Class / Patent application number | Description | Number of patent applications / Date published |
438279000 | Making plural insulated gate field effect transistors having common active region | 15 |
20080305595 | METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING OPENINGS - There is provided a method of forming a semiconductor device. According to the method, a gate pattern having a capping insulating layer is formed on a substrate, a first etch stop layer is conformably formed. A first interlayer insulating layer having a planarized upper surface, a second etch stop layer and a second interlayer insulating layer are sequentially formed on the first etch stop layer. A first opening and a second opening are formed. The first opening penetrates the second interlayer insulating layer, the second etch stop layer, the first interlayer insulating layer, the first etch stop layer and the capping insulating pattern to expose the gate electrode, and the second opening penetrates the second interlayer insulating layer, the second etch stop layer, the first interlayer insulating layer and the first etch stop layer to expose the substrate. The forming the first and second openings includes at least one selective etching process and a nonselective etching process. | 12-11-2008 |
20090253238 | METHOD OF FORMING MULTIPLE FINS FOR A SEMICONDUCTOR DEVICE - A fabrication process for a FinFET device is provided. The process begins by providing a semiconductor wafer having a layer of conductive material such as silicon. A whole-field arrangement of fins is then formed from the layer of conductive material. The whole-field arrangement of fins includes a plurality of conductive fins having a uniform pitch and a uniform fin thickness. Next, a cut mask is formed over the whole-field arrangement of fins. The cut mask selectively masks sections of the whole-field arrangement of fins with a layout that defines features for a plurality of FinFET devices. The cut mask is used to remove a portion of the whole-field arrangement of fins, the portion being unprotected by the cut mask. The resulting fin structures are used to complete the fabrication of the FinFET devices. | 10-08-2009 |
20100003797 | METHOD FOR FORMING TRANSISTOR WITH HIGH BREAKDOWN VOLTAGE - Transistors are formed using pitch multiplication. Each transistor includes a source region and a drain region connected by strips of active area material separated by shallow trench isolaton structures. The shallow trench isolaton structures are formed by dielectric material filling trenches that are formed by pitch multiplication. During pitch multiplication, rows of spaced-apart mandrels are formed and spacer material is blanket deposited over the mandrels. The spacer material is etched to define spacers on sidewalls of the mandrels and the mandrels are subsequently removed, thereby leaving free-standing spacers. The spacers constitute a mask, through which an underlying substrate is etched to form the trenches and strips of active area material. The trenches are filled to form the shallow trench isolaton structures. The substrate is doped to form source, drain and channel regions and a gate is formed over the channel region. In some embodiments, the shallow trench isolaton structures and the strips of material facilitate the formation of transistors having a high breakdown voltage. | 01-07-2010 |
20110076819 | Three-dimensional semiconductor memory device and method of fabricating the same - A method of fabricating a semiconductor memory device includes alternately and repeatedly stacking sacrificial layers and insulating layers on a substrate, forming an active pattern penetrating the sacrificial layers and the insulating layers, continuously patterning the insulating layers and the sacrificial layers to form a trench, removing the sacrificial layers exposed in the trench to form recess regions exposing a sidewall of the active pattern, forming an information storage layer on the substrate, forming a gate conductive layer on the information storage layer, such that the gate conductive layer fills the recess regions and defines an empty region in the trench, the empty region being surrounded by the gate conductive layer, and performing an isotropic etch process with respect to the gate conductive layer to form gate electrodes in the recess regions, such that the gate electrodes are separated from each other. | 03-31-2011 |
20110076820 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME - A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines. | 03-31-2011 |
20110081759 | POWER MOS ELECTRONIC DEVICE AND CORRESPONDING REALIZING METHOD - Power MOS device of the type comprising a plurality of elementary power MOS transistors having respective gate structures and comprising a gate oxide with double thickness having a thick central part and lateral portions of reduced thickness. Such device exhibiting gate structures comprising first gate conductive portions overlapped onto said lateral portions of reduced thickness to define, for the elementary MOS transistors, the gate electrodes, as well as a conductive structure or mesh. Such conductive structure comprising a plurality of second conductive portions overlapped onto the thick central part of gate oxide and interconnected to each other and to the first gate conductive portions by means of a plurality of conducive bridges. | 04-07-2011 |
20110097865 | HIGH VOLTAGE-RESISTANT SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING HIGH VOLTAGE-RESISTANT SEMICONDUCTOR DEVICE - High voltage-resistant semiconductor devices adapted to control threshold voltage by utilizing threshold voltage variation caused by plasma damage resulting from the formation of multilayer wiring, and a manufacturing method thereof. Exemplary high voltage-resistant semiconductor devices include a plurality of MOS transistors having gate insulating films not less than about 350 Å in thickness on a silicon substrate, and the MOS transistors have different area ratios between gate electrode-gate insulating film contact areas and total opening areas of contacts formed on the gate electrodes. | 04-28-2011 |
20110159653 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PROCESS FOR MANUFACTURING THE SAME - A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines. | 06-30-2011 |
20110237038 | Closed cell configuration to increase channel density for sub-micron planar semiconductor power device - A semiconductor power device supported on a semiconductor substrate that includes a plurality of transistor cells, each cell has a source and a drain region disposed on opposite sides of a gate region in the semiconductor substrate. A gate electrode is formed as an electrode layer on top of the gate region for controlling an electric current transmitted between the source and the drain regions. The gate electrode layer disposed on top of the semiconductor substrate is patterned into a wave-like shaped stripes for substantially increasing an electric current conduction area between the source and drain regions across the gate. | 09-29-2011 |
20110294273 | Method and Layout of Semiconductor Device with Reduced Parasitics - An semiconductor device is disclosed. The device includes a semiconductor body, a layer of insulating material disposed over the semiconductor body, and a region of gate electrode material disposed over the layer of insulating material. Also included are a source region adjacent to gate region and a drain region adjacent to the gate region. A gate connection is disposed over the semiconductor body, wherein the gate connection includes a region of gate electrode material electrically coupling a contact region to the gate electrode. An insulating region is disposed on the semiconductor body beneath the gate connection. | 12-01-2011 |
20120040506 | Method for Forming Semiconductor Device - A method for manufacturing a semiconductor device includes forming a transistor having a stacked structure in a peripheral circuit region to increase net die and forming a metal silicide layer over a source/drain region of a transistor formed over an upper layer to reduce a contact resistance. The semiconductor device may include: a second active region including a silicon layer connected to a first active region of a semiconductor substrate; a gate formed over the second active region; a spacer formed on sidewalls of the gate; a source/drain region form at both sides of the spacer; and a metal silicide layer formed over the gate and the source/drain region. | 02-16-2012 |
20120270376 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE COMPRISING A DUMMY WELL - Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device can include first transistors that include a first gate insulating layer having a first thickness and second transistors include a second gate insulating layer having a second thickness less than the first thickness. At least one of the transistors formed on the first or second gate insulating layers is directly over a dummy well. | 10-25-2012 |
20130011982 | LAYOUT METHOD OF SEMICONDUCTOR DEVICE WITH JUNCTION DIODE FOR PREVENTING DAMAGE DUE TO PLASMA CHARGE - A layout method of junction diodes for preventing damage caused by plasma charge includes forming an active layer to form a plurality of active regions in a unit layout pattern; forming a gate layer to form a plurality of gate regions on the active regions; forming a first conductive type doping region in at least one of the plurality of active regions within a well layer where a second conductive type well region is formed to form a first conductive type active region; forming a second conductive type doping region in at least one of the plurality of active regions outside of the second conductive type well region to form a second conductive type active region; and forming a second conductive type doping region connected with the gate regions to form a junction diode in at least one active region between the first and second conductive type active regions. | 01-10-2013 |
20140120676 | DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: an isolation structure for defining device regions; a gate with a ring-shaped structure; a drain located outside the ring; and a lightly doped drain, a source, and a body electrode located inside the ring. To increase the sub-threshold voltage at the corners of the gate, the corners are located completely on the isolation structure, or the lightly doped drain is apart from the corners by a predetermined distance. | 05-01-2014 |
20150147858 | METHODS OF MANUFACTURING NON-VOLATILE MEMORY DEVICES - A non-volatile memory device includes a substrate including an active region and a field region, selection transistors and cell transistors on the active region, bit line contacts on the bridge portions, and shared bit lines electrically connected to the bit line contacts. The active region includes string portions and bridge portions. The string portions extend in a first direction and are arranged in a second direction substantially perpendicular to the first direction, and the bridge portions connect at least two adjacent string portions. Each bridge portion has a length in the first direction equal to or longer than about twice a width of each bit line contact in the first direction. | 05-28-2015 |