Class / Patent application number | Description | Number of patent applications / Date published |
442147000 | Nitrogen containing | 9 |
20090117797 | Washing-fast smoldering-suppressing compositions - Novel smoldering suppressing compositions containing a metal complex of ammonium superphosphoric acid and having a high phosphate content, and processes for their preparation, are disclosed. Further disclosed are formulations containing these compositions and articles-of-manufacture having these formulations applied thereon. These novel formulations are particularly effective as smoldering suppressants for textiles, and are characterized by a high washing fastness. | 05-07-2009 |
20090258558 | Garments Comprising High Strength Extreme Thermal Performance Outer Shell Fabric of Polybenzimidazole and Polypyridobisimidazole Fibers - This invention concerns a flame-resistant garment having an outer shell fabric comprising 50 to 95 parts by weight of a polypyridobisimidazole fiber having an inherent viscosity of greater than 20 dl/g and 5 to 50 parts by weight of polybenzimidazole fiber. | 10-15-2009 |
20100035495 | FLAME RETARDANT PRODUCTS - The invention relates to a flame retardant product comprising a one or two dimensional substrate further comprising a crystalline triazine layer. The amount of trazine is such that the flame retardant properties of the substrate are improved and preferably the amount is about 0.1 g/m2 or higher, and about 500 g/m2 or lower. The triazine is preferably vapor deposited, and is preferably melamine. | 02-11-2010 |
20110053447 | HALOGEN-FREE RESIN COMPOSITION WITH HIGH FREQUENCY DIELECTRIC PROPERTY, AND PREPREG AND LAMINATE MADE THEREFROM - The present invention relates to a halogen-free resin composition with high frequency dielectric property, and a prepreg and a laminate made therefrom. The halogen-free resin composition with high frequency dielectric property comprises, calculating according to the parts by weight of organic solids: (A) 10-50 parts by weight of copolymer of styrene-maleic anhydride; (B) 10-50 parts by weight of at least one compound having dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one polyepoxide; (D) 5-30 parts by weight of at least one phosphorus-containing flame retardant. Prepregs and laminates made from the resin composition have low dielectric constant, low dielectric dissipation factor, high glass transition temperature, high heat resistance, low moisture adsorption, and the technological operation is simple. | 03-03-2011 |
20120077401 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM - A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same. | 03-29-2012 |
20120108131 | POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are polyamide composite structures and processes for their preparation. The disclosed composite structures comprise a surface, having at least a portion made of a surface resin composition, and comprise a fibrous material being impregnated with a matrix resin composition. The surface resin composition is selected from polyamide compositions comprising a blend of (A) fully aliphatic polyamides having a melting point of less than 230° C., and (B) fully aliphatic polyamides having a melting point of at least 250° C., and wherein the matrix resin composition is independently selected from (B) or blends of (A) and (B). | 05-03-2012 |
20120129413 | HALOGEN-FREE AND PHOSPHORUS-FREE RESIN FORMULATION AND COMPOSITE MATERIALS PREPARED THEREFROM - A halogen-free and phosphorus-free resin formulation, prepared by the following method, is provided. The method includes mixing a carboxy anhydride derivative, diisocyanate, a styrene maleic anhydride (SMA) copolymer derivative and a solvent to form a mixture, and heating the mixture to form a resin formulation. The disclosure also provides a halogen-free and phosphorus-free composite material with a low dielectric constant and flame resistance prepared from the resin formulation. | 05-24-2012 |
20140199906 | CYANATE-BASED RESINS WITH REDUCED VISCOSITY AND DUROMERS PRODUCED THEREFROM WITH IMPROVED IMPACT RESISTANCE - The invention relates to a cyanate resin that can be obtained by mixing at least
| 07-17-2014 |
20160083618 | POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF - An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R | 03-24-2016 |