Entries |
Document | Title | Date |
20090067117 | MULTI-LAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF - A multi-layer ceramic capacitor, which has an internal electrode of good continuity and may be obtained at a relatively low cost, is disclosed. The internal electrode layer comprises metal particles, wherein the arithmetic mean particle diameter of the metal particles, which is determined based on the particle diameter in the direction parallel with the plane direction of the internal electrode layer, is made smaller than the thickness of the internal electrode layer. The multi-layer ceramic capacitor can be obtained by forming the internal electrode layer using a conductive paste containing a conductive power comprising Ni metal particles coated with particles of a base metal selected from Mn, Co, Fe, Cu, Nb, Ba, Ca, Sr, Ti, Zn, V, and rare earth metals, particles of an oxide thereof and applying a heat treatment in a reducing firing atmosphere having an oxygen partial pressure from about 10 | 03-12-2009 |
20090097187 | MULTI-LAYER CERAMIC CAPACITOR WITH LOW SELF-INDUCTANCE - A Multi-layer Ceramic Capacitor (MLCC) device of a low self-inductance is disclosed. The MLCC device includes a plurality of ceramic sheets arranged in parallel to each other, a plurality of inner metal electrodes, and a plurality of outer electrodes including a pair of positive terminals and a pair of negative terminals. The plurality of inner metal electrodes and the plurality of ceramic sheets are stacked alternately to form a plurality of capacitors. The plurality of outer electrodes is disposed on corners of the plurality of ceramic sheets such that the pair of positive terminals is disposed on adjacent corners of the plurality of ceramic sheets and the pair of negative terminals is disposed on other set of adjacent corners of the plurality of ceramic sheets. An MLCC device having the plurality of outer electrodes disposed on middle portions of the edges of the plurality of ceramic sheets is also disclosed. | 04-16-2009 |
20090103237 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes a ceramic laminate which includes a plurality of stacked ceramic layers and which has a first principal surface, a second principal surface opposed to the first principal surface, a first side surface, and a second side surface opposed to the first side surface, first external terminal electrodes arranged on the first side surface, second external terminal electrodes arranged on the second side surface, first internal electrodes arranged in the ceramic laminate, and second internal electrodes arranged in the ceramic laminate. The first internal electrodes include first opposed portions, first lead portions, and first projecting portions. The second internal electrodes include second opposed portions, second lead portions, and second projecting portions. | 04-23-2009 |
20090122462 | Electronic Device, Multilayer Ceramic Capacitor and the Production Method Thereof - An electronic device, such as a multilayer ceramic capacitor, and a method for producing the electronic device having an internal electrode layer and a dielectric layer, comprising a step of forming a pre-fired internal electrode thin film including a conductive component and a dielectric component, a step of stacking green sheets to be dielectric layers after firing and the internal electrode thin films, and a step of firing a multilayer body of the green sheets and the internal electrode thin films are provided: by which grain growth of conductive particles in a firing step can be suppressed, spheroidizing in the internal electrode layers and breaking of electrodes can be effectively prevented, and a decline of the capacitance can be effectively suppressed even when a thickness of each internal electrode layer is made thinner. | 05-14-2009 |
20090122463 | TOP TO BOTTOM ELECTRODE CONNECTION ON SINGLE LAYER CERAMIC CAPACITORS - Disclosed are methodology and corresponding device subject matters for providing single layer ceramic capacitors through the use of significantly reduced numbers of processing steps. An aspect of present methodology resides in the early introduction of a plurality of selectively spaced through holes in an unfired ceramic wafer. Such holes provide connection points between conductive coatings on both sides of a subsequently fired wafer and eliminate the need to perform a previously employed third sputtering step to achieve connection between the layers. The present methodology also provides for end of process determination of final capacitive values for the finished devices. | 05-14-2009 |
20090122464 | Surface modified nickel nanoparticle, and conductive paste and multi-layer capacitor comprising the same - A method for surface treatment of nickel nanoparticles using an organic solution, including dispersing nickel nanoparticles in a reductive organic solvent to obtain homogeneity; heating the dispersion of nickel nanoparticles; and separating the solution after treatment, washing and drying. Nickel nanoparticles treated by this method are preferably substantially free of impurities remaining on particle surfaces and thus have smooth surfaces and increased tap density, and the use thereof enables efficient production of a multi-layer ceramic capacitor. | 05-14-2009 |
20090135546 | NANO COMPLEX OXIDE DOPED DIELECTRIC CERAMIC MATERIAL, PREPARATION METHOD THEREOF AND MULTILAYER CERAMIC CAPACITORS MADE FROM THE SAME - The present invention provides a nano complex oxide doped dielectric ceramic material used for a multilayer ceramic capacitor using a base metal as a material of internal electrodes. The doped dielectric ceramic material comprises barium titanate and a nano complex oxide dopant, wherein the molar ratio of the barium titanate to the nano complex oxide dopant is in the range of (90˜98):(2˜10), the average particle size of the barium titanate is 50˜300 nm and the nano complex oxide dopant has the following formula (1): w A+x B+y C+z D. The present invention also provides processes for preparing the nano complex oxide doped dielectric ceramic material and ultrafine-grained and temperature-stable multilayer ceramic capacitors using the nano complex oxide doped dielectric ceramic material as the material of dielectric layers. | 05-28-2009 |
20090141426 | THIN FILM MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME - Provided are a thin film multi-layered ceramic capacitor and a method of fabricating the same. The thin film multi-layered ceramic capacitor includes a multi-layered structure including at least two capacitor layers stacked on top of each other. Each capacitor layer includes a substrate comprising a top surface comprising a plurality of holes, and a thin film capacitor including at least three electrode layers sequentially stacked on the top surface of the substrate along the holes, and dielectric layers respectively interposed between every two adjacent electrode layers. The electrode layers of each of the capacitor layers are alternately connected to a first external electrode and a second external electrode. | 06-04-2009 |
20090161292 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor includes a ceramic body having a structure in which a plurality of dielectric sheets are laminated; a first external electrode formed outside the ceramic body; at least two second external electrodes formed outside the ceramic body, separated from the first external electrode and having a polarity that is different from that of the first external electrode; a first internal electrodes formed on one surface of at least one laminated dielectric sheet; and at least two second internal electrodes respectively connected to the at least two second external electrodes through a lead, the second internal electrodes forming capacitive coupling with the first internal electrode, having the at least one dielectric sheet therebetween. | 06-25-2009 |
20090207554 | CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT, AND PACKAGING METHOD OF CERAMIC ELECTRONIC COMPONENTS - A ceramic electronic component has a chip element body having a conductor arranged inside, external electrodes, and a discrimination layer. The chip element body has first and second end faces facing each other, first and second side faces being perpendicular to the first and second end faces and facing each other, and third and fourth side faces being perpendicular to the first and second end faces and to the first and second side faces and facing each other. The external electrodes are formed on the first and second end faces, respectively, of the chip element body. The discrimination layer is provided on at least one side face out of the first side face and the second side face in the chip element body. The chip element body is comprised of a first ceramic. The discrimination layer is comprised of a second ceramic different from the first ceramic and has a color different from that of the third and fourth side faces. | 08-20-2009 |
20090268374 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less. | 10-29-2009 |
20090290284 | Electrical Component and External Contact of an Electrical Component - An electric component has a base body. A surface of the base body is provided with at least one first electrically conductive material layer and the first material layer is coated with a further electrically conductive material layer on the surface facing away from the base body. The material layers form at least part of an external contact that has a closed, porous, outer surface. | 11-26-2009 |
20100002359 | MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF - The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing. A method for manufacturing the multi-layer ceramic capacitor comprising first external electrode, dielectric, internal electrode and second external electrode prints simultaneously the first external electrode; the internal electrode which is connected with the first external electrode and formed at an invaginated portion of the dielectric invaginated to allow one side to be opened at one portion; and the second external electrode which is formed integrally with the internal electrode by employing an inkjet printing. According to the present invention, a method for manufacturing the multi-layer ceramic capacitor resolves contact problems by printing integrally the internal electrode and the external electrode and reduces the manufacturing process. | 01-07-2010 |
20100091429 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF - A monolithic ceramic electronic component includes a first internal electrode including a first region which extends to a first end surface and which has a relatively large dimension in a width direction and a second region which is located at the side closer to a front end than is the first region and which has a relatively small dimension in a width direction, wherein d | 04-15-2010 |
20100149724 | METHOD AND APPARATUS FOR PRODUCING A CERAMIC ELECTRONIC COMPONENT - A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer. | 06-17-2010 |
20100182733 | Dielectric Ceramic and Laminated Ceramic Capacitor - A dielectric ceramic for use in dielectric ceramic layers has a main component represented by a composition formula of (Sr | 07-22-2010 |
20100195264 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, an interdiginated pair of internal electrodes are arranged, on a substrate, perpendicular to a surface of the substrate, and a ceramic dielectric member is filled into a gap between this pair of internal electrodes. For this reason, the dimensions of the internal electrodes do not substantially change before and/or after the formation of the ceramic dielectric member, whereby the dimensions formed at the time of internal electrode can be maintained. According to this ceramic capacitor, since the internal electrode dimensions can be easily controlled like this, dimensional control of internal electrode spacing can also be easily carried out. | 08-05-2010 |
20100214720 | Electrical Multilayer Component - An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. An electrically insulating stiffening element is arranged at a distance from at least one electrode layer on the same dielectric layer as the electrode layer. The stiffening element preferably has an increased flexural strength with respect to dielectric material surrounding it. | 08-26-2010 |
20100290173 | Multi layer ceramic capacitor and DC-Link capacitor module using the same - Provided are a high voltage multi-layer ceramic capacitor (MLCC) that may enable a surface mounting, and may form a guide electrode between inner electrodes or between sealing electrodes to thereby prevent a decrease in an inner voltage, caused by a parasitic capacitance, and a director current (DC)-link capacitor module using the MLCC. The high voltage MLCC may include: a ceramic laminated body | 11-18-2010 |
20110007449 | CERAMIC ELECTRONIC COMPONENT - There is provided a ceramic electronic component including a ceramic sintered body, internal conductive layers, and external electrodes. Each of the external electrodes includes a first electrode layer, a conductive resin layer covering the first electrode layer, and a second electrode layer covering the conductive resin layer and having an extension length greater than the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof. The distance from the top or bottom surface of the ceramic sintered body to the closest layer of the internal conductive layers is greater than or equal to the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof. | 01-13-2011 |
20110102971 | CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND COLLECTIVE COMPONENT - A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region. | 05-05-2011 |
20110141658 | MULTILAYER CERAMIC CAPACITOR - Disclosed is a multilayer ceramic capacitor. The multilayer ceramic capacitor includes a sintered ceramic body, a plurality of first internal electrodes and a plurality of second internal electrodes formed inside the sintered ceramic body, the first and second internal electrodes having ends alternately and respectively exposed to side surfaces of the sintered ceramic body, and first and second external electrodes formed on the side surfaces of the ceramic body and electrically connected to the first and second internal electrodes, the first and second external electrodes each including a plurality of pores with an average pore size of 2 μm to 5 μm and having a porosity of 2% to 10%. | 06-16-2011 |
20110141659 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor. The multilayer ceramic capacitor includes an effective layer including inner electrodes and dielectric layers that are alternately stacked, and a protection layer formed on each of top and bottom surfaces of the effective layer, the protection layer being formed by stacking dielectric layers. The effective layer has an outside part, an inside part and an outside part in that order along a stack direction, the inner electrodes of the outside parts have a smaller thickness than that of the inner electrodes of the inside part, and the outside parts have a thickness 0.1 to 0.5 times that of the protection layer. | 06-16-2011 |
20110149469 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME - There is provided a multilayer ceramic capacitor including: a capacitor main body formed by stacking a dielectric layer having a thickness of td and alternately stacking more than one opposing pair of a first internal electrode having a thickness of to and a second internal electrode having the same thickness as the first internal electrode, and having the dielectric layer therebetween; and a protective layer formed by stacking a second dielectric layer on at least one of an upper surface and a lower surface of the capacitor main body so that a dielectric material layer has a thickness of tc, wherein when a thickness from an end of a region where the first internal electrode and the second internal electrode oppose each other to side and end surfaces of the capacitor main body is a, it satisfies the following Equation 1 and a method of fabricating a multilayer ceramic capacitor are provided. | 06-23-2011 |
20110149470 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF - Provided are a multilayer ceramic capacitor and a manufacturing method thereof, which can stably secure capacitance and prevent cracking caused by the diffusion of an electrode material. The multilayer ceramic capacitor includes a capacitor body where an inner electrode including a first electrode material and a dielectric layer are alternately laminated, and an outer electrode disposed on an outer surface of the capacitor body and electrically connected to the inner electrode, the outer electrode including a second electrode material. A diffusion layer having a length exceeding 1 μm in which the first and second electrode materials are mixed is provided at a region where the inner electrode and the outer electrode are connected to each other. | 06-23-2011 |
20110149471 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF FABRICATING THE SAME - There is provided a multilayer ceramic capacitor including: a capacitor main body formed by alternately stacking an internal electrode including an internal electrode-forming material and a dielectric layer; and an external electrode formed on the external surface of the capacitor to be electrically connected to the internal electrode and having an external electrode-forming material, wherein the internal electrode includes a non-diffusion layer including the external electrode-forming material of 2 vol % to 20 vol % and a diffusion layer made of the external electrode-forming material on at least one of the both ends of the non-diffusion layer. | 06-23-2011 |
20110157768 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor and a method of manufacturing the same are provided. The multilayer ceramic capacitor includes a capacitive part, a passivation layer, and first and second outer electrodes. In the capacitive part, a plurality of dielectric layers and a plurality of first and second inner electrodes are alternately laminated, and ends of the first and second inner electrodes are alternately and respectively exposed in a direction of lamination of the dielectric layers. The passivation layer is provided at either or both of the top and bottom surfaces of the capacitive part. The first and second outer electrodes are electrically connected to the first and second inner electrodes exposed in a direction of lamination of the dielectric layers. One or more inner electrodes disposed at both ends in a direction of lamination among the plurality of inner electrodes include oxide represented by Ni—Mg—O. | 06-30-2011 |
20110292567 | ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES - A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive. | 12-01-2011 |
20120057271 | GLASS COMPOSITIONS, DIELECTRIC COMPOSITIONS AND MULTILAYER CERAMIC CAPACITOR HAVING HIGH CAPACITANCE USING THE SAME - Disclosed are a glass composition and a dielectric composition enabling low temperature sintering, and a high capacitance multilayer ceramic capacitor using the same. In the glass composition used for sintering, the glass composition may be formed of a formula, aR | 03-08-2012 |
20120113562 | DIELECTRIC COMPOSITION HAVING HIGH DIELECTRIC CONSTANT, MULTI LAYERED CERAMIC CONDENSERS COMPRISING THE SAME, AND METHOD OF PREPARING FOR MULTI LAYERED CERAMIC CONDENSERS - A dielectric composition having a high dielectric constant, multi layered ceramic condensers comprising the same, and a method of preparing for multi layered ceramic condensers. The dielectric composition includes: a compound represented by general formula (Ba | 05-10-2012 |
20120134067 | MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor capable of being implementing as a micro supercapacitor capable of minimizing a mounting area and increasing a mounting efficiency thereof. The multilayered ceramic capacitor includes a capacitor body in which a plurality of dielectric layers having a size of 1.6 mm in length and 0.8 mm in width are stacked; an internal electrode unit having a plurality of internal electrodes arranged on each of the plurality of dielectric layers; and an external electrode unit, having a plurality of external electrodes horizontally arranged in the capacitor body and electrically connected to the internal electrodes. | 05-31-2012 |
20120134068 | MULTILAYERED CERAMIC CAPACITOR - In a multilayered ceramic capacitor, the width of an exposed portion of an internal electrode is reduced to be narrower than that of a non-exposed portion thereof. A dummy electrode that is not electrically connected to the internal electrode is formed to be connected to an external electrode. Deterioration of reliability due to penetration of the plating solution thereby is prevented and reduction in adhesion of the external electrode due to reduction in width of the exposed portion of the internal electrode is supplemented through mechanical connection between the external electrode and the dummy electrode. | 05-31-2012 |
20120140377 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF - There are provided a multilayer ceramic electronic component and a fabricating method thereof. The multilayer ceramic electronic component includes: a multilayer ceramic body including a first ceramic powder and having a plurality of ceramic sheets stacked therein, each ceramic sheet having a thickness of 1 μm or less; internal electrode patterns formed on the plurality of ceramic sheets; and dielectric patterns formed on the ceramic sheets to enclose the internal electrode patterns, the dielectric patterns including a second ceramic powder having a particle size smaller than that of the first ceramic powder and each having a thickness equal to or thinner than that of each of the internal electrode patterns. | 06-07-2012 |
20120147521 | CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODE, MANUFACTURING METHOD THEREOF, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a conductive paste composition for an inner electrode, a manufacturing method thereof, and a multilayer ceramic electronic component using the same. The method of manufacturing the conductive paste composition for the inner electrode includes: preparing a metal powder in which a cellulose-based resin is coated on the surfaces of metal particles by dispersing the metal powder within the cellulose-based resin; preparing a ceramic powder in which a polyvinyl butyral resin is coated on the surfaces of ceramic particles by dispersing the ceramic powder within the polyvinyl butyral resin; and mixing the metal powder and the ceramic powder. The conductive paste composition for the inner electrode has excellent dispersibility, thereby allowing for the formation of a thin inner electrode layer. | 06-14-2012 |
20120147522 | MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method of manufacturing a multilayer ceramic condenser. There is provided a method of manufacturing a multilayer ceramic condenser, including: printing a plurality of stripe-type inner electrode patterns on a ceramic green sheet in parallel; forming a laminate by stacking ceramic green sheets on which a plurality of stripe-type inner electrode patterns are formed; cutting the laminate so that a first inner electrode pattern and a second inner electrode pattern are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the side of the laminate to which both the first inner electrode pattern and the second inner electrode pattern are exposed. | 06-14-2012 |
20120154978 | MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body. | 06-21-2012 |
20120188683 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT - A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon. | 07-26-2012 |
20120188684 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges. | 07-26-2012 |
20120188685 | Electrical Multilayer Component and Circuit Arrangement - An electrical multilayer component having has a monolithic main body that includes a number of alternating ceramic layers disposed one above the other and at least one electrode layer. The main body has two end faces opposite each other and two lateral faces opposite each other. The component also includes a number of outer electrodes and at least three inner electrodes. Each of the inner electrodes is associated with one outer electrode. A first inner electrode protruding from an end face and a second inner electrode protruding from an opposite end face have a first distance to each other. A third inner electrode protrudes from a side face. | 07-26-2012 |
20120229949 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposite to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed in the multilayer body and having distal edges exposed to the first side or the second side, first and second side members formed on the first and second sides to cover the distal edges of the plurality of inner elecrodes, and outer electrodes formed on the third side and the fourth side to be electrically connected to the inner electrodes. An angle between a virtual line connecting the distal edges of the plurality of inner electrodes and the first side member or the second side member is less than 90° (π/2). | 09-13-2012 |
20120229950 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There are disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed within the ceramic body, and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A distance from distal edges of the inner electrodes to the first side or the second side of the ceramic body is 30 μm or less. | 09-13-2012 |
20120229951 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side; a plurality of inner electrodes formed within the ceramic body and having respective one ends exposed to the third side and the fourth side; and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A shortest distance from distal edges of an outermost inner electrode among the plurality of inner electrodes to the first side or the second side is smaller than a shortest distance from distal edges of a central inner electrode to the first side or the second side. | 09-13-2012 |
20120229952 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There are provide a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, inner electrodes formed in the multilayer body and formed to be spaced apart from the third side or the fourth side by a predetermined distance, groove portions formed on at least one of top and bottom surfaces of the multilayer body and formed parallel to the third or fourth side by a predetermined distance from the third side or the fourth side, and outer electrodes extended from the third side and the fourth side to the top surface or the bottom surface of the multilayer body to cover the groove portions. | 09-13-2012 |
20120250220 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces. | 10-04-2012 |
20120250221 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - An electronic component includes a ceramic sintered body, and a plurality of first and second inner electrodes alternately arranged inside the ceramic sintered body to be opposed to each other in a third direction with a ceramic layer interposed between the adjacent first and second inner electrodes. The first and second inner electrodes are each arranged to be exposed to a third or fourth surface without being exposed to fifth and sixth surfaces. Heterogeneous regions, which include solid solutions of metals included in the first and second inner electrodes and the ceramic sintered body, are arranged continuously in opposite end portions of the ceramic sintered body in a first direction to extend from one side end to an opposite side end of a region where the first and second inner electrodes are disposed in a third direction. | 10-04-2012 |
20120262840 | LAMINATED CERAMIC CAPACITOR - The laminated ceramic capacitor has a laminate block made of alternately laminated ceramic dielectric layers and internal electrodes, a pair of cover layers, laminated on top and bottom of the laminate block, ceramic bodies formed on both side faces of the laminate block, and a pair of external electrodes that are electrically connected to the internal electrodes, wherein the average grain size of the ceramic dielectric grains constituting the ceramic body is smaller than the average grain size of the ceramic dielectric grains constituting the ceramic dielectric layer in the laminate block. | 10-18-2012 |
20120268861 | CERAMIC SHEET PRODUCT FOR CERAMIC ELECTRONIC COMPONENT, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a ceramic sheet product for a ceramic electronic component, a multilayer ceramic electronic component using the same, and a method of manufacturing the multilayer ceramic electronic component. The ceramic sheet product for a ceramic electronic component includes a ceramic layer; a metal layer formed on the ceramic layer; and metal nanostructures contacting the metal layer and protruding from the metal layer to an inner portion of the ceramic layer. With the multilayer ceramic electronic component using the ceramic sheet product for a ceramic electronic component, an interval between electrodes is reduced to thereby allow for the increase of capacitance, whereby a multilayer ceramic electronic component having high capacitance may be provided. | 10-25-2012 |
20120307417 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a lamination main body including a dielectric layer; and a plurality of inner electrode layers formed within the lamination main body and having ends exposed from one or more faces of the laminated main body, wherein when a distance between central portions of adjacent inner electrodes among the plurality of inner electrodes is T | 12-06-2012 |
20120307418 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor. The capacitor includes: a multilayer body having a dielectric layer; and first and second internal electrodes disposed in the multilayer body, the dielectric layer being disposed between the first and second internal electrodes, wherein, in a cross-section taken in a width-thickness direction of the multilayer body, an offset portion is defined as a portion where adjacent first and second internal electrodes do not overlap with each other, and a ratio (t | 12-06-2012 |
20120320495 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes curved surface portions provided in an outer surface of a ceramic element assembly, and internal conductors provided within the ceramic element assembly that are exposed in the curved surface portions and principal surfaces to define starting points for plating deposition. A base layer, in an external conductor, which is defined by a plating film is arranged so as to directly cover the exposed portions of the internal conductors. | 12-20-2012 |
20120320496 | STACKED CHIP DEVICE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof. | 12-20-2012 |
20120327556 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA | 12-27-2012 |
20130027841 | MULTI-LAYERED CERAMIC CAPACITOR - There is provided a multi-layered ceramic capacitor including: a laminated body having a plurality of dielectric layers laminated therein and including first and second surfaces opposed to each other; a first internal electrode formed between the plurality of dielectric layers, exposed to the first surface, and including a plurality of first sub-electrodes; a second internal electrode exposed to the second surface and including a plurality of second sub-electrodes alternately disposed with the first sub-electrodes; a third internal electrode having at least one dielectric layer disposed between the first and second internal electrodes and the third internal electrode, exposed to the second surface, and including a plurality of third sub-electrodes disposed to be opposed to the first sub-electrodes; and a fourth internal electrode exposed to the first surface and including a plurality of fourth sub-electrodes opposed to the second sub-electrodes and alternately disposed with the third sub-electrodes. | 01-31-2013 |
20130027842 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 μm or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td≦0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability. | 01-31-2013 |
20130027843 | MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT - There is provided a multi-layered ceramic electronic component including: a ceramic main body including a dielectric layer; and inner electrode layers disposed to face each other, with the dielectric layer interposed therebetween, in the ceramic main body, wherein when an average thickness of the dielectric layer is defined as t | 01-31-2013 |
20130050899 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes including respective lead-out portions having an overlapping area, the overlapping area being exposed to one surface of the ceramic body; first and second external electrodes formed on the one surface of the ceramic body and connected to the respective lead-out portions; and an insulation layer formed on the one surface of the ceramic body to which the lead-out portions are exposed. | 02-28-2013 |
20130058006 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including lead-out portions exposed to a first surface of the ceramic body and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; external electrodes formed on the first surface of the ceramic body and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and on third and fourth surfaces thereof connected to the first surface, wherein the lead-out portions have a predetermined interval from the third or fourth surface of the ceramic body. | 03-07-2013 |
20130063864 | MULTI-LAYER CERAMIC ELECTRONIC COMPONENT WITH SOLDER BLOCKING LAYER - A multi-layer ceramic electronic component includes a ceramic base, a pair of exterior electrodes located on two ends of the ceramic base, respectively, an inner electrode embedded in the ceramic base, and a solder blocking layer located between the pair of the exterior electrodes and projecting from an exterior surface of the ceramic base. | 03-14-2013 |
20130100578 | MULTILAYER CERAMIC ELECTRONIC PART - There is provided a multilayer ceramic electronic part, including: a ceramic body having a plurality of dielectric layers laminated therein; a plurality of inner electrode layers formed on at least one surface of each dielectric layer; and margin dielectric layers formed on a margin part of each dielectric layer, on which the inner electrode layers are not formed, and having a dielectric grain size smaller than that of the dielectric layers. | 04-25-2013 |
20130100579 | MULTI-LAYER CERAMIC CAPACITOR - An object of the present invention is to provide a multi-layer ceramic capacitor that includes a laminated block | 04-25-2013 |
20130107422 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF | 05-02-2013 |
20130114182 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a ceramic element having a plurality of dielectric layers stacked therein; a plurality of inner electrode layers formed on each dielectric layer; margin dielectric layers each formed on a margin part of each dielectric layer, on which the inner electrode layers are not formed, the margin dielectric layers having a porosity of 10% or less; and outer electrodes formed on outer surfaces of the ceramic element. | 05-09-2013 |
20130120905 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There are provided a multilayered ceramic electronic component and a method of fabricating the same. The multilayered ceramic electronic component includes: a ceramic main body; external electrodes; and inner conductors forming a structure of a coil within the ceramic main body, wherein a central axis of the coil is in parallel to the direction in which the external electrodes are connected, and the inner conductors include via conductors laminated to be perpendicular to the central axis of the coil and a ratio of the area of one face of the via conductor to the area of the other face of the via conductor ranges from 0.9 to 1.1. | 05-16-2013 |
20130128411 | CHIP ELECTRONIC DEVICE - Provided is a chip electronic device that has an increased reliability with a small size. A chip electronic component has a main body made of a ceramic having an internal electrode therein. Provided on the main body is an external electrode that is made of a first electrode layer on the main body, a conductive protective layer on the first electrode layer, and a second electrode layer on the conductive protective layer formed by electrolytic plating. The conductive protective layer prevents hydrogen from diffusing into the main body during the electrolytic plating. | 05-23-2013 |
20130135789 | MULTILAYER CERAMIC ELECTRONIC PART - There is provided a multilayer ceramic electronic part, including: a ceramic body including dielectric layers each having an average thickness of 0.6 μm or less; and first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween, wherein the ceramic body includes a capacitance forming part and non-capacitance forming parts, and when the capacitance forming part is divided into 2n+1 (n is 1 or more) regions in a thickness direction of the ceramic body, the dielectric layers of the capacitance forming part get thinner in directions from a central region toward upper and lower regions, whereby continuity of the internal electrode may be improved and a high-capacity multilayer ceramic electronic part may be realized. | 05-30-2013 |
20130141837 | MULTILAYER CERAMIC ELECTRONIC PART - There is provided a 1005-sized or smaller multilayer ceramic electronic part, including: a ceramic body having internal electrodes having a directivity perpendicular to a printed circuit board; and external electrodes formed on both end portions of the ceramic body and electrically connected to the internal electrodes each including an active area part and a lead part, the active area parts facing each other to contribute to forming capacitance, and the lead part having a width smaller than that of the active area part, and wherein when a width of the active area part is defined as WLa, a width of the lead part on one end portion of the ceramic body connected to the external electrodes is defined as WL1, and a bottleneck rate α of the lead part is defined as 1−WL1/WLa, the bottleneck rate α of the lead part satisfies a range of 0<α≦0.12. | 06-06-2013 |
20130163144 | LAMINATED CERAMIC CAPACITOR - Provided is a laminated ceramic capacitor which can suppress degradation of the insulation resistance due to the addition of vanadium. Second insulating layers are stacked on both sides in the stacking direction of a first insulating layer group, which has first insulating layers stacked over one another, and internal electrodes are placed on principal surfaces of the first insulating layers. At least one internal electrode is placed between the first and second insulating layers. Both contain, as their main constituent, a perovskite-type compound represented by the formula “ABO | 06-27-2013 |
20130222973 | Laminated Ceramic Electronic Component and Manufacturing Method Therefor - A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes. | 08-29-2013 |
20130229749 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively. | 09-05-2013 |
20130250480 | MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes. | 09-26-2013 |
20130250481 | CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT - A conductive fine powder includes flat metal/alloy fine particles. The flat metal/alloy fine particles have a nanocomposite structure in which crystalline or non-crystalline nanoparticles are mixed or formed in a matrix. The flat metal/alloy fine particles have a maximum thickness of 50 nm or less and a maximum diameter at least twice the thickness and contain a high-melting-point metal and a low-melting-point metal. | 09-26-2013 |
20130279074 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 μm to 13 μm. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts. | 10-24-2013 |
20130294010 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween in the ceramic body; external electrodes formed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes; and grooves formed in at least one of top and bottom surface of the ceramic body on which the external electrodes are formed. | 11-07-2013 |
20130294011 | LAMINATED CERAMIC CAPACITOR - Provide is a laminated ceramic capacitor which can suppress the decrease in dielectric constant even when ceramic layers are further reduced in thickness. The laminated ceramic capacitor includes a laminate having a plurality of stacked ceramic layers stacked and a plurality of internal electrodes formed along interfaces between the ceramic layers; and a plurality of external electrodes formed on the outer surface of the laminate and electrically connected to the internal electrodes ceramic grains in contact with both of adjacent internal electrodes adjacent with a ceramic layer interposed therebetween are present in the ceramic layers and the internal electrodes are 0.60 μm or less in thickness. | 11-07-2013 |
20130321981 | LAMINATED CHIP ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND PACKING UNIT THEREOF - A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer. | 12-05-2013 |
20140022698 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented. | 01-23-2014 |
20140043724 | MULTILAYER CERAMIC ELECTRONIC PART AND FABRICATING METHOD THEREOF - There is provided a multilayer ceramic electronic part having high reliability including: a ceramic body including a dielectric layer; internal electrodes formed in the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween; an electrode layer formed on the exterior of the ceramic body and electrically connected to the internal electrodes; a conductive resin layer formed on the electrode layer; and a plating layer formed on the conductive resin layer, wherein the conductive resin layer includes a first conductive resin layer contacting the electrode layer, and a second conductive resin layer formed on the exterior of the first conductive resin layer, contacting the plating layer and having a resin content different from that of the first conductive resin layer. | 02-13-2014 |
20140049875 | NICKEL POWDER FOR INTERNAL ELECTRODE, METHOD OF PRODUCING THE SAME, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There are provided a nickel powder for an internal electrode, synthesized by a vapor phase synthesis method using plasma, more particularly, a nickel powder for an internal electrode, having a favorable crystallite diameter and high density, a method of producing the same, and a multilayer ceramic electronic component including the same. According to the nickel powder for an internal electrode, the method of producing the same, and the multilayer ceramic electronic component including the same, a nickel powder having less impurities, a favorable crystallite diameter, and high density can be produced. | 02-20-2014 |
20140118882 | CERAMIC ELECTRONIC COMPONENT WITH METAL TERMINALS - A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed. | 05-01-2014 |
20140126110 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic capacitor and a manufacturing method thereof, the multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes; first and second external electrodes; and a first insulating layer | 05-08-2014 |
20140126111 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF - There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers; internal electrodes disposed to face each other, having the dielectric layer therebetween; and external electrodes formed at an outer side of the ceramic body and respectively electrically connected to the internal electrodes, wherein the internal electrodes include a single ceramic layer therein. The disconnection generated by a difference in contraction and extension rates due to a difference in the sintering temperature between the internal electrodes and the dielectric is prevented and the electrode connectivity and the coverage are maintained, whereby the high capacitance multilayered ceramic electronic component having excellent reliability may be implemented. | 05-08-2014 |
20140133065 | 3D CAPACITOR - A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal. | 05-15-2014 |
20140185189 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein when it is defined that a thickness of a band of the first and second external electrodes is T1 and a thickness of the ceramic body is T2, a ratio (T1/T2) of the thickness of the band of the first or second external electrode to the thickness of the ceramic body is equal to or less than 0.18. | 07-03-2014 |
20140285950 | MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multi-layer ceramic capacitor is constituted by ceramic dielectric layers alternately laminated with conductive layers, wherein the ceramic dielectric layers are sintered in such a way that core-shell grains having a core-shell structure are mixed with uniform solid-solution grains resulting from uniform progression of the solid solution process. Such multi-layer ceramic capacitor is characterized in that the area ratio of the core-shell grains to all sintered grains constituting the ceramic dielectric layer is 5 to 15% and that the average grain size of all sintered grains including the core-shell grains and uniform solid-solution grains is 0.3 to 0.5 μm. | 09-25-2014 |
20140355177 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component including a ceramic body including a plurality dielectric layers stacked thereon, a plurality of internal electrodes formed to be exposed to both end surface of the ceramic body, having the dielectric layer interposed therebetween, and external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein connectivity of the internal electrode is equal to or greater than 87%. | 12-04-2014 |
20150103468 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; and first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having at least one of the dielectric layers interposed therebetween. The second internal electrode may include a space part disposed to be adjacent to a portion thereof exposed to one end surface of the ceramic body so as to be not overlapped with the first internal electrode in the space part. | 04-16-2015 |
20180025844 | MULTILAYER CERAMIC CAPACITOR | 01-25-2018 |
20180025845 | MULTILAYER CERAMIC CAPACITOR | 01-25-2018 |
20190148074 | MULTILAYER CERAMIC CAPACITOR | 05-16-2019 |