Class / Patent application number | Description | Number of patent applications / Date published |
439069000 | Overlying second, coextensive micro panel circuit arrangement | 7 |
20090075500 | Connector with dual compression polymer and flexible contact array - A socket connector includes an insulative carrier having opposite first and second sides and a plurality of vias extending between the first and second sides. A plurality of polymer columns is held by the carrier. Each polymer column includes a first end extending from the first side of the carrier and a second end extending from the second side of the carrier. A contact array is disposed on each first and second side of the carrier. Each contact array comprises a flexible sheet having a plurality of conductive elements having contact tips proximate corresponding first and second ends of the polymer columns. The conductive elements on the first side of the carrier are electrically connected to corresponding conductive elements on the second side of the carrier through the vias in the carrier to establish electrical paths between corresponding contact tips on the first and second sides of the carrier. | 03-19-2009 |
20090111292 | Surface Mount Technology Pad Layout for Docking Connector Systems - A pad array for a surface mount technology board includes a front row ground pad as a single pad, followed by a signal pad. The ground pads internal to the array may be arranged as pairs of pads interconnected to each other, with sandwiching signal pads on the internal portion of the array. To minimize stress on connector wafers of large scale connectors, external rows of ground pads may be enlarged by a predetermined amount in a Y-direction to minimize potential formation of stress risers, while ensuring that electrical spacing requirements to adjacent signal leads may be preserved for optimal signal integrity. | 04-30-2009 |
20090246983 | Integrated Circuit Socket Set - An integrated circuit socket set includes a package receiving unit and a package fixing unit. The package receiving unit includes an insulating housing provided with a plurality of contacts. The insulating housing includes a frame with a recess. The contacts at least partially extend into the recess. The package fixing unit includes a base plate and a load applying plate. The load applying plate is rotatable with respect to the base plate by movement of a lever. The lever has an arm arranged on one side of the base plate. The base plate is provided with an opening that receives the frame of the insulating housing. The opening in the base plate being formed such that the frame of the insulating housing is received in the base plate in an initial position and in a position wherein the base plate is rotated at least 90 degrees from the initial position. | 10-01-2009 |
20090258511 | PRINTED WIRING BOARD SOLDER PAD ARRANGEMENT - A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions. | 10-15-2009 |
20090263988 | IC socket with improved contact having deformable retention portion - An IC socket ( | 10-22-2009 |
20090305525 | Electrical connector having reinforcement member attached to housing - An electrical connector ( | 12-10-2009 |
20090305526 | IC SOCKET HAVING IMPROVED LATCH DEVICES - An IC socket ( | 12-10-2009 |