Entries |
Document | Title | Date |
20080225461 | ELECTRONIC COMPONENT, MOUNTED STRUCTURE, AND INVERTER DEVICE THEREWITH - There are provided an electronic component permitting easy surface mounting onto a circuit board and, a mounted structure and an inverter device therewith. | 09-18-2008 |
20080239621 | Clip-on leadframe - A capacitor with a multiplicity of first plates and second plates in parallel relationship wherein the first plates terminate at a first face and the second plates terminate at a second face. A dielectric is between the first plates and the second plates. A first external termination is in electrical contact with the first plates and a second external termination is in electrical contact with the second plates. A first lead terminal is in electrical contact with the first external termination and the first lead terminal has a first foot below the first external termination and a first solder stop coated on the first foot between the first foot and the first external termination. A second lead terminal is in electrical contact with the second external termination wherein the second lead terminal comprises a second foot below the second external termination and a second solder stop is coated on the second foot between the second foot and the second external termination. | 10-02-2008 |
20080291600 | MONOLITHIC CERAMIC CAPACITOR - A multi-terminal monolithic ceramic capacitor arranged to reduce an equivalent series inductance and having an array structure is provided. A first same-polarity-connection conductor and a second same-polarity-connection conductor are provided inside a capacitor body so as to extend over at least two capacitors. The first same-polarity-connection conductor is electrically connected to a plurality of first external terminal electrodes, and the second same-polarity-connection conductor is connected to a plurality of second external terminal electrodes. In the monolithic ceramic capacitor which is mounted on a wiring substrate, the overall capacitance can be maintained even if an accident, such as cracking of a solder joint, occurs in one of the external terminal electrodes. | 11-27-2008 |
20090103235 | Metal capacitor and manufacturing method thereof - A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a terminal increase-type metal member comprising a groove forming portion; a metal oxide layer being formed on the terminal increase-type metal member; an insulating layer being formed on the terminal increase-type metal member; a plurality of main electrode layers being formed in a groove forming portion; a plurality of conductive connecting layers being formed on the plurality of main electrode layers and the insulating layer; a first lead terminal being selectively connected to the first and the second electrode withdrawing portions of the terminal increase-type metal member; a second lead terminal being connected to the main electrode layer of the terminal increase-type metal member; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals. | 04-23-2009 |
20090116167 | PASSIVE ELECTRONIC NETWORK COMPONENTS DESIGNED FOR DIRECT BODY FLUID EXPOSURE - An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials. | 05-07-2009 |
20090174984 | SEMICONDUCTOR DEVICE HAVING CAPACITORS AND ITS MANUFACTURE METHOD - A capacitor is formed over a semiconductor substrate. The capacitor includes a lower electrode, a capacitor dielectric film and an upper electrode in this order recited, and has an area S equal to or larger than 1000 μm | 07-09-2009 |
20090213526 | CAPACITOR DEVICES WITH CO-COUPLING ELECTRODE PLANES - A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via. | 08-27-2009 |
20090262483 | CAPACITOR IN SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A capacitor may include at least one of a polysilicon layer over a semiconductor substrate; a capacitor dielectric layer over a polysilicon layer; an insulating layer over a capacitor dielectric layer; a metal layer connected to a capacitor dielectric layer through a first region of an insulating layer; an upper metal wiring layer connected to a metal layer over an insulating layer; and/or a lower metal wiring line layer connected to a polysilicon layer through a metal contact that passes through a second region of an insulating layer and a capacitor dielectric layer over the insulating layer. | 10-22-2009 |
20090273884 | CAPACITOR COMPONENT, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - There are provided an upper electrode 18 and a lower electrode which are formed like flat plates, a dielectric layer interposed between the upper electrode and the lower electrode, and a covering portion which covers an external surface of at least one of the upper electrode and the lower electrode and is formed by an insulating resin. At least one of the upper electrode and the lower electrode is provided with at least one of opening holes having larger diameters than a via formed in a connection to a wiring pattern when a capacitor component is to be included in a substrate. | 11-05-2009 |
20100008018 | LOW INDUCTANCE INTERCONNECT DEVICE FOR A POWER CAPACITOR COMPONENT - Systems and apparatus are provided for capacitor segments for use in a vehicle. A capacitor segment comprises an inner conductor configured to receive a first potential and having a generally L-shaped longitudinal cross-section. An outer conductor is configured to receive a second potential, and is electrically insulated from the inner conductor. The outer conductor comprises a first section having a generally L-shaped longitudinal cross-section aligned with the inner conductor, and a second section coupled to the first section and having a generally L-shaped lateral cross-section. The second section and the inner conductor define an inner region. A capacitor is located in the inner region and coupled to the inner conductor and the second section. The capacitor segment is configured such that current flows through the capacitor in a first direction, and current flows through the second section in a second direction that generally opposes the first direction. | 01-14-2010 |
20100246089 | METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR - A method of manufacturing a thin film capacitor, having: a base electrode; dielectric layers consecutively deposited on the base electrode; an internal electrode deposited between the dielectric layers; an upper electrode deposited opposite the base electrode with the dielectric layers and the internal electrode being interposed therebetween; and a cover layer deposited on the upper electrode, has depositing an upper electrode layer which is to be the upper electrode, and a cover film which is to be the cover layer on the unsintered dielectric film which is to be the dielectric layer, to fabricate a lamination component, and sintering the lamination component. | 09-30-2010 |
20100277851 | ELECTRIC CIRCUIT DEVICE - An electric circuit device ( | 11-04-2010 |
20110080687 | METHOD OF ADJUSTMENT ON MANUFACTURING OF A CIRCUIT HAVING A RESONANT ELEMENT - A method of adjustment in the manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the capacitance between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode. | 04-07-2011 |
20110170231 | Passive Coupler Between Package Substrate and System Board - A passive device having a portion in the package substrate and a portion in the system board such that the portions of the device are electromagnetically coupled. A transformer including inductors in the package substrate and system board electromagnetically coupled across a space between the substrate and board that is surrounded by solder balls coupling the substrate and board. A capacitor including plates in the substrate and board electromagnetically coupled across a space between the substrate and board that is surrounded by solder balls coupling the substrate and board. A core material can at least partially fill the space between the substrate and board. The solder balls surrounding the space can be coupled to ground. Metal shielding can be put in the substrate and/or board surrounding the device. The metal shielding can be coupled to the solder balls. The metal shielding can be coupled to ground. | 07-14-2011 |
20110199715 | IMPROVED METAL-ON-METAL CAPACITOR WITH DIAGONAL FEEDLINE - A design for an improved metal-on-metal capacitor design is described. The design includes a substantially diagonal feedline ( | 08-18-2011 |
20110255209 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T | 10-20-2011 |
20120081835 | SURFACE MOUNTING SOCKET FOR ELECTROLYTIC CAPACITORS AND METHOD FOR SURFACE MOUNTING OF ELECTROLYTIC CAPACITORS - So as to allow a high capacitance electrolytic capacitor to be surface-mounted and replaced by a new one and thereby increases an effectiveness of repetitive use of an electric circuit used therewith, a socket for a surface-mounting of an electrolytic capacitor, the capacitor having a housing and leads extending from a bottom surface of the housing, includes a support for receiving the bottom surface of the capacitor. The support has a holder for releasably holding a portion of the housing of the capacitor adjacent to the leads; connecting terminals for electrically connecting the leads to a circuit substrate; a recess defined in a top surface of the support for accommodating a deformation of a seal rubber provided at a bottom portion of the housing of the capacitor; and grooves defined in a bottom surface of the support for drawing the connecting terminals. | 04-05-2012 |
20120194966 | Systems and Methods for a Thin Film Capacitor Having a Composite High-K Thin Film Stack - Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrat e material using a metal organic deposition or chemical solution deposition process, depositing a second layer of ferroelectric material on top of the first layer using a high temperature sputter process and depositing a metal interconnect layer to provide electric connections to layers of the capacitor. | 08-02-2012 |
20120236462 | ELECTRONIC COMPONENT - An electronic component includes an electronic component body and metal terminals. The electronic component body includes a base member and external electrodes. The base member includes two opposed end surfaces, two opposed side surfaces, and two opposed principal surfaces. The external electrodes are disposed on the end surfaces of the base member. The metal terminals are connected to the external electrodes by bonding with solder. A relationship of about 21≦Vc/Vh≦about 320 is satisfied where Vc is a volume of the electronic component body and Vh is a volume of the solder provided at one of the pairs of the external electrodes and the metal terminals. | 09-20-2012 |
20120257325 | Multi-Anode Solid Electrolytic Capacitor Assembly - A capacitor assembly that is stable under extreme conditions is provided. A capacitor assembly that is capable of achieving a high capacitance and yet remain thermally and mechanically stable under extreme conditions. Even at high capacitance values, good mechanical stability can be achieved by connecting multiple individual capacitor elements to the housing of the assembly. Without intending to be limited by theory, it is believed that the use of multiple elements increases the surface area over which the elements are connected to the housing. Among other things, this allows the elements to dissipate vibrational forces incurred during use over a larger area, which reduces the likelihood of delamination. The capacitor elements are also enclosed and hermetically sealed within a single housing in the presence of a gaseous atmosphere that contains an inert gas, thereby limiting the amount of oxygen and moisture supplied to the solid electrolyte of the capacitor elements. Through the combination of the features noted above, the capacitor assembly is able to better function under extreme conditions. | 10-11-2012 |
20120262838 | CERAMIC CAPACITOR AND ELECTRONIC COMPONENT INCLUDING THE SAME - In a ceramic capacitor, first and second electrode terminals each include a bonded-to-substrate portion, a first bonded-to-electrode portion bonded to a first edge of one of first and second external electrodes, a second bonded-to-electrode portion bonded to a second edge of the one of first and second external electrodes and disposed at a distance from the first bonded-to-electrode portion in the first directions, and a connecting portion connecting the first and second bonded-to-electrode portions and the bonded-to-substrate portion. W | 10-18-2012 |
20130027840 | ENERGY STORAGE MODULE - Disclosed herein is an energy storage module, including: upper and lower cases each having elastic bodies provide at both side parts thereof; a capacitor cell inserted within the upper case and the lower case and having anode electrodes and cathode electrodes extended at both side parts thereof; and bus bars inserted between the anode terminals and between the cathode terminals of the capacitor cell. According to the present invention, the module can be manufactured in a comparative simple constitution, and an electric short circuit between anode and cathode terminals can be prevented when swelling occurs due to repetitive charging and discharging of capacitor cells. | 01-31-2013 |
20130141836 | METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO | 06-06-2013 |
20140098459 | CAPACITOR AND CONTACT STRUCTURES, AND FORMATION PROCESSES THEREOF - Capacitor and contact structures are provided, as well as methods for forming the capacitor and contact structures. The methods include, for instance, providing a layer of conductive material above a conductive structure and above a lower electrode of a capacitor; etching the layer of conductive material to define a conductive material hard mask and an upper electrode of the capacitor, the conductive material hard mask being disposed at least partially above the conductive structure; and forming a first conductive contact structure and a second conductive contact structure, the first conductive contact structure extending through an opening in the conductive material hard mask and conductively contacting the conductive structure, and the second conductive contact structure conductively contacting one of the lower electrode of the capacitor, or the upper electrode of the capacitor. | 04-10-2014 |
20140111905 | Contact part for electrically connecting end-face contact layers on the end faces of a plastic film capacitor winding of an encased electric single-phase or three-phase capacitor, and encased electric single-phase and three-phase capacitors comprising same - The invention relates to a contact part ( | 04-24-2014 |
20150055274 | METHOD FOR MANUFACTURING TERMINAL-STRIP-EQUIPPED ELECTRONIC COMPONENT AND TERMINAL-STRIP-EQUIPPED ELECTRONIC COMPONENT - A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component. | 02-26-2015 |
20150380908 | CLAD METAL BUS BAR FOR FILM CAPACITOR AND FILM CAPACITOR COMPRISING THE SAME - A clad metal bus bar for a film capacitor may include a clad metal layer including: an aluminum layer; a first copper layer stacked on one surface of the aluminum layer; and a second copper layer stacked on the other surface of the aluminum layer. | 12-31-2015 |
20160055975 | AXIAL LEAD CAPACITORS - This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module. | 02-25-2016 |
20160055978 | CAPACITOR MODULE - This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module. | 02-25-2016 |
20160104574 | CAPACITOR ASSEMBLY ADAPTED FOR CIRCUIT BOARD - A capacitor assembly is providing for adapting a replacement capacitor to an existing circuit board layout. The capacitor assembly has an adapter with a plate and the replacement capacitor affixed thereto, and the adapter has terminals which are connected to the leads of the replacement capacitor. The adapter further has leads, such as pins, extending downward from the plate, to electrically connect the capacitor assembly to the circuit board. | 04-14-2016 |
20160163460 | CAPACITOR AND INVERTER - A capacitor including: a capacitor case having a bottom portion and an opening; a capacitor element accommodated in the capacitor case and including a first electrode E | 06-09-2016 |
20160189870 | ELECTRIC CAPACITOR FOR A COOLANT COMPRESSOR - The invention relates to an electric capacitor having at least one capacitor coil, a cylindrical housing that surrounds the capacitor coil, composed of metal, electric connectors, and connection lines that run in the housing interior and electrically connect the capacitor coil with the connectors, wherein at least one connection line has a planned breaking point, and wherein at least one circumferential depression is formed in the mantle of the housing, which depression divides the housing into a first segment and a second segment and can be unfolded by means of excess pressure in the housing interior, wherein the first segment surrounds the capacitor coil and the second segment carries the connectors. | 06-30-2016 |
20180025848 | Multi-Anode Solid Electrolytic Capacitor Assembly | 01-25-2018 |