Class / Patent application number | Description | Number of patent applications / Date published |
361708000 | Specific chemical compound or element | 28 |
20080291633 | PACKAGE ASSEMBLY WITH HEAT DISSIPATING STRUCTURE - A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer. | 11-27-2008 |
20080291634 | THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF - Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile. | 11-27-2008 |
20090034203 | Cr-Cu ALLOY, METHOD FOR PRODUCING THE SAME, HEAT-RELEASE PLATE FOR SEMICONDUCTOR, AND HEAT-RELEASE COMPONENT FOR SEMICONDUCTOR - In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided. | 02-05-2009 |
20090059531 | Endotherm Systems and Methods Utilizing Carbohydrate In Non-Oxidizing Environment - The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a carbohydrate endotherm in an amount sufficient to effect the required heat absorption. The carbohydrate endotherm operates in an environment substantially devoid of potential oxidizing reactants. A scavenger may be employed in combination with the carbohydrate endotherm to remove or neutralize potential oxidizing reactants. Alternatively (or in addition), a fluoro-inert material may be employed in combination with the carbohydrate endotherm to effect a desired non-oxidizing environment. The carbohydrate endotherm may be used to provide thermal control and/or thermal protection in a variety of applications and environments. The carbohydrate endotherm may also be employed in combination with previously disclosed endotherm materials to achieve synergistic benefits therewith. | 03-05-2009 |
20090067132 | Heat spreader and method of making the same - A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are then each individually oriented 90 degrees such that the thickness direction of the original pyrolytic graphite sheet becomes the width or length of the cut strip. A face on the side of a first strip adjoins a face on the side of a second strip. Due to the greater thermal conductivity in the xy plane of the strips as compared to in the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips. | 03-12-2009 |
20090109629 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is received in the first groove, and an electronic component is received in the second groove. | 04-30-2009 |
20090122491 | UNIVERSAL PATTERNED METAL THERMAL INTERFACE - The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned metal insert, a corrosion resistant layer coating at least one exterior side of the insert, for protecting the insert from corrosion, and an organic layer coating the corrosion resistant layer, for facilitating bonding of the insert to one of the first solid or the second solid. | 05-14-2009 |
20090154107 | ONE-DIMENSIONAL HIERARCHICAL NESTED CHANNEL DESIGN FOR CONTINUOUS FEED MANUFACTURING PROCESSES - A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface and a second member surface of the second member. An inventive assembly includes mating surfaces with at least one surface formed with a series of parallel hierarchical channels configured to control stacking of the particles during pressing together of the surfaces. The surface is substantially free of any other hierarchical channels formed thereon. | 06-18-2009 |
20090190312 | Heat transfer film, semiconductor device, and electronic apparatus - A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material. | 07-30-2009 |
20090213551 | INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE - Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement ( | 08-27-2009 |
20090237886 | SHEET STRUCTURE AND METHOD OF MANUFACTURING SHEET STRUCTURE - The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K. | 09-24-2009 |
20100046170 | COMPOSITE AVIONICS CHASSIS - An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lower levels of radiated emissions and improved resistance to incident external radiation. Electric and magnetic shielding is also provided. | 02-25-2010 |
20100110637 | HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES - Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product. | 05-06-2010 |
20100124025 | HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - The electronic device includes a heat generator | 05-20-2010 |
20100315783 | HEAT SPREADER AND METHOD OF MAKING THE SAME - A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are then each individually oriented 90 degrees such that the thickness direction of the original pyrolytic graphite sheet becomes the width or length of the cut strip. A face on the side of a first strip adjoins a face on the side of a second strip. Due to the greater thermal conductivity in the xy plane of the strips as compared to in the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips. | 12-16-2010 |
20110141698 | HEAT SPREADING STRUCTURE - The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure. | 06-16-2011 |
20110261535 | POWER MODULE - A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more. | 10-27-2011 |
20110279979 | Constructions Comprising Rutile-Type Titanium Oxide; And Methods Of Forming And Utilizing Rutile-Type Titanium Oxide - Some embodiments include methods of forming rutile-type titanium oxide. A monolayer of titanium nitride may be formed. The monolayer of titanium nitride may then be oxidized at a temperature less than or equal to about 550° C. to convert it into a monolayer of rutile-type titanium oxide. Some embodiments include methods of forming capacitors that have rutile-type titanium oxide dielectric, and that have at least one electrode comprising titanium nitride. Some embodiments include thermally conductive stacks that contain titanium nitride and rutile-type titanium oxide, and some embodiments include methods of forming such stacks. | 11-17-2011 |
20120120609 | PACKAGE STRUCTURE HAVING A SEMICONDUCTOR COMPONENT EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME - A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure. | 05-17-2012 |
20120218713 | HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - The electronic device includes a heat generator | 08-30-2012 |
20130094148 | INTEGRAL HEATER ASSEMBLY AND METHOD FOR CARRIER OR HOST BOARD OF ELECTRONIC PACKAGE ASSEMBLY - A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface. | 04-18-2013 |
20130148304 | EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELECTRONIC PARTS-EQUIPPED DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for electronic parts encapsulation, including the following components (A) to (E), (A) an epoxy resin having an ICI viscosity of from 0.008 to 0.1 Pa·s and an epoxy equivalent of from 100 to 200 g/eq; (B) a phenol resin having an ICI viscosity of from 0.008 to 0.1 Pa·s and a hydroxyl-group equivalent of from 100 to 200 g/eq; (C) a curing accelerator; (D) an inorganic filler; and (E) a silicone compound, in which the component (D) is contained in an amount of from 82 to 88 wt % of the whole of the epoxy resin composition, the component (E) is contained in an amount of from 5 to 15 wt % of the whole of organic components in the epoxy resin composition, and the epoxy resin composition has a gelation time of 15 to 25 seconds. | 06-13-2013 |
20130271921 | PLASTICIZED CERAMIC THERMAL DISSIPATION MODULE - A plasticized ceramic thermal dissipation module comprises a heating electrical component, a cooling body, and a thermal conductive device. They are located orderly. The thermal conductive device is a substrate and the heating electrical component is arranged on the substrate, in which the cooling body is a plasticized ceramic and seamlessly integrated with the thermal conductive device together as a component (All-In-One). The present invention efficiently integrates electrical circuits (or package) board with cooling body together, may be able to simplify the assembling process during the late production stage, to decrease the thermal resister between the two components during assembling and efficiently enhances the thermal conductive performance, furthermore, the plasticized ceramic with high thermal conductive coefficient has excellent lateral thermal conductive ability to enhance the cooling performance, and be able to integrate with different types of circuits (or package) boards together to increase product's productivity and design flexibility. | 10-17-2013 |
20150077942 | ELECTRONIC POWER MODULE ARRANGEMENT - The invention provides an electrical power module, including power transistors, and control components for controlling said power transistors, said module being cooled, in particular, by heat conduction. The module of the invention further includes a main substrate of the AMB/Si3N4 type carrying the power transistors, this main substrate itself constituting a heat-dissipating baseplate for dissipating the heat generated by the power transistors by being arranged in the module to be directly in contact with the carrier structure that provides cooling by conduction when said module is in place, and a ceramic substrate carrying the control components, this ceramic substrate itself being carried by the main substrate. | 03-19-2015 |
20150116943 | THERMOELECTRIC HEAT PUMP WITH A SURROUND AND SPACER (SAS) STRUCTURE - A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure. | 04-30-2015 |
20150303362 | Ceramic Substrate and Semiconductor Package Having the Same - A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers. | 10-22-2015 |
20150327393 | HEAT-DISSIPATING RESIN COMPOSITION, AND COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME - Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain diameter of 15 μm or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 μm to 20 μm. | 11-12-2015 |
20160381782 | LIGHT EMITTING ELEMENT MODULE - A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer. | 12-29-2016 |