Entries |
Document | Title | Date |
20080197963 | BALUN TRANSFORMER, MOUNTING STRUCTURE OF BALUN TRANSFORMER, AND ELECTRONIC APPARATUS HAVING BUILT-IN MOUNTING STRUCTURE - There is provided a balun transformer, in which first to fourth layer coils are stacked and coupled magnetically; one end of each coil of the first to fourth layer coils is grounded; the second and third layer coils are connected in parallel, an unbalanced signal is input/output to/from a common terminal of the second and third layer coils; a first balanced signal is input/output to/from the other end of the first layer coil; and a second balanced signal is input/output to/from the other end of the fourth layer coil. | 08-21-2008 |
20080204183 | 3D-COIL FOR SAVING AREA USED BY INDUCTANCES - Some embodiments discussed relate to an apparatus, including a planar coil that is disposed in a metallization above and perpendicular to a substrate. Some embodiments include a plurality of planar coils that are disposed in the metallization above and perpendicular to the substrate, and that may be electrically connected, or only inductively coupled. A process includes the formation of the planar coil. A method includes using the planar coil as an inductor that is disposed perpendicular to the substrate. A method includes a plurality of spaced apart planar coils that are used as a transformer apparatus. | 08-28-2008 |
20080218302 | Inductive conductivity sensor - A conductivity sensor for measuring conductivity of a medium surrounding the conductivity sensor includes a first toroidal coil bounding a medium-receiving passageway and serving for inducing an electrical current in the medium, and a second toroidal coil also bounding the passageway and serving for registering a magnetic field produced by the electrical current. At least one of the toroidal coils has a plurality of first conductor segments, which extend in a plane of a multi-ply circuit board, a plurality of second conductor segments, which extend in a second plane of the circuit board, and a plurality of through-contacts, which connect the first conductor segments with the second conductor segments, wherein the first conductor segments, the second conductor segments and the through-contacts form, together, the windings of a toroidal coil. | 09-11-2008 |
20080224811 | Magnetic core-coil device - A core-coil device includes: a printed circuit board having upper and lower surfaces and formed with a pair of through-holes that are spaced apart from each other and that extend through the upper and lower surfaces, the printed circuit board being further formed with at least one conductive coil winding that surrounds one of the through-holes; and at least one loop-shaped magnetic core of an integrally molded single piece extending through said one of the through-holes in the printed circuit board. | 09-18-2008 |
20080231406 | SURFACE MOUNT MAGNETIC DEVICE - A surface mount magnetic device includes a magnetic core assembly, a winding coil and an extension region. The magnetic core assembly includes a first magnetic part and a second magnetic part. The second magnetic part has a first surface and a second surface. The first surface of the second magnetic part is connected to second magnetic part such that a receptacle is formed between the first magnetic part and the second magnetic part. The winding coil is partially accommodated within the receptacle and includes at least two pins, wherein the pins are attached on the second surface of the second magnetic part. The extension region is integrally formed on the second surface of the second magnetic part. | 09-25-2008 |
20080231407 | Coupled inductor structure - A coupled inductor structure applied in a first dielectric layer and a second dielectric layer disposed under the first dielectric layer includes a first inductor element disposed on the first dielectric layer and a second inductor element disposed on the second dielectric layer. The first inductor element has a first bending segment, a second bending segment connected to the first bending segment, and a third bending segment connected to the second bending segment. The second bending segment of the first inductor element has on the second dielectric layer a projection intersecting a second bending segment of the second inductor element. A relative position of the first bending segment of the first inductor element to a first bending segment of the second inductor element is opposite to another relative position of the third bending segment of the first inductor element to a third bending segment of the second inductor element. | 09-25-2008 |
20080238601 | Inductive devices with granular magnetic materials - An inductive device is provided, comprising a conductor configured in a spiral and a first layer of granular magnetic material having a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3. A transformer is also provided, comprising a core and a first inductor. The first inductor includes a first conductor configured in a spiral surrounding a first portion of the core, and a first layer of granular magnetic material. The transformer further comprises a second inductor. The second inductor includes a second conductor configured in a spiral surrounding a second portion of the core, and a second layer of granular magnetic material. The first and second layers of granular magnetic material have a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3. | 10-02-2008 |
20080246578 | OPEN PATTERN INDUCTOR - Various embodiments includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns embedded in a magnetic oxide or in an insulator and a magnetic material. Embedding the stacked open pattern inductor in a magnetic oxide or in an insulator and a magnetic material increases the inductance of the inductor and allows the magnetic flux to be confined to the area of the inductor. A layer of magnetic material may be located above the inductor and below the inductor to confine electronic noise generated in the stacked open pattern inductor to the area occupied by the inductor. The stacked open pattern inductor may be fabricated using conventional integrated circuit manufacturing processes, and the inductor may be used in connection with computer systems. | 10-09-2008 |
20080266043 | PLANAR TRANSFORMER ARRANGEMENT - A planar transformer arrangement and method provide isolation between an input signal and an output signal. The planar transformer arrangement includes a planar medium having a first layer, a second layer, and a dielectric interlayer arranged between the first and second layers; at least one meandering primary winding arranged on the first layer of the planar medium, a current flow being induced within the primary winding in accordance with the input signal; at least one meandering secondary winding arranged on the second layer of the planar medium, the primary and secondary windings forming a planar transformer, whereby a voltage is induced across the secondary winding in accordance with the current flow within the primary winding; and a mode elimination arrangement configured to produce a compensated voltage by compensating for a common mode interference on the voltage induced across the secondary winding, the mode elimination arrangement being further configured to generate the output signal in accordance with the compensated voltage; wherein the dielectric interlayer of the planar medium provides a voltage isolation between the primary and secondary windings. | 10-30-2008 |
20080284552 | INTEGRATED TRANSFORMER AND METHOD OF FABRICATION THEREOF - An integrated transformer structure includes a first coil element associated with a transverse axis, the first coil element having at least one turn. The first coil element includes a first portion provided on a first lateral level, and a second portion provided on a second lateral level. The first and second lateral levels being mutually spaced apart along said transverse axis. The first and second portions being displaced laterally from said axis by different respective distances. At least one crossover portion of the first coil element, in which the first coil element being configured to provide a conducting path through at least a portion of the first portion of the first coil element to the crossover portion, through the crossover portion and subsequently through at least a portion of the second portion of the first coil element, in which any change of flow direction along said path is less than 90° in a lateral direction. | 11-20-2008 |
20080284553 | TRANSFORMER WITH EFFECTIVE HIGH TURN RATIO - Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5 p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes. | 11-20-2008 |
20080284554 | Compact robust linear position sensor - The present invention is directed to a position sensor, comprising a printed circuit board; a pair of stationary planar air-core coils formed in a trapezoidal or rectangular shape and side-by-side one another on the printed circuit board, coil windings being relatively uniformly distributed over a predetermined area of the printed circuit board; and a moving target formed by a sheet of copper on the printed circuit board. | 11-20-2008 |
20080284555 | Process for refurbishing an electrical device component comprising a laminate electrical insulation part and electrical device component comprising said part - This invention relates to an improved process for removing conductors and electrical insulation parts from electrical device components so that these devices can be refurbished with new insulation and conductors. This invention also relates to an electrical device component having an electrical winding support, a laminate electrical insulation part, an electrical conductor, and an encapsulating resin, that has a special laminate electrical insulation part that allows more efficient and environmentally friendly refurbishing. | 11-20-2008 |
20080290980 | CONTROL OF EDDY CURRENTS IN MAGNETIC VIAS FOR INDUCTORS AND TRANSFORMERS IN INTEGRATED CIRCUITS - An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency. | 11-27-2008 |
20080297298 | TUNABLE EMBEDDED INDUCTOR DEVICES - The invention provides tunable embedded high frequency inductor devices. The inductor device comprises a dielectric substrate. A first conductive line is disposed on a first surface of the dielectric substrate. A second conductive line is disposed on a second surface of the dielectric substrate. An interconnection is disposed perforating the dielectric substrate and connecting the first conductive line with the second conductive line. A coupling region is defined between the first and the second conductive lines. A conductive plug connecting the first conductive line and the second line is disposed in the coupling region. Alternatively, an opening is disposed in the first and second conductive lines to tune inductance of the inductor. | 12-04-2008 |
20080297299 | VERTICALLY FORMED INDUCTOR AND ELECTRONIC DEVICE HAVING THE SAME - Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs. | 12-04-2008 |
20080297300 | High Voltage Transformer | 12-04-2008 |
20080303621 | COMMON MODE CHOKE COIL - A common mode choke coil includes two laminated coil conductors, a first magnetic substrate arranged on one of the coil conductors, and a second magnetic substrate arranged on the other coil conductor. When it is assumed that a distance from a conductor center of the one coil conductor to the surface of the first magnetic substrate is designated as A, a distance from a conductor center of the other coil conductor to the surface of the second magnetic substrate is designated as B, and a distance from the conductor center of the one coil conductor to the conductor center of the other coil conductor is designated as C, C<(A+B)/2 is satisfied. Accordingly, because a difference in the distances between the magnetic substrates and the coil conductors becomes relatively small, a leakage inductance due to the difference in the distance decreases, and the cut-off frequency with respect to a differential mode signal can be increased. | 12-11-2008 |
20080303622 | SPIRAL INDUCTOR - There is provided a spiral inductor including an insulation board formed into a flat-plate shape; a conductive pattern having a spiral shape and formed at least one surface of the insulation board, wherein the conductive pattern varies in line width according to a distance from one end of the conductive pattern forming a spiral. | 12-11-2008 |
20080303623 | Inductor structure - An inductor structure comprising a substrate; a plurality of insulation layers on the substrate; a first spiral electric conductive coil positioned in the insulation layers to form an inductor having a first direction of magnetic field; a second spiral electric conductive coil positioned in the insulation layers to form an inductor having a second direction of magnetic field, in which, the two or more inductors are independently positioned in a same 3-D space and have a good integration. | 12-11-2008 |
20090002114 | INTEGRATED INDUCTOR - An integrated inductor has a winding. The winding includes a first level metal layer inlaid in a first dielectric layer, a second level metal layer inlaid in a second dielectric layer above the first dielectric layer, and a first line-shaped via structure inlaid in a slot of a third dielectric layer interposed between the first and second dielectric layers for interconnecting the first and second level metal layers. | 01-01-2009 |
20090002115 | METHOD TO IMPROVE INDUCTANCE WITH A HIGH-PERMEABILITY SLOTTED PLATE CORE IN AN INTEGRATED CIRCUIT - An inductor structure ( | 01-01-2009 |
20090009278 | INDUCTOR - An inductor includes: a substrate; an insulator layer; a conductive coil; and a permeability-enhancing film of a multi-layer structure. The multi-layer structure includes at least one repeating unit that has at least two layers. The two layers exhibit an exchange-coupling effect and include a first ferromagnetic layer of a first ferromagnetic material and an exchange-coupling layer. | 01-08-2009 |
20090015363 | INTEGRATED TRANSFORMER - A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn. | 01-15-2009 |
20090027150 | INDUCTANCE WITH A SMALL SURFACE AREA AND WITH A MIDPOINT WHICH IS SIMPLE TO DETERMINE - An inductance formed in a stack of insulating layers, the inductance comprising first and second access terminals and first and second half-loops distributed in the stack of insulating layers on a number of distinct levels greater than or equal to four. For each level, each first half-loop is at least partly symmetrical to one of the second half-loops. All the first half-loops are series-connected according to a first succession of first half-loops to form first loops between the first access terminal and a midpoint and all the second half-loops are series-connected according to a second succession of second half-loops to form second loops between the second output terminal and the midpoint. | 01-29-2009 |
20090039999 | INDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An inductor device formed on a semiconductor substrate includes an inductor body penetrating the semiconductor substrate, taking a spiral shape and having a conductivity, and an insulating film provided between a side surface of the inductor body and the semiconductor substrate. | 02-12-2009 |
20090040000 | INTEGRATED CIRCUITS WITH INDUCTORS - The claimed invention relates to arrangements of inductors and integrated circuit dice. One embodiment pertains to an integrated circuit die that has an inductor formed thereon. The inductor includes an inductor winding having a winding input and a winding output. The inductor also comprises an inductor core array having at least first and second sets of inductor core elements that are magnetically coupled with the inductor winding. Each inductor core element in the first set of inductor core elements is formed from a first metallic material. Each inductor core element in the second set of inductor core elements is formed from a second metallic material that has a different magnetic coercivity than the first magnetic material. The inductor further comprises a set of spacers that electrically isolate the inductor core elements. Some embodiments involve multiple inductor windings and/or multiple inductor core elements that magnetically interact in various ways. Particular embodiments involve core elements having different compositions and/or sizes. | 02-12-2009 |
20090045903 | INDUCTOR STRUCTURE - An inductor structure including a coil layer and at least a gain lead is disclosed. The coil layer is disposed over a substrate and has a plurality of coil turns, wherein one of the coil turns is grounded. The gain lead is disposed under at least one of the inner side and the outer side of the grounded coil turn and is electrically connected in parallel to the grounded coil turn. The width of the gain lead is less than the width of the grounded coil turn. | 02-19-2009 |
20090045904 | INTER-HELIX INDUCTOR DEVICES - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end. | 02-19-2009 |
20090051477 | PLANAR TRANSFORMER, TRANSMISSION LINE BALUN AND METHOD OF FABRICATION - A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit. | 02-26-2009 |
20090058589 | SUSPENSION INDUCTOR DEVICES - Suspension inductor devices are provided. A suspension inductor device includes a dielectric substrate and a suspension induction coil. The suspension induction coil includes an input end disposed on the dielectric substrate. A spiral coil is wound from the dielectric substrate to an interconnection. The interconnection is disposed in the spiral coil and connects the input end and the spiral coil. An output end is disposed on the dielectric substrate and adjacent to the input end. | 03-05-2009 |
20090066461 | PLANAR INDUCTIVE STRUCTURE - A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding. | 03-12-2009 |
20090066462 | COMMON MODE CHOKE COIL AND MANUFACTURING METHOD THEREOF - A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short. | 03-12-2009 |
20090072942 | MEANDER INDUCTOR AND SUBSTRATE STRUCTURE WITH THE SAME - A meander inductor is disclosed, the inductor is disposed on a substrate or embedded therein. The meander inductor includes a conductive layer composed of a plurality of sinusoidal coils with different amplitudes and in series connection to each other, wherein the sinusoidal coils with different amplitudes are laid out according to a periphery outline. The profile of the meander inductor is designed according to an outer frame range available for accommodating the meander inductor and is formed by coils with different amplitudes. Therefore, under a same area condition, the present invention enables the Q factor and the resonant frequency fr of the novel inductor to be advanced, and further expands the applicable range of the inductor. | 03-19-2009 |
20090079530 | Forming a helical inductor - In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a via, which may be formed of a conductive material. Other embodiments are described and claimed. | 03-26-2009 |
20090079531 | Multipole coils - Multipole coils ( | 03-26-2009 |
20090085704 | CHIP INDUCTOR - A chip inductor includes a first substrate and a second substrate. The first substrate includes at least one first conductive strip line having end terminals at a surface of the first substrate and the second substrate includes at least one second conductive strip line having end terminals at a surface of the second substrate, wherein a pitch of the end terminals on the first substrate corresponds to a pitch of the end terminals on the second substrate. Furthermore, conductive studs are provided which connect the end terminals on the first substrate with the end terminals on the second substrate to form an inductor loop. | 04-02-2009 |
20090085705 | TRANSFORMER - A transformer including: a multilayer board; one or more input conductive lines formed on the multilayer board, whose both ends connected to input terminals of a positive signal and a negative signal, respectively; one output conductive line formed adjacent to the one or more input conductive lines to form an electromagnetic coupling with the one or more input conductive lines, whose one end is connected to an output terminal and another end is connected to a ground; a power supply pad formed in an area of the one or more input conductive lines; and a harmonics remover formed between the one end and the another end of the output conductive line to remove harmonics components of a signal outputted from the output conductive line, wherein a part of the one or more input conductive lines is formed on a top surface of the multilayer board and rest of the one or more input conductive lines is formed on a different layer from the top surface of the multilayer board, which are connected to each other via a via hole, and a portion of the output conductive line is formed on the top surface of the multilayer board and another portion of the output conductive line is formed on the different layer from the top surface of the multilayer board, which are connected to each other via the via hole, not to be directly connected to the one or more input conductive lines. | 04-02-2009 |
20090085706 | PRINTED CIRCUIT BOARD COIL - A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern. | 04-02-2009 |
20090085707 | ELECTRONIC DEVICE - An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided. | 04-02-2009 |
20090085708 | ELECTRONIC DEVICE - An electronic device includes a substrate, two ellipse spiral coils that are provided on the substrate, are spaced from each other in a longitudinal direction thereof, and are electrically connected to each other, two wires that are electrically connected to outermost circumference of the two coils respectively and extract the two coils to outside, and a connection portion that electrically connects each end of innermost circumference of the two coils. A ratio of inner diameter against outer diameter of the two coils in a long axis direction and in a short axis direction thereof is respectively 0.5 to 0.8. | 04-02-2009 |
20090096566 | SPIRAL INDUCTOR DEVICE - A spiral inductor device is provided. The spiral inductor device comprises an insulating layer disposed on a substrate. A spiral conductive trace with multiple turns is disposed on the insulating layer, wherein the outermost turn and the innermost turn of the spiral conductive trace have a first end and a second end, respectively, and one of the first and second ends is connected to ground. A non-continuous spiral conductive trace with a single turn is disposed on the insulating layer, parallel and adjacent to the turn that belongs to the spiral conductive trace and is extended from the end of the spiral conductive trace without being connected to ground, wherein the non-continuous spiral conductive trace is connected to the ground. | 04-16-2009 |
20090096567 | INDUCTOR STRUCTURE - An inductor structure includes a winding turn layer, a shielding layer, and a number of vias. The winding turn layer disposed above a substrate is formed by a number of turns connected in series and t has a first end and a second end. The first end is grounded. The shielding layer disposed between the winding turn layer and the substrate has a third end and a fourth end. At least two turns starting from the first end of the winding turn layer are projected onto the shielding layer. The vias are disposed between the winding turn layer and the shielding layer to at least electrically connect the third end and the fourth end of the shielding layer to a first turn of the winding turn layer. The first turn starts from the first end, and the winding turn layer and the shielding layer are electrically coupled in parallel. | 04-16-2009 |
20090102591 | Inductive Component and Method for Manufacturing an Inductive Component - A method for manufacturing an inductive component which is formed from a plurality of layers, wherein the method comprises the steps of a) arrangement of an electrically conductive material as a winding of the component on a first non-magnetic, dielectric ceramic layer; b) formation of at least one cutout which passes all the way through in the non-magnetic, dielectric ceramic layer; c) arrangement of a first magnetic ceramic layer on an upper face and a second magnetic ceramic layer on a lower face of the non-magnetic, dielectric ceramic layer; and d) carrying out a process step in which at least one of the magnetic ceramic layers is plastically deformed such that contact is made with the two magnetic ceramic layers in the area of the cutout, and the two magnetic ceramic layers form a magnetic core of the component. | 04-23-2009 |
20090102592 | Multi-Primary Distributed Active Transformer Amplifier Power Supply and Control - An integrated power combiner is disclosed. The power combiner includes a first circular geometry primary winding having one or more inductive elements, such as an active winding with one or more driver stages. A circular geometry secondary winding is disposed adjacent to the first primary winding, such as an active winding with one or more driver stages. A second circular geometry primary winding is disposed adjacent to the secondary winding and has one or more inductive elements. One or more connections are provided between one or more of the inductive elements of the first circular geometry primary winding and one or more of the inductive elements of the second circular geometry primary winding. | 04-23-2009 |
20090108978 | Cross-coupled Inductor Pair Formed in an Integrated Circuit - Cross-coupled first and second helical inductors formed in an IC. The cross-coupled first and second helical inductors comprise a first helical conductor having a first portion and a second portion, and a second helical conductor having a first portion and a second portion. The second helical conductor is in close proximity to the first helical conductor. The first helical inductor is formed by the first portion of the first helical conductor and the second portion of the second helical conductor. The second helical inductor is formed by the second portion of the first helical conductor and the first portion of the second helical conductor. | 04-30-2009 |
20090115562 | SPIRAL INDUCTOR - A spiral inductor is provided. The spiral inductor includes a first spiral conductive trace with at least one turn, a second spiral conductive trace, and a connector. The first spiral conductive trace comprises an outer end and an inner end. The second spiral conductive trace surrounds a portion of the outermost turn of the first spiral conductive trace, and comprises a first end and a second end. The connector electrically connects to the inner end and the first end. | 05-07-2009 |
20090115563 | Laminated inductor and method of manufacture of same - A laminated inductor, in which there is extremely little tendency for cracking to occur between adjacent conductor patterns in portions of a laminate in the lamination direction even when the conductor pattern thickness is large, as well as a method of manufacturing such a laminated inductor, are provided. | 05-07-2009 |
20090134964 | Lead frame-based discrete power inductor - A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil. | 05-28-2009 |
20090146770 | PLANAR-LIKE INDUCTOR COUPLING STRUCTURE - A planar-like inductor coupling structure includes a first planar inductor embedded in an insulating material layer and a second planar inductor also embedded in the insulating material layer. The first planar inductor and the second planar inductor are substantially at the same height, and have a portion in a horizontal distribution serving as a coupled overlapping region with electric insulation from each other. In addition, the first planar inductor and the second planar inductor may be at different heights. | 06-11-2009 |
20090153281 | METHOD AND SYSTEM FOR AN INTEGRATED CIRCUIT PACKAGE WITH FERRI/FERROMAGNETIC LAYERS - Methods and systems for an integrated circuit package with ferri/ferromagnetic layers are disclosed and may include processing a received signal via a hybrid including an integrated circuit bonded to a multi-layer package including integrated layers of ferrimagnetic material and/or ferromagnetic material, metal interconnect materials and insulating materials. The received signal may be filtered, amplified, and/or impedance matched via the integrated layers of ferrimagnetic material and/or ferromagnetic material. The integrated circuit may be hybridized to the multi-layer package utilizing a flip-chip bonding technique. The hybridized multi-layer package and integrated circuit may be coupled to a printed circuit board utilizing a flip-chip bonding technique. The ferromagnetic material and/or ferrimagnetic material may be deposited on the multi-layer package. The magnetic material may be deposited on the multi-layer package using an ink printing technique and/or a spin-on technique. One or more surface mount devices may be coupled to the multi-layer package. | 06-18-2009 |
20090153282 | ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREOF - There is provided an electronic component formed by adopting an adhesion reinforcement structure to an external electrode or the like, which is embedded in a protecting section made of a resin and part of which is exposed. Even when an external force is applied through the external electrode, the external force can be broadly dispersed all over a connecting section with the protecting section due to the adhesion reinforcement structure, to suppress an influence of the external force on a wiring, and whereby it is possible to omit a substrate that has been one of constitutional elements of a conventional electronic component, so as to realize reduction in height of the electronic component by the height of the substrate. | 06-18-2009 |
20090153283 | MINIATURE TRANSFORMERS ADAPTED FOR USE IN GALVANIC ISOLATORS AND THE LIKE - A component coil for constructing transformers and the transformer constructed therefrom are disclosed. The component coil includes a substrate having an insulating layer of material having top and bottom surfaces. First and second traces are included on the top and bottom surfaces. Each trace includes a spiral conductor. The inner ends of the spiral conductors are connected by a conductor that passes through the insulating layer. The first and second spiral conductors are oriented such that magnetic fields generated by the first and second spiral conductors have components perpendicular to the top surface and in the same direction. The component coils can be used to construct a power transformer or a galvanic isolator. | 06-18-2009 |
20090160595 | Compact Power Semiconductor Package and Method with Stacked Inductor and Integrated Circuit Die - A power semiconductor package is disclosed with high inductance rating while exhibiting a reduced foot print. It has a bonded stack of power IC die at bottom, a power inductor at top and a circuit substrate, made of leadframe or printed circuit board, in the middle. The power inductor has a inductor core of closed magnetic loop. The circuit substrate has a first number of bottom half-coil forming conductive elements beneath the inductor core. A second number of top half-coil forming conductive elements, made of bond wires, three dimensionally formed interconnection plates or upper leadframe leads, are located atop the inductor core with both ends of each element connected to respective bottom half-coil forming conductive elements to jointly form an inductive coil enclosing the inductor core. A top encapsulant protectively encases the inductor core, the top half-coil forming conductive elements, the bottom half-coil forming conductive elements and the circuit substrate. | 06-25-2009 |
20090167476 | INDUCTOR STRUCTURE - An inductor structure disposed over a substrate and including a coil layer is provided. The coil layer has a plurality of coil turns electrically connected with each other. An innermost coil turn of the coil layer has a portion with a narrower width in a region with a higher magnetic flux density than that in the other region with lower magnetic flux density. | 07-02-2009 |
20090167477 | Compact Inductive Power Electronics Package - An inductive power electronics package is disclosed. It has a circuit substrate with power inductor attached atop. The power inductor has inductor core of closed magnetic loop with an interior window. The closed magnetic loop can include air gap for inductance adjustment. The circuit substrate has bottom half-coil forming elements constituting a bottom half-coil beneath the inductor core. Also provided are top half-coil forming elements interconnected with the bottom half-coil forming elements to form an inductive coil enclosing the inductor core. An inner connection chip can be added in the interior window for interconnecting bottom half-coil forming elements with top half-coil forming elements. An outer connection chip can be added about the inductor core for interconnecting bottom half-coil forming elements with top half-coil forming elements outside the inductor core. A power Integrated Circuit can be attached to the top side of the circuit substrate as well. | 07-02-2009 |
20090179723 | Method For Making Magnetic Components With M-Phase Coupling, And Related Inductor Structures - An M phase coupled inductor includes a magnetic core including a first end magnetic element, a second end magnetic element, and M legs disposed between and connecting the first and second end magnetic elements. M is an integer greater than one. The coupled inductor further includes M windings, where each winding has a substantially rectangular cross section. Each one of the M windings is at least partially wound about a respective leg. | 07-16-2009 |
20090184794 | LAMINATED COIL - A laminated coil includes a laminated body having magnetic body sections that are provided on both main surfaces of a non-magnetic body section and include a plurality of stacked magnetic layers, the non-magnetic body section including at least one non-magnetic layer, and a coil including helically connected coil conductors provided in the laminated body. The conductor width of at least one of the coil conductors provided inside the non-magnetic body sections and the coil conductors provided on both main surfaces of the non-magnetic body sections is greater than the conductor width of the other coil conductors in the laminated body. | 07-23-2009 |
20090189727 | Inductor device - An inductor device includes at least one printed circuit board, a magnetic device and a metal wire. The printed circuit board has through holes disposed on it. The magnetic device passes through the through holes on the printed circuit board. The metal wire surrounds the magnetic device with an eddy shape. | 07-30-2009 |
20090195343 | Planar inductor - A planar inductor ( | 08-06-2009 |
20090195344 | CONTACTLESS DATA COMMUNICATIONS COUPLER - The embodiments of the present invention provide a non-contact data connection that is adaptable to transmit data across an air gap. The data connection includes a first substrate ( | 08-06-2009 |
20090201115 | INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE - An electronic circuit in an integrated circuit package comprises an inductance element. The inductance element further comprises a plurality of separated metal strips formed on a substrate and a ferrite core coupled to the substrate. The metal strip plurality is formed between the substrate and the ferrite core. The inductance element further comprises a plurality of wires coupled to the separated metal strips whereby the metal strips and wires form a continuous coil. The ferrite core is interposed between the metal strip plurality and the wire plurality. | 08-13-2009 |
20090201116 | ANTENNA CIRCUIT AND TRANSPONDER - A transponder is provided capable of having desired characteristics by a method for forming a resonance circuit, despite the fact that its cost is low and its structure is simple. An antenna circuit is provided in the transponder and comprises an antenna conductor having a predetermined conductor pattern formed on the front surface of a substrate and a sheet metal disposed on the rear surface of the substrate. A part of the sheet metal is provided with a slit so formed that its start end and terminal end are opened to the area at which the sheet metal does not exist. | 08-13-2009 |
20090201117 | CONTAINER WITH ELECTROMAGNETIC COUPLING MODULE - A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system. | 08-13-2009 |
20090243778 | INDUCTOR HAVING OPENING ENCLOSED WITHIN CONDUCTIVE LINE AND RELATED METHOD - Embodiments of an inductor including a conductive line including at least one turn and an opening positioned within an interior of a region of the conductive line are disclosed. Embodiments of a related method of designing the inductor are also disclosed. | 10-01-2009 |
20090243779 | METHOD AND SYSTEM FOR RECONFIGURABLE DEVICES FOR MULTI-FREQUENCY COEXISTENCE - Aspects of a method and system for reconfigurable devices for multi-frequency coexistence are provided. In this regard, an IC may be configured based on a frequency of signals processed by the IC. In instances that the IC may process signals of a first frequency, the IC may be configured such that a loop communicatively coupled to the integrated circuit may function as an inductor. In instances that the IC may process signals of a second frequency, the IC may be configured such that the loop may function as an antenna for transmitting and/or receiving the signals. The loop may be within and/or on the IC and/or a package such as a multilayer package to which the IC may be bonded. The loop may be fabricated with stripline and/or microstrip transmission line. In instances that the loop may function as an inductor, the loop may be communicatively coupled as part of a VCO tank circuit. | 10-01-2009 |
20090243780 | FLAT MAGNETIC ELEMENT AND POWER IC PACKAGE USING THE SAME - A planar magnetic device | 10-01-2009 |
20090243781 | METHOD OF MANUFACTURING A CONDUCTOR CIRCUIT, AND A COIL SHEET AND LAMINATED COIL - A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the of the continuous conductor pattern. | 10-01-2009 |
20090243782 | High Voltage Hold-Off Coil Transducer - Disclosed herein are various embodiments of coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided through and across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. A central core layer separates the transmitting and receiving coils, and has no vias disposed therethrough. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. | 10-01-2009 |
20090243783 | Minimizing Electromagnetic Interference in Coil Transducers - Disclosed herein are various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another. | 10-01-2009 |
20090243784 | LAMINATED COIL COMPONENT AND METHOD FOR PRODUCING THE SAME - A laminated coil component includes a laminate including laminated magnetic layers and a coil disposed in the laminate and including a plurality of internal electrodes. The number of the magnetic layers laminated in a non-superimposed area that does not overlap with the internal electrodes in the lamination direction is greater than the number of the magnetic layers laminated in a superimposed area that overlaps with the internal electrodes in the lamination direction. | 10-01-2009 |
20090251267 | Inductors and methods of operating inductors - An inductor may include a conductive line including a material in which an electrical resistance varies depending on an electric field applied to the material and/or first and second electrodes electrically connected to first and second end portions of the conductive line, respectively. A method of operating an inductor may include applying current to a conductive line of the inductor. The conductive line may include a material in which an electrical resistance may vary depending on an electric field applied to the material. The current may be applied to the conductive line via first and second electrodes electrically connected to first and second end portions of the conductive line, respectively. | 10-08-2009 |
20090251268 | LAMINATED COIL COMPONENT - In an open magnetic circuit type laminated coil component having a laminate formed by laminating a magnetic layer and a non-magnetic layer or a low magnetic permeability layer and a coil conductor disposed in the laminate, a zirconium oxide is included in the non-magnetic layer or the low magnetic permeability layer forming the laminate. The content of the zirconium oxide in the low magnetic permeability layer is in the range of about 0.02 wt % to about 1.0 wt %. A zirconium oxide is also included in the magnetic layer in a proportion of less than about 1.0 wt %. As the magnetic layer, a material including Ni—Cu—Zn ferrite as a main component is preferably used. As the non-magnetic layer or the low magnetic permeability layer, a material including Cu—Zn ferrite as a main component is preferably used. | 10-08-2009 |
20090256668 | MULTILAYER ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME - A multilayer electronic component that can suppress the formation of projections and depressions on a surface, and an electronic component unit including the multilayer electronic component, are provided. In the multilayer electronic component, coil electrodes ( | 10-15-2009 |
20090261935 | INDUCTOR DEVICE - An inductor device is provided. The inductor includes: a first inductor; a second inductor, wherein the first inductor and the second inductor are arranged such that a magnetic field generated by the first inductor and passing through the inside of a loop formed from the second inductor comprises a first magnetic field and a second magnetic field, the first magnetic field passing from the topside of the loop to the downside of the loop, the second magnetic field passing from the downside of the loop to the topside of the loop. | 10-22-2009 |
20090261936 | THIN FILM STRUCTURES WITH NEGATIVE INDUCTANCE AND METHODS FOR FABRICATING INDUCTORS COMPRISING THE SAME - An inductor structure comprising a substrate and a planar conductor structure on a surface of the substrate, and methods for fabricating an inductor structure. The planar conductor structure may comprise a vertical stack of three or more multilayer films. Each multilayer film may comprise a first layer of a first metal, defining a first vertical thickness, and a second layer of a second metal, defining a second vertical thickness. The metals and thicknesses are chosen such that the inductor exhibits a negative electrical self-inductance when an electrical signal is transmitted from a first contact point to a second contact point. | 10-22-2009 |
20090261937 | INTEGRATED INDUCTOR - An integrated inductor includes a winding consisting of an aluminum layer atop a passivation layer, wherein the aluminum layer does not extend into the passivation layer and has a thickness that is not less than about 2.0 micrometers. The passivation layer has a thickness not less than about 0.8 micrometers. By eliminating copper from the integrated inductor and increasing the thickness of the passivation layer, the distance between the bottom surface of the inductor structure and the main surface of the semiconductor substrate is increased, thus the parasitic substrate coupling may be reduced and the Q-factor may be improved. Besides, the increased thickness of the aluminum layer may help improve the Q-factor as well. | 10-22-2009 |
20090273427 | COMPACT SIZED CHOKE COIL AND FABRICATION METHOD OF SAME - The present invention relates to a compact sized choke coil and fabrication method of same, an enameled metal wire or metal wire enclosed with insulated material is firstly prepared, then the wire is wound into helical coil, and then a magnetic film on the helical coil is formed by sputtering a layer of magnetic substance with a thickness greater than 10 | 11-05-2009 |
20090273428 | INDUCTIVE MODULE - An inductive module includes an electrically insulating basic substrate unit having opposite first and second trace-forming sides, a ferromagnetic core unit embedded in the basic substrate unit and having horizontal sides substantially parallel to and respectively spaced apart from the first and second trace-forming sides, and a coil unit. The coil unit includes first and second conductive vias respectively formed in the basic substrate unit adjacent to vertical sides of the core unit, and respectively spaced apart from the vertical sides, and first and second conductive traces, each of which is disposed on a corresponding one of the first and second trace-forming sides, and interconnects electrically a corresponding pair of the first and second conductive vias. The conductive traces and the conductive vias of the coil unit cooperate to form an electric current path that substantially winds around the core unit. | 11-05-2009 |
20090273429 | INDUCTOR AND METHOD FOR FABRICATING THE SAME - An inductor includes a flat substrate and a conductor in a spiral shape having a plurality of turns. The plane on which the conductor is formed is substantially in parallel with a principal surface of the substrate. The turns of the conductor are equally spaced from each other in a direction parallel to the plane on which the conductor is formed. An outer one of the turns of the conductor is wider and thinner than an inner one of the turns of the conductor. A level of at least one of a top and a bottom of the conductor differs from one turn to another in a cross section vertical to the plane on which the conductor is formed. | 11-05-2009 |
20090278649 | Laminated Ceramic Electronic Component and Method for Producing the Same - A laminated ceramic electronic component includes a plurality of conductor pattern layers for a coil arranged to overlap each other to form substantially U-shaped conductors for the coil. The conductors for the coil are electrically connected in series through via holes for inner layer connection provided in ceramic green sheets to form a spiral coil. A plurality of lead conductor pattern layers also overlaps each other to form lead conductors. One lead conductor pattern layer is disposed per a predetermined number of conductor pattern layers for the coil. An end of each lead conductor pattern layer is in contact with the corresponding conductor pattern layer for the coil. In other words, the thickness of the lead conductors is less than the thickness of the conductors for the coil. | 11-12-2009 |
20090278650 | INDUCTOR - An inductor includes a casing, a coil and a core. The casing is provided with a slot. The coil is constituted of a first terminal, a bottom ring, a top ring and a second terminal. The first terminal is formed into a T-shaped strip and is partially inserted into the slot. The bottom ring wraps from a distal end of the first terminal. The top ring wraps from the distal end of the bottom ring and is overlapped on the bottom ring. The distal end of the top ring is bent downwardly to be located at the outside of the bottom ring. The second terminal extends from the distal end of the top ring and is partially inserted into the slot. The shape of the second terminal is the same as that of the first terminal. All of the first terminal, the bottom ring and the top ring have the same cross-sectional area. The core penetrates the coil and is accommodated in the casing. | 11-12-2009 |
20090278651 | COIL UNIT AND ELECTRONIC APPARATUS USING THE SAME - A coil unit includes a coil including a coil wire, a magnetic substance for receiving magnetic force lines generated by the coil, a first substrate, and a temperature detection element disposed on the first substrate. | 11-12-2009 |
20090284339 | Transformers, balanced-unbalanced transformers (baluns) and Integrated circuits including the same - A transformer of fully symmetric structure includes a primary coil assembly and a secondary coil assembly. The primary coil assembly includes a plurality of primary coils formed in a plurality of metal layers, and a first interlayer connection unit for connecting the primary coils. The secondary coil assembly includes a plurality of secondary coils formed in the plurality of metal layers, and a second interlayer connection unit for connecting the secondary coils. The primary and secondary coils formed in the same metal layer are concentric and axisymmetric with respect to a diameter line passing through a planar center point. A balanced-unbalanced transformer (balun) is a type of transformer that may be used to convert an unbalanced signal to a balanced one or vice versa. An integrated circuit may include a semiconductor substrate and a transformer. Electrical elements such as transistors may be formed on the semiconductor substrate. | 11-19-2009 |
20090284340 | COMMON MODE FILTER - A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter | 11-19-2009 |
20090295528 | AC/DC PLANAR TRANSFORMER - An inductive element including a magnetic core with a section received in a central opening defined in each of the layers in a multilayer circuit board. A primary winding, an auxiliary winding, and a secondary winding are each realized in conductive coils located on a plurality of layers in the circuit board. The secondary winding is separated from the other windings by a relatively-thick dielectric layer. Other dielectric layers separate each of the layers with the coils. EMI shields are provided on other layers. The coils are located in a central region of each layer so as to provide an adequate safety margin from the side edges of the inductive element. | 12-03-2009 |
20090309687 | METHOD OF MANUFACTURING AN INDUCTOR FOR A MICROELECTRONIC DEVICE, METHOD OF MANUFACTURING A SUBSTRATE CONTAINING SUCH AN INDUCTOR, AND SUBSTRATE MANUFACTURED THEREBY, - A method of manufacturing an inductor for a microelectronic device comprises providing a substrate ( | 12-17-2009 |
20090309688 | Circuit apparatus and method of manufacturing the same - A circuit apparatus includes a first insulating layer, a first inductor, a first terminal, a second terminal, a first interconnect, and a wire. The first inductor is located at one surface of the first insulating layer and configured by a spiral conductive pattern. The first terminal and the second terminal are exposed from one surface of the first insulating layer. The first interconnect is formed on one surface of the first insulating layer to connect the first terminal and an external end of the first inductor. The wire is located on a one-surface side of the first insulating layer to connect the second terminal and a central end of the first inductor. | 12-17-2009 |
20090315662 | INDUCTOR ELEMENT, INDUCTOR ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE WITH INDUCTOR ELEMENT MOUNTED THEREON - An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer. | 12-24-2009 |
20100001823 | Flexible Coil - The present invention is to provide a coil having flexibility even if it includes a core body. A flexible coil | 01-07-2010 |
20100001824 | Autotransformer using printed wireboard - An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface. | 01-07-2010 |
20100007456 | MANUFACTURING OF AN ELECTRONIC CIRCUIT HAVING AN INDUCTANCE - An electronic circuit has an inductor. The inductor comprises a first number of electrically conductive tracks ( | 01-14-2010 |
20100013589 | SUBSTRATE INDUCTIVE DEVICES AND METHODS - Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed. | 01-21-2010 |
20100026439 | Antenna For Near Field And Far Field Radio Frequency Identification - In accordance with an embodiment of the invention, there is disclosed an antenna for radio frequency identification. The antenna comprises a first radiating element for operating a first mode of radio frequency identification using a first current. The antenna further comprises a second radiating element for operating a second mode of radio frequency identification using a second current. Specifically, at least one of a portion of the first radiating element forms a portion of the second radiating element and a portion of the second radiating element forms a portion of the first radiating element. When the first radiating element is excited by the first current, the first radiating element generates a first field for providing the first mode of radio frequency identification, and when the second radiating element is excited by the second current, the second radiating element generates a second field for providing the second mode of radio frequency identification. | 02-04-2010 |
20100026440 | Co-Fired Ceramic Inductors With Variable Inductance, and Voltage Regulators Having Same - Ceramic inductors are made from stacked sheets of co-fired ceramic. At least one of the ceramic sheets has a slot with a conductor disposed in the slot. The conductor has a thickness equal to a thickness of the ceramic sheet containing the slot. The conductor has a large thickness (compared to prior art co-fired ceramic inductors) and therefore can carry large currents. The present ceramic inductor can be used in power electronics applications due to the ability to carry large currents. The present ceramic inductor preferably has an inductance that decreases with increasing current. A decreasing inductance characteristic tends to increase energy efficiency in a voltage regulator when the inductor is used as an output inductor. Specifically, the variable inductance tends to substantially increase energy efficiency at low current loads without adversely affecting efficiency at high loads. | 02-04-2010 |
20100033286 | LAMINATED DEVICE - A laminated device comprising pluralities of magnetic ferrite layers, conductor patterns each formed on each magnetic ferrite layer and connected in a lamination direction to form a coil, and a non-magnetic ceramic layer formed on at least one magnetic ferrite layer such that it overlaps the conductor patterns in a lamination direction, the non-magnetic ceramic layer comprising as main components non-magnetic ceramics having higher sintering temperatures than that of the magnetic ferrite, and further one or more of Cu, Zn and Bi in the form of an oxide. | 02-11-2010 |
20100033287 | INTEGRATED PASSIVE DEVICE AND IPD TRANSFORMER - Provided are an integrated passive device (IPD) and an IPD transformer. The integrated passive device includes a dielectric laminated substrate, a first conductive layer, a buffer layer, and a second conductive layer. The first conductive layer is formed in the dielectric laminated substrate. The buffer layer is formed on one region of the first conductive layer in the dielectric laminated substrate. The second conductive layer is formed on the buffer layer such that a portion of the second conductive layer is exposed to the outside of the dielectric laminated substrate. | 02-11-2010 |
20100033288 | Thin inductor, method of producing the thin inductor, and ultra small size power conversion apparatus using the thin inductor - Two coil conductors of the same spiral shape are cut out from a lead frame. The two coil conductors are disposed back to back so that the front of a first coil conductor is superimposed over the rear of a second coil conductor. Central end portions of the first and second coil conductors are connected to each other through a connection layer. Outer end portions of the spirals of the first and second coil conductors are connected to corresponding ones of first and second terminals of the thin inductor, respectively. A sintered green sheet as a magnetic substance is disposed in gaps between the first and second coil conductors. In this manner, the invention can provide a thin inductor small in size, strong in mechanical strength and inexpensive, a method of producing the thin inductor, and an ultra small size power conversion apparatus using the thin inductor. | 02-11-2010 |
20100033289 | Miniaturized Wide-Band Baluns for RF Applications - A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil. | 02-11-2010 |
20100033290 | Miniaturized Wide-Band Baluns for RF Applications - A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil. | 02-11-2010 |
20100039205 | SPIRAL INDUCTOR WITH MULTI-TRACE STRUCTURE - A spiral inductor with a multi-trace structure having an insulating layer disposed on a substrate. A first spiral conductive trace with multiple turns is disposed on the insulating layer, wherein the outermost turn and the innermost turn of the first spiral conductive trace have a first end and a second end, respectively, and one of the first and second ends is connected to ground. A second spiral conductive trace with a single turn is disposed on the insulating layer and adjacent to the first spiral conductive trace, wherein the second spiral conductive trace is electrically connected to the turn that is connected to the ground and belongs to the first spiral conductive trace. The first spiral conductive trace has a relative outside and a relative inside, wherein the end of the first spiral conductive trace connected to ground and the second spiral conductive trace are located at different sides respectively. | 02-18-2010 |
20100045419 | INDUCTOR - Parasitic capacitance between upper and lower adjacent wirings of an inductor using a multilayer wiring layer in an insulating film formed on a base substrate is reduced. An inductor is characterized by having one go-around of go-around wiring (A-B or B-C) formed in each of at least two of adjacent wiring layers of a plurality of wiring layers | 02-25-2010 |
20100052837 | Integrated Circuit Multilevel Inductor - An integrated circuit (IC) multilevel inductor structure is provided. The IC multilayer inductor structure is made from an IC including a plurality of circuit layers, where the inductor is a three-dimensional (3D) loop formed over a plurality of the circuit layers. In a simple example, if the IC includes a first circuit layer and a second circuit layer, then the inductor 3D loop includes a first partial loop portion formed on the first circuit layer, a second partial loop portion formed on the second circuit layer, and a via connecting the first and second partial loop portions. More generally, the inductor typically includes a plurality of 3D loops. A first plurality of 3D loops is formed between the input and an nth circuit layer, and a second plurality of 3D loops is formed between the nth circuit layer and the output. | 03-04-2010 |
20100052838 | ELECTRONIC COMPONENT - An electronic component is configured to include a laminate disposed between first and second magnetic substrates. The laminate is formed by laminating resin insulating layers, a coil pattern, and a lead pattern. The coil pattern is connected to external electrodes disposed on end surfaces of the laminate by using internal electrodes. The electronic component further includes expansion relaxation portions disposed in the inside of the resin insulating layers and located in the vicinity of connection regions of the internal electrodes and the external electrodes. The expansion relaxation portions are formed by using a magnetic powder resin in which a ferrite powder and a resin material are mixed. | 03-04-2010 |
20100060402 | BALUN CIRCUIT MANUFACTURED BY INTEGRATE PASSIVE DEVICE PROCESS - A Balun circuit manufactured by integrate passive device (IPD) process is provided. The Balun circuit includes a substrate, a first coplanar spiral structure, and a second coplanar spiral structure. At least two first left half coils of the first coplanar spiral structure are electrically connected to the corresponding two first right half coils through a first intersecting structure. At least two second left half coils of the second coplanar spiral structure are electrically connected to the corresponding two second right half coils through a second intersecting structure. The two ends of the second coplanar spiral structure are electrically connected to the innermost second left half coil and the second right half coil respectively. The first left half coils and the second left half coils are interlaced, and so are the first right half coils and the second right half coils interlaced. | 03-11-2010 |
20100060403 | DUAL INDUCTANCE STRUCTURE - A dual inductance structure including a substrate, a first inductance element, a second inductance element and a grounding element is provided. The substrate has a layout layer and a grounding layer. The first inductance element has a first and a second conductor. The second inductance element has a third and a fourth conductor. The grounding element has a first and a second grounding portion. The first grounding portion is on the grounding layer and located at an area between the first conductor and the third conductor. At least a part of the second grounding portion is on the grounding layer and located at an area between the first conductor and the second conductor. At least another part of the second grounding portion is on the grounding layer and located at an area between the third conductor and the fourth conductor. | 03-11-2010 |
20100079232 | MULTI-LAYERED DEVICE - A multilayered device comprises an insulation sheet | 04-01-2010 |
20100079233 | PLANAR TRANSFORMER - A planar transformer includes first and second windings that may be comprised of electrically conductive traces etched onto one or more printed circuit boards. The printed circuit boards may be arranged in various orientations so as to change the turns ratio of the planar transformer. In one embodiment, the printed circuit boards are substantially similar and may be electrically connected via connectors that separate the circuit boards. Insulating sleeves may be inserted between the printed circuit boards in an interleaved configuration. | 04-01-2010 |
20100109829 | ELECTRONIC COMPONENT - A multilayer body is formed by laminating multiple insulating layers. External electrodes are provided on the opposed side surfaces of the multilayer body and extend in the z axis direction. Coil conductors are laminated together with the insulating layers and form a coil. Coil conductors other than coil conductors connected to the external electrodes are made up of pairs of adjacent coil conductors having an identical shape, and coil conductors forming each pair are connected in parallel to each other. None of the coil conductors connected to the external electrodes is connected in parallel to coil conductors with an identical shape. | 05-06-2010 |
20100117779 | INDUCTOR AND ELECTRIC POWER SUPPLY USING IT - An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board. | 05-13-2010 |
20100127812 | CHIP-TYPE COIL COMPONENT - A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated. | 05-27-2010 |
20100141369 | Planar Inductor | 06-10-2010 |
20100141370 | Multilayer inductor - A multilayer inductor is disclosed. The multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element. The spiral inductor element is coupled to the first inductor electrode by means of a through hole formed in the bottom magnetic layer and to the second inductor electrode by means of power conductive traces formed on side surfaces of the multilayer inductor. Flux density reducing layers may be inserted directly above the bottom magnetic layer and directly below the top magnetic layer. Signal/power conductive traces formed on side surfaces of the multilayer inductor provide signal/power routing between the top magnetic layer signal/power contacts and the bottom magnetic layer signal/power contacts. The top external conductive pattern accommodates a semiconductor chip in a flip chip configuration. | 06-10-2010 |
20100141371 | Magnetic Core-Coil Device and Method for Making the Same - A magnetic core-coil device includes: a printed circuit board having a stack of plate layers, a loop-shaped magnetic core, a primary winding, and an auxiliary winding. The loop-shaped magnetic core has two side portions extending through two rows of through holes of the printed circuit board. The primary winding includes a plurality of primary coil sections formed respectively on the plate layers and each looping around one of the side portions. The auxiliary winding includes a plurality of auxiliary coil sections formed respectively on the plate layers and each looping around the other one of the side portions. | 06-10-2010 |
20100148909 | HIGH ENERGY DENSITY INDUCTOR - A substrate layer for use in an inductor is provided. The substrate layer comprises traces disposed on a first side of the substrate layer, wherein the traces are configured to facilitate conduction of current in a winding of the inductor, a sealing layer disposed on a second side of the substrate layer, wherein the sealing layer is configured to provide a sealing border for an electrically isolated cooling channel and an interconnect foil disposed on the second side of the substrate layer, wherein the interconnect foil is configured to facilitate operationally coupling the substrate layer to a second substrate layer. Further, the first substrate layer and the second substrate layer may be operationally coupled to form a winding for use in an inductor with an electrically isolated cooling channel in between. | 06-17-2010 |
20100148910 | ELECTRONIC CIRCUIT DEVICE - An electronic circuit device | 06-17-2010 |
20100148911 | Miniature Transformers Adapted For Use In Galvanic Isolators And The like - A component coil for constructing transformers and the transformer constructed therefrom are disclosed. The component coil includes a substrate having an insulating layer of material having top and bottom surfaces. First and second traces are included on the top and bottom surfaces. Each trace includes a spiral conductor. The inner ends of the spiral conductors are connected by a conductor that passes through the insulating layer. The first and second spiral conductors are oriented such that magnetic fields generated by the first and second spiral conductors have components perpendicular to the top surface and in the same direction. The component coils can be used to construct a power transformer or a galvanic isolator. | 06-17-2010 |
20100164669 | PASSIVE ELECTRICAL COMPONENTS WITH INORGANIC DIELECTRIC COATING LAYER - A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer. | 07-01-2010 |
20100164670 | COIL SUBSTRATE STRUCTURE, SUBSTRATE HOLDING STRUCTURE, AND SWITCHING POWER SUPPLY - A coil substrate structure which enhances heat dissipation and fully secures a mounting area is provided. A coil substrate structure | 07-01-2010 |
20100164671 | INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION - An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna. | 07-01-2010 |
20100164672 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device and a method for manufacturing the same improves performance of an inductor, wherein a PGS pattern formed in a spiral shape, like inductors, blocks electric current induced to a semiconductor substrate, removes effects of parasitic capacitance thereon and thereby improves performance of the inductor. In accordance with the method, the PGS pattern is formed in a spiral shape, like the inductor, to inhibit flow of induced current. As a result, flow of current induced to the semiconductor substrate, one of resistant conductors, can be blocked. In addition, the PGS pattern acts between the inductor and the semiconductor substrate, thus preventing current leakage to the semiconductor substrate. Furthermore, the PGS pattern is interposed between the inductor and the semiconductor substrate to form an inductor-inserted structure, thus enabling reduction in effects of parasitic capacitance generated between the inductor and the semiconductor substrate on the semiconductor substrate arranged thereunder. | 07-01-2010 |
20100171582 | MONOLITHIC INDUCTIVE COMPONENT, METHOD FOR THE PRODUCTION OF THE COMPONENT, AND APPLICATION OF THE COMPONENT - A method for manufacturing a monolithic inductive component is provided. The method may include providing a green body comprising a green sheet composite for forming a multilayer ceramic body with an integrated winding and a shaped body of terrific core material, the green sheet composite being combined with an encapsulation so as to create a cavity with a cavity opening between the encapsulation and the green sheet composite, and the cavity being filled with the ferritic core material through the cavity opening; and heat-treating the green body, a multilayer ceramic body with an integrated winding being created from the green sheet composite and a magnetic core comprising the ferritic core material being created from the green sheet composite. | 07-08-2010 |
20100176905 | Magnetic Device Having a Conductive Clip - A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. | 07-15-2010 |
20100182118 | Solid State Components Having an Air Core - Solid state components having an air core and methods of producing such components are presented. An air core component preferably has lower conducting bands, upper conducting, and conducting posts that collectively form a conducting coil. A coating material placed at least over the upper bands of the coil provides structural support for the coil. The coil can be built around or in a sacrificial core material that can be removed leaving an air core behind. | 07-22-2010 |
20100188182 | Narrowbody Coil Isolator - Disclosed herein are various embodiments of narrowbody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price. | 07-29-2010 |
20100194513 | LAYERED INDUCTOR - A layered inductor | 08-05-2010 |
20100194514 | COUPLED INDUCTOR STRUCTURE - A coupled inductor structure applied in a first dielectric layer and a second dielectric layer disposed under the first dielectric layer includes a first inductor element disposed on the first dielectric layer and a second inductor element disposed on the second dielectric layer. The first inductor element has a first bending segment, a second bending segment connected to the first bending segment, and a third bending segment connected to the second bending segment. The second bending segment of the first inductor element has on the second dielectric layer a projection intersecting a second bending segment of the second inductor element. A relative position of the first bending segment of the first inductor element to a first bending segment of the second inductor element is opposite to another relative position of the third bending segment of the first inductor element to a third bending segment of the second inductor element. | 08-05-2010 |
20100201473 | MULTILAYER COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A highly reliable multilayer coil component is provided without forming voids between magnetic ceramic layers and internal conductor layers. According to the multilayer coil component, an internal stress problem is reduced, the direct current resistance is low, and fracture of internal conductors caused by the surge or the like is not likely to occur. An acidic solution is allowed to permeate a magnetic ceramic element from a side surface thereof through a side gap portion which is a region between side portions of the internal conductors and the side surface of the magnetic ceramic element and to reach interfaces between the internal conductors and a magnetic ceramic located therearound. A pore area ratio of the magnetic ceramic of the side gap portion which is located between the side portions of the internal conductors and the side surface of the magnetic ceramic element is set in the range of 6% to 28%. | 08-12-2010 |
20100207715 | CHOKE INTEGRATED INTO A PRINTED CIRCUIT - Choke printed on a material of thickness H, the choke including one or more turns characterized in that a turn includes a first metallized track deposited on a first face of the material, of a second metallized track deposited on a second face of the material, a track deposited on the first face being united with a track deposited on the second face by means of at least one metallized hole passing through the thickness of the material. | 08-19-2010 |
20100219926 | LOW-PROFILE TRANSFORMER - The present invention provides an improved transformer ( | 09-02-2010 |
20100219927 | ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - An electronic substrate including: a base substrate having an active face and a rear face; and a plurality of inductor elements formed on or above the active face, or formed on or above the rear face. | 09-02-2010 |
20100225434 | STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING SAME - A stacked semiconductor device assembly ( | 09-09-2010 |
20100225435 | Magnetic Film Enhanced Inductor - An integrated magnetic film enhanced inductor and a method of forming an integrated magnetic film enhanced inductor are disclosed. The integrated magnetic film enhanced inductor includes an inductor metal having a first portion and a second portion, a top metal or bottom metal coupled to the inductor metal, and an isolation film disposed one of in, on, and adjacent to at least one of the first portion and the second portion of the inductor metal. The isolation film includes a magnetic material, such as a magnetic film. | 09-09-2010 |
20100225436 | MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS - The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral. | 09-09-2010 |
20100225437 | MULTILAYER COIL COMPONENT - A multilayer coil component is provided in which solder fusibility and a self-alignment property are prevented from being degraded due to absorption of a flux in a soldering step. The multilayer coil component has no voids present at interfaces between internal conductors | 09-09-2010 |
20100231344 | INDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME - An inductor device includes a first magnetic body pattern layer in which slits are provided and which is made to a pattern, a lower insulating layer formed on the first magnetic body pattern layer, a planar coil layer formed on the lower insulating layer, an upper insulating layer formed on the planar coil layer, and a second magnetic body pattern layer formed on the upper insulating layer and in which slits are provided and which is made to a pattern, wherein the first magnetic body pattern layer and the second magnetic body pattern layer are arranged to intersect orthogonally with the planar coil layer. | 09-16-2010 |
20100237976 | LOW-PROFILE INDUCTIVE COIL AND METHOND OF MANUFACTURE - Disclosed is an inductive coil comprising a non-conductive substrate, a plurality of insulator layers laminated in a stack over the non-conductive substrate, and a plurality of conductive layers interleaved between the insulator layers. A hole passes through the conductive and insulator layers, and a magnetic core is placed in the hole and over the substrate. Each of the conductive layers includes a single-layer conductive trace coiled around the hole with an isolating gap between each turn of the conductive trace. At least one plated via passes through at least one of the insulator layers to connect traces of at least two conductive layers. The inductive coil may be a Hearing Aid Compliant (HAC) T-coil, includable in a wireless communication device, such as a cellular phone. A method of manufacturing the inductive coil is also disclosed. | 09-23-2010 |
20100245011 | Integrated or printed margarita shaped inductor - An integrated printed inductor has a set of open petal loops, connected together in series. For a given inductance value higher quality factor and higher frequency value result using an equal chip surface area. With the same fabrication cost and equal occupied area, higher quality factor values at higher frequency can be achieved. The innovative shape is such that secondary mutual coupling effects occur and contribute to increases of overall inductance values. Small current loops arranged as petals corresponding to inductance value LO are connected in series for the inductance value to add up to a higher value. The loops are connected along a circular path to minimize the total chip area occupied. A secondary loop in the center of the inductor results in a stronger magnetic flux and a higher inductance value, due to both self inductance of the secondary loop and mutual inductance of it with the petals. | 09-30-2010 |
20100245012 | Integrated Spiral Inductor - An integrated receiver with channel selection and image rejection substantially implemented on a single CMOS integrated circuit is described. A receiver front end provides programmable attenuation and a programmable gain low noise amplifier. Frequency conversion circuitry advantageously uses LC filters integrated onto the substrate in conjunction with image reject mixers to provide sufficient image frequency rejection. Filter tuning and inductor Q compensation over temperature are performed on chip. The filters utilize multi track spiral inductors with shields to increase circuit Q. The filters are tuned using local oscillators to tune a substitute filter, and frequency scaling during filter component values to those of the filter being tuned. In conjunction with filtering, frequency planning provides additional image rejection. The advantageous choice of local oscillator signal generation methods on chip is by PLL out of band local oscillation and by direct synthesis for in band local oscillator. The VCOs in the PLLs are centered using a control circuit to center the tuning capacitance range. A differential crystal oscillator is advantageously used as a frequency reference. Differential signal transmission is advantageously used throughout the receiver. ESD protection is provided by a pad ring and ESD clamping structure that maintains signal integrity. Also provided are shunts at each pin to discharge ESD build up. The shunts utilize a gate boosting structure to provide sufficient small signal RF performance, and minimal parasitic loading. | 09-30-2010 |
20100245013 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component is provided which includes layers composed of different materials and bonded together and which is capable of suppressing the occurrence of delamination at a bonded portion between the layers composed of different materials. A magnetic first layer is composed of a material with relatively high magnetic permeability. A second magnetic layer is composed of a material with relatively low magnetic permeability. Boundary magnetic layers are provided between the two magnetic layers and include a partial magnetic layer composed of the same material as the first magnetic layer and a partial magnetic layer composed of the same material as the second magnetic layer. The partial magnetic layers are provided to be adjacent to each other in the boundary magnetic layers. | 09-30-2010 |
20100253461 | PLANAR TRANSFORMER WITH BOARDS - Transformers ( | 10-07-2010 |
20100253462 | SHORT HYBRID MICROSTRIP MAGNETIC RESONANCE COILS - A hybrid microstrip coil for magnetic resonance imaging including a microstrip assembly aligned in the superior/inferior (S/I) direction. In one example, the microstrip assembly has conductive strips disposed on one side of a substrate corresponding shield planes disposed on the other side of the substrate. The microstrip assemblies are coupled together by coaxial sections forming a continuous transmission line and having a specific overall electrical length. | 10-07-2010 |
20100253463 | INDUCTANCE PART AND METHOD FOR MANUFACTURING THE SAME - Disclosed is an inductance part including a coiled conductor formed from a metal conductor, a magnetic body formed by pressure-molding a mixture of metal magnetic powder and bonding material in such a manner that the coiled conductor is embedded in the mixture, and a terminal derived from the coiled conductor. The coiled conductor is formed in a single layer with no insulating film on its surface. The metal magnetic powder of the magnetic body penetrates into the surface of the coiled conductor so as to make the filling factor of the metal magnetic powder in the magnetic body not less than 80% by volume. | 10-07-2010 |
20100253464 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME - An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction. | 10-07-2010 |
20100259349 | Magnetic Film Enhanced Inductor - An integrated magnetic film enhanced transformer and a method of forming an integrated magnetic film enhanced transformer are disclosed. The integrated magnetic film enhanced transformer includes an transformer metal having a first portion and a second portion, a top metal coupled to the transformer metal, a bottom metal coupled to the transformer metal, and an isolation film disposed between the first portion and the second portion of the transformer metal. The isolation film includes a magnetic material that can enhance a magnetic flux density B of the transformer, increase an electromotive force (EMF) of the transformer, and increase a magnetic permeability of the transformer. | 10-14-2010 |
20100259350 | INDUCTOR OR TRANSFORMER FOR MICROELECTRIC SYSTEM - A microinductor comprises an insulating substrate, a lower conductive winding, an upper conductive winding, and a core. The lower conductive winding is disposed on an upper surface of the substrate. The core is made of a material with high permeability and stacked over the lower conductive winding. The upper conductive winding is disposed on an upper surface of the core. The upper conductive winding electrically interconnects with the lower conductive winding so as to form an inductor coil. | 10-14-2010 |
20100259351 | LOW PROFILE LAYERED COIL AND CORES FOR MAGNETIC COMPONENTS - A low profile magnetic component includes at least one coil layer defining a generally planar coil winding having a center area and a number of turns extending about the center area. A body encloses the coil layer, and is fabricated from one of a dielectric material and a magnetic material. A magnetic core material occupies at least the center area of the coil layer. | 10-14-2010 |
20100259352 | MINIATURE POWER INDUCTOR AND METHODS OF MANUFACTURE - Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions. | 10-14-2010 |
20100265023 | TRANSFORMER - A printed circuit board transformer comprises at least one primary winding and one secondary winding, each in the form of at least one layer of turns inside or at the surface of a printed circuit board. The transformer is designed for a step-up/down-operation. Each of the two layers ( | 10-21-2010 |
20100265024 | SEMICONDUCTOR DEVICE - In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit and chip-side connecting terminals. An interconnect substrate is placed over the first semiconductor chip and the second semiconductor chip. The interconnect substrate includes a second inductor and substrate-side connecting terminals. The second inductor is located above the first inductor. The chip-side connecting terminals and the two substrate-side connecting terminals are connected through first solder balls. | 10-21-2010 |
20100265025 | INDUCTOR UTILIZING PAD METAL LAYER - An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the pad metal layer and a plurality of vias and has one end connected to the metal spiral. The metal interconnect is connected to the other end of the metal bridge. In addition, resistivity of the pad metal layer is lower than that of the metal spiral. | 10-21-2010 |
20100265026 | PASSIVE ELECTRICAL COMPONENTS WITH INORGANIC DIELECTRIC COATING LAYER - A passive electrical component includes an inorganic dielectric coating layer laser applied to a conductor layer. | 10-21-2010 |
20100271163 | OPEN MAGNETIC CIRCUIT MULTILAYER COIL COMPONENT AND PROCESS FOR PRODUCING THE OPEN MAGNETIC CIRCUIT MULTILAYER COIL COMPONENT - An open magnetic circuit multilayer coil component includes a laminate with magnetic layers, a coil, and a nonmagnetic layer provided within the laminate so as to cross a magnetic path formed by energization of the coil. A nonmagnetic material constituting the nonmagnetic layer is a Zn—Cu-based ferrite nonmagnetic material, and a magnetic material constituting the magnetic layer is a magnetic material containing 100 parts by weight of an Ni—Zn—Cu-based magnetic ferrite material and 0.1 to 2.0 parts by weight, in terms of Co | 10-28-2010 |
20100283570 | NANO-ENCAPSULATED MAGNETIC PARTICLE COMPOSITE LAYERS FOR INTEGRATED SILICON VOLTAGE REGULATORS - A method of forming an integrated silicon voltage regulator (ISVR) comprises providing a nano-encapsulated magnetic particle (NEMP) suspension, depositing a first layer of the NEMP suspension on an integrated circuit (IC) device, curing the first layer of the NEMP suspension to form a first NEMP composite layer, forming at least one inductor wire on the NEMP composite layer, depositing an interlayer dielectric material over the inductor wire, depositing a second layer of the NEMP suspension on the interlayer dielectric material, and curing the second layer of the NEMP suspension to form a second NEMP composite layer. | 11-11-2010 |
20100295648 | STACKED STRUCTURE OF A SPIRAL INDUCTOR - A stacked structure of a spiral inductor includes a first metal layer, a second metal layer, a first set of vias, and a second set of vias. The first metal layer includes a first segment, a second segment, and a third segment, wherein the layout direction of the third segment is different from the layout direction of the first and second segments. The second metal layer includes a fourth segment, a fifth segment, and a sixth segment connected to the fifth segment, wherein the layout direction of the sixth segment is different from the layout direction of the fourth and fifth segments. The first set of vias connects the first and fourth segments, and they construct a first shunt winding. The second set of vias connects the second and fifth segments, and they construct a second shunt winding. The third and sixth segments construct a crossover region. | 11-25-2010 |
20100295649 | INTEGRATED TRANSFORMER - A transformer comprises a substrate comprising a semiconductor material, a first conductor over the substrate, a second conductor over the substrate, and a magnetic layer over the substrate. The first conductor defines a generally spiral-shaped signal path having at least one turn. The second conductor defines a generally spiral-shaped signal path having at least one turn. | 11-25-2010 |
20100315191 | Patterned magnetic inductors - A patterned inductor includes a conductive path and a nanostructured magnetic composition deposited on the conductive path. The magnetic composition can be screen printed, inkjetted, electrodeposited, spin coated, physical vapor deposited, or chemical vapor deposited onto the conductive path. | 12-16-2010 |
20100328009 | ELECTRONIC COMPONENT - An electronic component includes overlapping coils in a rectangular laminate to form a substantially annular orbit. The orbit passes about an intersection of diagonal lines of an insulator layer of the laminate and is divided into a first orbit portion and a second orbit portion by a straight line parallel to a short side of the insulator layer. When an orbit obtained by the axisymmetric movement of the first orbit portion relative to the straight line is defined as a third orbit portion, a part of the second orbit portion overlaps with a part of the third orbit portion, and the non overlapped portion of the second orbit portion is positioned closer to the intersection than the non overlapped portion of the third orbit portion. A via hole conductor is provided in a region outboard an outer side of the non overlapping portion of the second orbit portion and inboard an outer side of the non overlapping portion of the third orbit portion. | 12-30-2010 |
20100328010 | DC TO DC CONVERTER MODULE - Lower surface terminals are disposed at the lower surface of a magnetic substrate. An upper surface electrode is disposed at the upper surface of the magnetic substrate. A control circuit, an input capacitor, and an output capacitor are mounted on the upper surface electrode. The control circuit contains a switching element. A smoothing choke is disposed inside the magnetic substrate. The connection wiring of connecting the upper surface electrode and at least one of the input terminal, the output terminal, and the ground terminal is constructed using an inner conductor passing through the inside of the magnetic substrate, and the connection wiring forms an inductor. | 12-30-2010 |
20100328011 | MODE-SWITCHING TRANSFORMER - A mode-switching transformer comprising a first line in common mode and a second line in differential mode, each line comprising two sections in series respectively coupled with one of the two sections of the other line and all sections having the same lengths, the common mode line being connected in series with a capacitor, to lower the central frequency of the transformer passband, the λ/4 lengths of the sections being chosen to correspond to a central frequency greater than the central frequency desired for the transformer. | 12-30-2010 |
20110001599 | LAMINATED INDUCTOR - A laminated inductor includes a laminate having a plurality of insulating layers, a helical coil and first and second external electrodes on an underside of the laminate. The helical coil has coiled electrodes, each coiled up in one turn, and the first and second external electrodes are connected to respective, or corresponding, ends of the helical coil. Each of the coiled electrodes of the helical coil follow a path along the periphery of one of the insulating layers and include first end located in the path and second end located outside the path. The helical coil and the first external electrode are connected to each other by a lead via conductor formed in a space that is enclosed by parts of the coiled electrodes including the first and second ends. | 01-06-2011 |
20110006868 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction. | 01-13-2011 |
20110012701 | MULTILAYER INDUCTOR - A multilayer inductor is disclosed. The multilayer inductor includes a bottom magnetic layer having an external conductive pattern formed on a bottom surface thereof for connection to a substrate such as a printed circuit board. The bottom external conductive pattern includes signal/power contacts and first and second inductor electrodes. A top magnetic layer includes a top external conductive pattern having signal/power contacts and inductor electrode contacts. An inductor conductive pattern formed on the top surfaces of intermediate magnetic layers disposed between the top and bottom magnetic layers are electrically coupled to each other by means of through holes to form a spiral inductor element. The spiral inductor element is coupled to the first inductor electrode by means of a through hole formed in the bottom magnetic layer and to the second inductor electrode by means of power conductive traces formed on side surfaces of the multilayer inductor. Flux density reducing layers may be inserted directly above the bottom magnetic layer and directly below the top magnetic layer. Signal/power conductive traces formed on side surfaces of the multilayer inductor provide signal/power routing between the top magnetic layer signal/power contacts and the bottom magnetic layer signal/power contacts. The top external conductive pattern accommodates a semiconductor chip in a flip chip configuration. | 01-20-2011 |
20110018670 | ELECTRONIC DEVICE INCLUDING LTCC INDUCTOR - Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet. | 01-27-2011 |
20110018671 | Glass-Ceramic Substrate - A glass-ceramic substrate with improved bonding strength between an insulating and ferrite layer, and method of manufacturing same are disclosed. The glass-ceramic substrate comprises a glass-ceramic layer, a ferrite layer, and interlayer means between the glass-ceramic layer and the ferrite layer. The glass-ceramic layer comprises a glass phase and a glass comprising a first crystal. The ferrite layer comprises a ferrite crystal. | 01-27-2011 |
20110018672 | Integrated High Frequency BALUN and Inductors - Integrated high frequency balanced-to-unbalanced transformers and inductors suitable for operation in high frequencies, such as radio frequencies. Embodiments disclosed give consideration to issues related to the layout of the top and bottom inductors for the minimization of capacitive effects between layers. A displacement between the conductive paths of the top inductor and the bottom inductor is shown that provides for superior performance over prior art solutions. | 01-27-2011 |
20110018673 | ELECTRONIC COMPONENT - An electronic component includes a coil whose inductance changes in accordance with the magnitude of a current and in which abrupt reduction in the inductance due to magnetic saturation is suppressed. A stack formed by a plurality of stacked first magnetic layers includes a coil formed by coil electrodes connected to one another in the stack. A first nonmagnetic layer is arranged in such a manner as to cut across the coil. When viewed in a stacking direction, a second nonmagnetic layer is formed in a region outside of a region in which the coil is formed. The structure of the second nonmagnetic layer on the upper side of the first nonmagnetic layer in the stacking direction is different from a structure of the second magnetic layer on the lower side of the first nonmagnetic layer in the stacking direction. | 01-27-2011 |
20110025442 | COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME - A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate. | 02-03-2011 |
20110025443 | APPARATUS AND METHOD FOR WAFER LEVEL FABRICATION OF HIGH VALUE INDUCTORS ON SEMICONDUCTOR INTEGRATED CIRCUITS - An apparatus and method for wafer level fabrication of high value inductors directly on top of semiconductor integrated circuits. The apparatus and method includes fabricating a semiconductor wafer including a plurality of dice, each of the dice including power circuitry and a switching node. Once the wafer is fabricated, then a plurality of inductors are fabricated directly onto the plurality of dice on the wafer respectively. Each inductor is fabricated by forming a plurality of magnetic core inductor members on an interconnect dielectric layer formed on the wafer. An insulating layer, and then inductor coils, are then formed over the plurality of magnetic core inductor members over each die. A plated magnetic layer is formed over the plurality of inductors respectively to raise the permeability and inductance of the structure. | 02-03-2011 |
20110032065 | Two Layer Transformer - One aspect of the invention relates to a symmetrical transformer with a stacked coil structure comprising two coils each having at least two turns, said coils being located in two conductive planes. The structure comprises four identical basic elements, each basic element providing a conductive path for part of said coils. The terminals of the transformer are located at opposite sites of the structure so that the structure can be easily connected in a chain. | 02-10-2011 |
20110032066 | LAMINATED INDUCTOR WITH ENHANCED CURRENT ENDURANCE - A laminated inductor includes a plurality of magnetic plates, each having a surface to which a high-permeability magnetic body is attached, and at least one spacer assembly interposed between the magnetic plates. The spacer assembly includes two magnetic boards having moderate magnetic permeability and a magnetic board having low magnetic permeability interposed between the two moderate-permeability magnetic boards. Both moderate-permeability and low-permeability boards are provided, at a surface of each board, with a magnetic body having high permeability. A magnetic top lid and a magnetic bottom lid are respectively set on outside surfaces of the topmost and bottommost ones of the magnetic plates. The high-permeability magnetic bodies mounted to the magnetic plates and the arrangement of the spacer assembly help improve the characteristic of DC superimposition of the laminated inductor thereby enhancing current endurance thereof. | 02-10-2011 |
20110032067 | 8-SHAPED INDUCTOR - In a first aspect, the invention provides to a device comprising a substrate and an electrical conductor arranged between two terminals (A, B) and shaped for forming an inductor comprising at least two loops ( | 02-10-2011 |
20110037555 | TRANSFORMER-BASED CIRCUIT WITH COMPACT AND/OR SYMMETRICAL LAYOUT DESIGN - A transformer-based circuit has at least a first port and a plurality of second ports. The transformer-based circuit includes a first winding conductor and a plurality of second winding conductors. The first winding conductor is electrically connected to the first port, and has a plurality of sectors connected in series to thereby form a plurality of loops, where the loops are arranged in a concentric-like fashion. The second winding conductors are magnetically coupled to the first winding conductor; besides, the second winding conductors are electrically connected to the second ports, respectively. Overall layout patterns of the second winding conductors are identical to each other. The first winding conductor acts as one of a primary winding conductor and a secondary winding conductor, and each of the second winding conductors acts as the other of the primary winding conductor and the secondary winding conductor. | 02-17-2011 |
20110037556 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first layer, a second layer, a number of vias each passing through the first and second layers, and a number of transmission lines. Each transmission line is connected between bonding pads of the two of the number of vias to form a helical-shaped transmission path by the vias and the transmission lines. As a result, the printed circuit board can generate inductive effect. | 02-17-2011 |
20110037557 | MULTILAYER COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A multilayer coil component includes internal conductors made of silver (Ag) having metal films provided on surfaces thereof to suppress migration of Ag contained in the internal conductors and/or relieve internal stress between magnetic ceramic layers and internal conductor layers without forming gaps at interfaces between the internal conductors including the metal films and a magnetic ceramic surrounding the internal conductors and the interfaces between the internal conductors and the magnetic ceramic. In a manufacturing method for forming a multilayer coil, an acidic solution containing a metal is allowed to penetrate a magnetic ceramic through side surfaces thereof and side gap sections that are regions between side portions of internal conductors and the side surfaces to reach the interfaces between the internal conductors and a surrounding magnetic ceramic, whereby the metal is deposited on surfaces of the internal conductors. | 02-17-2011 |
20110043318 | GROUNDING OF MAGNETIC CORES - An apparatus includes a magnetic core, a ground node, and one or more vias to provide a connection between the magnetic core and the ground potential. The magnetic core includes a first magnetic layer and a second magnetic layer. In addition, the apparatus may include a conductive pattern. The conductive pattern may be at a third layer between the first and second magnetic layers. The apparatus may be included in inductors, transformers, transmission lines, and other components using ferromagnetic cores or shields. Such components may be integrated on a chip or die. | 02-24-2011 |
20110050379 | PLANAR TRANSFORMER - There is provided a planar transformer having a dual-bobbin structure. The planar transformer includes a core unit including a pair of cores that are electromagnetically coupled to each other, and a bobbin unit including an inner bobbin part and a board part. The inner bobbin part includes a bobbin body having a predetermined volume and having a through hole into which the core is inserted, and a first winding wound around an outer circumferential surface of the bobbin body, and the board part includes at least one board including a board body having a predetermined surface area and having a through hole into which the inner bobbin part and the core are inserted, and a second winding formed on at least one surface of the board body and causing electromagnetic action with the first winding. | 03-03-2011 |
20110050380 | COIL APPARATUS - A coil apparatus comprising: a core-insertion hole; a plurality of wiring layers including a first wiring layer and a second wiring layer; a coil pattern, which is formed on each of the plurality of wiring layers into a spiral shape around the core-insertion hole, wherein the coil patterns is connected in series and integrated so as to form a single coil formed of laminated wiring layers; and a slit, which divides at least part of each of the coil patterns formed on each of the respective the first wiring layer and the second wiring layer into a plurality of wiring patterns, wherein an outermost wiring pattern on the first wiring layer is connected to an innermost wiring pattern on the second wiring layer, and wherein an innermost wiring pattern on the first wiring layer is connected to an outermost wiring pattern on the second wiring layer. | 03-03-2011 |
20110050381 | METHOD OF PRODUCING A MULTI-TURN COIL FROM FOLDED FLEXIBLE CIRCUITRY - A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board. | 03-03-2011 |
20110063066 | SPACE TRANSFORMER FOR PROBE CARD AND METHOD OF REPAIRING SPACE TRANSFORMER - A space transformer for a probe card includes: a multilayered circuit board having first and second faces which face each other and a plurality of side faces connecting the first and second faces; a plurality of channels including a first pad formed on the first face and receiving an electrical signal applied from the exterior, a second pad formed on the second face, to which a probe is connected, and a through wiring penetrating the multilayered circuit board and connecting the first and second pads; and side wirings formed on the side faces and connecting first and second pads of a damaged channel among a plurality of channels. When a portion of channels transferring an electrical signal to probes is damaged, the space transformer can repair the damaged channel by means of the side wirings. | 03-17-2011 |
20110063067 | Inter-Helix Inductor Devices - The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end. | 03-17-2011 |
20110068887 | ON-DIE MICRO-TRANSFORMER STRUCTURES WITH MAGNETIC MATERIALS - Some embodiments include a die having a transformer. The transformer includes windings formed from a set of lines, such that no two lines belonging to any one winding are nearest neighbors. The lines are formed within one layer on the die. Other embodiments are described. | 03-24-2011 |
20110074536 | ELECTRONIC CIRCUIT WITH AN INDUCTOR - An electronic device which includes an electronic component having a substrate and a plurality of metal interconnection layers, the plurality of metal interconnection layers having a top surface. It further comprises a dielectric layer situated above said metal interconnection layers, a conductive layer situated above said dielectric layer, an inductor coil and a ground shield, the inductor coil being formed in the conductive layer and the ground shield being formed in a layer of said plurality of metal interconnection layers. | 03-31-2011 |
20110074537 | info@sbpatentlaw.com - An electronic component having a coil includes a laminated body formed by laminating a plurality of magnetic body layers. The coil is formed by connecting coil electrodes in the laminated body. Nonmagnetic body layers are disposed on the laminated body to have a gap with the coil when seen in a plan view from a coil axis direction of the coil. The embodiment of an electronic component has a stair-like direct-current superposition characteristic. | 03-31-2011 |
20110080245 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first dielectric layer, a second dielectric layer, a first conductor path, a second conductor path and a soldered joint. The first dielectric layer has a first side and a second side. The second dielectric layer has a first side and a second side, where the first side of the second dielectric layer facing towards the first side of the first dielectric layer. The first conductor path is disposed on the first side of the first dielectric layer. The second conductor path is disposed on the first side of the second dielectric layer. The soldered joint is disposed between the first dielectric layer and the second dielectric layer, where the soldered joint electrically connects the first conductor path to the second conductor path. The first dielectric layer extends continuously through an area surrounding the soldered joint. | 04-07-2011 |
20110084791 | MULTI-BAND LOW NOISE AMPLIFIER AND MULTI-BAND RADIO FREQUENCY RECEIVER INCLUDING THE SAME - An integrated circuit (IC) includes multiple circuits isolated with respect to one another. Each circuit of the multiple circuits includes an inductor pair formed in a loop pattern on a same layer as at least one other inductor pair from another circuit of the multiple circuits, such that the inductor pair surrounds and is isolated from the at least one other inductor pair. | 04-14-2011 |
20110102122 | INDUCTOR AND ELECTRIC POWER SUPPLY USING IT - A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor. | 05-05-2011 |
20110102123 | MULTILAYER INDUCTOR - This disclosure provides a multilayer inductor that includes a coil formed from coil electrodes each looping through a length of one turn and that is capable of preventing the occurrence of delamination. Each of a plurality of coil electrodes loops through a length of one turn on one of magnetic plurality of insulating layers so as to make a ring-shaped track when viewed in plan in a z-axis (stacking) direction. The coil electrodes include end portions located on the ring-shaped track and end portions located off the ring-shaped track, respectively. Additional coil electrodes are electrically connected to the plurality of coil electrodes. The additional coil electrodes include land portions, respectively, each overlapping a region surrounded by the end portions of the plurality of coil electrodes when viewed in plan in the z-axis direction. | 05-05-2011 |
20110102124 | ELECTRONIC COMPONENT - In an electronic component, a multilayer body includes a plurality of insulator layers stacked on top of one another. A first coil is provided in the multilayer body, includes a first coil axis and extends toward the positive side in the z-axis direction while circling counterclockwise around the first coil axis. A second coil is connected to the first coil, is provided in the multilayer body, includes a second coil axis, and extends toward the negative side in the z-axis direction while circling counterclockwise around the second coil axis. When viewed in plan from the z-axis direction, the first coil axis is disposed inside the second coil and the second coil axis is disposed inside the first coil. | 05-05-2011 |
20110109415 | INDUCTOR STRUCTURE - The present invention discloses an improved inductor structure, which applies to the semiconductor field, particularly to a system-on-chip, and which comprises a substrate, a first conductive patterned film, and a first insulating layer formed between the substrate and the first conductive patterned film. The substrate has a base and an accommodation portion formed in the base. A magnetic material is filled into the accommodation portion to form a magnetic region. The accommodation portion is fabricated via etching the base or drilling a through-hole in the base. A plurality of conductive wires is arranged in a spiral way to form the first conductive patterned film. A protective layer covers the surface of the first conductive patterned film and isolates the contact of the first conductive patterned film and moisture. | 05-12-2011 |
20110109416 | INDUCTOR OF CIRCUIT BOARD - An exemplary inductor of a circuit board includes a base portion of the circuit board, a plurality of through holes defined in two opposite sides of the base portion and a conductive wiring passing through the through holes and wrapping the base portion. The inductor arranged in the circuit board allows height of the printed circuit board to be minimized. | 05-12-2011 |
20110109417 | POWER TRANSFORMER FOR RADIOFREQUENCY SIGNALS - The present invention relates to a power transformer for radiofrequency signals. The transformer is made in a low-cost, multilayer printed circuit board comprising at least the following stacked layers in succession: a first conductive layer, a first layer of dielectric substrate, a second conductive layer, a second layer of dielectric substrate, and a third conductive layer, the primary winding being formed by a turn printed in the second conductive layer, the secondary winding being formed by a first turn printed in the first conductive layer, this first turn being connected to a second turn printed in the third conductive layer, the turns of the secondary winding being placed opposite to the turn of the primary winding, the board being tightly held above and below by two plates of ferromagnetic material. Capacitive components connected between winding(s) on the one hand and ground on the other hand can improve the behavior of the proposed transformer. The invention applies notably to the production of HF transmitting radioelectric terminals. | 05-12-2011 |
20110115597 | TRANSFORMER DEVICES - A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit. | 05-19-2011 |
20110121934 | Lead Frame-based Discrete Power Inductor - A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil. | 05-26-2011 |
20110128108 | TRANSFORMER - A transformer may include a semiconductor layer coil, a trench coil connected with the semiconductor layer coil in parallel, and a metal layer coil opposing both of the semiconductor layer coil and the trench coil. The semiconductor layer coil and the trench coil may be insulated from the metal layer coil by an insulating layer. | 06-02-2011 |
20110128109 | Laminate Device and Module Comprising Same - The laminate device of the present invention comprises magnetic layers and coil patterns alternately laminated, the coil patterns being connected in a lamination direction to form a coil, and pluralities of magnetic gap layers being disposed in regions in contact with the coil patterns. | 06-02-2011 |
20110133874 | MAGNETIC COMPONENTS AND METHODS FOR MAKING THE SAME - A method for making a magnetic component is provided. The method comprises providing a core with one or more ridges protruding from one or more surfaces of the core, depositing one or more electrically conductive materials on the core, and removing at least a portion of the one or more ridges to form one or more continuous conductors wound around the core. Each of the one or more continuous conductors defines at least one insulating gap. Further, a magnetic component and methods for making the magnetic component are also presented. | 06-09-2011 |
20110133875 | Stack inductor with different metal thickness and metal width - A stacked inductor with different metal thickness and metal width is represented in this invention, this structure comprise: top and bottom metal trace, which is aligned with each other. The thickness and width of top and bottom metal trace are different. The top and bottom metal trace are connected at the end of metal trace with via holes. The inductance is increased with the use of the mutual inductance between top and bottom metal layers, and the parasitic resistor is reduced by means of different top and bottom metal width. This stacked inductor possesses larger inductance than single layer spiral inductor with relatively higher Q factor. | 06-09-2011 |
20110133876 | Manufacture method for IC process with TOP and TOP-1 metal layers thickened and stacked inductor manufactured by this method - A manufacture method for IC process with top and top-1 metal layers thickened and stacked inductor manufactured by this method is represented in this invention. This method includes: with multi metal layers, and the thickness of top and top-1 metal layers are more than 2.8 um. Thickened top and top-1 metal layers can reduce the resistance of top and top-1 metal layers, so can increase the Q factor of inductor. | 06-09-2011 |
20110133877 | Stacked inductor with multi paths for current compensation - A multi-path stacked inductor for current compensation is represented in this invention. This structure includes top and bottom metal trace, which are aligned with each other. Each metal trace consists of multi paths. The inner path in top metal flips over to the outer path in the bottom metal, while the outer path in top metal flips over to the inner path in the bottom metal. These paths join together at the end of the metal trace with via holes. Skin effect and current crowding effect are reduced by means of this method. This stacked inductor possesses larger inductance than single layer spiral inductor, with relatively higher Q factor. | 06-09-2011 |
20110133878 | Stacked differential inductor - A structure of stack differential inductor is represented in this invention; this structure includes top and bottom metal traces, which are aligned with each other and symmetric. Starting from one port and after half turn, the top metal trace is connected to bottom metal trace through via holes. Meanwhile, after another half turn, the bottom trace is connected to top trace through via holes. The inductance is increased by means of this method. With the same chip area, this stack differential inductor possesses larger inductance and higher Q factor because of the larger mutual inductance between top and bottom metal than conventional differential inductor. | 06-09-2011 |
20110133879 | STACKED INDUCTOR - A stacked inductor with combined metal layers is represented in this invention. The stacked inductor includes: a top layer metal coil, and at least two lower layer metal coils, the metal coils being aligned with each other; adjacent metal coils being connected at the corresponding ends through a via; wherein, each of the lower layer metal coils is consisted of plural layers of metal lines which are interconnected. With the same chip area, the stacked inductor of the present invention can achieve higher inductance and Q factor because of the mutual inductance generated from the plural layers of metal lines and the reduced parasitic resistance. | 06-09-2011 |
20110133880 | INTEGRATED CIRCUIT INDUCTOR WITH INTEGRATED VIAS - Integrated circuit inductors ( | 06-09-2011 |
20110133881 | LAMINATED INDUCTOR, METHOD FOR MANUFACTURING THE LAMINATED INDUCTOR, AND LAMINATED CHOKE COIL - Disclosed is a laminated inductor that has good direct current superimposition characteristics, does not cause a variation in temperature characteristics, suppresses the occurrence of delamination, and can be stably manufactured. Also disclosed are a method for manufacturing the laminated inductor and a laminated choke coil. A laminated inductor ( | 06-09-2011 |
20110140824 | PLANAR TRANSFORMER - A planar transformer suitable for intrinsically safe electronic circuits with a core, a first printed circuit board and a second printed circuit board. The first printed circuit board has a first winding and the second printed circuit board has a second winding. The planar transformer can be produced at a low cost and is compact, but is still suitable for connection to intrinsically safe operating circuits is implemented by at least one gap being asymmetrically split on the first printed circuit board and the second printed circuit board. | 06-16-2011 |
20110148563 | PLANAR TRANSFORMER AND WINDING ARRANGEMENT SYSTEM BACKGROUND - A winding arrangement system of a planar transformer includes a primary winding arranges on a number of first circuit layers of a printed circuit board (PCB), and two secondary winding arranged on a number of second circuit layers. The turns of the primary winding are coupled in series. Each second circuit layer has a winding turn. A first half of the winding turn belongs to one of the two secondary winding. A second half of the winding turn belongs to the other of the two secondary winding. The first and second halves of winding turns on each of the second secondary circuit layers share a common grounded node. All of the first halves of winding turns are coupled in parallel. All of the second halves of winding turns are also coupled in parallel. | 06-23-2011 |
20110156854 | Spiral Inductor Device - A spiral inductor device is provided. The spiral inductor device includes a first spiral conductive trace with multiple turns and a second spiral conductive trace with multiple turns adjacent thereto, disposed on an insulating layer over a substrate, wherein the outermost turn and the innermost turn of the first spiral conductive trace have a first end and a second end, respectively, the outermost turn and the innermost turn of the second spiral conductive trace have a third end and a fourth end, respectively, and the second and fourth ends are connected to ground. A non-continuous spiral conductive trace with a single turn is disposed on the insulating layer, parallel and adjacent to the outermost turn of the first spiral conductive trace, wherein the non-continuous spiral conductive trace is connected to the ground and at least a portion thereof is disposed between the first and the second spiral conductive traces. | 06-30-2011 |
20110163831 | Fully Differential, High Q, On-Chip, Impedance Matching Section - An inductor circuit is disclosed. The inductor circuit includes a first in-silicon inductor and a second in-silicon inductor each having multiple turns. A portion of the multiple turns of the second in-silicon inductor is formed between turns of the first in-silicon inductor. The first and second in-silicon inductors are configured such that a differential current flowing through the first in-silicon inductor and the second in-silicon inductor flows in a same direction in corresponding turns of inductors. | 07-07-2011 |
20110163832 | LAMINATED ELECTRONIC COMPONENT - The invention presents a laminated electronic component configured to include: first coil pattern formed on a plurality of insulating layers, and second coil pattern disposed to face first coil pattern through at least one insulating layer. Both ends of first coil pattern are coupled with external electrodes; both ends of second coil pattern are not coupled with the external electrodes. | 07-07-2011 |
20110169596 | System and Method for Integrated Inductor - In one embodiment, an inductor has a substrate, a conductor disposed above the substrate and a seemless ferromagnetic material surrounding at least a first portion of the conductor. | 07-14-2011 |
20110169597 | INDUCTOR DEVICES - An inductor device comprising a first conductive pattern on a first layer of a substrate, a second conductive pattern on a second layer of the substrate, and a first region between the first layer and the second layer through which at least one hole is coupled between the first dielectric layer and the second dielectric layer, wherein a magnetic field induced by at least one of the first conductive pattern or the second conductive pattern at the first region is more intensive than that induced by at least one of the first conductive pattern or the second conductive pattern at a second region between the first conductive layer and the second conductive layer. | 07-14-2011 |
20110181383 | Micromagnetic Device and Method of Forming the Same - A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device. | 07-28-2011 |
20110187486 | ELECTRONIC COMPONENT - This disclosure provides an electronic component that can suppress a decrease in the resonant frequency. The electronic component includes a multilayer body having plural insulating layers stacked in a staking direction. Outer electrodes are provided on facing lateral sides of the multilayer body and extend in the stacking direction. Coil conductors are stacked together with the insulating layers to form a coil. The thickness in the stacking direction of at least one of the coil conductors that is directly connected to one of the outer electrodes is smaller than that of the coil conductors that are not directly connected to any of the outer electrodes. | 08-04-2011 |
20110187487 | INDUCTOR FORMED ON A SEMICONDUCTOR SUBSTRATE - An inductor formed on a semiconductor substrate, comprising a coil formed with at least a single metal layer having a plurality of slots and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the insulator layer does not cover the top surface of the single metal layer. | 08-04-2011 |
20110193671 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME - An electronic component and manufacturing method are provided that allow an increase in a size of a circuit element included therein and suppression of a short-circuit-preventing insulator film from easily peeling off from a laminated body. The laminated body includes a plurality of insulator layers laminated on one another. The laminated body has an upper face and a lower face opposing each other in a z-axis direction and lateral faces connecting the upper face to the lower face. The insulator film is provided on the lateral faces. A circuit element such as a coil is included in the laminated body and has a part protruding from the lateral faces of the laminated body toward the insulator film. | 08-11-2011 |
20110215893 | PLANAR AUDIO AMPLIFIER OUTPUT INDUCTOR WITH CURRENT SENSE - An audio amplifier, that includes a planar inductor structure that includes a first plurality of windings, formed on layers of a first circuit board and a second plurality of windings, formed on layers of a second circuit board. The planar inductor structure may further include a sense winding. | 09-08-2011 |
20110221560 | INTEGRATED CIRCUITS WITH SERIES-CONNECTED INDUCTORS - An integrated circuit inductor may have upper and lower loop-shaped line portions that are connected in series. The upper and lower portions may have 45° bends that form hexagonal or octagonal loops. Each loop portion may have one or more turns. Intervening metal-free regions of metal routing layers may be formed between the two layers to reduce capacitive coupling. Each loop portion may have sets of two or more metal lines shorted in parallel by vias. The upper and lower loops may be laterally offset or nested to reduce capacitive coupling. | 09-15-2011 |
20110221561 | Planar inductor - [Problems] To provide a planar inductor that can be easily designed in any size without restricting coil characteristics, that supplies the necessary power corresponding to the area when a pair of inductors are placed facing each other to carry out non-contact power transmission, and that has greater design flexibility that allows for setting separation cut-off lines with relative freedom. | 09-15-2011 |
20110227688 | PLANAR TRANSFORMER - There is provided a planar transformer having improved performance through a reduction in heat generation by removing part of a conductor from a substrate. The planar transformer includes a core part having a pair of cores being electromagnetically coupled to each other; a substrate part having at least one substrate disposed between the pair of cores; a pattern part formed on the at least one substrate and including a conductor having an adjustable width; and an opening part including a non-conductor allowing for variations in the width of the conductor of the pattern part. | 09-22-2011 |
20110227689 | Method of Creating Spiral Inductor having High Q Value - A method for fabricating an inductor structure having an increased quality factor (Q) is provided. In one embodiment, a substrate is provided and a plurality of metal layers are formed on the substrate. A spirally patterned conductor layer is formed over and in the substrate and in the metal layers to produce a planar spiral inductor. A via hole is formed over and in the substrate and in the metal layers within the spirally patterned conductor layer, the via hole being formed by a through silicon via (TSV) process. Thereafter, the via hole is filled with a core layer, wherein the core layer extends from a bottom surface of the substrate to a top surface of the metal layers. | 09-22-2011 |
20110234357 | Three Dimensional Inductor and Transformer Design Methodology of Glass Technology - An inductor or transformer for use in integrated circuit devices that includes a high-resistivity substrate. The inductor includes a plurality of conductive traces around the substrate forming a continuous conductive path from a first to a second port. The conductive path can be solenoid-shaped. Some of the conductive traces can be formed during back-end-of-line processing or backside plating of an integrated circuit die. The transformer includes a first inductor with input and output ports, and a first continuous conductive path therebetween; and a second inductor with input and output ports, and a second continuous conductive path therebetween. The second inductor is independent of and electromagnetically coupled to the first inductor. The first and second conductive paths can be solenoid-shaped. The first conductive path can be interleaved with the second conductive path. | 09-29-2011 |
20110234358 | Laminated Inductive Device - An inductive electrical device comprises multiple laminations, each lamination comprising: a generally planar electrically nonconductive substrate that has a central axis normal to its plane, a first surface and a second surface; at least one electrically conductive layer pattern along the first surface in the form of a narrow strip that starts from a first point displaced from the central axis and extends along the first surface about the central axis through a first angle of rotation to a second point; a least one electrically conductive layer pattern along the second surface in the form of a narrow strip that starts from the second point and extends along the second surface about the central axis through a second angle of rotation to at least the first point; an electrically conductive coupling region passing through the substrate proximate the second point that couples the electrically conductive layer pattern along the first surface to the electrically conductive layer pattern along the second surface; wherein stacking the laminations upon each other form at least one winding with multiple turns for the inductive device. | 09-29-2011 |
20110241816 | PLANAR TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - There are is a planar transformer and a method of manufacturing the same that can prevent resin being coated from being separated from a conductor during the manufacturing of a transformer by forming a dummy pattern on a board. A planar transformer according to an aspect of the invention may include: a core part having a pair of cores electromagneticaliy coupled to each other; a board part having a plurality of boards disposed between the pair of cores and stacked upon one another; a pattern part having a power transmission pattern provided on at least one board of the plurality of boards of the board part and transmitting power being input, and a dummy pattern provided on the same board having the power transmission pattern thereon and separated from the power transmission pattern by a predetermined interval; and a resin part being coated over the at least one board of the plurality of boards, the at least one board having the pattern part thereon. | 10-06-2011 |
20110248811 | STACKED DUAL INDUCTOR STRUCTURE - The dual inductor structure can include a first inductor including a first plurality of coils. Each coil of the first plurality of coils can be disposed within a different one of a plurality of conductive layers. The coils of the first plurality of coils can be vertically stacked and concentric to a vertical axis. The dual inductor structure further can include a second inductor including a second plurality of coils. Each of the second plurality of coils can be disposed within a different one of the plurality of conductive layers. The coils of the second plurality of coils can be vertically stacked and concentric to the vertical axis. Within each conductive layer, a coil of the second plurality of coils can be disposed within an inner perimeter of a coil of the first plurality of coils. | 10-13-2011 |
20110254649 | INTEGRAL PLANAR TRANSFORMER AND BUSBAR - The primary and/or secondary coils of a relatively high power planar transformer are integrated together with a laminated busbar, thereby incorporating together the planar transformer and the busbar as a single component. A coil is cut out or otherwise formed in at least one busbar conductor, and when electrically connected, the busbar coils act as part of the primary and/or secondary circuit of the transformer. One or more coil lead frames are embedded in the laminated stack, and when electrically connected, form the primary and/or secondary circuit, respectively, of the transformer. Insulating material coils are also embedded within the laminated stack. The center leg of an E-shaped ferrite core passes through the center opening of each of the busbar coils, the coil lead frames, and the insulating material coils. The E-shaped core is located next to (i.e., with an opening) or closed with, an I-shaped or E-shaped core. | 10-20-2011 |
20110254650 | ELECTRONIC COMPONENT - In an electronic component having a built-in coil composed of coil conductors with a length of one turn, the inductance value can be increased while suppressing generation of short circuits inside the coil conductors. The electronic component includes a multilayer body formed by stacking a plurality of magnetic layers on top of one another. The built-in coil includes coil conductors and via hole conductors. The coil conductors each have a ring-shaped coil portion having a cut out portion in one side of one corner thereof, and a connecting portion that form an obtuse angle with a side extending from one end portion of the coil portion and is positioned in a region enclosed or surrounded by the coil portion. Via hole conductors connect the plurality of coil conductors to one another. | 10-20-2011 |
20110260823 | TRANSMISSION LINE IMPEDANCE TRANSFORMER AND RELATED METHODS - A transmission line impedance transformer may include a printed circuit board (PCB) having a dielectric layer and an electrically conductive layer thereon defining a medial interconnection portion, and first and second lateral loop portions extending laterally outwardly from opposing first and second sides of the medial interconnection portion. The PCB also may have first ferrite body receiving openings therein adjacent the first lateral loop portion and second ferrite body receiving openings therein adjacent the second lateral loop portion. The transmission line impedance transformer may also include a first ferromagnetic body extending through the first ferrite body receiving openings to surround the first lateral loop portion, and a second ferromagnetic body extending through the second ferrite body receiving openings to surround the second lateral loop portion. | 10-27-2011 |
20110267165 | INDUCTOR ASSEMBLY FOR A MAGNETIC RESONANCE IMAGING SYSTEM - An inductor assembly includes a substrate having a first surface and an opposing second surface, a first spiral electrical conductor formed on the first surface, a second spiral electrical conductor formed on the second surface, at least one opening extending through the first and second surfaces, and a metallic pin configured to be inserted in the opening, the pin coupling the first conductor to the second conductor. An RF coil including the inductor assembly and a method of fabricating an inductor assembly are also described. | 11-03-2011 |
20110267166 | ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME - An electronic component that reduces resistance and prevents occurrence of an edge effect, includes a laminated body formed by stacking insulator layers. Conductor layers are linear conductors, and define coils included in the laminated body. The conductor layers face each other, with the insulator layer interposed therebetween, and allow signals of substantially the same phase to pass therethrough. The conductor layers define regions, each having a shape which decreases in thickness in the z-axis direction with increasing distance from a center thereof in a line width direction. | 11-03-2011 |
20110273258 | INTEGRATED TRANSFORMER - A transformer comprising primary and secondary windings is disclosed. Each winding has first and second metal capping layers coupled together electrically in parallel by a metal connector passing through a substrate lying between the first and second metal capping layers. | 11-10-2011 |
20110279213 | LAMINATED INDUCTOR - This disclosure provides a laminated inductor capable of suppressing concentration of magnetic gap portions, preventing local magnetic saturation, and obtaining excellent DC superposition characteristics. In an embodiment of a laminated inductor, magnetic layers and coil conductors are alternately laminated. The laminated inductor includes plural first mixed layers and plural second mixed layers. Each first mixed layer includes a first nonmagnetic material portion between ones of the conductive patterns overlapping in a lamination direction and a second nonmagnetic material portion that is inside the coil conductor and connected to the first nonmagnetic material portion. Each second mixed layer includes a nonmagnetic material portion between ones of the conductive patterns overlapping in the lamination direction and a nonmagnetic material portion that is outside the coil conductor and is connected to the first nonmagnetic material portion. The plural first mixed layers and the plural second mixed layers are formed as different layers. | 11-17-2011 |
20110285493 | HIGH Q VERTICAL RIBBON INDUCTOR ON SEMICONDUCTING SUBSTRATE - A method of making a semiconductor device and devices thereof are provided. The semiconductor device ( | 11-24-2011 |
20110285494 | MULTILAYER TYPE INDUCTOR - A multilayer type inductor includes: an inductor main body formed by laminating a plurality of sheets; a coil part including conductive patterns and conductive vias formed on the respective sheets; a first withdrawal via formed at one end of the coil part and withdrawn to one surface of the inductor main body through the inductor main body; a second withdrawal via formed at the other end of the coil part and withdrawn in the same direction as that of the first withdrawal via; and first and second external terminals formed on one surface of the inductor main body and electrically connected to the first and second withdrawal vias. | 11-24-2011 |
20110285495 | MULTILAYER INDUCTOR - This disclosure provides a multilayer inductor that has a built-in coil composed of coil conductors each having a length of one turn and that can suppress the occurrence of delamination. The inductor includes plural laminated magnetic layers. Coil conductors loop along a ring-shaped path each through a length of one-turn on the magnetic layers, and include connection portions including end portions that are located on the loop and connection portions including end portions that are located inside the ring-shaped path. Lands are provided on the insulating layers so as to overlap a region as viewed in plan, and the region is surrounded by the first connection portions and the second connection portions. | 11-24-2011 |
20110291785 | POWER INDUCTOR STRUCTURE - A variety of power inductor structures are obtained by arranging a magnetic material block between a plurality of wires and a plurality of bond fingers or bond finger pairs. The power inductor structure can provide high inductance and high currents and at the same time afford smaller sizes. | 12-01-2011 |
20110291786 | Through Via Inductor Or Transformer In A High-Resistance Substrate With Programmability - A through via inductor or transformer in a high-resistance substrate in an electronic package. In one embodiment, the package comprises a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. In another embodiment, a transformer can comprise a primary loop and a secondary loop, each of which includes a plurality of through-vias that are coupled to a plurality of conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio. | 12-01-2011 |
20110291787 | PLANAR INDUCTOR DEVICES - A planar inductor device includes a ferrite body and a conductive pathway. The ferrite body extends around an opening in the ferrite body. The conductive pathway includes an input section, a current-splitting section, a coil section, a current-combining section, and an output section connected with each other, the input section extending toward the opening in the ferrite body. The current-splitting section includes a plurality of conductive coils joined with the conductive pathway and electrically disposed parallel to each other. The coil section includes the conductive coils helically wrapped around the ferrite body. The current-combining section includes the conductive coils joined with each other. The output section includes the joined conductive coils extending out of the ferrite body. | 12-01-2011 |
20110291788 | PLANAR INDUCTOR DEVICES - A planar inductor device includes a substrate, a ferrite body in the substrate, upper and lower conductors, and conductive vias. The substrate vertically extends from an upper surface to an opposite lower surface. The substrate laterally extends from a first edge to a second edge. The upper conductors are disposed above the ferrite body. The lower conductors are disposed below the ferrite body. The conductive vias extend through the substrate and are conductively coupled with the upper conductors and with the lower conductors. The vias, the upper conductors, and the lower conductors form one or more conductive coils that encircle the ferrite body in the substrate. At least one of the first edge or the second edge of the substrate passes through one or more of the vias such that the vias are exposed at the at least one of the first edge or the second edge. | 12-01-2011 |
20110291789 | PLANAR INDUCTOR DEVICES - A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body. | 12-01-2011 |
20110291790 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode. | 12-01-2011 |
20110304422 | TRANSFORMER ASSEMBLY FOR A MAGNETIC RESONANCE IMAGING SYSTEM - A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, and a second spiral wound inductive coil formed on the first surface; the first and second spiral wound inductive coils forming a double spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described. | 12-15-2011 |
20110316657 | Three Dimensional Wire Bond Inductor and Transformer - A three-dimensional inductor or transformer for an electronic packaging system that includes a plurality of conductive traces and a plurality of conductive wire bonds. The traces are located in a single layer, and each have a first and second pad. Each of the wire bonds couples the second pad of one trace to the first pad of another trace. The trace and wire bonds create a continuous conductive path from the first pad of a first trace to the second pad of a last trace. Passing a current from the first trace to the last trace creates an electromagnetic field between the single layer and the wire bonds. The transformer includes two independent and electromagnetically coupled inductors that can be interleaved. The continuous conductive path can be solenoid-shaped. A shielding layer can also be included that blocks the substrate from the electromagnetic field of the inductor or transformer. | 12-29-2011 |
20110316658 | THIN TYPE COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A thin type common mode filter includes an insulating flexible substrate, a first magnetic material layer, a first coil leading layer, a coil main body multi-layer, a second coil leading layer, and a second magnetic material layer. The first coil leading layer is formed on a first surface of the flexible substrate, and the first coil leading layer is formed on a second surface of the flexible substrate opposite to the first surface. The coil main body multi-layer, the second coil leading layer, and the second magnetic material layer are sequentially stacked on the first coil leading layer. | 12-29-2011 |
20120001715 | TRANSFORMER ASSEMBLY FOR A MAGNETIC RESONANCE IMAGING SYSTEM - A transformer assembly includes a substrate having a first surface and an opposing second surface, a first spiral wound inductive coil formed on the first surface, a second spiral wound inductive coil formed on the first surface, and a third spiral wound inductive coil formed on the first surface, the first, second and third spiral wound inductive coils forming a triple spiral arrangement on the first surface such that the first coil is inductively coupled to the second coil and the third coil. An RF coil including the transformer assembly and a method of fabricating the transformer assembly are also described. | 01-05-2012 |
20120007709 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component | 01-12-2012 |
20120013429 | MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Provided is a multilayer inductor and a method of manufacturing the same. The multilayer inductor includes a plurality of deposited ferrite sheets, a coil part constituted by a plurality of internal electrode patterns and internal electrode vias formed on the plurality of ferrite sheets, non-magnetic vias formed at arbitrary positions of the plurality of ferrite sheets and filled with a non-magnetic material of paste so that a magnetic flux formed around the coil part can be dispersed, and a gap layer formed of a non-magnetic ferrite disposed at a center of the deposited ferrite sheets. Since a non-magnetic via is formed in the multilayer inductor, a magnetic flux propagation path in a coil can be dispersed and blocked to suppress magnetization at a high current and thus improve variation in inductance according to current application. | 01-19-2012 |
20120032767 | LAMINATED COIL - A laminated coil includes a laminated body insulating layers and coil patterns are integrally stacked in a desired order, a coil formed by connecting the coil patterns, a pair of external electrodes provided at opposite ends of the laminated body, and an insulating film provided on an outer peripheral surface of the laminated body. At least one of the coil patterns is in contact with an outer peripheral edge of the corresponding insulating layer at least a part of an outer peripheral edge of the coil pattern, but is not in contact with corners of the insulating layer in a manner such that the at least one coil-pattern is absent at portions of the corresponding insulating layer near the corners of the corresponding insulating layer. | 02-09-2012 |
20120044034 | SYMMETRICAL INDUCTOR - A symmetrical inductor having at least one inductor turn. Each inductor turn has a plurality of separate conductive paths having substantially equal inductance. The inductor also comprises a plurality of crossing points. At each crossing point, some of the conductive paths within a given inductor turn cross over each other to change the order in which they appear within the inductor turn. | 02-23-2012 |
20120056705 | LAYERED INDUCTOR AND MANUFACTURING METHOD THEREOF - There is provided a layered inductor and a manufacturing method of the layered inductor. There is provided a layered inductor, comprising: a main body in which a plurality of non-magnetic layers are stacked; coil parts ha-ving a plurality of conductor patterns and a plurality of via electrodes formed on the plurality of non-magnetic layers; a plurality of magnetic paths formed in the inner central portion of the coil parts and passing the magnetic flux induced from the coil parts therethrough; and first and second external electrodes formed on the external surface of the main body to be connected to both ends of the coil part, respectively. | 03-08-2012 |
20120075050 | CIRCUIT DEVICE - The device includes a first inductor, a first insulating layer, a second inductor, and a third inductor. The first inductor includes a helical conductive pattern. | 03-29-2012 |
20120081202 | HIGH SPEED TRANSFORMER - Embodiments of the present invention provide novel techniques for creating a high speed transformer such as a pulse transformer. In particular, a secondary coil of the high speed transformer may include a single turn. The use of a single turn secondary coil simplifies the design and manufacture of the transformer and aids in more efficient inspections. Further, the single turn secondary coil transformer may reduce the number of vias used to interconnect the components of the transformer. Additionally, the embodiments described herein may significantly improve voltage isolation by single turn coils, and eliminate vias between board layers. | 04-05-2012 |
20120086537 | PLANAR COIL AND METHOD OF MAKING THE SAME - A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench. | 04-12-2012 |
20120092119 | MULTIPLE-LOOP SYMMETRICAL INDUCTOR - A symmetrical inductor includes pairs of half-loops, first and second terminal electrodes, and a center-tap electrode. The half-loop pairs are in respective conductive layers of an integrated circuit. Each half-loop pair includes a first and second half-loop in the respective conductive layer. The first and second terminal electrodes are in a first conductive layer, and the center-tap electrode is in a second conductive layer. The first terminal electrode and the center-tap electrode are coupled through a first series combination that includes the first half-loop of each half-loop pair. The second terminal electrode and the center-tap electrode are coupled through a second series combination that includes the second half-loop of each half-loop pair. | 04-19-2012 |
20120098634 | METHOD AND APPARATUS FOR TRANSMITTING POWER AND DATA WITHOUT CONTACT - In a power and data transmission method which can transmit power and information (data) simultaneously and contactlessly, and an apparatus therefor, a pair of coil units are magnetically coupled to each other. Each of the coil units has: a power transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil; and an information transmission coil configured by a coil which is wound in a plane, and a magnetic shield member which is placed on a rear surface of the coil, the coil diameter of the information transmission coil is made different from that of the power transmission coil, and the information transmission coil and the power transmission coil are stacked. Data are transmitted while power is transmitted. | 04-26-2012 |
20120105188 | STACKED INDUCTOR USING MAGNETIC SHEETS, AND METHOD FOR MANUFACTURING SAME - The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics. In order to achieve the objective, the present invention provides a multilayered chip power inductor using a magnetic sheet, characterized in that a plurality of magnetic sheets are laminated, wherein an electrical conductive circuit is formed on the surfaces of said sheets; that a terminal is formed at an outermost part; that said electrical conductive circuit and said terminal are electrically connected through via holes, and form a circuit in the form of a coil; and that a magnetic core is inserted into said circuit, and a method for manufacturing the same. | 05-03-2012 |
20120112868 | THREE-DIMENSIONAL COILING VIA STRUCTURE FOR IMPEDANCE TUNING OF IMPEDANCE DISCONTINUITY - Methods, systems, and apparatuses are provided for three-dimensional coiling via structures. A substrate includes a plurality of insulating layers, a plurality of trace layers interleaved with the insulating layers, and a three-dimensional coiling via. The three-dimensional coiling via includes a plurality of electrically conductive traces and a plurality of electrically conductive vias through the insulating layers. The electrically conductive traces are present in at least two of the traces layers and are coupled together by the electrically conductive vias. The electrically conductive traces are arranged to form at least one partial turn around an axis through the substrate. | 05-10-2012 |
20120112869 | COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A coil component | 05-10-2012 |
20120119866 | NON-MAGNETIC MATERIAL COMPOSITION FOR CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT MANUFACTURED BY USING THE SAME, AND METHOD OF MANUFACTURING THE CERAMIC ELECTRONIC COMPONENT - There is provided a non-magnetic material composition for a ceramic electronic component, a ceramic electronic component manufactured by using the same, and a method of manufacturing the ceramic electronic component. The non-magnetic material composition for the ceramic electronic component includes a compound represented by Chemical Formula Zn | 05-17-2012 |
20120119867 | MULTILAYER COIL COMPONENT - A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound. | 05-17-2012 |
20120119868 | WIRING SUBSTRATE AND MANUFACTURING METHOD FOR WIRING SUBSTRATE - Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts ( | 05-17-2012 |
20120126927 | COIL APPARATUS - Disc-type coil lamination work is facilitated, and a manufacturing cost is reduced. A plurality of disc-type coils each including a discoid insulating substrate | 05-24-2012 |
20120133471 | High-k Transformers Extending into Multiple Dielectric Layers - A device includes a first plurality of dielectric layers over a substrate and a second plurality of dielectric layers over the first plurality of dielectric layers. A metal inductor includes a first metal portion, a second metal portion, a third metal portion, and a fourth metal portion, wherein each of the first, the second, the third, and the fourth metal portions extends into the first and the second plurality of dielectric layers. A first metal bridge connects the first metal portion to the second metal portion, wherein the first metal bridge extends into the first plurality of dielectric layers and not into the second plurality of dielectric layers. A second metal bridge connects the third metal portion to the fourth metal portion, wherein the second metal bridge extends into the second plurality of dielectric layers and not into the first plurality of dielectric layers. | 05-31-2012 |
20120133472 | ELECTRONIC COMPONENT - An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer. | 05-31-2012 |
20120133473 | INDUCTIVE COMPONENT HAVING TERMINAL WINDING - An inductive component formed on a substrate ( | 05-31-2012 |
20120133474 | DISC-TYPE COIL - In a disc-type coil that enables assuring a sufficiently high value of a flowing current to increase an output and comprises: a discoid insulating substrate | 05-31-2012 |
20120146757 | THREE DIMENSIONAL INDUCTOR - A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other. | 06-14-2012 |
20120154096 | Transformer - The invention discloses an RF ASIC, ( | 06-21-2012 |
20120154097 | PLANAR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING - A method of manufacturing a planar board substrate for receiving a magnetic core. The method includes providing a cover layer having a layer side and providing a base layer having first and second sides. The base layer includes a material hole that extends completely through the base layer between the first and second sides. The method also includes coupling the cover and base layers to each other along the first side and the layer side. The cover layer extends over at least a portion of the material hole. The method also includes providing a dielectric member within the material hole, wherein a core-holding channel exists between the dielectric member and the base layer. The core-holding channel extends circumferentially around the dielectric member and is configured to have a magnetic core therein. | 06-21-2012 |
20120161914 | TRANSFORMER - There is provided a transformer having a minimized thickness. The transformer includes: insulating layers; and coil units including primary and secondary coils disposed on the insulating layers to have a common center. | 06-28-2012 |
20120169447 | NANOCOMPOSITE POWDER FOR INNER ELECTRODE OF MULTILAYER CERAMIC ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle. | 07-05-2012 |
20120188047 | INDUCTOR STRUCTURE HAVING INCREASED INDUCTANCE DENSITY AND QUALITY FACTOR - Disclosed is an inductor structure. The inductor structure includes a base material, at least one bottom spiral conductor disposed on the base material, a middle spiral conductor disposed on the bottom spiral conductor, a top spiral conductor disposed on the middle spiral conductor, and dielectric material separating the bottom, middle and top spiral conductors. The at least one bottom spiral conductor is connected electrically in parallel to the middle spiral conductor and the middle spiral conductor is connected electrically in series to the top spiral conductor. The top spiral conductor is thicker, narrower and less tightly wound than the middle spiral conductor and the bottom spiral conductor. | 07-26-2012 |
20120194314 | LOW-PROFILE INDUCATOR AND ITS FABRICATION METHOD - A low-profile inductor includes
| 08-02-2012 |
20120223798 | Partial conformal coating of electronic ceramic component and method making the same - A partial conformal coating covers the ceramic portion of leadless type electroceramic component but not the metalized terminals to improve the surface condition without altering the solderability of the component. And the methods to form the partial conformal coating to cover the desired area of the electroceramic component in simple processes suitable for mass production. | 09-06-2012 |
20120229243 | INTEGRATED CIRCUIT FOR INFORMATION TRANSFER - An integrated circuit for information transfer, having a substrate, at least one Hall element which is integrated into the substrate or situated on the substrate, a first coil which is situated essentially concentrically with respect to the Hall element and at a distance from the Hall element in the vertical direction and galvanically separated therefrom, and at least one second coil which is situated essentially concentrically with respect to the Hall element and galvanically separated therefrom and situated at a distance from the Hall element and the first coil in the vertical direction. The first coil and the second coil are electrically connected in series so that a current flow in the same direction results in the coils. | 09-13-2012 |
20120235779 | MICRO COIL APPARATUS AND MANUFACTURING METHODS THEREFOR - A method for manufacturing a conductive coil, the method comprising using a semiconductor fabrication process (e.g. TSV) to manufacture a coil, typically a planar spiral conductive coil. | 09-20-2012 |
20120249281 | INDUCTOR AND EDDY CURRENT SENSOR INCLUDING AN INDUCTOR - An inductor and an eddy current sensor including an inductor are disclosed. The inductor includes a patterned metal layer arranged on an insulating substrate. The inductor is capable of sensing eddy current within a high temperature region. | 10-04-2012 |
20120249282 | LARGE INDUCTANCE INTEGRATED MAGNETIC INDUCTION DEVICES AND METHODS OF FABRICATING THE SAME - Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop/gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop/gapped magnetic core and the first and second conductive windings. | 10-04-2012 |
20120268229 | Compact Vertical Inductors Extending in Vertical Planes - A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor. | 10-25-2012 |
20120268230 | MULTILAYER TYPE POWER INDUCTOR - Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current. | 10-25-2012 |
20120274434 | INTEGRATED TRANSFORMER - A device having a substrate and a dielectric layer disposed over the substrate is disclosed. The device includes a transformer layout disposed in the dielectric layer. The transformer layout includes an integrated transformer having primary and secondary coil elements. The first and second coil elements are configured to result in noise-self cancellation effect. | 11-01-2012 |
20120274435 | CHIP-TYPE COIL COMPONENT - There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers, and having a lower surface provided as a mounting area, an upper surface corresponding thereto, two end surfaces, and two lateral surfaces; conductor patterns formed on the magnetic layers, respectively, and connected to each other to have a coil structure; and external electrodes formed on at least one external surface of the body, and electrically connected to the conductor patterns, the external electrodes each being formed on the lower surface and spaced apart from edges thereof. Short circuits between electronic components may be prevented and sticking strength between the chip-type coil component and a substrate may be increased. | 11-01-2012 |
20120274436 | THROUGH VIA INDUCTOR OR TRANSFORMER IN A HIGH RESISTANCE SUBSTRATE WITH PROGRAMMABILITY - A through via inductor or transformer in a high-resistance substrate in an electronic package. The package may comprise a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. A transformer can comprise a primary loop and a secondary loop, each of which includes through-vias coupled to conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio. | 11-01-2012 |
20120286917 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component capable of preventing the occurrence of magnetic saturation due to a magnetic flux surrounding each coil conductor and a method of manufacturing the electronic component are provided. The electronic component includes a laminate formed by stacking unit layers, where each unit layer includes a first insulating layer, and a coil conductor and second insulating layer formed on the first insulating layer. Each second insulating layer has a Ni content greater than a Ni content of each first insulating layer. Portions of the first insulating layers have a Ni content lower than a Ni content of the second portions after the laminate is calcined. | 11-15-2012 |
20120299683 | ASYMMETRIC DIFFERENTIAL INDUCTOR - An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout. | 11-29-2012 |
20120306608 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure. | 12-06-2012 |
20120306609 | COMMON MODE CHOKE COIL AND HIGH-FREQUENCY COMPONENT - A common mode choke coil includes a first coil element and a second coil element connected in series between a first port and a second port, and a third coil element and a fourth coil element connected in series between a third port and a fourth port. With normal mode current flow through the first and second transmission lines, a first closed magnetic circuit forms in which magnetic flux passing through the first and second coil elements forms a closed loop, and a second closed magnetic circuit forms in which a magnetic flux passing through the third coil element and the fourth coil element forms a closed loop. With common mode current flow in the first and second transmission lines, a third closed magnetic circuit forms in which a magnetic flux passing through the first through fourth coil elements forms a closed loop. | 12-06-2012 |
20120313743 | LAMINATED ELECTRONIC COMPONENT EQUIPPED WITH INDUCTOR - A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor. | 12-13-2012 |
20120319811 | MANUFACTURING METHOD OF COMMON MODE FILTER AND STRUCTURE OF THE SAME - A manufacturing method of common mode filters and a structure of the same are revealed. A common mode choke layer is disposed over a composite substrate and a second magnetic material layer is coated on an upper surface of the common mode choke layer. The common mode choke layer is produced by a wafer-level electrode leading out method and having leading-out terminals on sides thereof. External electrodes are formed on sides of the common mode choke layer by partial cutting, sputtering, lithography and electroplating at wafer level and corresponding to the leading-out terminals. Thereby common mode filters produced are supported more stably. Moreover, the volume is minimized due to inductive coils and external electrodes connected by wafer level packaging. Thus the common mode filters are mass-produced, the cost is down and the defect rate is reduced. | 12-20-2012 |
20120326827 | BUILT-IN-COIL SUBSTRATE - In a built-in-coil substrate, when viewed in perspective in a stacking direction in which insulating layers of a substrate body are stacked, mutually superposed second coil elements are located further inward than inner peripheries of mutually superposed first coil elements. A cavity is continuous between at least one of the second coil elements and one insulating layer that is in contact with the second coil element(s), and another insulating layer that opposes the second coil element(s) such that the second coil element(s) are exposed, and, when viewed in perspective in the stacking direction, the cavities have annular shapes and extend further inward than the outer peripheries of the mutually superposed first coil elements, there being an interval provided between the cavities and these outer peripheries, and further outward than the inner peripheries of the mutually superposed second coil elements. | 12-27-2012 |
20120326828 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ferrite material magnetic body part and a Cu conductive part, the ferrite containing 20 to 48% trivalent Fe in terms of Fe | 12-27-2012 |
20130002387 | METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR AND STRUCTURE THEREOF - A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots. | 01-03-2013 |
20130002388 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided a multilayered ceramic electronic component capable of securing capacitance by controlling electrode connectivity. The multilayered ceramic electronic component includes: a ceramic main body; and internal electrodes formed in the interior of the ceramic main body and having a central portion and a tapered portion becoming thinner from the central portion toward edges thereof, respectively, wherein the ratio of the area of the tapered portion to the overall area of the internal electrodes is 35% or less. A desired capacitance can be obtained by controlling an electrode connectivity even in the small high capacitance multilayered ceramic capacitor. | 01-03-2013 |
20130002389 | GAP COMPOSITION OF MULTI LAYERED POWER INDUCTOR AND MULTI LAYERED POWER INDUCTOR INCLUDING GAP LAYER USING THE SAME - Disclosed are a multilayered power inductor, including: a body in which a plurality of magnetic layers formed with inner electrodes are stacked; and a plurality of gap layers, wherein the plurality of gap layers are formed so as not to contact external electrodes formed at both sides of the body, and a gap composition of the multilayered power inductor.
| 01-03-2013 |
20130009740 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other. | 01-10-2013 |
20130009741 | INTEGRATED CIRCUIT TRANSFORMER - The invention provides an integrated circuit transformer disposed on a substrate. The integrated circuit transformer includes a first coiled metal pattern disposed on the substrate, comprising an inner loop segment and an outer loop segment. A second coiled metal pattern is disposed on the substrate, laterally between the inner loop segment and the outer loop segment. A dielectric layer is disposed on the first coiled metal pattern and the second coiled metal pattern. A first via is formed through the dielectric layer, electrically connecting to one of the first and second coiled metal patterns. A first redistribution pattern is disposed on the dielectric layer, electrically connecting to and extending along the first via, wherein the first redistribution pattern covers at least a portion of the first coiled metal pattern and at least a portion of the second coiled metal pattern. | 01-10-2013 |
20130015935 | COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAANM CHANG; YU CHIAAACI TAICHUNG CITYAACO TWAAGP CHANG; YU CHIA TAICHUNG CITY TWAANM LIN; CHI LONGAACI HSINCHU COUNTYAACO TWAAGP LIN; CHI LONG HSINCHU COUNTY TWAANM WANG; CHENG YIAACI NEW TAIPEI CITYAACO TWAAGP WANG; CHENG YI NEW TAIPEI CITY TWAANM TAI; SHIN MINAACI TAOYUAN COUNTYAACO TWAAGP TAI; SHIN MIN TAOYUAN COUNTY TW - A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. | 01-17-2013 |
20130015936 | CONVERTER AND METHOD FOR MANUFACTURING THE SAME - A converter includes a main board, at least one first connecting member, and a magnetic component. The first connecting member is defined on a surface of the main board. The magnetic component is assembled with the main board. The magnetic component includes a winding board, at least one second connecting member and a core. The second connecting member is defined on a surface of the winding board, and the second connecting member is in electrical contact with the first connecting member. The core is assembled with the winding board. A method for manufacturing a converter is also disclosed herein. | 01-17-2013 |
20130015937 | ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAMEAANM SEKO; AtsushiAACI Kyoto-fuAACO JPAAGP SEKO; Atsushi Kyoto-fu JP - A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface. | 01-17-2013 |
20130027168 | MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multilayer power inductor and a method of manufacturing the same. The multilayer power inductor includes a multilayer body formed by multi-layering a plurality of body sheets; a coil portion including internal electrode patterns that are respectively formed on the plurality of body sheets; and external electrodes that are disposed on lateral surfaces of the multilayer body and are electrically connected to both ends of the coil portion, wherein a space portion is formed in the internal electrode pattern to correspond to contraction of the plurality of body sheet. The multilayer power inductor relieves internal stress generated in a product through the space portion so as to prevent the body sheet from being magnetized due to the internal stress, thereby preventing a reduction in inductance. The multilayer inductor may also be manufactured by using conventional manufacturing processes themselves without any influence on the productivity of a product. | 01-31-2013 |
20130027169 | MAGNETIC COMPONENTS AND METHODS OF MANUFACTURING THE SAME - Magnetic component assemblies and core structures including coil coupling arrangements, that are advantageously utilized in providing surface mount magnetic components such as inductors and transformers. | 01-31-2013 |
20130027170 | ISOLATED POWER CONVERTER WITH MAGNETICS ON CHIP - An integrated circuit fabricated with a number of layer may include a substrate, a transformer having a first winding, a second winding and a magnetic core. The first winding and the second winding may surround the magnetic core. The transformer may be disposed above a first side of the substrate. A flux conductor may be disposed on a second surface of the substrate opposite to the first surface. | 01-31-2013 |
20130027171 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR SAME - An electronic component and manufacturing method for preparing an electronic component includes providing a first insulator layer having a first nickel content rate. A coil conductor and a second insulator layer having a first bismuth content rate and a second nickel content rate higher than the first nickel content rate are provided on the first insulator layer. The first insulator layer, the coil conductor, and the second insulator layer constitute a first unit layer. The first unit layer and an exterior insulator layer are laminated to obtain a laminate. After a step of firing the laminate, a nickel content rate in a first portion of the first insulator layer, the first portion being sandwiched between the coil conductors from both sides facing in a lamination direction, is lower than a nickel content rate in a second portion of the first insulator layer other than the first portion. | 01-31-2013 |
20130027172 | METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR AND STRUCTURE THEREOF - A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots. | 01-31-2013 |
20130033353 | SUBSTRATE INDUCTIVE DEVICES AND METHODS - Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed. | 02-07-2013 |
20130038418 | CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | 02-14-2013 |
20130038419 | LAMINATED INDUCTOR - A laminated inductor having a laminate structure constituted by magnetic layers and internal conductive wire-forming layers, wherein the magnetic layer is formed by soft magnetic alloy grains, the internal conductive wire-forming layer has an internal conductive wire and a reverse pattern portion around it, and the reverse pattern portion is formed by soft magnetic alloy grains whose constituent elements are of the same types as those of, and whose average grain size is greater than that of, the soft magnetic alloy grains constituting the magnetic layer. | 02-14-2013 |
20130043967 | ROGOWSKI COIL ASSEMBLIES AND METHODS FOR PROVIDING THE SAME - Rogowski coil assemblies and methods for providing or forming Rogowski coil assemblies are provided. A Rogowski coil assembly may include a printed circuit board and a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces. The circuit traces may retain and connect the plurality of Rogowski coil sections. | 02-21-2013 |
20130043968 | VERTICALLY ORIENTED SEMICONDUCTOR DEVICE AND SHIELDING STRUCTURE THEREOF - The present disclosure provides a semiconductor device. The semiconductor device includes a substrate that spans in an X-direction and a Y-direction that is orthogonal to the X-direction. The semiconductor device includes an interconnect structure formed over the substrate in a Z-direction that is orthogonal to both the X-direction and the Y-direction. The interconnect structure includes a plurality of metal lines interconnected together in the Z-direction by a plurality of vias. The interconnect structure contains a transformer device that includes a primary coil and a secondary coil. The primary coil and the secondary coil are each wound at least partially in the Z-direction. | 02-21-2013 |
20130049916 | SEMICONDUCTOR STRUCTURE WITH GALVANICALLY-ISOLATED SIGNAL AND POWER PATHS - A galvanic die has signal structures and a transformer structure that provide galvanically-isolated signal and power paths for a high-voltage die and a low-voltage die, which are both physically supported by the galvanic die and electrically connected to the signal and transformer structures of the galvanic die. | 02-28-2013 |
20130049917 | CONDUCTOR PATTERN AND ELECTRONIC COMPONENT HAVING THE SAME - Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component. | 02-28-2013 |
20130057379 | PRINTED CIRCUIT BOARD - A printed circuit board includes metallization layers are stacked along a vertical direction and separated mechanically from one another by electrically insulating layers. A coil extends along a vertical winding axis and has turns formed by conductive tracks made in respective metallization layers, the turns being electrically connected to one another by pads going through at least one of the electrically insulating layers. A superimposition, in a plane parallel to the metallization layers, of the conductive tracks of the coil, made in a first metallization layer and a second metallization layer, that are immediately consecutive in the vertical direction, forms a pattern having two axial symmetries relative to X and Y axes orthogonal to each other and parallel to the metallization layers. The conductive tracks of each of the superimposed metallization layers are devoid, of themselves, of axial symmetry relative to the X or Y axes. | 03-07-2013 |
20130063238 | CHIP INDUCTOR - Disclosed herein is a laminated chip inductor including: a laminate including a plurality of first sheets having conductive patterns printed thereon and laminated in order; and a sheet having a discrimination via hole and provided on and/or under the laminate. | 03-14-2013 |
20130069752 | LAMINATED INDUCTOR - There is provided a laminated inductor including: a body in which a plurality of magnetic layers are stacked; at least one non-magnetic layers interposed between the magnetic layers and including a Al | 03-21-2013 |
20130069753 | HIGH FREQUENCY PCB COILS - Described herein designs for high frequency printed circuit board (PCB) resonator coils. The resonator coils are printed or etched on a thin substrate. The number of loops of the resonator coil, the width of each trace, the spacing between the traces, and the like are adjusted to increase the quality factor Q of the resonator coils. | 03-21-2013 |
20130076474 | COMMON MODE FILTER WITH MULTI-SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material. | 03-28-2013 |
20130082812 | COIL PARTS AND METHOD OF FABRICATING THE SAME - A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate. | 04-04-2013 |
20130082813 | COIL PARTS - A coil part is provided. The coil part includes a coil layer, a lower magnetic layer, and an upper magnetic layer. The coil layer includes a primary coil pattern, a secondary coil pattern, and a dielectric including the primary coil pattern and the secondary coil pattern. The lower magnetic layer is disposed under the coil layer. The upper magnetic layer is disposed on the lower magnetic layer to fill up the center and the periphery of the coil layer and cover the coil layer. Accordingly, the coil part can improve filtering characteristics by more smoothly increasing a magnetic flux surrounding the coil pattern. Also, the coil part can cut fabrication costs by reducing the length of the coil pattern with respect to the same characteristics. | 04-04-2013 |
20130088316 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the eletronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions. | 04-11-2013 |
20130093556 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained. | 04-18-2013 |
20130093557 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate has a structure in which magnetic layers and a non-magnetic layer containing glass are stacked. A coil is incorporated in the laminate. The magnetic permeability μ | 04-18-2013 |
20130093558 | ELECTRONIC COMPONENT - An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction. | 04-18-2013 |
20130106552 | INDUCTOR WITH MULTIPLE POLYMERIC LAYERS | 05-02-2013 |
20130106553 | SINGLE DIFFERENTIAL TRANSFORMER CORE | 05-02-2013 |
20130106554 | HIGH FREQUENCY INDUCTOR STRUCTURE HAVING INCREASED INDUCTANCE DENSITY AND QUALITY FACTOR | 05-02-2013 |
20130113593 | MULTILAYER TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer type inductor, incluing: an inductor main body; a coil part having conductive circuits and conductive vias formed in the inductor main body; and external electrodes formed on both ends of the inductor main body, wherein in the inductor main body, at least parts around the conductive circuits and the conductive vias are formed of a ferrite material or a non-magnetic material. | 05-09-2013 |
20130113594 | STAMP FOR MANUFACTURING CONDUCTOR LINE AND VIA AND METHOD FOR MANUFACTURING COIL PARTS - The present invention discloses a stamp for manufacturing a conductor line and a via including: an imprint body portion having a plate shape; a line imprint portion continuing in a spiral shape from an outer side to a center side of the imprint body portion while projecting from one surface of the imprint body portion; and a via imprint portion projecting from an end portion of the line imprint portion positioned on the center side of the imprint body portion while projecting from one surface of the imprint body portion, and a method for manufacturing coil parts using the same. | 05-09-2013 |
20130113595 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREFOR - A monolithic ceramic electronic component including coil conductors is capable of reducing the number of stacked ceramic layers without sacrifice of the performance of coils and be capable of increasing the number of turns of the coils without increasing the size in. In the monolithic ceramic electronic component, coil conductors having more than one turn for one ceramic layer are formed. The coil conductors include surface coil conductors that are located along surfaces of sequentially stacked ceramic layers and intra-layer coil conductors that are located inside the ceramic layers so as not to extend beyond the thickness of the individual ceramic layers. The surface coil conductors and the intra-layer coil conductors are connected in series with connecting portions therebetween. | 05-09-2013 |
20130120095 | METHOD FOR MAKING AN ELECTRICAL INDUCTOR AND RELATED INDUCTOR DEVICES - A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate. | 05-16-2013 |
20130120096 | MULTILAYERED MINIATURE COIL COMPONENT - A multilayered miniature coil component, comprising a plurality of coil layers and insulating layers, the plurality of coil layers and insulating layers being alternately overlapped on each other. Each of the plurality of coil layers includes a plurality of coils and wires, each of the coils has a first and a second end, and a plurality of first conductive portions is disposed on each of the coil layers, at least one second conductive portion is disposed on at least one of the coil layers, and each of the plurality of insulating layers has a plurality of conductive through holes disposed correspondingly to the first conductive portions and the second conductive portions, thus through the plurality of wires, the first and the second conductive portions and the conductive through holes, the plurality of coils in each of the coil layers are composed as a circuit loop | 05-16-2013 |
20130120097 | COIL-TYPE ELECTRONIC COMPONENT - A coil-type electronic component having a coil inside or on the surface of a base material, characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains whose main ingredients are iron, silicate and chromium, and that an oxide layer is formed on the surface of each soft magnetic alloy grain, where the oxide layer is produced as a result of oxidization of the grain and has more chromium than the alloy grain, and this oxide layer has a two-layer structure constituted by an inner layer whose main ingredient is chromium oxide and an outer layer whose main ingredient is iron-chromium oxide, and the outer layers of soft magnetic alloy grains are inter-bonded. | 05-16-2013 |
20130127576 | LAMINATED INDUCTOR - A laminated inductor offers higher magnetic permeability, high inductance, low resistance and high rated current, while also supporting downsizing of device, by using a soft magnetic alloy as the magnetic material. Provided is a laminated inductor, comprising: an internal conductor forming area and a top cover area and a bottom cover area formed in a manner sandwiching the internal conductor forming area from above and below, wherein the internal conductor forming area has a magnetic material part formed by soft magnetic alloy particles, and internal conductors buried in the magnetic material part, and at least one of the top cover area and bottom cover area is formed by soft magnetic alloy particles exhibiting a two-peak particle size distribution curve (based on count). | 05-23-2013 |
20130127577 | Micromagnetic Device and Method of Forming the Same - A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device. | 05-23-2013 |
20130127578 | METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH METAL CORE AND STRUCTURE THEREOF - A method for fabricating a inductor carrier comprises the steps of providing a substrate with a protective layer; forming a first photoresist layer on protective layer; patterning the first photoresist layer to form a first opening and first apertures; forming a first metal layer within first opening and first apertures; removing the first photoresist layer; forming a first dielectric layer on protective layer; forming a second photoresist layer on first dielectric layer; patterning the second photoresist layer to form a second aperture and a plurality of third apertures; forming a second metal layer within second aperture and third apertures; removing the second photoresist layer; forming a second dielectric layer on first dielectric layer; forming a third photoresist layer on second dielectric layer; patterning the third photoresist layer to form a fifth aperture and sixth apertures; forming a third metal layer within fifth aperture and sixth apertures. | 05-23-2013 |
20130135074 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer. | 05-30-2013 |
20130135075 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A stack is configured by stacking magnetic layers and non-magnetic layers, and has a rectangular-parallelepiped shape. A coil is provided in the stack, and has a coil axis that is substantially parallel to a stacking direction of the stack. The stacking direction and the coil axis are not parallel to sides that configure the stack. | 05-30-2013 |
20130141205 | CONDUCTOR PATTERN AND COIL PARTS HAVING THE SAME - A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion. | 06-06-2013 |
20130141206 | COMMON MODE NOISE FILTER - Disclosed herein is a common mode noise filter including: a plurality of insulation layers configuring a laminated body formed on a substrate; internal electrode coils included in the plurality of insulation layers; external electrode terminals connected to an end portion of the internal electrode coils; and a magnetic layer formed on a surface of the laminated body. According to the present invention, the common mode noise filter has the magnetic layer including the conductive metal on the uppermost layer thereof, such that the permeability of the ferrite composite may be increased and the ferrite powder may be effectively compensated for the eddy current loss of the internal electrode coil, thereby making it possible to improve the impedance characteristics of the common mode noise filter. | 06-06-2013 |
20130147591 | MULTILAYERED INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered inductor, including: an inductor body; a coil part formed on the inductor body and having a conductive circuit and a conductive via; and external electrodes formed on both end surfaces of the inductor body, wherein the inductor body includes 65 to 95 wt % of a metallic magnetic material and 5 to 35 wt % of an organic material. | 06-13-2013 |
20130147592 | COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a lower magnetic body; primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other; a lower insulating layer covering the primary and secondary lower patterns; primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary lower patterns; and an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns have portions which cross the primary and secondary lower patterns on the plane, and a method of manufacturing the same. | 06-13-2013 |
20130147593 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A multilayer body includes a plurality of insulator layers that are stacked together and has top and bottom surfaces that oppose each other in a stacking direction and side surfaces that connect the top and bottom surfaces to each other. A coil is incorporated in the multilayer body. A connecting conductor is provided on the top surface of the multilayer body so as not to be in contact with the side surfaces of the multilayer body. An outer electrode is provided on the top surface of the multilayer body so as to cover the connecting conductor. A via-hole conductor connects an end portion of the coil and the connecting conductor to each other and extends through at least one of the insulator layers in the stacking direction. | 06-13-2013 |
20130154783 | HIGH-FREQUENCY TRANSFORMER, HIGH-FREQUENCY COMPONENT, AND COMMUNICATION TERMINAL DEVICE - In a high frequency transformer, when a current flows between input-output ports, a magnetic flux produced by first and third coil conductor patterns of a primary coil is interlinked with a second coil conductor pattern of a secondary coil. A magnetic flux produced by the second coil conductor pattern of the primary coil is interlinked with the first and third coil conductor patterns of the secondary coil. The coil conductor patterns are wound so that when a current flows through a transformer, the directions of magnetic fields occurring within the first and third coil conductor patterns of the primary coil and the second coil conductor pattern of the secondary coil are the same and the directions of magnetic fields occurring within the first and third coil conductor patterns of the secondary coil and the second coil conductor pattern of the primary coil are the same. | 06-20-2013 |
20130154784 | COIL-TYPE ELECTRONIC COMPONENT - A coil-type electronic component having a coil inside or on the surface of a base material is characterized in that the base material of the coil-type electronic component is constituted by a group of soft magnetic alloy grains inter-bonded via oxide layers, multiple crystal grains are present in each soft magnetic alloy grain, and the oxide layers preferably have a two-layer structure whose outer layer is thicker than the inner layer. | 06-20-2013 |
20130154785 | LAMINATED TYPE INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR - In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state. | 06-20-2013 |
20130154786 | LAMINATED COMMON-MODE CHOKE COIL - A laminated common-mode choke coil offering higher insulation reliability has a glass ceramic layer, two spiral internal conductors facing each other and sandwiching the glass ceramic layer in between, and insulation layers sandwiching the two internal conductors, wherein the glass ceramic layer contains segregated Al regions and the maximum dimension t | 06-20-2013 |
20130162385 | COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern; a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; and a ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside. | 06-27-2013 |
20130169402 | Compact Planar VHF/UHF Power Impedance Transformer - An RF impedance transformer having a parallel low-impedance access Eb and serial high-impedance access Eh and intended for connection onto a printed circuit. The transformer includes a multilayer circuit that includes a long side and at least three layers. A first outer layer is separated from a second outer layer of the same thickness by at least one inner layer having a thickness at least four times greater than the thickness of the outer layers, each outer layer comprising an electrical conductor on each surface for forming a microstrip line, the serial high-impedance access Eh and the parallel low-impedance access Eb being on the long side of the multilayer circuit and near to each other so as to limit the area for connection with the printed circuit. | 07-04-2013 |
20130169403 | MAGNETIC COMPONENT AND MANUFACTURING METHOD THEREOF - A magnetic component and manufacturing method thereof are described. The manufacturing method includes the following steps: (1) coating an insulation material on the surface of a magnetic core to form an insulation magnetic core; (2) bending the conducting material into a predetermined shape to form a preformed conductive body; and (3) assembling the mold conducting body with the insulation magnetic core to form a magnetic component. The method of the present invention easily manufactures the magnetic component with a shrinkage size and good insulation characteristic between the preformed conductive body and the insulation magnetic core. | 07-04-2013 |
20130169404 | MULTILAYER INDUCTOR - Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor. | 07-04-2013 |
20130176096 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A laminated electronic component with adjacent wires (such as coil conductors) in insulator layers inter-connected through via holes, wherein its laminate is structured in such a way that a coil-embedded layer constituted by first insulator layers and second insulator layers laminated alternately is sandwiched between a top magnetic layer and bottom magnetic layer, with external electrodes formed on both end faces. First coil conductors are formed on the first insulator layers and second coil conductors are formed on the second insulator layers, with these coil conductors connected through via holes. Formed at the end of each second coil conductor is a connection conductor of a size sufficiently large to block off the top of the via hole provided in the insulator sheet. By discharging the air in the via hole by means of pressure-bonding the laminate, the connection conductor will have a part filling inside the via hole and another part projecting on top of the via hole, with the center of the via hole recessed, to prevent shorting and cracking | 07-11-2013 |
20130187742 | INDUCTIVE TOUCH SENSOR USING A FLEXIBLE COIL - An inductive touch sensor comprises an inductors disposed in or on a deformable substrate. When a force is applied to the deformable substrate the physical shape of the inductor will change and thereby change its inductance value. The change in the inductance value can be detected and used to indicate actuation of an associated touch key of the inductive touch sensor. A plurality of inductive touch sensors may be used to form a touch panel. | 07-25-2013 |
20130187743 | INDUCTOR STRUCTURE - An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids. | 07-25-2013 |
20130187744 | ELECTRONIC COMPONENT - A multilayer body is formed of a plurality of insulator layers that are stacked on top of one another. A coil is a helical coil provided in the multilayer body and includes a plurality of coil conductor layers that are superposed with one another so as to form a ring-shaped path when seen in plan view from a stacking direction and a plurality of via hole conductors that connect the plurality of coil conductor layers together. The path includes corners that project outward and corners that project inward. Each of the via hole conductors are provided at one of the corners, which project outward. | 07-25-2013 |
20130187745 | TRANSMISSION-LINE TRANSFORMER IN WHICH SIGNAL EFFICIENCY IS MAXIMISED - Provided is a transmission line transformer having increased signal efficiency. The transmission line transformer is formed on an integrated circuit (IC), wherein a first transmission line disposed in one direction. Second and third transmission lines have same length direction as the first transmission line and are spaced apart from each other in a lateral direction above or below the first transmission line. Accordingly, an area of the first transmission line and areas of the second and third transmission lines, which face each other, are increased, thereby improving a coupling factor. Also, since a secondary transmission line is divided into two regions and uses the second and third transmission lines that have narrower widths than the first transmission line, parasitic capacitance components generated between the first through third transmission lines and a semiconductor substrate may be decreased. | 07-25-2013 |
20130200979 | LAMINATED INDUCTOR - A laminated inductor includes a laminate constituted by multiple insulator layers, and a coil conductor formed in a spiral shape inside the laminate; wherein the coil conductor has conductor patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns; wherein conductor patterns formed on some insulator layers each represent a C-shaped pattern that includes the four corners and has an open part on one side, of a roughly rectangular shape, while a conductor pattern formed on other insulator layer(s) represents a line-shaped pattern corresponding to the open part of one side of the aforementioned C-shaped pattern of the roughly rectangular shape; and wherein an insulator layer on which the C-shaped pattern is formed, and insulator layer(s) on which the line-shaped pattern is formed, adjoin each other at least in one part of the laminate. | 08-08-2013 |
20130200980 | LAMINATED INDUCTOR - A laminated inductor includes: a laminate constituted by multiple insulator layers; external electrodes formed on the outside of the laminate; and a coil conductor formed spirally inside the laminate, wherein the coil conductor has leaders that electrically connect to the external electrodes and a coil body other than the leaders, wherein the coil conductor has conductive patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, wherein all of the conductor patterns constituting the coil body are either a C-shaped pattern or line-shaped pattern, wherein the coil body has a partial structure where two or more C-shaped pattern layers are stacked together successively, and wherein the number of C-shaped patterns in the coil body is greater than that of line-shaped patterns. | 08-08-2013 |
20130200981 | TRANSMISSION LINE TRANSFORMER WHICH MINIMIZES SIGNAL LOSS - Provided is a transmission line transformer, and more particularly, a transmission line transformer capable of decreasing a power loss caused by a parasitic resistance component of the transmission line transformer and improving a coupling factor by forming a primary transmission line and a secondary transmission line parallel to each other on an integrated circuit (IC) by using a highest layer metal line, and forming a lower layer metal line immediately below the highest layer metal line in addition to the highest layer metal line in a region where the primary transmission line and the secondary transmission line face each other, while forming the transmission line transformer used in a high frequency circuit via a semiconductor process. | 08-08-2013 |
20130214890 | High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application - A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer. | 08-22-2013 |
20130214891 | CHIP-TYPE COIL COMPONENT - A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated. | 08-22-2013 |
20130222104 | COMMON MODE CHOKE COIL AND METHOD FOR MANUFACTURING THE SAME - There is provided a common mode choke coil in which a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer and two facing conductive coils are included in the non-magnetic layer, the non-magnetic layer is formed of sintered glass ceramics, the conductive coils and are formed of a conductor containing copper, and at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing Fe | 08-29-2013 |
20130222105 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion. | 08-29-2013 |
20130229253 | LAMINATED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT - A laminated electronic component includes a first magnetic material portion, a low-magnetic-permeability portion laminated on the first magnetic material portion, a second magnetic material portion laminated on the low-magnetic-permeability portion, at least one annular or spiral coil disposed within the low-magnetic-permeability portion, and a plurality of columnar magnetic material portions disposed within the low-magnetic-permeability portion so as to extend through inside of the coil and connecting the first magnetic material portion to the second magnetic material portion. | 09-05-2013 |
20130234819 | THIN FILM TYPE COMMON MODE FILTER - The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate. | 09-12-2013 |
20130234820 | COMMON MODE FILTER AND FABRICATION METHOD THEREOF - Disclosed herein are a common mode filter and a fabrication method thereof. The common mode filter includes: a first magnetic substrate; a laminate including insulating sheets with coil pattern electrodes printed thereon, having holes therein, and provided on the first magnetic substrate; a magnetic core inserted into the hole; and a second magnetic substrate integrally formed with the magnetic core and provided on the laminate. | 09-12-2013 |
20130241683 | Inductor for Post Passivation Interconnect - An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member. | 09-19-2013 |
20130241684 | METHOD FOR MANUFACTURING COMMON MODE FILTER AND COMMON MODE FILTER - Disclosed herein are a method for manufacturing common mode filter and a common mode filter. The method includes: performing electroplating on first coil patterns made of a conductive material to form second coil patterns having a cross-sectional area increased as compared to the first coil patterns. Therefore, the common mode filter fulfilling a miniaturization demand and having the improved characteristics such as the inductance, the DC resistance, and the like, may be implemented. | 09-19-2013 |
20130241685 | Method of Constructing Inductors and Transformers - An embodiment of the invention relates to an apparatus including a magnetic device and a related method. A multilayer substrate is constructed with a winding formed in a metallic layer, an electrically insulating layer above the metallic layer, and a via formed in the electrically insulating layer to couple the winding to a circuit element positioned on the multilayer substrate. A depression is formed in the multilayer substrate, and a polymer solution, preferably an epoxy, containing a ferromagnetic component such as nanocrystaline nickel zinc ferrite is deposited within a mold positioned on a surface of the multilayer substrate above the winding and in the depression. An integrated circuit electrically coupled to the winding may be located on the multilayer substrate. The multilayer substrate may be a semiconductor substrate or a printed wiring board, and the circuit element may be an integrated circuit formed on the multilayer substrate. | 09-19-2013 |
20130249660 | PARALLEL STACKED SYMMETRICAL AND DIFFERENTIAL INDUCTOR - A parallel stacked symmetrical and differential inductor and manufacturing method of the same is disclosed. The parallel stacked symmetrical and differential inductor is disposed on a substrate and comprises at least one first conductive layer ( | 09-26-2013 |
20130249661 | COMMON MODE NOISE FILTER - A filter body of a common mode noise filter includes: a non-magnetic body; a first magnetic body and a second magnetic body sandwiching the non-magnetic body; and a first coil conductor and a second coil conductor of planar shape which are embedded in the non-magnetic body and positioned on the first magnetic body side and second magnetic body side in the non-magnetic body in a manner facing each other in a non-contact state; and also has a non-magnetic first protective part and second protective part which are made of a non-magnetic material whose strength is higher than the first magnetic body and second magnetic body and which are positioned on the outermost side of the filter body in a manner sandwiching the first magnetic body and second magnetic body. | 09-26-2013 |
20130249662 | PLANAR COIL ELEMENT - In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. | 09-26-2013 |
20130249663 | ANTENNA DEVICE FOR NEAR FIELD WIRELESS COMMUNICATION AND PORTABLE TERMINAL HAVING THE SAME - An antenna device for near field wireless communication which may be mounted at a part of a Black Mark (BM) region of a window, and a portable terminal having the same are provided. The antenna device for near field wireless communication mounted in the portable terminal having a BM region, includes: a plurality of flexible printed circuit board layers stacked at a partial region of a lower portion of the BM region, a plurality of conductive antenna patterns of a loop type provided for the plurality of flexible printed circuit board layers, respectively, and a plurality of through holes through which adjacent conductive antenna patterns are connected to each other among the plurality of conductive antenna patterns of a loop type such that the plurality of conductive antenna patterns are electrically connected to each other so as to define one loop antenna. | 09-26-2013 |
20130249664 | PLANAR COIL ELEMENT AND METHOD FOR PRODUCING THE SAME - In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element. | 09-26-2013 |
20130257575 | COIL HAVING LOW EFFECTIVE CAPACITANCE AND MAGNETIC DEVICES INCLUDING SAME - A coil of a magnetic device comprising a conductor having its plurality of turns arranged in a plurality of conductive layers, wherein at least two non-innermost and electrically consecutive turns of the conductor are arranged in different conductive layers, and a magnetic device including same. | 10-03-2013 |
20130257576 | MULTILAYER COIL COMPONENT - A multilayer coil component has an element body, a coil, a pair of first external electrodes, a pair of second external electrodes, a first connection conductor, and a second connection conductor. The coil is composed of a plurality of internal conductors arranged in the element body and connected to each other. The first external electrodes are arranged on a first principal face of the element body. The second external electrodes are arranged on the first principal face. The first connection conductor is arranged between the coil and the first external electrodes in the element body and is connected to one end of the coil and to the first external electrodes. The second connection conductor is arranged between the coil and the second external electrodes in the element body and is connected to the other end of the coil and to the second external electrodes. | 10-03-2013 |
20130257577 | INTEGRATED CIRCUIT INDUCTORS - In order to reduce the inter-path capacitance of an inductor, an integrated circuit inductor design is provided in which the path crossings are designed such that the voltage differences between the adjacent paths in the loops are (in total) minimised. | 10-03-2013 |
20130271251 | Substrate-Less Electronic Component - The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate. | 10-17-2013 |
20130271252 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes a first insulating layer, a first magnetic layer that is a first plating film formed on the first insulating layer, a flat coil formed on the first magnetic layer, and a second magnetic layer that is a second plating film formed on the flat coil. | 10-17-2013 |
20130271253 | POWER CONVERTING TRANSFORMER, VEHICLE HEADLIGHT PROVIDED WITH THE POWER CONVERTING TRANSFORMER AND MOTOR VEHICLE PROVIDED WITH THE HEADLIGHT - In a power converting transformer, an I-core has a pair of fixing grooves provided at centers on opposite side surfaces of the I-core in a y-direction in an xyz orthogonal coordinate system, the fixing grooves extending through the I-core in the z-direction, and an E-core has a pair of fixing recess portions provided at x-direction centers of the y-direction opposite end portions of the base portion on a surface opposite from a surface of the base portion facing the I-core. The I-core and the E-core are pressed and fixed to each other by a fixing spring wrapped around the I-core and the E-core through the fixing grooves and the fixing recess portions. An x-direction length of the E-core is shorter than an x-direction length of the I-core, and a y-direction length of the E-core is shorter than or equal to a y-direction distance between the fixing grooves of the I-core. | 10-17-2013 |
20130271254 | LAMINATED-TYPE ELECTRONIC COMPONENT - A laminated-type electronic component including: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic gaps are formed of a compound of Ni and Cu. | 10-17-2013 |
20130271255 | CIRCUIT PROTECTION DEVICE - The present invention relates to a circuit protection device and provides a circuit protection device comprising a laminate having a plurality of sheets laminated; a magnetic core provided within the laminate; a coil provided within the laminate and configured to wind vertically and to wrap the magnetic core; a projecting electrode connected to the coil and projected to be exposed to the outside of the laminate; and an external electrode provided on the laminate and connected to the projecting electrode. | 10-17-2013 |
20130278372 | Semiconductor Component with Coreless Transformer - A semiconductor component has integrated a coreless transformer with a first connection contact, a second connection contact, an electrically conductive spiral first coil, an electrically conductive first ring, and an electrically conductive second ring. The electrically conductive spiral first coil is electrically connected between the first connection contact and the second connection contact. The electrically conductive first ring surrounds the first coil and one or both of the first connection contact and the second connection contact. The electrically conductive second ring is arranged between the first coil and the first ring, electrically connected to the first coil, and surrounds the first coil and one or both of the first connection contact and the second connection contact. | 10-24-2013 |
20130278373 | COIL UNIT, SUBSTRATE UNIT AND POWER SUPPLY DEVICE - In the coil unit | 10-24-2013 |
20130278374 | COIL ASSEMBLY COMPRISING PLANAR COIL - Coil assembly ( | 10-24-2013 |
20130285785 | LOW TEMPERATURE CO-FIRED CERAMIC DEVICE AND A METHOD OF MANUFACTURING THEREOF - The invention relates to a low temperature co-fired ceramic (LTCC) device comprising a first dielectric layer having a first electrode, a second dielectric layer having a second electrode, wherein the first dielectric layer and the second dielectric layer are arranged so that the first electrode and the second electrode overlap with each other to form a coupled structure, wherein the two electrodes are asymmetric in configuration, with the first electrode being smaller than the second electrode in at least one dimension. The invention also relates to a method in preparing such a LTCC composition. | 10-31-2013 |
20130293336 | THREE-DIMENSIONAL MULTILAYER SOLENOID TRANSFORMER - This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another. | 11-07-2013 |
20130293337 | HIGH QUALITY FACTOR PLANAR INDUCTORS - This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spacer may be a line of metal formed as a planar inductor in the shape of the planar spiral coil. The spacer may be between the line of metal and the surface of the substrate. The spacer may elevate the line of metal above the surface of the substrate. | 11-07-2013 |
20130293338 | CIRCUIT PROTECTION DEVICE - The present invention relates to a circuit protection device and provides a circuit protection device comprising a laminate having a plurality of sheets laminated; a magnetic core provided within the laminate; a coil provided within the laminate and configured to wind vertically and to wrap the magnetic core; an ESD protection unit provided within the laminate and connected to the coil; first and second projecting electrodes connected to the coil and the ESD protection unit, respectively, and projected to be exposed to an outside of the laminate; and first and second external electrodes provided on the laminate and connected to the first and second projecting electrodes, respectively. | 11-07-2013 |
20130293339 | CHIP-TYPE COIL COMPONENT - The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired. | 11-07-2013 |
20130314192 | INDUCTOR WITH STACKED CONDUCTORS - A thin film coupled inductor, a thin film spiral inductor, and a system that includes an electronic device and a power supply or power converter incorporating one or more such inductors. A thin film coupled inductor includes a wafer substrate; a bottom yoke comprising a magnetic material above the wafer substrate; a first insulating layer above the bottom yoke; a first conductor above the bottom yoke and separated therefrom by the first insulating layer; a second insulating layer above the first conductor; a second conductor above the second insulating layer; a third insulating layer above the second conductor; and a non-planar top yoke above the third insulating layer, the top yoke comprising a magnetic material. | 11-28-2013 |
20130314193 | CHIP INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a chip inductor and a method of manufacturing the same. The chip inductor includes: a laminate in which a magnetic sheet having a C-pattern electrode formed thereon and a magnetic sheet having an I-pattern electrode formed thereon are alternately laminated; a via penetrating through the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; and an external electrode terminal provided at either side portion of the laminate. | 11-28-2013 |
20130314194 | LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF - A laminated inductor element is configured to prevent warpage of the entire element with a structure in which a non-magnetic ferrite layer on an upper surface side is reduced in thickness to achieve a reduction in height of the entire element, a non-magnetic ferrite layer on a lower surface side is increased in thickness to be thicker than the non-magnetic ferrite layer so as to prevent a metal component diffused from a magnetic ferrite layer from coming into electrical contact with a land electrode of a mounting substrate, and an inductor is disposed toward the lower surface side across a non-magnetic ferrite layer. | 11-28-2013 |
20130321115 | MULTILAYERED-TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered-type inductor including: a body in which a plurality of sheets are multilayered; and a plurality of internal electrode patterns formed on respective sheets and connected to each other by a conductive via, wherein the plurality of internal electrode patterns include first and second internal electrode patterns having different internal diameters such that they do not overlap each other on respective sheets in a thickness direction of the body, and alternately disposed in the thickness direction of the body. | 12-05-2013 |
20130321116 | INTEGRATED CIRCUIT BASED TRANSFORMER - An integrated circuit based transformer, comprising: a primary winding located in a winding layer, the primary winding having two primary terminals at a first side of the transformer; a secondary winding located in a winding layer, the secondary winding having two secondary terminals at a second side of the transformer, the first and second sides located at different sides of the transformer; and a reference bar located in a reference bar layer, the reference bar having a primary reference bar terminal at the first side of the transformer, and having a secondary reference bar terminal at the second side of the transformer. The reference bar is configured to provide a direct electrical connection between the first reference bar terminal and the second reference bar terminal. | 12-05-2013 |
20130321117 | PLANAR TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - A planar transformer for preventing resin being coated from being separated from a conductor during the manufacturing of a transformer by forming a dummy pattern on a board includes: a core part having a pair of cores electromagnetically coupled to each other; a board part having a plurality of boards disposed between the pair of cores and stacked upon one another; a pattern part having a power transmission pattern provided on at least one board of the plurality of boards of the board part and transmitting power being input, and a dummy pattern provided on the same board having the power transmission pattern thereon and separated from the power transmission pattern by a predetermined interval; and a resin part being coated over the at least one board of the plurality of boards, the at least one board having the pattern part thereon. | 12-05-2013 |
20130328655 | TRANSFORMER WITH PLANAR PRIMARY WINDING - A transformer, such as a current sense transformer, in which conductive traces disposed within a printed circuit board serve as the primary winding of the transformer. The transformer also includes a secondary winding, for example wound around a hollow pin of a bobbin, through which a leg of a magnetic core is disposed. The magnetic core leg, and in some embodiments also all or a part of the secondary winding, is inserted into a through-hole in the printed circuit board that is surrounded by the primary winding traces. | 12-12-2013 |
20130335184 | MULTI-LAYERED CHIP ELECTRONIC COMPONENT - There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern. | 12-19-2013 |
20130335185 | MULTI-LAYERED CHIP ELECTRONIC COMPONENT - There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1≦Ts:Te≦0.3 is satisfied. | 12-19-2013 |
20130335186 | ELECTROMAGNETIC COMPONENT AND FABRICATION METHOD THEREOF - An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques. | 12-19-2013 |
20130342301 | INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRING BOARD - An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure. | 12-26-2013 |
20140002225 | SPIRAL NEAR FIELD COMMUNICATION (NFC) COIL FOR CONSISTENT COUPLING WITH DIFFERENT TAGS AND DEVICES | 01-02-2014 |
20140002226 | INDUCTOR AND METHOD OF MANUFACTURING THE SAME | 01-02-2014 |
20140002227 | MAGNETIC DEVICE AND METHOD OF MANUFACTURING THE SAME | 01-02-2014 |
20140002228 | MAGNETIC ELEMENT FOR WIRELESS POWER TRANSMISSION AND METHOD FOR MANUFACTURING SAME | 01-02-2014 |
20140022042 | CHIP DEVICE, MULTI-LAYERED CHIP DEVICE AND METHOD OF PRODUCING THE SAME - There is provided a multi-layered chip device, including: a multi-layered body in which a plurality of inner magnetic layers are stacked; an inner electrode layer formed within the multi-layered body; an outer magnetic layer stacked on at least one of an upper surface and a lower surface of the multi-layered body; and external electrodes formed on outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer, wherein a length of the outer magnetic layer is shorter than the inner magnetic layer. | 01-23-2014 |
20140028430 | MULTILAYER INDUCTOR AND PROTECTING LAYER COMPOSITION FOR MULTILAYER INDUCTOR - Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability. | 01-30-2014 |
20140043130 | PLANAR ELECTRONIC DEVICE - A planar electronic device includes top conductors on a top side of a planar substrate connected to conductive vias and defining top conductor groups and bottom conductors on a bottom side connected to corresponding vias and defining bottom conductor groups. The conductors and vias define primary and secondary conductive loops with the top conductor group including at least one primary top conductor and at least one secondary top conductor and with the bottom conductor group including at least one primary bottom conductor and at least one secondary bottom conductor. The top conductors within each group have substantially similar layouts that are different from layouts of the immediately adjacent groups, and the bottom conductors within each group have substantially similar layouts that are different from layouts of the immediately adjacent groups. | 02-13-2014 |
20140043131 | PLANAR ELECTRONIC DEVICE - A planar electronic device includes a planar substrate having a cavity configured to receive a ferrite material body therein. The planar substrate has an upper side and a lower side and conductive vias extending through the substrate. Top conductors are provided on the upper side of the planar substrate and are electrically connected to corresponding conductive vias. Bottom conductors are provided on the lower side of the planar substrate and are electrically connected to corresponding conductive vias. The bottom conductors, top conductors and conductive vias define a primary conductive loop and a secondary conductive loop. An upper cover layer covers the upper side and has a high permittivity. The upper cover layer is positioned relative to the top conductors to increase capacitance between the primary and secondary loops. | 02-13-2014 |
20140049350 | METHOD OF PRODUCING AN INDUCTOR WITH A HIGH INDUCTANCE - A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer. | 02-20-2014 |
20140062643 | MULTI-LAYERED CHIP ELECTRONIC COMPONENT - There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40≦Ai:Ao≦1.03 is satisfied. | 03-06-2014 |
20140062644 | THIN FILM TYPE COMMON MODE FILTER - Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained. | 03-06-2014 |
20140070915 | ELECTRONIC SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - An electronic substrate including: a base substrate having an active face and a rear face; and a plurality of inductor elements formed on or above the active face, or formed on or above the rear face. | 03-13-2014 |
20140070916 | METAL POWDER AND ELECTRONIC COMPONENT - Metal powder has composite particles each coated with a Zn-based ferrite film not containing Ni. | 03-13-2014 |
20140077917 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - An electronic component having a laminate formed by laminating a plurality of insulator layers and a helical coil provided in the laminate, the coil including first and second coil conductors, and via-hole conductors provided so as to pierce through the insulator layers. The first and second coil conductors are opposed to each other via the insulator layers in a direction of lamination. The first coil conductor has a first side opposed to the second coil conductor and having a convex portion in a cross section normal to a direction in which the first coil conductor extends. The second coil conductor has a second side opposed to the first coil conductor and has a concave portion in a cross section normal to a direction in which the second coil conductor extends. The concave portion overlaps the convex portion in the direction of lamination. | 03-20-2014 |
20140085031 | PLANAR LITZ WIRE COIL AND METHOD OF MAKING SAME - Several embodiments of a circuit device using principles of planar Litz wire construction are disclosed using flexible printed circuit boards on which a given set of conductors is located on one surface only. The FPCBs are folded at strategic locations to effectively cause conductors in adjacent parallel planes to effectively cross one another to realize the advantages of braided Litz wire conductors, but without the use of vias or circuit interconnections between opposite sides of any given FPCB or between different sections of a continuous FPCB wherein each section defines its own coil or coil set. | 03-27-2014 |
20140085032 | PLANAR MAGNETIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A planar magnetic component and a method for manufacturing the same are provided. The planar magnetic component includes a substrate, a first conductor layer and a magnetic structure; wherein the first conductor layer is disposed on a first surface of the substrate, and the magnetic structure penetrates the first conductor layer and is embedded in the substrate. The magnetic structure includes a ferromagnetic material layer and at least one first hard protective layer disposed on a first surface of the ferromagnetic material layer, which could prevent the ferromagnetic material layer from breaking in a pressing process. | 03-27-2014 |
20140085033 | PLANAR MAGNETIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A planar magnetic component and a method for manufacturing the same are provided. The planar magnetic component includes a substrate and a magnetic structure embedded in the substrate; wherein the magnetic structure includes a ferromagnetic material layer and at least one first hard protective layer disposed on a first surface of the ferromagnetic material layer to prevent the ferromagnetic material layer from being breaking in a pressing process. | 03-27-2014 |
20140085034 | THERMO/ELECTRICAL CONDUCTOR ARRANGEMENT FOR MULTILAYER PRINTED CIRCUIT BOARDS - The present invention relates to a thermo/electrical conductor arrangement for multilayer printed circuit boards (PCBs). Using vias for the transport of heat from the interior of the PCB and for conducting high currents between the conducting layers have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin of a current conductive material (such as copper) into the via so that the pin is brought into galvanic contact with the conducting layers in the PCB and where at least one end of the pin is freely protruding from the PCB thereby allowing the pin to conduct heat from the interior of the PCB to the protruding end of the pin for external cooling. | 03-27-2014 |
20140091892 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor. | 04-03-2014 |
20140097926 | INDUCTION DEVICE - The induction device includes a magnetic core and a coil. The coil is formed around the magnetic core by laminating and electrically connecting together a plurality of multilayer wiring boards. Each multilayer wiring board has a hole through which the magnetic core is inserted. Each multilayer wiring board includes a first outer conductor, an inner conductor and a second outer conductor that are laminated together with an insulating layer disposed between the first outer conductor and the inner conductor and also the insulating layer disposed between the inner conductor and the second outer conductor. The first outer conductor, the inner conductor and the second outer conductor are formed around the hole of the multilayer wiring board. The first outer conductor and the second outer conductor are connected to the inner conductor. | 04-10-2014 |
20140097927 | LAMINATED COIL COMPONENT - A laminated coil component includes a magnetic body part made of a Ni—Zn-based ferrite material and a coil conductor containing Cu as a main component, which is wound into a coil shape, and the coil conductor is embedded in the magnetic body part to form a component base. The component base is divided into a first region near the coil conductor and a second region other than the first region. The grain size ratio of the average crystal grain size of the magnetic body part in the first region to the average crystal grain size of the magnetic body part in the second region is 0.85 or less. The molar content of CuO in the ferrite raw material is set to 6 mol % or less, and firing is performed in a reducing atmosphere in which the oxygen partial pressure is an equilibrium oxygen partial pressure of Cu—Cu | 04-10-2014 |
20140104027 | FILTER FOR REMOVING NOISE - The present invention discloses a filter for removing noise, which includes: a lower magnetic body; primary and secondary patterns spirally provided on the lower magnetic body in parallel to each other; an insulating layer for covering the primary and secondary patterns; and an upper magnetic body provided on the insulating layer, wherein the primary and secondary patterns are formed to have a ratio of vertical thickness (T) to horizontal width (W) of 0.27≦T/W≦2.4. According to the present invention, it is possible to improve performance and capacity by implementing high common-mode impedance in the same frequency and reduce manufacturing costs by simplifying structures and processes. | 04-17-2014 |
20140104028 | PLANAR TRANSFORMERS HAVING REDUCED TERMINATION LOSSES - The present disclosure relates to planar transformers including a plurality of circuit layers that are configured to reduce termination losses on at least one of the plurality of circuit layers. The plurality of circuit layers are stacked together in a first direction and include at least first and second circuit layers. The first and second circuit layers each include an electrically conductive trace forming at least one winding having a first termination portion and a second termination portion that are separated by a gap. The gaps of the first and second circuit layers are offset relative to each other in a second direction different from the first direction. The plurality of circuit layers may further include a third circuit layer, which includes an electrically conductive trace having a grounded portion that is disposed adjacent to at least one of the gaps of the first and second circuit layers. | 04-17-2014 |
20140104029 | Micromagnetic Device and Method of Forming the Same - A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device. | 04-17-2014 |
20140118100 | LAMINATED COIL COMPONENT - In the laminated coil component, the grain diameter of the coil conductors is 10 μm to 22 μm after baking is completed. When the grain diameter of the coil conductors is set to be 10 μm or larger after baking is completed, surface roughness of the coil conductors can be reduced to such an extent that a satisfactory Q value can be obtained at a high frequency. In addition, when the grain diameter of the coil conductors is set to be 22 μm or smaller after baking is completed, metal of the coil conductors can be refrained from being rapidly melted down during baking. Accordingly, a high Q value can be obtained while a high quality is ensured. | 05-01-2014 |
20140125445 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a common mode filter and a method of manufacturing the same. The common mode filter includes: a primary coil that includes a primary coil body forming a plane in a vortex structure; and a secondary coil that includes a secondary coil body forming a co-plane in the same vortex structure as the primary coil body and forms a 180° rotational symmetry with the primary coil body, having the same length, width, and turn number as the primary coil body. Further, the method of manufacturing a common mode filter is proposed. | 05-08-2014 |
20140132385 | MULTILAYER CHIP INDUCTOR AND PRODUCTION METHOD FOR SAME - A group of magnetic sheets are stacked and connected via through-holes, on each of which magnetic sheets a circling pattern having connection parts at its corners and ends is formed to form a spiral coil pattern. Leader patterns each have a leader part formed at a position not overlapping with the circling parts of the coil pattern and connected to an external terminal electrode, as well as two connection parts that continue to the leader part and are formed at positions corresponding to the connection parts of the circling patterns, together with a cutout formed between the two connection parts. Magnetic sheets with the leader patterns are provided at the top and bottom of the laminate forming the coil pattern. The multilayer chip inductor can suppress decrease in core area caused by displacement due to the stacking | 05-15-2014 |
20140132386 | Method for Producing a Coil and Electronic Device - The invention relates to a method for producing a coil ( | 05-15-2014 |
20140132387 | MULTILAYERED POWER INDUCTOR AND METHOD FOR PREPARING THE SAME - Disclosed herein are a multilayered power inductor including an inner electrode coil pattern formed on a ceramic substrate; an outer electrode layer; and a magnetic layer made of a metal powder insulated along a grain interface of the metal powder included in a part or the whole of a chip, and a method for preparing the same. According to the exemplary embodiments of the present invention, the magnetic layer made of the metal powder insulation-coated with the ceramic material along the grain interface of the magnetic metal powder can be used for a part or the whole of the chip, thereby increasing the filling ratio of the magnetic metal powder to 90% within the magnetic layer. Therefore, a high-capacity power inductor can be implemented to effectively improve efficiency characteristics. | 05-15-2014 |
20140139308 | MULTILAYER COIL COMPONENT - Disclosed herein is a multilayer coil component, in which a copper-nickel mixture is used for an internal electrode, to form a nickel and ferrite mixed region at an interface between the internal electrode layer and a ceramic layer, thereby interrupting contact between the ceramic layer and the internal electrode, so that insulation resistance, which may be generated between the two materials can be increased and thus the deterioration in the characteristics of the multilayer coil component can be prevented. | 05-22-2014 |
20140139309 | MULTILAYER COIL COMPONENT - Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved. | 05-22-2014 |
20140139310 | WIRING BOARD - This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface. | 05-22-2014 |
20140145812 | MULTILAYER INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured. | 05-29-2014 |
20140145813 | PLANAR HIGH VOLTAGE TRANSFORMER - A planar high voltage transformer comprising a magnetic core, a primary winding, a secondary winding, and an insulating plate is provided, wherein the secondary winding comprises a plurality of secondary winding printed circuit boards each having a secondary coil distributed thereon. | 05-29-2014 |
20140145814 | THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer. | 05-29-2014 |
20140145815 | LAMINATED INDUCTOR - A laminated inductor includes a component body that provides a mounting surface on one of its faces, and at least a pair of external electrodes are formed on the mounting surface, wherein the component body has a laminate constituted by multiple insulator layers, a spiral coil conductor formed in the laminate, and leader parts that electrically connect the coil conductor and external electrodes; the coil conductor comprises conductor patterns formed in the insulator layers and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, and also has a coil axis running roughly in parallel with the mounting surface and a turn unit having one or more sides running roughly in parallel with the mounting surface; and the via hole conductors are formed only on the side farthest away from the mounting surface among the one or more sides. | 05-29-2014 |
20140159850 | INDUCTOR FORMED IN SUBSTRATE - A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate. | 06-12-2014 |
20140159851 | INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND PRINTED WIRING BOARD - An inductor device has a core base, and an inductor structure including a first conductive pattern formed on a first surface side of the core base, a second conductive pattern formed on a second surface side of the core base on the opposite side with respect to the first surface side of the core base, and a through-hole conductor formed through the core base such that the through-hole conductor is connecting the first conductive pattern and the second conductive pattern. The core base includes a magnetic material layer including a magnetic material, and the magnetic material layer of the core base is positioned adjacent to at least a portion of the periphery of the inductor structure. | 06-12-2014 |
20140167901 | PLANAR TRANSFORMER - A multi-layered printed circuit board, PCB, includes first windings for a first side of a planar magnetic transformer and second windings for a second side of the planar magnetic transformer. The PCB further includes conductive layers configured as the first windings, conductive layers configured as the second windings, and layers of an isolation material. Each layer of the isolation material is arranged between two conductive layers to provide electrical isolation between the two conductive layers. A group of two or more adjacent conductive layers are all conductive layers of the first windings and are all arranged between two conductive layers of the second windings. The thickness of the isolation material between the group of adjacent conductive layers of the first windings is less than the thickness of the isolation material between a conductive layer of the second windings and a conductive layer of the first windings. | 06-19-2014 |
20140176281 | ELECTROMAGNETIC INDUCTION MODULE FOR WIRELESS CHARGING ELEMENT AND METHOD OF MANUFACTURING THE SAME - There is provided an electromagnetic induction module for a wireless charging element, including a laminate formed by laminating magnetic sheets, each magnetic sheet including magnetic particles and having a groove portion of a coil pattern formed in one surface thereof, and a coil disposed in the groove portion. | 06-26-2014 |
20140176282 | ELECTROMAGNETIC INDUCTION MODULE FOR WIRELESS CHARGING ELEMENT AND METHOD OF MANUFACTURING THE SAME - There is provided an electromagnetic induction module for a wireless charging element, including a laminate formed by laminating magnetic sheets, each magnetic sheet including magnetic particles and having a groove portion of a coil pattern formed in one surface thereof, a coil disposed in the groove portion and having a spiral shape and 2 or more turns, and a cover sheet laminated on an upper surface, a lower surface, or both surfaces of the laminate. | 06-26-2014 |
20140176283 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a common mode filter for increasing inductance using simpler structure and a method of manufacturing the same, the common mode filter including: a magnetic material substrate; an insulating layer included on an upper portion of the magnetic material substrate and having a coil electrode formed therein; an opening part penetrating through a central portion of the insulating layer; and a magnetic composite formed in the opening part, wherein the opening part has a side wall inclined at a predetermined angle. | 06-26-2014 |
20140176284 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method. | 06-26-2014 |
20140176285 | FERRITE CERAMIC COMPOSITION, CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a magnetic section composed of a ferrite material and a coil conductor containing Cu as its main constituent. The magnetic section is formed from Ni—Cu—Zn ferrite which falls within the range specified by (x, y)=A (25, 1), B (47, 1), C (47, 7.5), D (46, 7.5), E (46, 10), F (30, 10), G (30, 7.5), and H (25, 7.5) when the molar content x of Fe | 06-26-2014 |
20140176286 | FERRITE CERAMIC COMPOSITION, CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - A coil conductor and a via electrode placed away from the coil conductor are embedded in a magnetic layer. The magnetic layer is sandwiched between a pair of non-magnetic layers. The coil conductor and the via electrode are formed from a conductive material containing Cu as its main constituent, and the magnetic layer is formed from Ni—Mn—Zn ferrite where the CuO molar content is 5 mol % or less, and (x, y) falls within the range of A (25, 1), B (47, 1), C (47, 7.5), D (45, 7.5), E (45, 10), F (35, 10), G (35, 7.5), and H (25, 7.5) when the molar content x of Fe | 06-26-2014 |
20140176287 | LAMINATED COMMON MODE CHOKE COIL AND HIGH FREQUENCY COMPONENT - A primary coil is configured by series connection of a first coil element (L | 06-26-2014 |
20140184376 | ELECTRONIC COMPONENT - An electronic component including a substrate, an insulating unit provided on the substrate, and a conductor coil provided within the insulating unit, wherein a distance from the outermost portion of the conductor coil in one axial direction to the outermost portion of the substrate in one axial direction is greater than 0.0125 times a length of the substrate in one axial direction, thus having enhanced reliability. | 07-03-2014 |
20140184377 | INDUCTOR - Disclosed herein is an inductor including: a substrate; an insulating part provided on the substrate; and a conductive pattern part provided in the insulating part, wherein the insulating part includes first and second insulating parts that are provided at regions physically separated from each other, the first and second insulating parts being made of materials of which at least one of dielectric constant and heat resistance are different. In the inductor according to the present invention, high Q and L values may be implemented, and deformation by heat treatment may also be decreased, thereby making it possible to improve reliability. | 07-03-2014 |
20140191837 | COIL ELEMENT AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a coil element including a ceramic body and an internal electrode coil pattern formed on the ceramic body, wherein the ceramic body includes NiZnMn ferrite and the internal electrode coil pattern uses copper, and a method for manufacturing the same. | 07-10-2014 |
20140191838 | COMMON MODE NOISE FILTER AND PRODUCTION METHOD THEREFOR - A common mode noise filter includes a first insulating layer, a first coil conductor on an upper surface of the first insulating layer, a second coil conductor on a lower surface of the first insulating layer, a second insulating layer on the upper surface of the first insulating layer to cover the first coil conductor, a third insulating layer on a lower surface of the second insulating layer to cover the second coil conductor. The first insulating layer contains glass and inorganic filler, and contains pores dispersed therein. The second insulating layer covers the first coil conductor, contains glass and inorganic filler, and contains pores dispersed therein. The third insulating layer covers the second coil conductor, contains glass and inorganic filler, and contains pores dispersed therein. This common mode noise filter has excellent high-frequency characteristics at a high yield rate. | 07-10-2014 |
20140197916 | INDUCTOR DESIGN WITH METAL DUMMY FEATURES - Techniques are disclosed for enhancing performance of integrated or on-chip inductors by implementing a schema of conductive metal dummies in the design thereof. In some cases, a metal dummy schema may be disposed in a layer proximate an upper surface of the inductor. The techniques may be implemented to improve overall inductor performance while enabling area scaling effects such as shrinking of inductor-to-inductor spacing on a die and/or increasing the quantity of inductors that may be manufactured on a die. In some cases, conductive metal dummies may be disposed in a region of minimal or non-peak magnetic field relative to the inductor, orthogonal to current flow in the inductor, and/or so as to minimize their occupation of the overall area of the inductor. The techniques may be implemented in analog circuits such as inductor-capacitor phase-locked loops (LC-PLLs), high-volume architectures, processor microarchitectures, applications involving stringent jitter requirements, microprocessor clocking, and wireless communication systems. | 07-17-2014 |
20140197917 | LAMINATED COIL COMPONENT AND METHOD FOR MANUFACTURING SAME - A laminated coil component that has DC superimposition characteristics improved without causing an increase in direct-current resistance, and reduces stress which can be generated in a magnetic body. A laminated coil component includes a magnetic section of magnetic layers stacked and a conductor section which has a plurality of conductor pattern layers arranged between the magnetic layers, and interconnected in a coiled shape to pass through the magnetic layers, and which is buried in the magnetic section. The conductor section is composed of a conductor containing silver. The magnetic section is of a sintered ferrite material containing Fe | 07-17-2014 |
20140197918 | TRANSFORMER USING SYMMETRICAL PRINTING PATTERN - Disclosed is a transformer using a symmetrical printing pattern which includes: a substrate; a plurality of first printing lines printed at predetermined distances on the substrate; a plurality of second printing lines printed at predetermined distances on the substrate; first bonding wires connecting the first printing lines; and second bonding wires connecting the second printing lines, in which the first printing lines and the second printing lines are printed in a symmetrical printing pattern, respectively, on the substrate, and the first bonding wires and the second bonding wires are formed symmetrically, respectively. | 07-17-2014 |
20140232502 | FLEXIBLE SUBSTRATE INDUCTIVE APPARATUS AND METHODS - Flexible substrate inductive apparatus and methods for manufacturing, and utilizing, the same. In one embodiment, the flexible substrate inductive device includes a square shaped ferrite core having four (4) portions of flexible substrate disposed thereon. The disposal of the conductive traces onto the substrate utilizes highly controlled manufacturing processes such that the characteristics of the device, including the spacing and pitch of the windings, can be accurately controlled. The accurate placement of these conductive traces produces an inductive device with highly consistent performance capabilities as compared with traditional wire wound inductive devices. In addition to the performance capabilities provided via the use of flexible substrates utilizing highly automated processes, the flexible substrate inductive devices disclosed herein minimize/eliminate errors associated with traditional wire wound inductive devices. | 08-21-2014 |
20140232503 | FLEXIBLE SUBSTRATE INDUCTIVE APPARATUS AND METHODS - Flexible substrate inductive apparatus and methods for manufacturing, and utilizing, the same. In one embodiment, the flexible substrate inductive device is formed from a planar surface and has a plurality of conductive traces printed thereon. These conductive traces can be used as, for example, an inductor or when formed using multiple windings such as a primary and a secondary winding, as a transformer. The use of the flexible substrate as an inductive device is accomplished via the incorporation of slots within the substrate which allows the conductive traces to be formed and routed around, for example, a magnetically permeable core. Methods of using and manufacturing the aforementioned flexible substrate inductive devices are also disclosed. | 08-21-2014 |
20140232504 | ELECTRONIC COMPONENT - An electronic component having a laminate having a plurality of insulator layers. A coil is provided consisting of a plurality of coil conductors that are connected by via-conductors piercing through the insulator layers, the coil winding helically about an axis along a direction of lamination. External electrodes are provided on surfaces of the laminate, in which at least some pairs of the coil conductors that neighbor each other with one of the insulator layers provided therebetween have parallel sections that overlap each other when viewed in the direction of lamination. The parallel sections are connected in parallel by the via-conductors or the external electrodes, and each pair of the coil conductors that neighbor each other with one of the insulator layers provided therebetween do not overlap each other when viewed in the direction of lamination, except for the parallel sections, and connections between the coil conductors and the via-conductors. | 08-21-2014 |
20140240071 | 3D PRINTED INDUCTOR - An apparatus with an inductor having a conductive loop perpendicular to a metalization plane of a substrate. The conductive loop has an upper element and lower element both parallel to the metalization plane that are connected with a via. | 08-28-2014 |
20140240072 | VERTICAL-COUPLING TRANSFORMER WITH AN AIR-GAP STRUCTURE - In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure. | 08-28-2014 |
20140247102 | MULTILAYER COIL AND A MANUFACTURING METHOD THEREOF - A multilayer coil having a laminate body having a plurality of insulating layers including a specified insulating layer. A linear coil conductor is substantially looped on the specified insulating layer. An insertion is located on the specified insulating layer, in a position between a first part and a second part of the coil conductor. The first part and the second part are closest parts to each other in the coil conductor. Along a boundary surface between the first part of the coil conductor and the insertion, the first part is located at an upper side of the coil conductor with respect to a stacking direction. | 09-04-2014 |
20140247103 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT - An electronic component capable of preventing the occurrence of magnetic saturation due to a magnetic flux surrounding each coil conductor and a method of manufacturing the electronic component are provided. The electronic component includes a laminate formed by stacking unit layers, where each unit layer includes a first insulating layer, and a coil conductor and second insulating layer formed on the first insulating layer. Each second insulating layer has a Ni content greater than a Ni content of each first insulating layer. Portions of the first insulating layers have a Ni content lower than a Ni content of the second portions after the laminate is calcined. | 09-04-2014 |
20140247104 | Method For Making Magnetic Components With M-Phase Coupling, And Related Inductor Structures - An M phase coupled inductor includes a magnetic core including a first end magnetic element, a second end magnetic element, and M legs disposed between and connecting the first and second end magnetic elements. M is an integer greater than one. The coupled inductor further includes M windings, where each winding has a substantially rectangular cross section. Each one of the M windings is at least partially wound about a respective leg. | 09-04-2014 |
20140253276 | LAMINATED INDUCTOR - A laminated inductor having a laminate formed by laminating a plurality of insulator layers. A plurality of inductive conductor layers are provided in the laminate and connected in parallel. In a cross section perpendicular to a direction in which a current passes through the inductive conductor layers, a combined cross-sectional shape of the inductive conductor layers constitutes an ellipse as a whole. | 09-11-2014 |
20140253277 | ELECTRONIC COMPONENT - A laminate formed by laminating a plurality of insulator layers. First coil conductors are provided in the laminate winding in a predetermined direction when viewed in a plan view in a direction of lamination. Second coil conductors are provided in the laminate on one side in the direction of lamination relative to the first coil conductors, winding in the predetermined direction when viewed in a plan view in the direction of lamination. First via-hole conductors connect downstream ends of the first parallel portion in the predetermined direction. Second via-hole conductors connect downstream ends of the second parallel portions in the predetermined direction. A third via-hole conductor connects the farthest of the first coil conductors on one side to the farthest of the second coil conductors on the other side in the direction of lamination. The first through third via-hole conductors are not connected in a series. | 09-11-2014 |
20140266542 | Programmable Inductor - A system and method for providing and programming a programmable inductor is provided. The structure of the programmable inductor includes multiple turns, with programmable interconnects incorporated at various points around the turns to provide a desired isolation of the turns during programming. In an embodiment the programming may be controlled using the size of the vias, the number of vias, or the shapes of the interconnects. | 09-18-2014 |
20140266543 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure. | 09-18-2014 |
20140266544 | HIGH Q FACTOR INDUCTOR STRUCTURE - The present disclosure provides a vertical inductor structure in which the magnetic field is closed such that the magnetic field of the vertical inductor structure is cancelled in the design direction outside the vertical inductor structure, yielding a small, or substantially zero, coupling factor of the vertical inductor structure. In one embodiment, several vertical inductor structures of the present disclosure can be placed in close proximity to create small resonant circuits and filter chains. | 09-18-2014 |
20140266545 | COMMON MODE CHOKE COIL - A common mode choke coil exhibiting greater reliability against moisture load includes a nonmagnetic layer made of glass, magnetic layers placed in a manner sandwiching the nonmagnetic layer, and two or more coil conductors embedded in a base material constituted by the nonmagnetic layer and magnetic layers, wherein Mg segregation is present in the nonmagnetic layer and the Mg segregation accounts for 0.5 to 16 percent of the total area as observed on an electron micrograph of a section of the nonmagnetic layer, while the size of Mg segregation is preferably 0.2 to 10 μm. | 09-18-2014 |
20140266546 | High Density Packaging for Efficient Power Processing with a Magnetic Part - A package comprises a substrate with a plurality of metal tracks, a via hole formed in the substrate, wherein the sidewall of the via hole is partially plated and the via hole is filled with a magnetic material, and a first winding magnetically coupled to the via hole. | 09-18-2014 |
20140266547 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component includes a first conductor layer including a first conductor pattern P | 09-18-2014 |
20140266548 | SHEET FORMED INDUCTIVE WINDING - Systems and methods for creating an inductive element are disclosed. Multiple partial windings may be created relative to a core, where each of the partial windings is initially discontinuous. Multiple printed conductors may be created on a substrate, where the multiple printed conductors are arranged to electrically connect the multiple partial windings. The multiple partial windings may be electrically connected to the multiple printed conductors to create a complete winding around the core. | 09-18-2014 |
20140266549 | PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion. | 09-18-2014 |
20140266550 | SOLDERABLE PLANAR MAGNETIC COMPONENTS - An inductive component having a printed circuit board (“PCB”) with a first side and a second side. An aperture extends through the PCB and a conductive winding is printed onto the PCB surrounding the aperture. A core is formed by a first core member and a second core member. The first core member includes a first base member with at least one joining surface which is solderable to the first side. A first core leg extends at least partially through the aperture. The second core member includes at least a second base member and is coupled to the first core member or the second side. To manufacture the PCB, the first core member is soldered to the first side and then the PCB is inverted. The second core member is then coupled to at least one of the first core member or the second side. | 09-18-2014 |
20140266551 | STACK-TYPE INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME - A stack-type inductor element includes a stack including a magnetic element layer, a coil-shaped conductor pattern provided in the stack, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack and symmetric to the plurality of first pad electrodes. The stack is rectangular or substantially rectangular when viewed in a direction of stack of the stack. A first end and a second end of the coil-shaped conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open. | 09-18-2014 |
20140285304 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is an inductor including: a core layer having a conductive pattern formed on a surface thereof and having a through-hole formed at a region in which the conductive pattern is not formed; and a magnetic layer covering the core layer, wherein the magnetic layer includes: a filled part filled in the through-hole and having high magnetic material filling density; and a cover part covering the surface of the core layer and having magnetic material filling density lower than that of the filled part. | 09-25-2014 |
20140285305 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process. | 09-25-2014 |
20140285306 | ELECTRONIC COMPONENT - In an electronic component, a multilayer body is formed by a plurality of stacked insulator layers. A coil includes at least one coil conductor layer provided on at least one of the insulator layers. External electrodes are embedded in a lateral surface of the multilayer body which is formed by a series of continuous perimeter edges of the plurality of insulator layers, and includes a plurality of stacked external conductor layers provided on the plurality of insulator layers. The external electrodes have different shapes. The external conductor layers and the first coil conductor, which are provided on the same insulator layer, are simultaneously formed by photolithography or printing. | 09-25-2014 |
20140285307 | COIL COMPONENT - A coil component is provided with a first magnetic substrate, a laminate body, and a second magnetic substrate. A coil is formed inside the laminate body. In the coil, a plurality of coil patterns provided on one surface of an insulation layer and a plurality of coil patterns provided on the other surface of the insulation layer are connected at multiple locations through vias. The coil patterns are configured in such a manner that a portion which is in contact with each via has a wider width widened with equal size from the center of a coil pattern to both sides thereof in the width direction, and a portion which is adjacent to the portion having the wider width across a gap has a narrower width (s) narrowed with equal size from the center of the coil pattern to both sides thereof in the width direction. | 09-25-2014 |
20140292468 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME - A laminated electronic component whose internal electrode has sufficient cross-section area to achieve lower resistance, while also achieving a narrower pitch to accommodate more windings, is manufactured by forming a resist film on a conductive base plate; forming an opening of specified pattern in the resist film by photolithography; filling a conductor in the opening, by plating, to a level lower than the height of the resist film to form a conductor pattern; removing the resist film; transferring the conductor pattern from the base plate onto an insulation sheet; and laminating pattern-transferred insulation sheets obtained as above and then heating to obtain insulator layers from the insulation sheet, while obtaining internal electrodes from the conductor patterns. | 10-02-2014 |
20140292469 | POWER INDUCTOR AND MANUFACTURING METHOD THEREOF - Disclosed herein is a power inductor including: an opening part penetrating through the insulating layer; an upper coil electrode pattern formed on an upper surface of the insulating layer and having a form in which it is wound around the opening part; a lower coil electrode pattern formed on a lower surface of the insulating layer and having a form in which it is wound around the opening part; and metal layers plated on a surface of the innermost pattern of the upper coil electrode pattern and a surface of the innermost pattern of the lower coil electrode pattern, wherein the metal layers plated on the surfaces of the innermost patterns of the upper and lower coil electrode patterns are extended to an inner wall of the opening part to thereby be connected to each other. | 10-02-2014 |
20140292470 | LAMINATED INDUCTOR - A laminated inductor includes: a laminate having an insulating part constituted by non-magnetic layers, as well as a coil part constituted by conductors positioned between the non-magnetic layers; and external electrodes that are electrically connected to the ends of the coil part and positioned on the exterior surfaces of the laminate; wherein the external electrodes each have a first electrode layer whose primary constituent is Ag, as well as a second electrode layer whose primary constituent is Cu and which is positioned on the outer side of the first electrode layer and has a thickness of 4 μm or more, and the total thickness of the first electrode layer and second electrode layer is 5 μm or more and preferably 10 μm or less. | 10-02-2014 |
20140300442 | PLANAR CORE-TYPE UNIFORM EXTERNAL FIELD EQUALIZER AND FABRICATION - A device is disclosed to include: a first set of windings and a second set of windings that are formed in a printed wiring board (PWB) and that are to be magnetically coupled, wherein upon receiving an applied voltage, the first set of windings generates a first uniform external field and induces the second set of windings to generate a second uniform external field; a first conductor formed in the PWB and positioned at a first location that is within the first uniform external field; and a second conductor formed in the PWB and positioned at a second location that is within the second uniform external field; wherein the first conductor and the second conductor are galvanically coupled. | 10-09-2014 |
20140306792 | ELECTRONIC COMPONENT - An electronic component having; a laminate formed by laminating a plurality of insulator layers; and a coil consisting of linear coil conductor layers that are laminated along with the insulator layers, the coil having a spiral form or a helical form that windingly extends in a direction of lamination. In a cross section perpendicular to a direction in which the coil conductor layers extend, the coil conductor layers have recesses provided in their surfaces directed toward an inner circumference side of the coil, the recesses being set back toward an outer circumference side of the coil. | 10-16-2014 |
20140306793 | High Q, Miniaturized LCP-Based Passive Components - Various methods and systems are provided for high Q, miniaturized LCP-based passive components. In one embodiment, among others, a spiral inductor includes a center connection and a plurality of inductors formed on a liquid crystal polymer (LCP) layer, the plurality of inductors concentrically spiraling out from the center connection. In another embodiment, a vertically intertwined inductor includes first and second inductors including a first section disposed on a side of the LCP layer forming a fraction of a turn and a second section disposed on another side of the LCP layer. At least a portion of the first section of the first inductor is substantially aligned with at least a portion of the second section of the second inductor and at least a portion of the first section of the second inductor is substantially aligned with at least a portion of the second section of the first inductor. | 10-16-2014 |
20140313005 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a common mode filter capable of increasing a thickness of the coil electrode in a more simple and stable scheme. The common mode filter includes: a magnetic substrate; a coil electrode formed on one surface of the magnetic substrate and enclosed by an insulating resin; and external electrode terminals connected to both ends of the coil electrode, wherein the coil electrode includes a first metal pattern layer and a second metal pattern layer formed on the first metal pattern layer by performing electroplating using the first metal pattern layer as a lead wire. | 10-23-2014 |
20140320251 | THIN FILM CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape. | 10-30-2014 |
20140320252 | LOW LOSS IMPEDANCE TRANSFORMERS IMPLEMENTED AS INTEGRATED PASSIVE DEVICES AND RELATED METHODS THEREOF - Disclosed are apparatus and methods related to low loss impedance transformers implemented as integrated passive devices (IPDs). In some embodiments, an IPD can include an autotransformer implemented within a body. The autotransformer can include primary and secondary metal traces implemented in respective planes separated by a distance. The autotransformer can be configured to, for example, facilitate impedance matching of radio-frequency (RF) signals. In some embodiments, the IPD can include a surface that allows mounting of one or more components thereon to provide space savings in RF modules. Examples of fabrication methods as well as products that can benefit from such IPDs are disclosed. | 10-30-2014 |
20140327510 | ELECTRONIC DEVICE HAVING ASYMMETRICAL THROUGH GLASS VIAS - An electronic device includes a structure. The structure includes a first set of through glass vias (TGVs) and a second set of TGVs. The first set of TGVs includes a first via and the second set of TGVs includes a second via. The first via has a different cross-sectional shape than the second via. | 11-06-2014 |
20140333405 | COMPOSITE FERRITE COMPOSITION AND ELECTRONIC DEVICE - A composite ferrite composition comprises a magnetic material and a non-magnetic material. A mixing ratio of said magnetic material and said non-magnetic material is 20 wt %:80 wt % to 80 wt %:20 wt %. Ni—Cu—Zn based ferrite is used as the magnetic material. Oxides of Zn, Cu, and Si are at least included in a main component of said non-magnetic material. Borosilicate glass is included in a subcomponent of said non-magnetic material. | 11-13-2014 |
20140333406 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a common mode filter. | 11-13-2014 |
20140333407 | ELECTRONIC COMPONENT - An electronic component is provided which includes a helical coil having good coil characteristics and high reliability without peeling or breakage in each insulator layer. As compared to an existing configuration in which coil patterns are disposed on insulator layers | 11-13-2014 |
20140340187 | POWER TRANSMISSION COIL - A power transmission coil is unsusceptible to a dimensional error between individual coils or a displacement between primary and secondary coils. The power transmission coil includes a first planar coil having an inner diameter (Di) and a second planar coil having an outer diameter (Do) and being disposed opposite to the first planar coil. The quotient of the outer diameter (Do) of the second planar coil and the inner diameter (Di) of the first planar coil is defined as an inner/outer diameter ratio (Do/Di). The rate of change in the coupling coefficient between the first planar coil and the second planar coil is defined as a coupling coefficient change rate (Δk). The inner diameter (Di) of the first planar coil and the outer diameter (Do) of the second planar coil are determined in accordance with the correlation between the inner/outer diameter ratio (Do/Di) and the coupling coefficient change rate (Δk) so that the inner/outer diameter ratio (Do/Di) has a value not more than the value at which the slope of the correlation begins to rise steeply. | 11-20-2014 |
20140354392 | METAL WIRES OF A STACKED INDUCTOR - A method including forming a first metal wire in a first dielectric layer, the first metal wire including a first vertical side opposite from a second vertical side; and forming a second metal wire in a second dielectric layer above the first dielectric layer, the second metal wire including a third vertical side opposite from a fourth vertical side, where the first vertical side is laterally offset from the third vertical side by a first predetermined distance, and the second vertical side is laterally offset from the fourth vertical side by a second predetermined distance, where the first metal wire and the second metal wire are in direct contact with one another. | 12-04-2014 |
20140368307 | COMMON MODE CHOKE COIL - In a common mode choke coil, electrodes of input/output terminals are located on a bottom surface of a bottom layer. First linear conductors and second linear conductors are located on base material layers. A primary coil includes the first linear conductors and via hole conductors. A secondary coil includes the second linear conductors and via hole conductors. In a plan view as seen from a direction of winding axes of the primary coil and the secondary coil, as for a plurality of first linear conductors and second linear conductors which are adjacent in a plan direction, there are provided a first region in which the second linear conductors are located between the first linear conductors, and a second region in which the first conductors are located between the second linear conductors. | 12-18-2014 |
20140368308 | PLANAR TRANSFORMER ASSEMBLIES FOR IMPLANTABLE CARDIOVERTER DEFIBRILLATORS - A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers. | 12-18-2014 |
20140375411 | PLANAR TRANSMITTER WITH A LAYERED STRUCTURE - A planar transmitter, particularly an intrinsically safe transmitter, having a layer structure having a first circuit and at least a second circuit, wherein the first circuit and the second circuit are galvanically separated from one another by means of at least one insulation layer. The transmitter has a first magnetic layer and a second magnetic layer, wherein the first magnetic layer delimits a first side of the layer structure, and the second magnetic layer delimits a second side of the layer structure, wherein the first magnetic layer | 12-25-2014 |
20140375412 | ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME - A laminate in which plural insulator layers are stacked includes an external electrode that is exposed to the exterior of the laminate and includes a plurality of conductive layers stacked in a staking direction and passing through some of the plural insulator layers in the stacking direction. At least one side of the external electrode facing in the stacking direction is overlaid with rest of the plural insulator layers. At least one side surface of the external electrode facing in the stacking direction is uneven with another portion of the side surface. | 12-25-2014 |
20150009003 | ELECTRONIC COMPONENT - An electronic component has a laminate including a plurality of laminated insulator layers, the laminate having a top surface and a mounting surface positioned in a first direction perpendicular to a direction of lamination. The direction of lamination is a direction in which the plurality of the insulator layers are laminated. First and second external electrodes are positioned on the mounting surface rather than on the top surface. The first and second external electrodes including first and second Ni-plating films and first and second Sn-plating films provided thereon, respectively. A first total thickness of the first Ni-plating film and the first Sn-plating film and/or a second total thickness of the second Ni-plating film and the second Sn-plating film are/is 11.6 μm or more, respectively. The first and/or second Ni-plating films are/is 1.37 times or more as thick as the first and/or second Sn-plating films, respectively. | 01-08-2015 |
20150015357 | MULTILAYER INDUCTOR - Disclosed herein is a multilayer inductor including: a multilayered body formed by alternately multilayering magnetic sheets and internal electrodes and a pair of external terminals provided at both end portions of the multilayered body, the internal electrodes being interlayer-connected through a via to form a coil, wherein a ratio (Ts/Te) between a space Ts between internal electrodes of upper and lower layers and a thickness Te of a single internal electrode and a ratio (Fw/W) between an inner width Fw of the internal electrode and a width W of the multilayered body are determined according to parasitic capacitance C generated between the internal electrodes of upper and lower layers, parasitic capacitance C generated between the internal electrodes and the external terminals, inductance L proportional to the number of layers of the internal electrodes, and inductance L proportional to an internal sectional area of the coil. | 01-15-2015 |
20150015358 | MULTILAYER DEVICE AND MANUFACTURING METHOD OF THE SAME - A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased. | 01-15-2015 |
20150022306 | PLANAR TRANSMITTER WITH A LAYERED STRUCTURE - A planar intrinsically safe transducer having a vertical extension and a horizontal extension having a layer structure with a plurality of circuits, wherein a first circuit and a second circuit are galvanically isolated from one another. Further, the transducer has a magnetic core | 01-22-2015 |
20150022307 | INDUCTOR ELEMENT - A multilayer body | 01-22-2015 |
20150028986 | HIGH EFFICIENCY ON-CHIP 3D TRANSFORMER STRUCTURE - An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track included first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including third turns of a third radius within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups. | 01-29-2015 |
20150028987 | HIGH EFFICIENCY ON-CHIP 3D TRANSFORMER STRUCTURE - An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track includes first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including a plurality of adjacent turns of one or more radii within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups. | 01-29-2015 |
20150028988 | LAMINATED COIL - A laminated coil having; a laminate body including a plurality of insulating layers laminated horizontally; and a coil located in the laminate body off-center in an upper portion of the laminate body and including a plurality of coil conductors connected through via conductors piercing the insulating layers. The plurality of coil conductors includes a first coil conductor and a second coil conductor. A cross-sectional area of the second coil conductor is less than a cross-sectional area of the first coil conductor. The second coil conductor is a lowermost coil conductor of the plurality of the coil conductors. A lower surface of the laminate body is a mounting surface. | 01-29-2015 |
20150035638 | INTEGRATION OF A COIL AND A DISCONTINUOUS MAGNETIC CORE - A particular device includes a coil and a discontinuous magnetic core. The discontinuous magnetic core includes a first elongated portion, a second elongated portion, and at least two curved portions, where the portions are coplanar and physically separated from each other. The discontinuous magnetic core is arranged to form a discontinuous loop. The discontinuous magnetic core is deposited as a first layer above a dielectric substrate. A first portion of the coil extends above a first surface of the magnetic core. A second portion of the coil extends below a second surface of the magnetic core. The second portion of the coil is electrically coupled to the first portion of the coil. The second surface of the magnetic core is opposite the first surface of the magnetic core. | 02-05-2015 |
20150035639 | COIL SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND INDUCTOR - A coil substrate includes a plurality of structural bodies, each of which comprises a first insulating layer, a wiring formed on the first insulating layer and configured to serve as a part of a spiral coil, and a second insulating layer formed on the first insulating layer and configured to cover the wiring. The plurality of structural bodies are stacked via an adhesion layer. The spiral coil is formed by series-connecting the wirings of adjacent ones of the plurality of structural bodies. | 02-05-2015 |
20150035640 | METHOD OF MANUFACTURING MULTI-LAYER COIL AND MULTI-LAYER COIL DEVICE - A method of manufacturing a multi-layer coil includes steps of providing a substrate; forming a seed layer on the substrate; and plating the seed layer with N coil layers by N current densities according to N threshold ranges, so as to form the multi-layer coil on the substrate, wherein an i-th current density of the N current densities is lower than an (i+1)-th current density of the N current densities. A first coil layer of the N coil layers is plated on the seed layer by a first current density of the N current densities. When an aspect ratio of an i-th coil layer of the N coil layers is within an i-th threshold range of the N threshold ranges, an (i+1)-th coil layer of the N coil layers is plated on the i-th coil layer by the (i+1)-th current density. | 02-05-2015 |
20150042438 | TUNABLE THREE DIMENSIONAL INDUCTOR - A tunable three-dimensional (3D) inductor comprises a plurality of vias arranged with spacing among them, a plurality of interconnects in a metal layer, wherein the plurality of interconnects connect the plurality of vias on one end, and a plurality of tunable wires that connects to the plurality of vias on the other end to form the 3D inductor. The physical configuration and inductance value of the 3D inductor are adjustable by tuning the plurality of tunable wires during manufacturing process. | 02-12-2015 |
20150042439 | ELECTRONIC COMPONENT - A multilayer body | 02-12-2015 |
20150048917 | PRINTED CIRCUIT BOARD AND POWER SUPPLY DEVICE - In the printed circuit board | 02-19-2015 |
20150048918 | COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT FOR THIN FILM INDUCTOR, THIN FILM INDUCTOR AND MANUFACTURING METHOD OF THIN FILM INDUCTOR - Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers. | 02-19-2015 |
20150061812 | STRUCTURE AND METHOD FOR HIGH PERFORMANCE MULTI-PORT INDUCTOR - A multi-port inductor structure for use in semiconductor applications such as high-performance RF filters and amplifiers is provided. Embodiments of the present invention may provide 3 metallization layers and two via layers. The metallization layers and via layers may be substantially stacked on top of each other to conserve space. Each metallization layer comprises a ring pattern. In embodiments, the top two ring patterns include a plurality of concentric bands, forming a spiral pattern. The third (bottom) ring may include a broken ring pattern. In embodiments, the second (middle) ring may include one or more spans to facilitate connection to the inner bands of the second ring. The spans connect inner bands to an outer perimeter region of the second ring. Multiple tap points along the bands and spans allow multiple inductance values to be obtained from the structure. | 03-05-2015 |
20150061813 | VARYING THICKNESS INDUCTOR - A particular device includes a substrate and a spiral inductor coupled to the substrate. The spiral inductor includes a first conductive spiral and a second conductive spiral overlaying the first conductive spiral. A first portion of an innermost turn of the spiral inductor has a first thickness in a direction perpendicular to the substrate. The first portion of the innermost turn includes a first portion of the first conductive spiral and does not include the second conductive spiral. A second portion of the innermost turn includes a first portion of the second conductive spiral. A portion of an outermost turn of the spiral inductor has a second thickness in the direction perpendicular to the substrate that is greater than the first thickness. A portion of the outermost turn includes a second portion of the first conductive spiral and a second portion of the second conductive spiral. | 03-05-2015 |
20150061814 | FERRITE CIRCUIT BOARD - A ferrite circuit board includes a substrate and a wire. The substrate is made of ferrite and provided with a surface and an elongated groove recessed from the surface. The elongated groove has an inner wall having a roughness Ra ranging from 0.1 μm to 20 μm. The wire is embedded in the elongated groove of the substrate, such that the wire is not easily separated from the substrate. The ferrite circuit board can be used as an inductor to provide abundant functionality. | 03-05-2015 |
20150077208 | HIGH-Q PARALLEL-TRACE PLANAR SPIRAL COIL FOR BIOMEDICAL IMPLANTS - A parallel-trace spiral coil comprising a plurality of electrically-isolated, parallel connected metal traces with high Q factor for use in bio-medical implants. | 03-19-2015 |
20150077209 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer. | 03-19-2015 |
20150084730 | MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - A multilayer inductor may include: a body having a plurality of dielectric layers stacked therein; a plurality of conductor patterns formed on the plurality of dielectric layers; via electrodes formed in the dielectric layers and connecting the conductor patterns disposed adjacent to each other in a vertical direction to form a coil; and pad patterns formed between the conductor patterns and the dielectric layers at positions of the via electrodes. | 03-26-2015 |
20150091686 | INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP - Various embodiments include inductor structures including at least one air gap for reducing capacitance between windings in the inductor structure. One embodiment includes an inductor structure having: a substrate; an insulation layer overlying the substrate; a conductive winding overlying the substrate within the insulation layer, the conductive winding wrapped around itself to form a plurality of turns substantially concentric about a central axis; an insulating structural support containing an air gap between the conductive winding and the insulation layer, the insulating structural support at least one of under, over or surrounding the plurality of turns of the conductive winding or between adjacent turns in the conductive winding; and at least one insulation pocket located radially inside a radially innermost turn in the plurality of turns with respect to the central axis. | 04-02-2015 |
20150091687 | WINDING AND METHOD FOR PREPARING A WINDING APPLIED TO AN INDUCTIVE DEVICE - The present invention relates to a winding and a method for preparing a winding of inductive devices. The winding includes at least a plurality of layers, where each layer includes at least one conductive loop; the conductive loops are electrically connected to form a winding; and the conductive loop or the portion of the conductive loop of at least one layer is not spatially aligned with the conductive loop or the portion of the conductive loop of at least one another layer. Preferably, except for the conductive loop that includes a center tap, other conductive loops are each divided into 2N loop sections, each loop section is electrically connected to a corresponding loop section of another layer through a pair of crossover conductive via plugs, so as to form N windings, where N is an integer greater than or equal to 1. The winding may be prepared by adopting a PCB process or semiconductor process, which can effectively consume less of surface area on the integration substrate, have a symmetric trace and reduce the parasitic coupling capacitance while acquiring a high Q-factor value. The windings of the present invention may be used for making an inductor or a transformer. | 04-02-2015 |
20150091688 | COIL SHEET AND METHOD OF MANUFACTURING THE SAME - There is provided a coil sheet including: a base sheet, and a coil unit disposed on the base sheet and including a central conductive part and a surface conductive part formed on surfaces of the central conductive part, wherein when a thickness of the surface conductive part formed on lateral surfaces of the central conductive part is ‘a’ and a thickness of the surface conductive part formed on an upper surface of the central conductive part is ‘b’, a | 04-02-2015 |
20150097648 | COMPOSITE ELECTRONIC COMPONENT AND COMPOSITE ELECTRONIC COMPONENT MANUFACTURING METHOD - A composite electronic component includes a multilayer body, coils, an antistatic element and outer electrodes. The multilayer body is configured by laminating insulator layers. The coils are provided on the upper surfaces of the insulator layers. The antistatic element is connected to the coils and includes ground electrodes. The outer electrodes are connected to the coils. The upper surfaces of the insulator layers on which the coils are provided do not intersect with the ground electrodes. | 04-09-2015 |
20150102887 | LAMINATED INDUCTOR AND MANUFACTURING METHOD THEREOF - A laminated inductor may include a body having a plurality of ceramic layers stacked therein, a plurality of conductive patterns formed on the ceramic layers, and via electrodes disposed between the ceramic layers and connecting the conductive patterns disposed in a vertical direction to form a coil. Each of the conductive patterns may include a plurality of unit patterns disposed in parallel to be spaced apart from each other on each of the ceramic layers. | 04-16-2015 |
20150102888 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle. | 04-16-2015 |
20150102889 | INDUCTOR AND MANUFACTURING METHOD THEREOF - An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed. | 04-16-2015 |
20150102890 | COIL SUBSTRATE, METHOD OF MANUFACTURING COIL SUBSTRATE AND INDUCTOR - A coil substrate includes a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series. | 04-16-2015 |
20150102891 | CHIP ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND PACKAGING UNIT THEREOF - A chip electronic component may include: a magnetic body having first and second main surfaces opposing each other in a thickness direction, first and second side surfaces opposing each other in a width direction, and first and second end surfaces opposing each other in a length direction, a thickness of the magnetic body being greater than a width thereof; internal coil pattern parts disposed in the magnetic body; and external electrodes disposed on at least one surface of the magnetic body. The internal coil pattern parts may be disposed to be perpendicular with respect to the first and second main surfaces of the magnetic body. | 04-16-2015 |
20150102892 | MAGNETIC SHEET, WIRELESS CHARGING SHEET AND METHOD FOR MANUFACTURING MAGNETIC SHEET - The present invention relates to a magnetic sheet, a wireless charging sheet, and a method for manufacturing a magnetic sheet. According to an embodiment of the present invention, a magnetic sheet used in a wireless charging sheet, which includes a metal sheet layer consisting of a plurality of divided segments; and an insulating material filled in a dividing space between the segments and forms a magnetic path of a magnetic field generated around a coil, is provided. Further, a wireless charging sheet and a method for manufacturing a magnetic sheet are provided. | 04-16-2015 |
20150109088 | CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency. | 04-23-2015 |
20150116071 | ENERGY SUPPLY DEVICE FOR EXPLOSION-PROOF ELECTRONIC FUNCTIONAL UNITS - An exemplary energy supply device for explosion-proof electronic functional units, in which the functional units are supplied from a high-frequency AC voltage that is individually output for each of the functional units via an inductor. In order to supply a multiplicity of functional units with little effort, the multi-level printed circuit board of each inductor can be covered with a flat board of magnetic material. The flat board being parallel to a plane of conductor tracks of the inductors. | 04-30-2015 |
20150123759 | Inductor For Semiconductor Integrated Circuit - An inductor includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of contacts. Each of the first conductive lines is spaced apart from one another. Each of the second conductive lines is spaced apart from one another, and each of the second conductive lines crosses over each of the first conductive lines. Each of the contacts electrically interconnects one of the first conductive lines and one of the second conductive lines. These contacts are arranged in a way such that at least parts of the first conductive lines and at least parts of the second conductive lines form an electric current path serving as an inductor. | 05-07-2015 |
20150130579 | MULTI SPIRAL INDUCTOR - An apparatus includes a multi spiral inductor that includes a first spiral and a second spiral. The first spiral includes a first turn, a second turn, and a third turn. The first turn is adjacent to and separated from the second turn by first spacing. The second turn is adjacent to and separated from the third turn by second spacing. The first spacing is different from the second spacing. | 05-14-2015 |
20150130580 | COMMON MODE FILTER AND MANUFACTURING METHOD THEREOF - A common mode filter and a manufacturing method thereof are disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil layer formed on the magnetic substrate and including a coil pattern; a magnetic layer formed on the coil layer; a resin layer formed on the magnetic layer; and an external electrode formed in the resin layer so as to be electrically connected with the coil pattern. | 05-14-2015 |
20150130581 | COMMON MODE FILTER - A common mode filter is disclosed. The common mode filter provided by the present invention includes: a magnetic substrate; a coil layer formed on the magnetic substrate and including a coil pattern; an external electrode formed on the coil layer so as to be electrically connected with the coil pattern; a ground electrode formed on the coil layer and configured to discharge static electricity brought in to the external electrode; a post formed on each of the external electrode and the ground electrode; and an electrostatic discharge member formed between the external electrode and the ground electrode so as to cover a side surface of the post and configured to discharge static electricity brought in to the external electrode to the ground electrode. | 05-14-2015 |
20150130582 | MAGNETIC SHEET HAVING WIRELESS CHARGING RADIATOR FUNCTION, METHOD OF MANUFACTURING THE SAME, AND WIRELESS CHARGING DEVICE USING THE SAME - Since the magnetic sheet of the present invention has a much thinner thickness compared to a corresponding conventional magnetic layer and radiator coil material assembly and has no adhesive layer or air layer between the magnetic layer and the radiator, permeability required at the time of charging can be improved, a loss rate can be reduced and high charging efficiency can be obtained. Furthermore, since a band width and a gain rate can be improved, the magnetic sheet can be very usefully applied to wireless charging products which pursue slimming in design. | 05-14-2015 |
20150137929 | MULTILAYER INDUCTOR - There is provided a multilayer inductor including: a body in which a plurality of dielectric layers are stacked in a width direction; a plurality of first and second internal electrode patterns disposed to oppose each other, having the dielectric layer therebetween and each led to positions of a lower surface of the body spaced apart from each other; and first and second external electrodes formed on a lower surface of the body to be spaced apart from each other and electrically connected to the first and second internal electrode patterns, respectively. | 05-21-2015 |
20150137930 | ROLLED-UP TRANSFORMER STRUCTURE FOR A RADIOFREQUENCY INTEGRATED CIRCUIT (RFIC) - A rolled-up transformer structure comprises a multilayer sheet having a rolled configuration comprising multiple turns about a longitudinal axis. The multilayer sheet comprises more than one conductive pattern layer on a strain-relieved layer, including a first conductive film and a second conductive film separated from the first conductive film in a thickness direction. The first conductive film comprises an even number of primary conductive strips, where each primary conductive strip has a length extending in the rolling direction, and the second conductive film comprises an even number of secondary conductive strips, where each secondary conductive strip has a length extending in the rolling direction. In the rolled configuration, turns of the primary conductive strips and turns of the secondary conductive strips wrap around the longitudinal axis. The primary conductive strips serve as a primary winding and the secondary conductive strips serve as a secondary winding of the rolled-up transformer structure. | 05-21-2015 |
20150137931 | INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRING BOARD - A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device. | 05-21-2015 |
20150145630 | COIL - A coil which maintains a balance of a parasitic capacitance and has a structure that can be multilayered. The coil is stacked with a structure which includes winding wire portions formed of a wire wound for several turns in a plane in each layer, wherein winding wire portions in each layer include a first winding portion formed by performing a single turn of winding in each layer in a same winding direction from a bottom layer to an uppermost layer, and a second winding portion formed by performing a single turn of winding in each layer in a same winding direction from the uppermost layer to the bottom layer, and the winding directions of the first and second winding portions are identical to each other and the first winding portion and the second winding portion are joined in the uppermost layer or the bottom layer. | 05-28-2015 |
20150294780 | LAMINATED COIL COMPONENT AND METHOD FOR PRODUCING SAME - A laminated coil component includes a magnetic material part containing a metal magnetic material and a first glass component, and a nonmagnetic material part containing a ceramic material and a second glass component, and a coil conductor is formed so that at least the main surface of a coil pattern is in contact with the nonmagnetic material part. The magnetic material part is formed with the volume content of the first glass component based on the total amount of the metal magnetic material and the first glass component is 46 to 60 vol %. The nonmagnetic material part is formed with the volume content of the second glass component based on the total amount of the ceramic material and the second glass component is 69 to 79 vol %. A laminated coil component having good high-frequency characteristics and magnetic characteristics is obtained and a method for producing the laminated coil component. | 10-15-2015 |
20150302971 | INDUCTION COIL HAVING A CONDUCTIVE WINDING FORMED ON A SURFACE OF A MOLDED SUBSTRATE - The following examples and embodiments are directed to an induction coil that can be used in a variety of applications, including, for example, induction charging systems. In one example, an induction coil is configured to couple an electrical field between a base device and a mobile device in an inductive charge system. The induction coil includes a coil substrate formed by a molding process. The induction coil also includes a shield element disposed within the coil substrate. The shield element may be formed within the coil substrate as part of the molding process. A conductive winding is also formed within a surface of the coil substrate. In some cases, the coil substrate is formed by an injection-molding process. | 10-22-2015 |
20150302973 | PASSIVE DEVICE SUBSTRATE - A passive device substrate includes a substrate, a passive device disposed at a first surface of the substrate, an insulating layer disposed on the first surface of the substrate to cover the passive device, a magnetic layer disposed on an opposite side of the insulating layer from the substrate to overlap the passive device in a plan view taken in a thickness direction of the substrate, and a metal layer disposed on a second surface of the substrate to overlap the passive device in the plan view. | 10-22-2015 |
20150302975 | Vertical Inductor and Method of Manufacturing the Same - A spiral inductor formed in a vertical plane relative to a planar surface of a substrate includes a plurality of through holes disposed in the vertical plane and spaced apart from each other, a metal interconnect structure on the top surface, and a redistribution layer on the bottom surface and having at least one bottom metal layer. The metal interconnect structure and the redistribution layer are connected to each other through the plurality of through holes to form the vertical spiral inductor. The thus formed vertical spiral inductor has a significantly reduced surface area comparing with lateral spiral inductors. | 10-22-2015 |
20150302980 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component with a built-in coil is provided which can be produced inexpensively, which can effectively increase insulating reliability, and which has the antistatic function. Coil wirings are disposed inside a sintered body that is formed by stacking a plurality of ferrite layers, which are fired as an integral unit. Voltage nonlinear members are incorporated in the sintered body at a different height position from those of the coil wirings. First inner electrodes and second inner electrodes are disposed in opposing relation with the voltage nonlinear members interposed therebetween. A magnetic circuit forming portion is constituted by a part of the ferrite layers and the coil wirings in a portion in which the coil wirings are arranged, and an antistatic portion is constituted in a portion in which the remaining ferrite layers, the voltage nonlinear members, and the first and second inner electrodes are arranged. | 10-22-2015 |
20150310980 | INTEGRATED STACKED TRANSFORMER - An integrated stacked transformer includes a primary inductor and a secondary inductor, and the primary inductor includes at least a first turn and a second turn, and is at least formed by a plurality of windings of a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are two adjacent metal layers, and the second turn of the primary inductor is disposed inside the first turn; the secondary inductor includes at least a first turn, and the secondary inductor is at least formed by at least one winding formed by the second metal layer, wherein the first turn of the secondary inductor substantially overlaps the first turn of the primary inductor; wherein the second turn of the primary inductor includes a segment of a parallel connection structure constructed by the first metal layer and the second metal layer. | 10-29-2015 |
20150310981 | INTEGRATED TRANSFORMER - An integrated transformer includes a primary inductor and a secondary inductor wherein the primary inductor includes a B turns spiral winding formed by a first metal layer and an A turns winding formed by a second metal layer, wherein the A turns winding formed by the second metal layer and the innermost turns of the B turns spiral winding formed by the first metal layer are substantially overlapped; and the secondary inductor includes a C turns winding at least formed by the second metal layer, wherein the C turns winding formed by the second metal layer of the secondary inductor and a portion of the winding formed by the first metal layer of the primary inductor are substantially overlapped, wherein A is not bigger than B, and A is not bigger than C. | 10-29-2015 |
20150310982 | Method for Producing a Coil and Electronic Device - The invention relates to a method for producing a coil integrated in a substrate or applied to a substrate, wherein the coil has first winding portions, which each have first ends and second ends, and wherein the coil has second winding portions and third winding portions, wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example. | 10-29-2015 |
20150325369 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body. | 11-12-2015 |
20150332842 | CHIP PARTS - A chip part is provided that includes a substrate | 11-19-2015 |
20150340148 | INDUCTOR AND METHOD OF FORMING AN INDUCTOR - An inductor for a semiconductor device is provided, which may include: a plurality of structured metallization layers, wherein the plurality of structured metallization layers includes at least a first metallization layer, a second metallization layer disposed over the first metallization layer, a third metallization layer disposed over the second metallization layer, and a fourth metallization layer disposed over the third metallization layer; wherein a portion of the first metallization layer and a portion of the fourth metallization layer form a first coil; wherein a portion of the second metallization layer and a portion of the third metallization layer form a second coil; and wherein the second coil is arranged within the inner space defined by the first coil. | 11-26-2015 |
20150340150 | Inductor and Coil Substrate - An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole. | 11-26-2015 |
20150340151 | INDUCTOR BRIDGE AND ELECTRONIC DEVICE - An inductor bridge is configured to bridge-connect a first circuit and a second circuit to each other, and includes a flexible flat plate base body, a first connector at a first end portion of the base body and connected to the first circuit, a second connector at a second end portion of the base body and connected to the second circuit, and an inductor section in the base body between the first connector and the second connector. The inductor section includes conductor patterns including a plurality of layers. The inductor bridge further includes a bending portion between the inductor section and the first connector, and a slot at an inner side of the bending portion that reduces a thickness of the base body. | 11-26-2015 |
20150340153 | INDUCTIVE CHARGING COIL DEVICE - An inductive charging coil device, in particular a hand-held power tool inductive charging coil device, includes at least one coil unit having at least one conductor. It is provided that the conductor includes at least two main cross sections. | 11-26-2015 |
20150348695 | Method for Producing a Coil Integrated in a Substrate or Applied to a Substrate, and Electronic Device - The subject matter of the invention relates to a method of producing a coil integrated in a substrate, using the following steps: creating the cavity in a substrate, said cavity having an open end which interrupts a surface of the substrate, introducing a paste containing ferromagnetic particles into the cavity so as to produce a coil core, closing the cavity by applying a cover layer so as to bridge the interruption in the surface of the substrate, introducing first winding portions of the coil which are vertical with respect to the surface, with a plurality or all of the first winding portions passing through the coil core contained inside the cavity, and applying second winding portions of the coil onto the surfaces of the substrate, with the second winding portions contacting the first winding portions so as to create the windings of the coil. | 12-03-2015 |
20150357112 | Power Management Module and Method of Manufacture - A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element. | 12-10-2015 |
20150357113 | PRINTED CIRCUIT BOARD HAVING A LAYER STRUCTURE - The invention relates to a printed circuit board having a layer structure, which accommodates a plurality of electric circuits. The electric circuits are separated from each other by an insulating barrier layer having a minimum thickness (Di) and a minimum distance (D | 12-10-2015 |
20150357114 | ELECTRONIC COMPONENT - To restrict a phenomenon that the direct-current resistance value after firing is larger than the direct-current resistance value before firing in an electronic component in which a conductor formed of a wire rod is embedded in a ceramic sintered compact. An electronic component | 12-10-2015 |
20150364241 | SOLENOIDAL SERIES STACKED MULTIPATH INDUCTOR - A series stacked, solenoidally wound, multipath inductor includes a plurality of turns disposed about a center region on two layers. The turns on the two layers have corresponding geometry therebetween. Each of the plurality of turns includes two or more segments that extend length-wise along the turns. The segments have positions that vary from an innermost position relative to the center region and an outermost position relative to the center region. A cross-over architecture is configured to couple the segments of a turn on one layer with the segments on a turn on another layer to form segment paths that have a substantially same length for all segment paths in a segment path grouping between the two layers. | 12-17-2015 |
20150364243 | ELECTRONIC DEVICE WITH TWO PLANAR INDUCTORS - An electronic device includes a first planar inductor and a second planar inductor. The first planar inductor includes at least a first ring structure and a second ring structure interconnected electrically for generating a first magnetic field having a first direction and a second magnetic field having a second direction respectively, wherein the first direction is different from the second direction. The second planar inductor includes at least a third ring structure and a fourth ring structure interconnected electrically for generating a third magnetic field having a third direction and a fourth magnetic field having a fourth direction respectively, wherein the third direction is different from the fourth direction. The first ring structure at least partially overlaps the third ring structure to form a first overlap region, and the second ring structure at least partially overlaps the fourth ring structure to form a second overlap region. | 12-17-2015 |
20150364244 | Induction Coil Structure for Wireless Charging Device - An induction coil structure for a wireless charger includes at least one first coil, at least one second coil, a first magnetic conductor and a second magnetic conductor. The first coil is disposed in a first layer of an induction coil. The second coil is disposed in a second layer of the induction coil. The first magnetic conductor is located between the first coil and the second coil, wherein a first surface and a second surface of the first magnetic conductor are superposed on the first coil and the second coil, respectively. The second magnetic conductor is superposed on a surface of the second coil that is not superposed on the first magnetic conductor. The first magnetic conductor includes a hole, and a wire for winding the first coil extends from the first layer to the second layer via the hole, to wind the second coil. | 12-17-2015 |
20150371728 | MULTILAYER ELECTRONIC COMPONENT AND CONDUCTIVE PASTE COMPOSITION FOR INTERNAL ELECTRODE - A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. | 12-24-2015 |
20150371751 | VERTICAL SPIRAL INDUCTOR - Methods and apparatuses, wherein the method forms a first plurality of vias in a substrate, further comprising forming the first plurality of vias to be substantially the same height. The method forms a plurality of conductive traces external to the substrate and couples the plurality of conductive traces to the first plurality of vias: wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns and wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane. | 12-24-2015 |
20150371752 | CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A chip electronic component may include: a magnetic body; and internal coil parts buried in the magnetic body. The magnetic body includes: a core layer including the internal coil parts; and upper and lower cover layers disposed on upper and lower portions of the core layer, respectively, the core layer having a level of magnetic permeability different from that of at least one of the upper and lower cover layers. | 12-24-2015 |
20150371755 | MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body. | 12-24-2015 |
20150371756 | Apparatus and Methods for Magnetic Core Inductors with Biased Permeability - Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors. | 12-24-2015 |
20150371757 | ELECTRONIC COMPONENT - A multilayer body is a lamination of a plurality of substantially rectangular insulating layers and has a bottom surface being a series of the outer edges of the insulating layers, an end surface being adjacent to the bottom surface and being a series of the outer edges of the insulating layers, and a side surface located on a negative side in the y-axis direction. An outer electrode is embedded in the multilayer body such that it is exposed while extending across the boundary between the bottom surface and the end surface. A coil is disposed in the multilayer body and is connected to the outer electrode. The distance between the outer electrode and the side surface in the corner between the bottom surface and the end surface is longer than the distance between the outer electrode and the side surface where the outer electrode and the coil are connected. | 12-24-2015 |
20150371758 | HIGH EFFICIENCY ON-CHIP 3D TRANSFORMER STRUCTURE - An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track included first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including third turns of a third radius within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups. | 12-24-2015 |
20150371759 | HIGH EFFICIENCY ON-CHIP 3D TRANSFORMER STRUCTURE - A transformer structure includes a first coil having two sections of spiral, with a top section including a plurality of metal layers occupying top X metal layers and a bottom section including a plurality of metal layers occupying bottom Z metal layers, where X and Z represent a number of metal layers having a specific number selected to provide a particular performance of the first coil. A second coil of the transformer is disposed between the two sections of the first coil and includes a plurality of metal layers where Y represents a number of vertically adjacent metal layers, with the specific number chosen to provide the particular performance, such that a sum X+Y+Z represents a total number of vertical metal layers for the transformer structure. | 12-24-2015 |
20150371760 | HIGH EFFICIENCY ON-CHIP 3D TRANSFORMER STRUCTURE - An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track includes first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including a plurality of adjacent turns of one or more radii within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups. | 12-24-2015 |
20150380151 | CHIP COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME - A chip coil component may include: a ceramic body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface, an internal coil part disposed in the ceramic body and having first and second lead-out portions exposed to both end surfaces of the ceramic body in a length direction thereof, an external electrode disposed on the bottom surface of the ceramic body, and plating spreading parts formed on both end surfaces of the ceramic body in the length direction and connecting the first and second lead-out portions and the external electrode to each other. | 12-31-2015 |
20150380152 | COIL COMPONENT AND METHOD OF MANUFACTURING COIL COMPONENT - A method of manufacturing a coil component, includes forming a conductive pattern on a substrate; forming an opening portion over a surface of the substrate so as to be disposed between neighboring conductors of the conductive pattern, the opening portion having a depth that is equivalent to or greater than a clearance dimension between the neighboring conductors; and forming a coil pattern by growing the conductive pattern including by plating. | 12-31-2015 |
20150380153 | LAMINATED HIGH BIAS RETENTION FERRITE SUPPRESSORS AND METHODS OF MAKING THE SAME - Disclosed are exemplary embodiments of chip type high bias retention suppressors that have a laminated structure, which comprises a ferrite magnetic substrate, dielectric material layers, and interior electrically-conductive or conductor layers. The internal electrical conductors may be printed (e.g., silver ink, etc.) on the magnetic layers such that the conductors connect with each other and define a spiral pattern or coil. The dielectric layers and/or interior conductors may be laminated on the magnetic substrate in a direction of thickness. The dielectric layers and/or interior connectors may be printed by a thick-film process. | 12-31-2015 |
20160005527 | COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT FOR THIN FILM INDUCTOR, THIN FILM INDUCTOR AND MANUFACTURING METHOD OF THIN FILM INDUCTOR - A coil unit for the thin film inductor includes an insulating material and a coil pattern. The coil pattern includes an inner plating layer embedded in the insulating layer, a growth conductive layer formed on a surface of the inner plating layer and formed on a top surface and a bottom surface of the insulating layer and an outer plating layer formed on the top surface and the bottom surface of the insulating material by plating and growing based on the growth conductive layer. | 01-07-2016 |
20160012952 | INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP | 01-14-2016 |
20160012956 | THIN-TYPE COMMON MODE FILTER AND MANUFACTURING METHOD THEREOF | 01-14-2016 |
20160012957 | CHIP COIL COMPONENT | 01-14-2016 |
20160020013 | SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR - A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate. | 01-21-2016 |
20160020014 | LAMINATED COIL COMPONENT AND METHOD FOR MANUFACTURING IT - A laminated coil component has a laminated body which is formed by laminating a plurality of ferrite layers, a helical coil which is provided in the laminated body, and a plurality of external electrodes which are provided on the surface of the laminated body and are electrically connected to the helical coil and are mainly composed of Cu. The ferrite layers have an exposed region exposed from the surface of the laminated body without being covered with the external electrodes. A surface resistivity of the exposed region of the ferrite layers is more than 10 | 01-21-2016 |
20160027570 | COIL COMPONENT, COIL COMPONENT COMPLEX, TRANSFORMER, AND POWER SUPPLY UNIT - Provided is a coil component that includes: a coil pattern provided on a substrate and including a plurality of separated end sections that are separated from each other with a gap in between; and a conduction member that allows a selective electrical conduction between the respective separated end sections. The selective electrical conduction causes a change in the number of turns of the coil pattern. Every section in the coil pattern configures a part of the coil component, irrespective of the number of turns. | 01-28-2016 |
20160027572 | METHOD OF MANUFACTURING A MULTILAYERED CHIP POWER INDUCTOR - The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics. In order to achieve the objective, the present invention provides a multilayered chip power inductor using a magnetic sheet, characterized in that a plurality of magnetic sheets are laminated, wherein an electrical conductive circuit is formed on the surfaces of said sheets; that a terminal is formed at an outermost part; that said electrical conductive circuit and said terminal are electrically connected through via holes, and form a circuit in the form of a coil; and that a magnetic core is inserted into said circuit, and a method for manufacturing the same. | 01-28-2016 |
20160035480 | MAGNETIC DEVICE - Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern. | 02-04-2016 |
20160035671 | Structure of Integrated Inductor - This invention discloses an integrated inductor structure, including a first metal trace, a second metal trace, and a connecting metal trace. Tow terminals of the connecting metal trace are respectively connected to the first metal trace and the second metal trace through at least a connecting structure. The connected first metal trace, the connecting metal trace and the second metal trace together form an inductor structure. The connecting structure is connected to a connecting area of the first metal trace. The connecting area of the first metal trace has a first width. A smallest width of the first metal trace is a second width. The second width is smaller than the first width. | 02-04-2016 |
20160042846 | INDUCTOR INCLUDING alpha"-Fe16Z2 OR alpha"-Fe16(NxZ1-x)2, WHERE Z INCLUDES AT LEAST ONE OF C, B, OR O - An inductor may include a magnetic material that may include α″-Fe | 02-11-2016 |
20160042856 | METHODS FOR MANUFACTURING INTEGRATED MAGNETIC COMPONENTS AND LED POWER SUPPLY - The present disclosure provides an integrated magnetic component, a method for manufacturing the integrated magnetic component, and an integrated LED power supply including the magnetic component. The integrated magnetic component includes a PCB baseboard, wherein magnetic core, copper coils and pins are embedded in the baseboard. The magnetic core may be an iron or cobalt-based soft magnetic thin film(s), and it may be stuck or coated on the inner layer of the PCB baseboard. Further, the copper coil may be thin copper tracks. The present disclosure provides a method for making iron or cobalt-based nanocrystalline strip(s) using a soft magnetic thin film deposition method, or a melt spinning method. The iron or cobalt-based soft magnetic thin film(s) may then be used to make an embedded PCB magnetic core. The resulting magnetic component is thin, highly efficient, and functions as a substrate in the assembly process. In addition, the LED power supply consistent with the present disclosure is thin and small, highly integrated, with process repeatability and reliability. Embodiments consistent with the present disclosure thus simplify the system assembly process for making LED power supplies, and save time and cost in the process. | 02-11-2016 |
20160042857 | CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There are provided a chip electronic component including: a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern, wherein each of the external electrodes includes a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern and a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body. | 02-11-2016 |
20160042858 | CHIP-TYPE COIL COMPONENT AND MANUFACTURING METHOD THEREOF - A chip-type coil component may include: a ceramic body of which a lower surface is provided as a mounting surface and in which a plurality of ceramic layers with a plurality of recesses provided therein are stacked; and an internal coil structure disposed within the ceramic body and including internal coil patterns disposed on the plurality of ceramic layers, wherein the plurality of recesses are exposed to the lower surface of the ceramic body, and the plurality of recesses are filled with a plurality of conductive materials. | 02-11-2016 |
20160042859 | CHIP ELECTRONIC COMPONENT - There is provided a chip electronic component including: a magnetic body having an internal coil part embedded therein, wherein the magnetic body includes: a central portion provided inside of the internal coil part and including a core; and an outer peripheral portion provided outside of the central portion, the central portion and the outer peripheral portion having different magnetic permeabilities. | 02-11-2016 |
20160042860 | INDUCTOR - Disclosed herein is an inductor including a ceramic main body on which a first ceramic sheet on which a primary conductor pattern is formed and a second ceramic sheet on which a secondary conductor pattern is formed are alternately stacked; a first via passing through the second ceramic sheet and connecting the primary conductor pattern; and a second via passing through the first ceramic sheet and connecting the secondary conductor pattern, so as to reinforce an electromagnetic coupling of primary and secondary coils. | 02-11-2016 |
20160042861 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure. | 02-11-2016 |
20160042862 | ELECTRONIC COMPONENT - An electronic component having; a multilayer body including insulating layers stacked on one another; a spiral coil including coil conductors provided on the insulating layers and a first via-hole conductor piercing through at least one of the insulating layers to connect the coil conductors to each other; a parallel conductor provided on one of the insulating layers; and a second via-hole conductor piercing through at least one of the insulating layers to connect the parallel conductor in parallel to one of the coil conductors provided on the insulating layer different from the insulating layer on which the parallel conductor is provided. A portion of the coil conductor not connected in parallel to the parallel conductor at least partly has a greater width than a portion of the coil conductor connected in parallel to the parallel conductor other than a contact point with the second via-hole conductor. | 02-11-2016 |
20160049234 | COMMON MODE NOISE FILTER AND MANUFACTURING METHOD THEREOF - A common mode noise filter includes: a laminated body; and a first and second coil conductors that are formed inside the laminated body and face each other in a first direction, wherein the first coil conductor has a first surface facing the second coil conductor; the second coil conductor has a second surface facing the first surface; a distance between ends of the first and second surfaces in the first direction is longer than a distance between centers of the first and second surfaces in the first direction; the first and second surfaces have corners each formed into an arcuate shape in a cross section; and a relationship between a height h in the first direction and a width w in a second direction perpendicular to the first direction is h≧w in a cross section of each of the first and second coil conductors. | 02-18-2016 |
20160049237 | ELECTRONIC COMPONENT - An electronic component includes a multilayer body including insulating layers stacked in a stacking direction, first and second linear conductors having different line widths and provided on a respective one of the insulating layers, and third and fourth linear conductors having different line widths and provided on a respective one of the insulating layers. The insulating layer(s) supporting the third and fourth linear conductors is/are at one side in the stacking direction of the insulating layer(s) supporting the first and the second linear conductors. In a planar view from the stacking direction, the first and the fourth linear conductors overlap each other, and the second and the third linear conductors overlap each other. The first, the second, the third and the fourth linear conductors are electrically connected to define a coil. | 02-18-2016 |
20160055957 | COMMON MODE FILTER AND MANUFACTURING METHOD THEREOF - A common mode filter and a method of manufacturing the same are disclosed. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer comprising a coil and an insulation layer and formed on the substrate to remove a signal noise; a magnetic compound layer laminated on the filter layer; an electrostatic electrode pattern formed on the magnetic compound layer to remove static electricity and having one portion thereof exposed to a lateral surface of the magnetic compound layer; a sealing layer laminated on the electrostatic electrode pattern so as to seal the electrostatic electrode pattern; and a lateral surface electrode connected with the exposed portion of the electrostatic electrode pattern and formed in a longitudinal direction between the sealing layer and the substrate. | 02-25-2016 |
20160055958 | PCB INTER-LAYER CONDUCTIVE STRUCTURE APPLICABLE TO LARGE-CURRENT PCB - For producing an inter-layer conductive structure of a circuit board, an insulating layer, a first conductive layer, a second conductive layer and an electric contact material are provided, wherein the insulating layer includes at least a conductive hole therein. The electric contact material is inserted into the conductive hole of the insulating layer to form a conductive plug, and the first and second conductive layers are laminated to opposite surfaces of the insulating layer, respectively. After lamination, the conductive plug has two ends thereof in electric contact with the first conductive layer and the second conductive layer, respectively. | 02-25-2016 |
20160071643 | COIL UNIT FOR POWER INDUCTOR, MANUFACTURING METHOD OF COIL UNIT FOR POWER INDUCTOR, POWER INDUCTOR AND MANUFACTURING METHOD OF POWER INDUCTOR - The present invention relates to a coil unit for a power inductor, a manufacturing method of a coil unit for a power inductor, a power inductor and a manufacturing method of a power inductor. The coil unit includes an insulating substrate and a coil pattern, wherein the coil pattern has a first plating part formed at least one surface among top and bottom surfaces of the insulating substrate, wherein a top side thereof has the shape of a taper and a second plating part formed to encompass the first plating part and to correspond to a shape of the first plating part. | 03-10-2016 |
20160078996 | COIL COMPONENT AND POWER SUPPLY APPARATUS INCLUDING THE SAME - A coil component includes a first coil part including a multilayer substrate on which a conductor pattern is formed, a second coil part formed as a wire and stacked together with the first coil part, a core coupled to the first and second coil parts while penetrating through the first and second coil parts to thereby be electromagnetically coupled to the first and second coil parts, and a pressing member interposed between the core and the second coil part to allow the first and second coil parts to closely adhere to each other. | 03-17-2016 |
20160086709 | EMBEDDED MAGNETIC COMPONENTS AND METHODS - Disclosed are apparatus and methods for a magnetic component. In accordance with an embodiment, a magnetic component comprises a base substrate defining a winding cup having a shape of a closed groove surrounding a hub. The winding cup defines a core space operable to receive a core therein. A first conductive pattern is disposed on at least a portion of the base substrate including the winding cup. A second substrate defines a second conductive pattern. The second substrate is coupled to the first base surface with the first conductive pattern in operable alignment with the second conductive pattern. The first and second conductive patterns are coupled in electrical communication so as to define one or more winding-type electric circuits surrounding the core space so as to induce a magnetic flux within the core space when the one or more electric circuits are energized by a voltage source. | 03-24-2016 |
20160086720 | CHIP ELECTRONIC COMPONENT - There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a≦15 μm and b/a≧7 are satisfied. | 03-24-2016 |
20160086721 | COIL UNIT FOR THIN FILM INDUCTOR, METHOD OF MANUFACTURING COIL UNIT FOR THIN FILM INDUCTOR, THIN FILM INDUCTOR, AND METHOD OF MANUFACTURING THIN FILM INDUCTOR - A coil unit for a thin film inductor includes an insulating material having double insulating layers of a first and a second insulating layers; and a plurality of coil patterns formed to be embedded in the insulating material. At least one coil pattern among the coil patterns has a thickness different from a thickness of rest of the coil patterns. | 03-24-2016 |
20160086723 | Low Profile Coupled Inductor Substrate with Transient Speed Improvement - A low profile inductor structure suitable for use in a high power density power converter has one or more windings formed by vias through a thin, generally planar body of magnetic material forming the inductor core and conductive cladding on the body of magnetic material or material covering the magnetic material body. Variation of inductance with load current and other operational or environmental parameters is reduced to any desired degree by forming a slot that removes all or a portion of the magnetic material between the locations of the vias. | 03-24-2016 |
20160086727 | ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - An electronic component and a board having the same are provided. The electronic component includes a multilayer body including a plurality of insulating layers with a bottom surface provided as a mounting surface and a top surface opposing the bottom surface; and external electrodes disposed on opposite end surfaces of the multilayer body in a length direction of the multilayer body. The multilayer body further includes a first protrusion portion disposed on the top surface, and second and third protrusion portions disposed on opposite side surfaces of the multilayer body in a width direction of the multilayer body, and a length of the first protrusion portion in the length direction is shorter than a length of the second and third protrusion portions in the length direction. | 03-24-2016 |
20160093431 | ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS - Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits. | 03-31-2016 |
20160099100 | CHIP COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a chip component and a manufacturing method thereof. The chip component includes: a ceramic body including a plurality of ceramic layers, each of which including external electrode patterns provided by filling intagliated recess portions with a conductive material, the intagliated recess portions being disposed to be spaced apart from one another; an internal coil unit positioned within the ceramic body and including internal conductive patterns disposed on the plurality of ceramic layers; and external electrodes, each of which is provided by connecting the external electrode patterns to each other. | 04-07-2016 |
20160104564 | CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There are provided a chip electronic component and aboard having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto. | 04-14-2016 |
20160104565 | ELECTRONIC COMPONENT - An electronic component includes a body formed of an insulator, a coil positioned in the body and including first and second coil conductors, an outer electrode including a first bottom-surface electrode and a first substantially columnar electrode (first electrode) and connected to the second conductor, and an outer electrode including a second bottom-surface electrode and a second substantially columnar electrode (second electrode) and connected to the first conductor. The second conductor is positioned between the first conductor and a bottom surface of the body. The second electrode is positioned to oppose the first electrode across the coil's central axis when viewed from the z-axis direction. An outermost peripheral portion of the first conductor is superposed with the first electrode when viewed from the z-axis direction. A smallest distance between the first conductor and a first side surface is smaller than that between the second conductor and a second side surface. | 04-14-2016 |
20160111193 | CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns | 04-21-2016 |
20160111194 | CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There is provided a chip electronic component including: an insulating substrate; a first internal coil part which is disposed on one surface of the insulating substrate; a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via, wherein when a width of each of a coil pattern of the first and second coil parts is a and a maximum width of each of the first and second via pads is b, 1≦b/a<2.3 is satisfied. | 04-21-2016 |
20160111195 | ELECTRONIC COMPONENT - An electronic component includes a body; a coil including a first coil conductor, a second coil conductor, and a via conductor; and an internal magnetic circuit provided on an inner peripheral side of the coil. The first coil conductor is formed of a plurality of straight portions and a plurality of arc-shaped portions and is substantially spiral shaped. A portion of the first coil conductor located furthermost toward the inner peripheral side is an arc-shaped first connection portion. The second coil conductor is formed of a plurality of straight portions and a plurality of arc-shaped portions and is substantially spiral shaped. A portion of the second coil conductor located furthermost toward the inner peripheral side is an arc-shaped second connection portion. An end of the via conductor is connected to the first connection portion and another end of the via conductor is connected to the second connection portion. | 04-21-2016 |
20160111196 | EMBEDDED MAGNETIC COMPONENT DEVICE - A magnetic core is situated in a cavity routed into an insulating substrate. The cavity and magnetic core are coved with a first insulating layer. Through holes are then formed through the first insulating layer and the insulating substrate, and plated to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a second set of the outer conductive vias, are spaced farther from the cavity than a first set, and have greater via hole diameter than the vias in the first set. This reduces the resistance of the windings for a given substrate size and improves the performance of the device. | 04-21-2016 |
20160111198 | NEAR-FIELD COMMUNICATIONS ELEMENT AND ELECTRONIC DEVICE HAVING SAME MOUNTED THEREIN - Near field communication device has a configuration in which at least a part of coil of coil element is covered with cover at a portion opposite to substrate and a part of cover is fixed to substrate directly or indirectly. Therefore, even when near field communication device is mounted to one of various electronic apparatuses in a vicinity of display unit outer peripheral frame made of metal, a large change in impedance or a large reduction in magnetic field strength can be prevented. As a result, a reduction in receiving sensitivity can be suppressed. | 04-21-2016 |
20160111199 | EMBEDDED MAGNETIC COMPONENTS AND METHODS - Disclosed are apparatus and methods for a magnetic component. In accordance with an embodiment, a magnetic component comprises a base substrate defining a winding cup having a shape of a closed groove surrounding a hub. The winding cup defines a core space operable to receive a core therein. A first conductive pattern is disposed on at least a portion of the base substrate including the winding cup. A second substrate defines a second conductive pattern. The second substrate is coupled to the first base surface with the first conductive pattern in operable alignment with the second conductive pattern. The first and second conductive patterns are coupled in electrical communication so as to define one or more winding-type electric circuits surrounding the core space so as to induce a magnetic flux within the core space when the one or more electric circuits are energized by a voltage source. | 04-21-2016 |
20160126001 | WIRELESS CHARGING COIL PCB STRUCTURE WITH SLIT - A wireless charging coil PCB structure with slit includes at least one coil is disposed on a printed circuit board (PCB), wherein a slit defined on a portion of the conductive wire of the coil. The slit is located at the center of the coil wires and extending parallel to the conductive wire of the coil to increase the distance between the coil turns of the wire winding, and to overcome the proximity effect between the coil wires, and to reduce the coil impedance as well as enhance the heat dissipation effect. | 05-05-2016 |
20160126003 | MULTILAYER INDUCTOR - A multilayer inductor includes: a body; and internal electrodes disposed within the body and connected to each other through conductive vias, wherein widths of the internal electrodes have two or more different values within a range of 35 μm to 55 μm, and the internal electrodes include a first internal electrode and a second internal electrode having a width different from that of the first internal electrode. | 05-05-2016 |
20160126005 | SURFACE-MOUNT INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - A surface-mount inductor having a molded body which includes a coil formed by winding a rectangular wire and sealed by sealant having resin and filler, a surface of the molded body being a mounting face, the coil includes: first rolls wound in two-roll arrangement along the winding axis, the ends of the wire being placed at the outermost turn; and second rolls wound in positions adjacent to the first rolls and oppositely shifted along the winding axis, the inner diameter being equal to or larger than the outer diameter of the first rolls, the ends of the wire are brought out from the outermost turn of the second rolls as lead ends which are sealed in a manner that the winding axis is parallel with the mounting face and the lead ends are partially exposed at the mounting face, as well as a method for manufacturing the same. | 05-05-2016 |
20160126007 | APPARATUS WITH 3D INDUCTORS - Embodiments of an apparatus are disclosed that includes a first three dimensional (3D) inductor and a second 3D inductor. The first three dimensional (3D) inductor has a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume. In addition, the second 3D inductor has a second conductive path, wherein the second 3D inductor is inserted into the first 3D inductor so that the second conductive path at least partially extends through the first 3D volume. Since second 3D inductor is inserted into the first 3D inductor, the 3D inductors may be coupled to one another. Depending on orientation and distances of structures provided by the 3D inductors, the 3D inductors may be weakly or moderately coupled. | 05-05-2016 |
20160126009 | WIRELESS CHARGING COIL PCB STRUCTURE - A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect. | 05-05-2016 |
20160133375 | COUPLING ON-DIE INDUCTORS FOR RADIO-FREQUENCY APPLICATIONS - A circuit includes a dielectric layer, a first via residing in the dielectric layer, a second via residing in the dielectric layer, and an inductor. The inductor includes a first inductor element and a second inductor element. The first inductor element is formed by a first transmission line including a plurality of segments defined between a first end and a second end thereof. The second inductor element is formed by a second transmission line including a plurality of segments defined between a first end and a second end thereof. A first port is defined by one segment of the plurality of segments of the second transmission line, wherein current flows in the inductor in the same direction from a second port defined at the first end of the first transmission line to the first port, and from the first port to a third port defined at the second via. | 05-12-2016 |
20160141089 | MULTILAYER INDUCTOR - A multilayer inductor providing improved DC superposition characteristics by a permanent magnet that emits a bias magnetic flux, and having a low-loss material as a magnetic body to improve converter conversion efficiency. The multilayer inductor has a plurality of laminated electrically insulating magnetic layers; and laminated conductive patterns, each of the conductive patterns being connected in sequence in the lamination direction forming a spiral coil inside the magnetic layer. An magnetized annular permanent magnet layer emits a magnetic flux whose direction is opposite that of a magnetic flux excited by the coil is between an outer peripheral edge of the inductor and an outer peripheral edge of the coil so as not to overlap an inner peripheral part of the magnet layer with the conductive patterns and so as to block a space between the conductive patterns and the magnet layer, in axial view of the coil. | 05-19-2016 |
20160141092 | COMPONENT ARRANGEMENT - Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier. | 05-19-2016 |
20160141093 | ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - An electronic component includes a body including internal electrodes; an insulating layer disposed on side surfaces of the body and at least one of an upper surface of the body and a lower surface of the body; and an external electrode disposed on an end surface of the body and connected to the internal electrodes. The external electrode extends to at least one of the upper surface of the body, the lower surface of the body, and the side surfaces of the body, and partially overlaps the insulating layer. | 05-19-2016 |
20160155558 | 3D Multipath Inductor | 06-02-2016 |
20160155559 | ELECTRONIC PACKAGE | 06-02-2016 |
20160163442 | ELECTRONIC COMPONENT - An electronic component comprises a magnetic body containing a magnetic metal powder; and internal coil parts embedded in the magnetic body and disposed on one surface and the other surface of an insulating substrate, respectively. A core part is disposed inwardly of the internal coil parts, and a through-hole penetrating through the magnetic body is disposed in a portion of the core part. | 06-09-2016 |
20160163444 | MULTILAYER SEED PATTERN INDUCTOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME - A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers. | 06-09-2016 |
20160163446 | COIL COMPONENT - A coil component capable of matching characteristic impedance (Zo) includes an insulating layer in which coil conductors are embedded; a first magnetic member disposed to be in contact with one surface of the insulating layer; and a second magnetic member having permeability lower than that of the first magnetic member and disposed to be in contact with the other surface of the insulating layer. An interval L | 06-09-2016 |
20160172096 | ELECTRONIC COMPONENT AND BOARD HAVING THE SAME | 06-16-2016 |
20160172099 | THREE-DIMENSIONAL PASSIVE COMPONENTS | 06-16-2016 |
20160181002 | POWER INDUCTOR AND METHOD OF MAUFACTURING THE SAME | 06-23-2016 |
20160181003 | EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING | 06-23-2016 |
20160181004 | EMBEDDED COIL ASSEMBLY AND PRODUCTION METHOD | 06-23-2016 |
20160181005 | TRANSFORMER AND ELECTRICAL CIRCUIT | 06-23-2016 |
20160189850 | MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A multilayer electronic component includes a multilayer body having a structure in which a plurality of insulation layers are stacked, and having first and second end surfaces opposing each other and first and second side surfaces connecting the first and second end surfaces to each other. An internal coil disposed in the multilayer body includes a plurality of internal coil patterns exposed to the first and second side surfaces of the multilayer body and vias penetrating through the insulation layers connecting the plurality of internal coil patterns to each other. First and second side parts cover at least portions of the first and second side surfaces of the multilayer body, respectively. | 06-30-2016 |
20160203904 | THIN FILM INDUCTOR WITH EXTENDED YOKES | 07-14-2016 |
20160203905 | COIL MODULE AND ELECTRONIC APPARATUS | 07-14-2016 |
20160254087 | Planar Transformer | 09-01-2016 |
20160254090 | EMBEDDED MAGNETIC COMPONENT | 09-01-2016 |
20160379745 | Magnetic Patterned Wafer Used for Production of Magnetic-Core-Inductor Chip Bodies and Methods of Making the Same - A magnetic patterned wafer used for production of magnetic-core-inductor chip bodies includes a peripheral end portion and at least one core chip unit that including a connecting portion, a breaking line, and a plurality of spaced apart chip bodies. The connecting portion is connected to the peripheral end portion and is spaced apart from the chip bodies by a tab-accommodating space. The breaking line has a plurality of connecting tabs that are spaced apart from one another and that are disposed in the tab-accommodating space. Each of the connecting tabs interconnects the connecting portion and a respective one of the chip bodies. The patterned wafer is made from a magnetic material. | 12-29-2016 |
20160379747 | VERTICAL INDUCTOR FOR WLCSP - Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace. | 12-29-2016 |
20160379748 | High Frequency Inductor Chip and Method of Making the Same - A high frequency inductor chip includes a core and a coil. The core is in the form of a single piece of a non-magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. A method for making the high frequency inductor chip is also disclosed. | 12-29-2016 |
20160379749 | Magnetic Core Inductor Chip and Method of Making the Same - A magnetic core inductor chip includes a core and a coil. The core is in the form of a single piece of a magnetic material. The coil is deposited on and surrounds the core and has structural characteristics indicative of the coil being formed on the core by deposition techniques. Methods for making the magnetic core inductor chip are also disclosed. | 12-29-2016 |
20170236634 | Monolithic Ceramic Component and Production Method | 08-17-2017 |
20170236635 | COIL COMPONENT | 08-17-2017 |
20190146339 | PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT | 05-16-2019 |
20190148044 | SOFT MAGNETIC METAL POWDER, METHOD FOR PRODUCING THE SAME, AND SOFT MAGNETIC METAL DUST CORE | 05-16-2019 |
20190148058 | INDUCTOR COMPONENT AND METHOD OF MANUFACTURING SAME | 05-16-2019 |
20190148059 | COMMON MODE CHOKE COIL | 05-16-2019 |