Entries |
Document | Title | Date |
20080247141 | System for slidably coupling consumer electronic devices to an appliance - A system of an appliance host with at least a pair of generally parallel elongated interface structures cooperatively defining alternative pairs of locations for removably coupling a portable device to the outer wall and a potable device for use with the appliance. The interface structures may be rails, slots or elongated electrical connectors. | 10-09-2008 |
20080285240 | Terminal Module with Integrated Functions - The invention relates to a terminal module ( | 11-20-2008 |
20090002957 | MEMORY INTERFACE CARD WITH SIM FUNCTIONS - A plug-in adapter includes a first contact for connection to a host device, at least two second contacts for connection to a memory card, and a third contact for connection to a subscriber identity module (SIM) component. Circuitry in the adapter connects at least one of the second contacts to the third contact and connects at least another of the second contacts to the first contact so as to create a communication path between the host device and the SIM component via the memory card. | 01-01-2009 |
20090034209 | MULTI-MODULE COMBINATION TYPE PORTABLE ELECTRONIC DEVICE - A multi-module combination type portable electronic device includes a display module having a display unit to display an image, a control module having a plurality of buttons, and a connection unit to connect the display module and the control module, thereby transmitting a data signal and power from the control module to the display module, and thus, enabling use in a plurality of modes according to a combination position of the display module and the control module. | 02-05-2009 |
20090086442 | CIRCUIT MODULE - To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate. | 04-02-2009 |
20090129031 | Planar Element Module, Manufacturing Method of Planar Element Module, and Planar Element Device - A flat pressure sensor of the invention is prepared by processing a thin film of a polymer material to have plurality of substantially square openings | 05-21-2009 |
20090168370 | INTEGRATED POWER SUPPLY AND PLATFORM FOR MILITARY RADIO - An improved power supply and platform for a military radio has been developed. The apparatus includes a base that is adapted and arranged for supporting a HARRIS 117 radio and a power amplifier adapted to amplify radio frequency output of the radio. The connectors include an electrical connector for the radio and a connector for the amplifier. A power supply is housed within the assembly. A power supply for the connector to the amplifier is also housed within the assembly, Also included is a wiring harness for a SINCGARS LS/671 device and a LED indicator to identify which radio is in operation for multiple radio configurations. | 07-02-2009 |
20090257200 | Device - A device, a module being insertible into a housing-forming recess of the device, energy and/or data being transmittable in a contactless manner. | 10-15-2009 |
20090257201 | Device Bracket with Integrated Device Hub - An device bracket for mounting devices to a flat panel display incorporates a device hub able to form a network with devices coupled to it where the device hub associates one or more physical characteristics to devices coupled to it, including locality, orientation and position relative to the device hub. The device hub is conveys data indicating these physical characteristics associated with these devices to one or more of the devices coupled to it, thereby either enabling the devices with those physical characteristics to modify the manner in which they perform their own functions in response to those physical characteristics, or enabling other devices to modify data that they exchange with the devices having those physical characteristics in response to those physical characteristics. | 10-15-2009 |
20090257202 | EXPENDABLE ELECTRICAL CONNECTOR - An expendable electrical connector uses a plurality of modular housings sequentially assembled for receiving receptacle assemblies. The expendable electrical connector does not use dedicated moulds for different numbers of the receptacle assemblies and cost is decreased. Two neighboring modular housings share a side plate so that total length of the expendable electrical connector will be shortened and cost will also be decreased. Each of the modular housings may be made from a metallic sheet by punching process, and used to cover each of the receptacle assemblies and the modular housings can be connected with each other. The modular housings provide a good performance of grounding and shielding electromagnetic interference without dedicated grounding steps for individual receptacle assemblies. | 10-15-2009 |
20090257203 | MOBILE COMMUNICATION DEVICE WITH REPLACEABLE FUNCTIONAL MODULES - A mobile communication device with replaceable function modules includes a main body and an externally connected device. The main body serves as a central member, and has a main hybrid joint including an electrical contact and a magnetic joint. The main hybrid joint of the main body is joined to a device hybrid joint of the externally connected device, so as to realize the function thereof. When joined together, the main body activates a functional module of the externally connected device functional module. In addition, the main body and the externally connected device are further joined through the magnetic joints. Therefore, when separated by accidentally falling onto the ground, the mobile communication device can be rejoined through the magnetic joints, and thus it is unnecessary to worry about the unavailability due to the break-down of the joint portion. | 10-15-2009 |
20090279268 | Module - A module is provided. The module includes a first module unit provided at a top surface with a cavity and a second module unit on which one or more electronic devices are mounted. The second module unit is at least partly received in the cavity of the first module unit. | 11-12-2009 |
20090290312 | MODULAR RACKS AND METHODS OF USE - A structural configuration and methods. A structural configuration includes a support structure having at least one module supporting a computer server disposed therein. Each module includes at least one support member separating the module from each adjacent module. The support member is configured to transmit simultaneously both power and data. A method for connecting servers includes placing a first server inside a first module which includes a first structural member configured to conduct both electrical power and data to the first server. A second server is placed inside a second module which includes a second structural member. The second module is placed on top of the first module. The first member supports the second module and separates the second module from the first module, resulting in the first member connecting to the second member. A method for using a computer support structure is also included. | 11-26-2009 |
20100033936 | Method and apparatus for rapid and dynamic RF and microwave circuit prototyping and integration - A method and apparatus for rapid and dynamic RF and Microwave circuit prototyping and integration provides a standard test fixture for testing any single device from any device vendors, provides a rapid dynamic tool for sub-system and system integration and prototyping, provides a flexibility to make any single function or multi-function assembled module quickly and economically. This prototyping approach can help RF/microwave companies share development times and costs. The combination of standard PCB function cells and dynamic standard mechanical cells helps build a prototype design quickly and reduce R&D costs. | 02-11-2010 |
20100128446 | SECURITY SYSTEM INCLUDING MODULAR RING HOUSING - A modular building system arrangement includes a plurality of electrical building systems. Each electrical building system has a housing with a mechanical connector that is connectable with a like connector of each other building system housing. Members of any subset of the building system housings are connectable with each other to form a building system assembly. The building systems of the building system assembly conjointly define an electrically conductive pathway interconnecting each of the building systems of the building system assembly. The pathway carries power and/or data. | 05-27-2010 |
20100157546 | Connecting a Plurality of Chassis Using a Rigid Connection - Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis. Connecting the first chassis and the second chassis may allow the first and second chassis to communicate. | 06-24-2010 |
20100182753 | SYSTEM FOR MOUNTING A DEVICE TO A HOST - A system for mounting a device to a host, such as an appliance, includes elongated, substantially parallel device interfaces for removably mounting the device to the host. The device interfaces can include rails, slots and/or electrical conductors. | 07-22-2010 |
20100208434 | MOBILE TERMINAL HAVING DETACHABLE SUB-MODULE - A mobile terminal having a detachable sub-module is disclosed. The mobile terminal includes a sub-module having a sub-function configuration unit formed with parts for performing a function and a main terminal having a display unit at a front surface and a connection unit at a rear surface for coupling the sub-module to the main terminal. A magnet is installed at a side surface of the connection unit or the sub-module, and the sub-module is coupled to the main terminal or is detached from the main terminal through the magnet. Enhancement of the portability and function quality of mobile terminals that support various functions is achieved by coupling a sub-module for performing a function to the main terminal having a display unit that allows user interactivity with the mobile terminal. | 08-19-2010 |
20100214747 | MODULAR ELECTRIC SYSTEM - The present invention relates to a modular electric system with a base module ( | 08-26-2010 |
20100271787 | Sensor module - A sensor module includes a housing and a chip system disposed therein, the chip system being disposed on a substrate and being embedded in a sealing layer deposited on the substrate. The chip system is disposed in a window region of a frame structure disposed on the substrate, the frame structure featuring substantially the same thermal expansion properties as the substrate. | 10-28-2010 |
20100290197 | Modular Data Center and Associated Methods - A number of structural modules are configured to be secured together and to be secured to a foundation. Each of the structural modules is without one or more sidewalls, such that when the structural modules are secured together they form a building structure that encloses an open region which continuously extends through interiors of the structural modules. Each of the number of structural modules is structurally formed to be independently transported. A power module is configured to be secured to one of the structural modules and to the foundation. The power module is defined as an enclosed structure and is structurally formed to be independently transported. The power module is equipped with electrical components for supplying and distributing electrical power to a pre-defined layout of data equipment to be deployed within the open region of the building structure formed by the number of structural modules. | 11-18-2010 |
20100296256 | CONFIGURABLE MODULE AND MEMORY SUBSYSTEM - A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair. | 11-25-2010 |
20100315789 | CIRCUIT BOARD DEVICE AND CIRCUIT BOARD MODULE DEVICE - Provided is a circuit board device in which printed wiring boards | 12-16-2010 |
20100321900 | CIRCUIT BOARD HAVING CONDUCTIVE SHIELD MEMBER AND SEMICONDUCTOR PACKAGE USING THE SAME - A circuit board having a board body includes a via structure. The via structure includes a conductive connector passing through the board body and a conductive shield member surrounding at least a portion of the conductive connector. The shield member prevents distortion of a data signal applied to the conductive connector, and also intercepts electromagnetic waves generated by the conductive connector. | 12-23-2010 |
20110038126 | Multifunctional/Modular Smoke Alarm Device - An improved smoke detector device comprising a base for mounting to a place on a ceiling or a wall via a mounting means; and a ring for removably attaching to the base, the ring comprising at least two modules that removably connect together via a connecting means to form the ring, wherein each module comprises an inner chamber and a door, the inner chamber of each module can hold an item, the door of each module can move between an open position and a closed position for respectively allowing and preventing access to the inner chamber of the module. | 02-17-2011 |
20110063804 | Portable Electronic Device - A portable electronic device includes a main body and a power converter. The main body includes a first housing and a main circuit disposed within the first housing. The main circuit includes a power input end located on a side surface of the first housing. The power converter includes a second housing and a power modulating circuit. A side surface of the second housing is detachably assembled to the side surface of the first housing. The modulating circuit is disposed in the second housing, and includes a power output end and a utility power input end. The power output end is located on the side surface of the second housing, and the utility power input end is located on another side surface of the second housing. The power modulating circuit is capable of modulating utility power from the utility power input end to modulated power suitable for the main circuit, and the modulated power s outputted from the power output end. When the side surface of the second housing is assembled to the side surface of the first housing, the power output end on the second housing is electrically connected to the power input end on the first housing thereby transmitting the modulated power to the main circuit. | 03-17-2011 |
20110176281 | VEHICLE CONTROL DEVICE - A vehicle control device includes plural functional modules each of which is a minimum part unit that contributes to change in input/output potentials, and has an input and an output of one power line or one set of power lines, except for power lines having a same potential as that on an overhead wire side or that on a ground side. The functional module has an interface surface on one side surface, to which both of a signal line and the power line are connected. Each interface surface is divided into a first interface area in which a signal line terminal connected to the signal line is placed, and a second interface area in which a power line terminal connected to the power line is placed. The plural functional modules are adjacently arranged such that the interface surfaces face in a same direction, the first interface areas are located on one end side in common, and the second interface areas are located on the other end side in common. | 07-21-2011 |
20110188209 | Processes for Enhanced 3D Integration and Structures Generated Using the Same - An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks. | 08-04-2011 |
20110235282 | CONFORMAL SHIELDING PROCESS USING PROCESS GASES - In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures. | 09-29-2011 |
20110286186 | Monitoring Systems and Backplane For A Monitoring System - A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module. | 11-24-2011 |
20110292618 | APPARATUS, ADD-ON MODULE, AND A SYSTEM COMPRISING A HOST APPARATUS AND AN ADD-ON MODULE - An apparatus ( | 12-01-2011 |
20110317371 | ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF - An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic component package module is mounted on a surface of a packaging layer. The first and second electronic component package modules respectively include at least two semiconductor chips laminated. A first redistribution layer is between the first and the second electronic component package modules, electrically connected to the first and the second electronic component package modules. A conductive bump is mounted on a bottom of the second electronic component package module, electrically connected to the second electronic component package module. | 12-29-2011 |
20110317372 | SEMICONDUCTOR DEVICE - A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals on the first surface; a plurality of second sets of terminals on the first surface; and a plurality of first signal lines. The terminals of the first set receive respective ones of a plurality of first signals supplied from a control device. Each of the second sets is provided for a corresponding one of the memory packages. The terminals of each of the second sets contact the corresponding one of the memory packages. The first signal lines extend from respective ones of the terminals of the first set while coupling respective ones of the terminals of each of the second sets. The first signal lines extend on the first surface without extending in the wiring board. | 12-29-2011 |
20120069529 | POWER CONVERSION MODULE - A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module. | 03-22-2012 |
20120081858 | FLEX CABLE AND METHOD FOR MAKING THE SAME - An assembly of substrate packages interconnected with flex cables. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing detachable inter-package flex cable connection. The flex cable comprises a transmission region that includes a plurality of signal traces and a ground plane. A plurality of solder mask strips are disposed on the plurality of signals traces to provide anchoring for the signal traces. The solder mask strips intersect the signals traces. The exposed signal traces and the ground plane are coated with organic solderability preservative material. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads. | 04-05-2012 |
20120147567 | Networking Packages Based on Interposers - A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections. | 06-14-2012 |
20120162931 | 3D POWER MODULE PACKAGE - Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit. | 06-28-2012 |
20120224332 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF - An integrated circuit packaging system and method of manufacture thereof includes: a substrate; a first module attached to the substrate; a conductive connection built on the first module and conductively connected thereto; an adhesive spacer on the first module with the conductive connection exposed; and a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby. | 09-06-2012 |
20120250265 | CIRCUIT MODULE MANUFACTURING METHOD, CIRCUIT MODULE, AND ELECTRONIC APPARATUS INCLUDING CIRCUIT MODULE - A method of manufacturing a plurality of circuit modules includes cutting a mother board including a plurality of electronic components mounted on at least a single surface thereof, and cutting out a plurality of circuit boards from the mother board. A plurality of terminal electrode boards, each of which is arranged so as to straddle at least the circuit boards that are adjacent to each other, are mounted onto one surface of the mother board. The mother board including the terminal electrode boards mounted on the one surface, and the electronic components, mounted on the at least single surface, is diced at positions where the circuit boards are to be cut out. | 10-04-2012 |
20120257358 | Microelectronic Assemblies - Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector. | 10-11-2012 |
20120314377 | PACKAGING STRUCTURE EMBEDDED WITH ELECTRONIC ELEMENTS AND METHOD OF FABRICATING THE SAME - A packaging structure is provided which includes: a substrate, at least an electronic module, and an adhesive material. The substrate has two opposing surfaces, at least an opening penetrating the two surfaces, and two metallic frames formed on two opening ends of the at least an opening. The electronic module is disposed in the opening and has electronic elements and an encapsulant encapsulating the electronic elements. Each of the electronic elements has two opposing active surfaces exposed from the encapsulant and electrode pads formed on the two opposing active surfaces. The electrode pads are exposed from the opening. The adhesive material is filled into the opening and a gap between the electronic module and the opening, so as to secure in position the electronic modules in the opening. Compared with the prior art, the embedded electronic elements of the packaging structure according to the present invention is prevented from short circuit, and thus has increased yield rate. | 12-13-2012 |
20120320537 | ELECTROSTATIC DISCHARGE PROTECTION FOR MODULAR EQUIPMENT - What is disclosed is a modular visualization display panel. The modular visualization display panel includes a first module having at least one surface and a connection to electrical ground. The modular visualization display panel also includes a second module having at least one surface with a plurality of raised contact nodes arranged on the one surface of the second module such that when in contact with the one surface of the first module electrostatic discharge energy is directed over at least one of the raised contact nodes to the one surface of the first module. | 12-20-2012 |
20130021760 | MULTI-CHANNEL PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n≧2) and controls the at least one multi-channel package. | 01-24-2013 |
20130039016 | MOTHERBOARD ASSEMBLY HAVING SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE - A motherboard assembly includes a motherboard with a memory slot, an adapter board, and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board and a connector. An edge connector is set on a bottom edge of the circuit board. The adapter board includes a SATA interface, a hard disk drive (HDD) signal multiplier, a power interface, and an expansion SATA interface. The edge connector is connected to the memory slot and the connector is connected to the expansion SATA interface, to enable the motherboard communication with SATA DIMM modules, which are connected to the memory slots. | 02-14-2013 |
20130070425 | Combinative Power Device - The present invention provides a combinative power device. In one aspect, the combinative power device of the present invention includes an AC-to-DC module including a first joint portion; and a DC-to-DC module having a second joint portion and coupled to the AC-to-DC module by the second joint portion with the first joint portion electrically, wherein the DC-to-DC module acts as a removable module which can be removable from the AC-to-DC module to enable the AC-to-DC module to cooperate with different types of the DC-to-DC module. | 03-21-2013 |
20130100615 | TAPE SUBSTRATE WITH CHIP ON FILM STRUCTURE FOR LIQUID CRYSTAL DISPLAY PANEL - The present invention provides a tape substrate with COF structures for a liquid crystal display panel. A plurality of package units with the COF structures are arranged along a longitudinal direction of the tape substrate. Each of the package units includes input leads and output leads. In each of the package units, along the longitudinal direction of the tape substrate, the input leads and the output leads are disposed at both sides of the tape substrate, respectively. The present invention further provides the liquid crystal display panel using the tape substrate. | 04-25-2013 |
20130107471 | ELECTRONIC MEDIA PRODUCTION SYSTEM AND SYSTEM FOR USE THEREWITH | 05-02-2013 |
20130141874 | SLIDING MECHANISM FOR SLIDING A DISPLAY MODULE RELATIVE TO A HOST MODULE AND PORTABLE ELECTRONIC DEVICE THEREWITH - The present invention discloses a sliding mechanism for sliding a display module relative to a host module. The sliding mechanism includes a host module fixing component installed inside the host module, a display module fixing component connected to the host module fixing component, a sliding component disposed on a lateral side of the display module and installed on the display module fixing component in a slidable manner, and a roller set installed on the display module fixing component for guiding the sliding component to slide in a first direction relative to the display module fixing component, such that the display module can slide relative to the host module in the first direction. | 06-06-2013 |
20130148311 | DOUBLE-LAYER PCB OF LOW POWER WIRELESS SENSING SYSTEM AND MANUFACTURING METHOD - The invention discloses a double-layer PCB of a low power wireless sensing system and a manufacturing method thereof. The low power wireless sensing system includes a first layer and a second layer. The first layer comprises a wireless communication module, a power amplifying module, a USB module, a balun module, an antenna module, a low-frequency oscillator and a high-frequency oscillator. According to the double-layer PCB of the low power wireless sensing system and the manufacturing method thereof, a circuit layout can be performed on the double-layer PCB to reduce volume of the PCB. | 06-13-2013 |
20130182396 | CONNECTING MECHANISM AND RELATED ELECTRONIC DEVICE - A connecting mechanism of adjusting an angle of a first module relative to a second module of an electronic device is disclosed in the present invention. The connecting mechanism includes a hinge assembly disposed on the second module, a rod disposed on the hinge assembly and pivoting to the first module, a torsional spring disposed between the rod and the hinge assembly, and a damper assembly disposed on the rod and sheathed by the torsional spring. The hinge assembly includes a first hinge installed inside the second module, and a second hinge slidably disposed on the first hinge. The torsional spring drives the rod to rotate relative to the second hinge from a first position to a second position, so that the first module can stand on the second module. The damper assembly can be for absorbing a vibration generated from the rod. | 07-18-2013 |
20130194758 | APPARATUS FOR PERFORMING COMMUNICATION CONTROL - An apparatus for performing communication control includes a control module implemented with at least one integrated circuit (IC) whose package includes a plurality of sets of terminals, each set of the plurality of sets of terminals corresponding to one of a plurality of sub-modules of the control module, and within the sets of terminals, a set of terminals corresponding to a specific sub-module of the sub-modules include a power-input terminal arranged to input power from outside the control module. For example, on a printed circuit board (PCB) of the apparatus, arrangement of some modules is similar to that of some contact pads associated to the sets of terminals. In another example, the control module includes a power distribution system including at least one power distribution wire. In another example, a PCB within the apparatus includes at least one signal transmission wire and at least one set of co-plane ground wires. | 08-01-2013 |
20130208429 | POSITIVE POLE MATERIAL OF LITHIUM ION BATTERY, METHOD FOR PREPARING THE SAME, POSITIVE POLE, AND LITHIUM ION BATTERY - The present invention, relating to the battery field, discloses a positive pole material of a lithium ion battery and method for preparing the same, a positive pole of a lithium ion battery, and a lithium ion battery, which are capable of effectively preventing precipitation of metal impurity ions on a negative pole, and improving the cycle performance and high-temperature storage performance of the lithium ion battery. The positive pole material of the lithium ion battery includes: a conductive additive; nano phosphate, where the formula of the nano phosphate is LiMPO | 08-15-2013 |
20130208430 | Mount Platform for Multiple Military Radios - A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting dual AN/VRC-110 radio systems. The platform has a first power supply that includes a DC power converter for converting 110/220 alternating current into +28 Volt direct current and a second power supply that converts +28 Volt direct current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said dual AN/VRC-110 radio systems. | 08-15-2013 |
20130242509 | Multiple Configuration Electronic Thermometer - A plurality of custom thermometer models are manufactured from a universal clinical thermometer core. The thermometer core includes a housing, a controller storing a software program, a power source, a probe, a probe cord, and a display. A plurality of model selection devices are produced, each corresponding to a different thermometer model. One of the model selection devices is selected and connected to the controller. The controller operates the thermometer as a function of the connected model selection device such that the thermometer is configured with the features and default settings of the thermometer model corresponding to the connected model selection device. | 09-19-2013 |
20130294035 | Device for Accommodating Mounting Rail Module Cases - The invention relates to an accommodating device having a one-piece support that prevents damage to a circuit board and its contacts even with frequent installation and dismantling of mounting rail module cases. This is achieved in particular by the fact that the module case can be detached from an integral mounting rail of the support by pivoting it in the direction of the circuit board. This special pivoting is made possible by the fact that the integral mounting rail and the holding area of the circuit board are separated from one another spatially so that even in the installed state, the mounting rail module case and the circuit board are mechanically decoupled. | 11-07-2013 |
20130301225 | CABLE MANAGEMENT APPARATUS FOR CONNECTOR - A cable management apparatus includes two mounting brackets respectively fixed to opposite sides of an electronic device. A cable management arm connected between the two mounting brackets, two latch members slidably connected to the cable management arm, two resilient members connected between the cable management arm and the corresponding latch members. In addition, two releasing members rotatably mounted to the cable management arm and engaging with the corresponding latch members. Each of the mounting brackets defines two locking holes respectively adjacent to top and bottom. Each of the latch members includes a positioning pin selectively engaging in one of the locking holes of the corresponding mounting bracket to respectively lock the cable management arm is at upper or lower position. The releasing members can be rotated to drive the latch members to slide away from the corresponding mounting brackets to unlock the cable management arm relative to the mounting brackets. | 11-14-2013 |
20130308280 | MEMORY MODULE AND ELECTRICAL CONNECTOR FOR THE SAME - A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge. | 11-21-2013 |
20130329377 | Module Arrangement - A module arrangement including a plurality of functional modules lined up in a stacking direction, which are connected to one another for fluidic and electric communication, wherein a functional module includes a plate-shaped base body having two parallel, opposite joining surfaces which are designed to contact joining surfaces of adjacent base bodies, wherein the base body includes a connecting device designed for transferring electric signals and/or electric supply voltages and/or fluid flows between adjacent functional modules along the stacking direction, and wherein several signal lines selectable by the control module extend along the stacking direction of the functional modules for transmitting control signals provided for the direct selection of individual functional modules wherein at least one storage device for detecting, buffering and transferring at least one electric signal of an external component is electrically looped into at least one signal line. | 12-12-2013 |
20130335925 | PORTABLE ELECTRONIC DEVICE - A portable electronic device including a first body, a second body, and an assembling structure is provided. The assembling structure includes a first assembling unit and a second assembling unit. The first assembling unit is adapted to hidden in one of the first and the second bodies, and the second assembling unit is disposed and hidden in another one of the first and the second bodies. When the first body is close to the second body, the first assembling unit is protruded out of the first body or the second body, and assembled to the second assembling unit, such that the first and the second bodies are fixed to each other. | 12-19-2013 |
20130335926 | GUIDING MECHANISM FOR GUIDING FLEXIBLE PRINTED CIRCUIT BOARD CONNECTED WITH DISPLAY MODULE AND HOST MODULE AND PORTABLE ELECTRONIC DEVICE THEREWITH - A guiding mechanism includes a first guiding component, a second guiding component, a push rod, a push rod sheath and a driving component. A distance is between the second guiding component and the first guiding component and increases in a first direction. The push rod includes a rod base slidably connected to the first guiding component. The push rod sheath includes an engaging portion movably engaged with the rod base, and a guiding portion slidably connected to the second guiding component and used for pushing a flexible printed circuit board. The driving component drives the rod base to move relative to the engaging portion, so as to drive the push rod and the push rod sheath to slide relative to the first guiding component and the second guiding component. | 12-19-2013 |
20130343007 | METHOD FOR MOUNTING CONNECTION PINS IN A COMPONENT CARRIER, A DIE TOOL FOR MOUNTING CONNECTION PINS, A COMPONENT CARRIER FORMING A MODULE FOR AN ELECTRONIC ASSEMBLY, AND SUCH AN ASSEMBLY - A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool. | 12-26-2013 |
20140022737 | POWER SYSTEM AND MODULAR POWER DEVICE THEREOF - A modular power device is used for mounting on a main plate. The modular power system includes a first substrate, a driving module and a converting module. The first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction is inserted into the main plate, such that the second axial direction is substantially perpendicular to the main plate. The driving module is located on one side of the first substrate and electrically connected thereon. The converting module is located on the other side of the first substrate and electrically connected to the driving module. A length of the converting module is substantially equal to that of the first substrate in the first axial direction, and a width of the converting module is smaller than a length of the first substrate in the first axial direction. | 01-23-2014 |
20140029209 | POWER MANAGEMENT SYSTEM - A power management system includes a main controller, a pair of supporting frames extending from the main controller, and a number of mobile modules removably mounted on the supporting frames. The main controller receives power from an external power source. Each of the mobile modules is connected to a load and electrically connected to the main controller via the supporting frame. The main controller provides power to the load via the corresponding mobile module. Each of the mobile modules presets a power limit according to a rated power of the load connected to the mobile module and cuts off an electrical connection with the load when an operating power of the load is greater than the power limit. | 01-30-2014 |
20140063753 | ELECTRONIC MODULE, ELECTRONIC DEVICE, AND MOBILE UNIT - An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element. | 03-06-2014 |
20140111948 | MODULAR ACCESSORY - An accessory is provided that includes power supply module, a first functional module, and a second functional module. The power supply module can be configured to be suspended beneath an overhead support, such as a hub of an umbrella. The first functional module is configured to affix to the power supply module and to be powered by the power supply module to provide a user directed function. The second functional module is configured to be detachably coupled to either the power supply module or the first functional module to receive power from the power supply module directly or through the first functional module. | 04-24-2014 |
20140111949 | METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD, AND ELECTRONIC DEVICE - Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided. | 04-24-2014 |
20140126158 | MODULAR OVERLOAD RELAY ASSEMBLY WITH MECHANICALLY ISOLATED CONNECTOR - A mating connector assembly for electrically coupling modular electrical devices. A first stationary connector is coupled to a first rigid circuit board positioned within a first housing of a first modular electrical device. The first floating connector is coupled to a flexible circuit element positioned within a second housing of a second modular electrical device, the flexible circuit element coupled to a circuit board positioned within a second housing of a second modular electrical device. The second housing includes a first latch plate adjustable between an unlatched position and a latched position, the first latch plate including a biasing member, such that, when the first modular electronic device is pressed together with the second modular electronic device, the biasing member applies a force to the first floating connector during a latch plate transition position to ensure that the first floating connector has fully mated with the first stationary connector. | 05-08-2014 |
20140133106 | MULTIMEDIA DEVICE - A multimedia device includes a body, a first electronic module and a second electronic module. The first electronic module and the second electronic module are pivotally connected onto the body, respectively. The first electronic module and the second electronic module are configured to rotate relatively to the body and capture or display a multimedia information, respectively. | 05-15-2014 |
20140153197 | POWER SUPPLY DEVICE - A power supply device includes a first power conversion unit and a second power conversion unit. The first power conversion unit includes a first interface and a second interface. The second power conversion unit includes a third interface and a fourth interface. The third interface is configured to detachably connect to the second interface. When the third interface is connected to the second interface, the first power conversion unit and the second power conversion unit are electrically connected with each other. When third interface is disconnected from the second interface, the first power conversion unit and the second power conversion unit are detached from each other. | 06-05-2014 |
20140204538 | ASSEMBLING STRUCTURE FOR MODULE AND ELECTRONIC DEVICE HAVING IT - A mounting structure for mounting a module and an electronic device having the structure are provided. The electronic device includes at least one module, a bracket having an opening configured to contain the at least one module, a support rib extended upwardly along a boundary of the opening to support an outer circumferential surface of the at least one module, and two stopper protrusions formed on the outer circumferential surface of the at least one module in a protrusion manner to support the at least one module being restrained by the bracket and prevent the at least one module from completely passing through the opening, wherein a lower portion of the at least one module is partially inserted into the opening of the bracket. | 07-24-2014 |
20140233191 | MODULE BOARD - A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part. | 08-21-2014 |
20140254108 | THERMAL ISOLATION IN PRINTED CIRCUIT BOARD ASSEMBLIES - A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer. | 09-11-2014 |
20140328028 | ARRANGEMENT HAVING A FIRST PERIPHERAL DEVICE AND A SECOND PERIPHERAL DEVICE - An arrangement having a first peripheral device and a second peripheral device that each include basic modules that are provided with process connections and that accommodate electronic modules, where a redundancy adapter unit is provided for redundantly connecting a field device to one of the basic modules of each of the two peripheral devices such that the redundancy connection of assemblies, which are arranged in spatially separate peripheral devices, is suitable simplified. | 11-06-2014 |
20140334110 | ELECTRICAL BRIDGE - An electrical bridge is provided for electrically connecting first and second electronic modules that include first and second external chassis, respectively. The electrical bridge includes a rigid housing extending along a fixed path from a first end to a second end, and first and second electrical contacts held by the housing. The first and second electrical contacts are positioned at the first and second ends, respectively, of the housing. An electrical pathway is defined within the housing from the first electrical contact to the second electrical contact such that the first and second electrical contacts are electrically connected. The first and second ends of the housing are configured to be mounted to the first and second external chassis, respectively, such that the first and second electrical contacts are configured to mate with, and thereby electrically connect to, the first and second electronic modules, respectively. | 11-13-2014 |
20140334111 | ELECTRONIC DEVICE WITH ROTATABLE STOP PLATE - An electronic device includes a receiving bracket and two electronic modules. The receiving bracket includes a partition plate to divide the receiving bracket into a first receiving space and a second receiving space. Each of the first receiving space and second receiving space includes an outlet located at an end of the receiving bracket. The partition plate defines a through slot. A stop plate is pivotably connected to an end of the through slot near the outlets. Two resilient tabs are formed on opposite sides of the stop plate, and respectively face the first receiving space and second receiving space. The electronic modules are received in the first receiving space and second receiving space, and deform the resilient tabs. | 11-13-2014 |
20140334112 | MOTHERBOARD WITH CONNECTOR COMPATIBLE WITH DIFFERENT INTERFACE STANDARDS - A motherboard includes a first connector, a first signal module, a second signal module, a control module, a power module, and a switch module. The first connector is used to connect external devices to the motherboard. The first signal module and the second signal module are compatible for external devices under different interface standards. The control module outputs different control signals to control the switch module corresponding to the external device connected to the motherboard. The switch module connects the first signal module or the second signal module to the first connector corresponding to the control signals received from the control module. | 11-13-2014 |
20140340852 | SUBSEA CONNECTIONS - An assembly of subsea equipment ( | 11-20-2014 |
20140355219 | SEMICONDUCTOR DEVICE - A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding. | 12-04-2014 |
20150043173 | MODULE TYPE SAFETY BUS BAR - Disclosed is a module type safety bus bar including: a vertical coupling portion ( | 02-12-2015 |
20150062831 | MOUNT PLATFORM FOR MULTIPLE MILITARY RADIOS - A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting dual AN/VRC-110 radio systems. The platform has a first power supply system that converts 110/220 alternating current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said dual AN/VRC-110 radio systems. | 03-05-2015 |
20150070851 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern. | 03-12-2015 |
20150092355 | System and Method for Industrial Control Using a High Availability Backplane - Base modules are provided over a backplane network for high availability control of industrial processes or machines. The base modules may include, for example, an I/O base module, which may control the industrial processes or machines and which may releasably receive an I/O function card, an adapter base module, which may communicate with an industrial controller over a separate control network, and a bus expansion base module, which may provide coupling to another bank of base modules. The base modules may be arranged side-by-side via electrical and mechanical connections. Logic of the I/O base module may detect the presence or absence of the I/O function card to allow coupling or bypassing of the I/O function card with respect to the backplane network. | 04-02-2015 |
20150103496 | POWER CONVERSION AND CONNECTION FOR PHOTOVOLTAIC (PV) PANEL ARRAYS - A solar energy collection and power generation element is described. The solar energy and collection element includes: a photovoltaic (PV) panel having a set of DC outputs; and a power management module coupled to the PV panel. The power management module includes: a base module having a connector adapted to receive electrical energy produced by the PV panel from the set of DC outputs; and a removable inverter that is able to be coupled to the base module via the connector, the removable inverter adapted to receive a DC voltage from the connector, generate an AC voltage, and provide the generated AC voltage to the connector. A solar energy collection system includes: a support structure and multiple PV panels mounted to the support structure. A method of manufacturing an integrated solar panel product includes: retrieving a panel body; retrieving a power module; and attaching the power module to the body. | 04-16-2015 |
20150103497 | PHOTOVOLTAIC SYSTEM WITH IMPROVED AC CONNECTIONS AND METHOD OF MAKING SAME - An alternating current (AC) harness for a photovoltaic (PV) system includes a wire assembly having a first end and a second end, the wire assembly having a plurality of lead wires, and at least one AC connection module positioned at a location along a length of the wire assembly between the first end and the second end. Further, the at least one AC connection module includes a first connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a first PV module of the PV system. The at least one AC connection module also includes a second connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a second PV module of the PV system. | 04-16-2015 |
20150116952 | APPARATUS FOR PERFORMING COMMUNICATION CONTROL - An apparatus for performing communication control includes a control module implemented with at least one integrated circuit (IC) whose package includes a plurality of sets of terminals, each set of the plurality of sets of terminals corresponding to one of a plurality of sub-modules of the control module, and within the sets of terminals, a set of terminals corresponding to a specific sub-module of the sub-modules include a power-input terminal arranged to input power from outside the control module. For example, on a printed circuit board (PCB) of the apparatus, arrangement of some modules is similar to that of some contact pads associated to the sets of terminals. In another example, the control module includes a power distribution system including at least one power distribution wire. In another example, a PCB within the apparatus includes at least one signal transmission wire and at least one set of co-plane ground wires. | 04-30-2015 |
20150116953 | ELECTRONIC MEDIA PRODUCTION SYSTEM AND SYSTEM FOR USE THEREWITH - A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method. | 04-30-2015 |
20150146384 | MULTI CONNECTOR, WIRING METHOD THEREOF AND DISPLAY APPARATUS HAVING THE SAME - Disclosed are a multi connector, a wiring method thereof and a display apparatus having the same that is configured to use a common interface (CI) module for data communication between an electronic apparatus and an external apparatus or a plug used for an electronic connection of elements, regardless of standard conditions such as the number of terminals. The multi connector includes a body portion including a first slot portion and a second slot portion; a substrate portion including a substrate having a first surface; a plurality of first connection terminals provided on the first surface and extending to an inside of the first slot portion; and a plurality of second connection terminals provided on the first surface and extending to an inside of the second slot portion. | 05-28-2015 |
20150351264 | UNGROUNDED INVERTER ENCLOSURE AND CABLING - A system and apparatus for power conversion without a connection to ground. In one embodiment, the apparatus comprises an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output. | 12-03-2015 |
20150366099 | WIRELESS COMMUNICATION MODULE - A wireless communication module can reduce the number of components through optimum design and improve transmission efficiency by implementing a short wiring. The wireless communication module may include a first front-end module, a second front-end module, and a wiring unit arranged between the first front-end module and the second front-end module to supply power to the first front-end module and the second front-end module. At least one capacitor may be connected to the wiring unit. | 12-17-2015 |
20160010673 | ATTACHMENT APPARATUSES AND ASSOCIATED METHODS OF USE AND MANUFACTURE | 01-14-2016 |
20160037660 | COUPLING UNIT AND INDUSTRIAL CONTROL SYSTEM - A coupling unit for an industrial control system has two module connections for making electrical contact with control modules, a field connection for making electrical contact with an industrial field device, a data transmission medium for the transmission of communication data, and a signal transmission medium for the transmission of field signals. Each of the two module connections comprise electrical contact elements which form a communication signal region and a field signal region. Contact elements of the communication signal regions of each of the two module connections are connected in an electrically conductive manner to the data transmission medium, and contact elements of the field signal regions of each of the two module connections are connected to the field connection via the signal transmission medium. | 02-04-2016 |
20160073530 | DESIGN AND APPARATUS FOR A SEGMENTED DEVICE ENCLOSURE - The present invention discloses a segmented device system. The segmented device system includes a plurality of modules. Each module incorporates a sub-system which provides a unique function (or set of functions). The segmented device includes a set of flexible interconnections which transfer power and data between adjacent modules. A segmented device consistent with the present disclosure can flex, bend, and wrap around a mounting structure. The segmented device allows for the expansion and rapid replacement of any segments. In addition, such extensibility and ability to shorten or contract the device enables the device to fit optimally on that which the device is mounted. | 03-10-2016 |
20160134067 | Modular Building Block System for RF and Microwave Design of Components and Systems from Concept to Production - An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design. | 05-12-2016 |
20160183391 | METHODS AND DEVICES FOR MINIATURIZATION OF HIGH DENSITY WAFER BASED ELECTRONIC 3D MULTI-CHIP MODULES | 06-23-2016 |