Class / Patent application number | Description | Number of patent applications / Date published |
442117000 | Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing | 10 |
20080200085 | Textile or Fabric - A textile or fabric ( | 08-21-2008 |
20080261472 | PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME - A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %. | 10-23-2008 |
20080268732 | Yarns and fabrics having a wash-durable non-electrically conductive topically applied metal-based finish - Durable non-electrically conductive metal treatments (such as coatings or finishes) for yarns and textile fabrics are provided. Such treatments preferably comprise silver and/or silver ions; however, other metals, such as zinc, iron, copper, nickel, cobalt, aluminum, gold, manganese, magnesium, and the like, may also be present or alternatively utilized. Such a treatment provides, as one example, an antimicrobial fiber and/or textile fabric which remains on the surface and does not permit electrical conductivity over the surface. The treatment is extremely durable on such substrates; after a substantial number of standard launderings and dryings, the treatment does not wear away in any appreciable amount and thus the substrate retains its antimicrobial activity (or other property). | 10-30-2008 |
20120315814 | HIGH-FREQUENCY COPPER FOIL COVERED SUBSTRATE AND COMPOUND MATERIAL USED THEREIN - A high-frequency copper claded laminate for use in an operational frequency of at least 1 GHz possesses properties of dielectric constant (Dk) less than 3.2, dissipation factor (Df) less than 0.005, high glass transition temperature, high thermal stability and low moisture absorption; the laminate contains a tack-free prepreg constituted by a reinforcement impregnated with an inventive resin mixture at least comprising a high-molecular-weight polybutadiene resin, a low-molecular-weight polybutadiene resin, a modified thermosetting polyphenylene ether resin and an inorganic powder; and particularly the tack-free prepreg can be processed into the copper claded laminates through automated layup processing to satisfy a long-felt but unmet needs in the filed of producing copper claded laminate. | 12-13-2012 |
20130012088 | MOLDING MATERIAL HAVING VIBRATION-DAMPING PROPERTY AND MOLDED ARTICLE - There are provided a cyanate ester resin composition for highly multilayered printed wiring boards for high-frequency applications which exhibits excellent heat resistance and dielectric characteristics and which can yield moldings with an excellent surface appearance, a prepreg prepared using the same, and a metal foil-clad laminated sheet. The resin composition comprises (a) a cyanate ester resin having two or more cyanate groups in the molecule, (b) a bisphenol A epoxy resin having two or more epoxy groups in the molecule, (c) a novolak epoxy resin having two or more epoxy groups in the molecule, (d) a brominated polycarbonate oligomer, (e) a low polymer of styrene and/or a substituted styrene, (f) spherical silica particles having a mean particle diameter of 3 μm or less, and (g) a wetting and dispersing agent. | 01-10-2013 |
20130225023 | Dielectric Fluids Comprising Polyol Esters - Dielectric fluids are provided, the dielectric fluids comprising a mixture of polyol esters derived from a reaction of a) a polyol comprising pentaerythritol, trimethylolpropane, neopentyl glycol, or combinations thereof, and b) a mixture of fatty acid esters derived from a high oleic soybean oil comprising fatty acid moieties, wherein the high oleic soybean oil has a C18:1 content of greater than 65% of the fatty acid moieties in the oil, and a combined C18:2 and C18:3 content of less than 20% of the fatty acid moieties in the oil. Also provided are electrical apparatuses comprising the dielectric fluids, and processes for preparing the mixtures of polyol esters. | 08-29-2013 |
20140127958 | DIBLOCK COPOLYMER MODIFIED NANOPARTICLE-POLYMER NANOCOMPOSITES FOR ELECTRICAL INSULATION - The invention relates to an electric insulation material including modified nanoparticles, a porous substrate and polymer matrix, wherein the modified nanoparticles include a nanoparticle and a diblock copolymer covalently attached to the nanoparticle, the diblock copolymer including a first block polymer of molecular weight greater than 1000 and a glass transition temperature below room temperature attached to the nanoparticle and a second block polymer of molecular weight greater than 1000 covalently linked to the first block polymer, wherein the second block polymer and the matrix both possess the same chemical functionality. Other electrical insulation materials and methods of making such electrical insulation materials are also disclosed. | 05-08-2014 |
20140370771 | RESIN COMPOSITION, PREPREG AND METAL FOIL-CLAD LAMINATE - Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h). | 12-18-2014 |
20150313012 | RESIN COMPOSITION AND ITS USE - Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device. | 10-29-2015 |
20160255718 | AN EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER-CLAD LAMINATE MADE BY USING SAME | 09-01-2016 |