013 |
20130189901 | ANGLE GRINDER COMPRISING A YAW RATE SENSOR FOR MEASURING THE HOUSING ROTATION - An angle grinder includes a housing, a drive unit configured to drive a usage tool, a sensor device configured to provide a rotation parameter, and a control unit configured to evaluate the rotation parameter to detect a clamped state of the usage tool. The sensor device has a yaw rate sensor configured to provide the rotation parameter in accordance with a rotational movement of the housing. The control unit triggers a safety mode in accordance with the rotation parameter or throttles the rotational speed and/or torque of the drive unit. | 07-25-2013 |
20130237125 | SHARPENING APPARATUS - A portable sharpening apparatus is described. The sharpening apparatus includes a body portion and a cavity formed in the body portion for receiving an object to be sharpened. A rotatable abrasive drum capable of sharpening and having an axis of rotation is provided and the abrasive drum is located in the body portion. The apparatus further comprises a motor arranged to drive the abrasive drum and a mouth communicating with the abrasive drum and arranged in the body portion so as to direct an object to be sharpened towards the abrasive drum, wherein the mouth has a supporting means for locating an object to be sharpened at the abrasive drum, the supporting means being such that, when in use, an object to be sharpened is orientated along an axis substantially perpendicular to the axis of rotation of the abrasive drum. | 09-12-2013 |
20130324012 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder. | 12-05-2013 |
20140073223 | METHOD AND APPARATUS FOR WAFER BACKGRINDING AND EDGE TRIMMING ON ONE MACHINE - A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states. | 03-13-2014 |
20140087627 | METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POLISHING APPARATUS - A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range. | 03-27-2014 |
20140094091 | BALANCING PROCESS AND DEVICE FOR A ROTATING BODY - A balancing device for a rotating body is provided, comprising at least one unbalance detector apt to measure the unbalance of the rotating body; two balancing masses apt to be handled along a handling circumference so as to cancel the unbalance; a position sensor apt to detect the mutual position of the balancing masses; and a motor apt to handle independently of each other the balancing masses as a function of their mutual position and unbalance. | 04-03-2014 |
20140106647 | MULTIFUNCTIONAL SUBSTRATE POLISHING AND BURNISHING DEVICE AND POLISHING AND BURNISHING METHOD THEREOF - The invention, involving grinding and polishing flat processing and thinning processing of hard and brittle materials such as silicon wafer, sapphire substrate and the glass substrate, belongs to ultra-precision machining technical field and provides a multifunction substrate grinding and polishing device and method for the substrate grinding and polishing, which could be used in the grinding and polishing process of flat substrate such as ceramics, metal and composite materials. The grinding and polishing of substrate are processed in three ways: axial plunge grinding and polishing, radial plunge grinding and polishing and back grinding and polishing of wafer with outer rim. Double-spindle structure consisting of grinding spindle unit and polishing spindle unit is used in the substrate grinding and polishing device where both substrate grinding and polishing can be done. The grinding spindle unit and polishing spindle counterweigh mutually via a traction rope. Since Grinding machine and polishing machine are integrated in the substrate grinding and polishing device, the grinding process and polishing process could be finished in order with just one clamping of the substrate, which improves the precision of the substrate grinding and polishing and the automation of grinding and polishing process, reduces fragmentation and improves production efficiency. | 04-17-2014 |
20140154951 | COMMON GROUND FOR ELECTRONIC LAPPING GUIDES - Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head. | 06-05-2014 |
20140154952 | WAFER GROUNDING DESIGN FOR SINGLE PAD LAPPING - Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 μm, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes. | 06-05-2014 |
20140162532 | METHOD OF POLISHING ONE SIDE OF WAFER AND SINGLE SIDE POLISHING APPARATUS FOR WAFER - A method of polishing one side of a wafer, which makes it possible to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth, is provided. In the method according to the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer, the method including the steps of measuring a contact angle of the polishing cloth (S | 06-12-2014 |
20140187122 | POLISHING APPARATUS - A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water; a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water; an ultrasonic cleaning unit coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water, which has been delivered through the gas-dissolved pure water delivery line, and then eject the gas-dissolved pure water onto an object to be cleaned; and a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit. | 07-03-2014 |
20140273745 | X-RAY METROLOGY FOR CONTROL OF POLISHING - A method of controlling a polishing operation includes receiving a first measurement of a first amount of metal on a substrate made by a first x-ray monitoring system after a first metal layer is deposited on the substrate and before a second metal layer is deposited on the substrate, transferring the substrate to a carrier head of a chemical mechanical polishing apparatus the substrate after the second metal layer is deposited on the substrate, making a second measurement of a second amount of metal on the substrate with a second x-ray monitoring system in the chemical mechanical polishing apparatus, comparing the first measurement to the second measurement to determine a difference, and adjusting a polishing endpoint or a polishing parameter of the polishing apparatus based on the difference. | 09-18-2014 |
20140273746 | CMP POLISHING PAD DETECTOR AND SYSTEM - A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the polishing pad. | 09-18-2014 |
20150017878 | SYSTEMS AND METHODS FOR PROCESSING SOLAR SUBSTRATES - A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer. | 01-15-2015 |
20150044944 | Surface Processing System for a Work Piece - The present invention provides a surface processing system for a work piece in the mechanical technical field. The system comprises at least one group of polishing units. A manipulator and several polishers with different polishing precisions are provided on the polishing units. The polishers are arranged around the manipulator in turn. The work piece could be moved by the manipulator between the processing center and the polishing units. The machined work piece is loaded by the manipulator for one time when the manipulator is located at the processing center. When the manipulator is located at the polishing units, the manipulator keeps holding the work piece and transfers the work piece in a preset sequence to each polisher corresponding to the polishing unit where the manipulator is located. The surface of work pieces having different wall thicknesses and complex surfaces could be processed in a large batch with a high efficiency. | 02-12-2015 |
20150072593 | APPARATUS INCLUDING ELECTRICAL LAPPING GUIDE AND METHODS OF USING THE SAME - An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches. | 03-12-2015 |
20150111467 | CMP HEAD STRUCTURE - A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out. | 04-23-2015 |
20160136781 | CMP HEAD STRUCTURE - A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out. | 05-19-2016 |