Class / Patent application number | Description | Number of patent applications / Date published |
361712000 | Thermally and electrically conductive | 22 |
20080198555 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS - The present invention provides a semiconductor device comprising a semiconductor element, a single-layer wiring board on which the semiconductor element is mounted, a connector section located at an end of the single-layer wiring board, a thermally and electrically conductive radiator plate, a relay electrode section formed on the single-layer wiring board, and a connecting member that electrically connects the radiator plate and the relay electrode section together. The single-layer wiring board is structured so that a power supply potential and/or a ground potential received by the connector section is transmitted through a path comprising the radiator plate, the relay electrode section, and the connecting member to the semiconductor element. | 08-21-2008 |
20080218979 | Printed circuit (PC) board module with improved heat radiation efficiency - A Printed Circuit (PC) board module is structured such that heat generated by an Integrated Circuit (IC) device can be sufficiently radiated to the outside. The PC board module includes: a first PC board having a first conductive ground pad arranged therein; a plurality of via holes contained within the first PC board and positioned below the first ground pad; a plurality of conductive via lines contained within the plurality of via holes; a second PC board arranged below the first PC board; and a second conductive ground pad arranged on the second PC board and contacting the plurality of via lines. | 09-11-2008 |
20080239675 | Thermally and Electrically Conductive Apparatus - The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices. In this manner, the combination of an electronic circuit carrier and a thermally conductive element can unify thermal conductivity with the provision of power and/or communication into a single integrated unit for use with electronic devices. | 10-02-2008 |
20090116196 | WATER COOLED HEAT DISSIPATION MODULE FOR ELECTRONIC DEVICE - A heat dissipation module for an electronic device includes a base disk, a suction disk, a water guide and a cover. The base has a containing space and a plurality of cooling strips. The suction base is attached to the base disk and further invludes a water chamber for receiving sucked water, an inlet and an outlet. The water guide is attached to the suction disk with a guide port at the periphery thereof. The cover closes the suction disk and is movably joined to a guide fan. When the heat dissipation module is full with fluid, the fluid can flow therein rapidly while the guide fan rotating such that the fluid is discharged from and flows into the heat dissipation module more effectively. | 05-07-2009 |
20100110639 | TERMINAL PLATE CIRCUIT - In a terminal plate circuit in which the bottom surface of the diode is attached to the surface of the terminal plate with solder so as to dissipate the heat of the diode, heat transfer from the diode to the terminal plate is facilitated by removing the air bubbles in the solder during the soldering. A terminal plate circuit configured in such a manner that a metal part of a bottom surface of a diode of surface mounting type is soldered onto a surface of a terminal plate that is larger than the metal part, characterized in that streaks consisting of a plurality of lines that do not intersect with each other are formed on the surface of the terminal plate onto which the diode is to be soldered, whereby air bubbles generated within the solder during the soldering are let to escape from a lower surface of the diode to outside through the streaks. This terminal plate circuit is suitable for the use in a terminal box for solar cell panel. | 05-06-2010 |
20100296254 | SOLID STATE SWITCH ARRANGEMENT - An example solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is silicon carbide based. The switch is secured relative to the bus bar and the bus bar is configured to communicate thermal energy away from the switch. An example method of arranging a switch includes mounting a silicon carbide based switch relative to a bus bar and communication thermal energy away from the silicon carbide based switch using the bus bar. | 11-25-2010 |
20110176278 | INTEGRATED HEAT SINK - An electronic device includes a heat dissipating component located over a substrate. An isolation trench is formed in the substrate adjacent the component. A contact region of the substrate is bounded by the trench. An electrically isolated contact is located over and in contact with the contact region. The electrically isolated contact and the contact region provide a thermally conductive path to the substrate. | 07-21-2011 |
20120201006 | ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package. | 08-09-2012 |
20130114212 | ELECTRICALLY CONDUCTIVE MATERIAL AND ELECTRONIC DEVICE USING SAME - An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver (Ag) or copper (Cu) and a second conductive metal consisting of tin (Sn), and a ratio of the atomicity of tin to the atomicity of silver or copper and tin is 27 to 40%, and an electronic device using the same. | 05-09-2013 |
20130208424 | SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY - A circuit comprising an integrated circuit disposed on a substrate. A via disposed adjacent to the integrated circuit. A solid metallic pin disposed within the via and configured to conduct heat generated by the integrated circuit to a heat sink. | 08-15-2013 |
20130314875 | THIN MULTI-LAYERED STRUCTURES PROVIDING RIGIDITY AND CONDUCTIVITY - Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness. | 11-28-2013 |
20140002995 | CONTACTOR MOUNTING PANEL WITH IMPROVED THERMAL CHARACTERISTICS | 01-02-2014 |
20140055956 | High-Frequency Circuit Module - A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC. | 02-27-2014 |
20140063743 | METHODS AND SYSTEMS FOR DISSIPATING HEAT IN OPTICAL COMMUNICATIONS MODULES - Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another. | 03-06-2014 |
20140133103 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 05-15-2014 |
20140254101 | SMART PHONE ON A CHIP AND METHOD MAKING SAME - Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components may be embedded into a copper core. In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate may be layered above and below the copper core. A copper ground plane may be fixed underneath the layer of PCB laminate below, and furthest from, the copper core. One or more additional components may be surface mounted on top of the PCB laminate layers above the copper core. A conformal coating may be applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating may include trenching and a copper sputter coating finish. | 09-11-2014 |
20140268574 | COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND COMPONENT BUILT-IN BOARD MOUNTING BODY - A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer. | 09-18-2014 |
20140369006 | POWER SUPPLY DEVICE AND COMPONENTS THEREOF - A power supply device including a capacitance partition, a control partition, a power switching partition, a thermal conduction partition, a magnetic partition. The thermal conduction partition includes electrical connections to connect other partitions. The thermal conduction partition provides for magnetic shielding of the magnetic partition and thermal dissipation in a substantially orthogonal direction to the electrical connections. The layering arrangement allows automated production and/or testing. | 12-18-2014 |
20160007440 | HEAT CHANNELING AND DISPERSING STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat channeling and dispersing structure includes a substrate, a printed circuit board, and a heat-producing electronic element on the printed circuit board. The printed circuit board is mounted on the substrate, which defines a through hole filled with filler. The electronic element covers the hole infilled with filler. The heat generated by the electronic element is conducted through the filler directly to the substrate for heat dissipation. | 01-07-2016 |
20160014879 | A PRINTED CIRCUIT BOARD (PCB) STRUCTURE | 01-14-2016 |
20160050744 | ELECTRONIC DEVICE AND SEMICONDUCTOR PACKAGE WITH THERMALLY CONDUCTIVE VIA - An electronic device and semiconductor package include a printed circuit board and a semiconductor device mounted thereon. The printed circuit board includes one or more thermally conductive vias for dissipating heat. | 02-18-2016 |
20160192544 | INTEGRATED THERMAL EMI STRUCTURE FOR ELECTRONIC DEVICES - In one example a electronic device comprises a housing, a circuit board comprising a plurality of heat generating components, a chassis, wherein the chassis comprises a cut-out section configured to receive the circuit board, an electromagnetic interference (EMI) shield is configured to cover the plurality of heat generating components on the circuit board and to be physically connected to the chassis, wherein the electromagnetic interference shield comprises at least one structural component. Other examples may be described. | 06-30-2016 |