Class / Patent application number | Description | Number of patent applications / Date published |
264272140 | Plural electrical components | 24 |
20090108496 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode. | 04-30-2009 |
20090295027 | SYSTEM AND METHOD OF SEALING ELECTRICAL COMPONENTS IN A FRAME TRAY - Electrical components mounted onto a circuit board may be sealed within a frame tray upon the addition of a curable material that encapsulates the circuit board. The electrical components of the circuit board are positioned and sealed within the frame tray such that the cured material does not affect an airflow path which dissipates heat produced by the electrical components during use. The curing of the curable material shields the circuit board from moisture, dust and other environmental contaminates. | 12-03-2009 |
20100065983 | METHOD OF COMPRESSION-MOLDING LIGHT-EMITTING ELEMENTS - A method of compression-molding light emitting elements is provided, which can efficiently prevent the formation of a resin burr on a frame on which LED chips (light-emitting elements) are mounted. A tape for resin burr prevention is adhered to a surface of the frame, i.e. the surface on which no light-emitting element is mounted, to form a tape-applied frame. The tape-applied frame is supplied and set onto a setting section of an upper die, with the LED chips directed downwards. A required amount of transparent liquid resin material is dripped by a dispenser into a large cavity including small cavities. Then, both the upper and lower dies are clamped with a required clamping pressure, whereby the LED chips are individually immersed in the resin contained in the small cavities inside the large cavity and compression-molded to form a molded frame (light emitters). | 03-18-2010 |
20100109192 | METHOD FOR SEALING A COMPLEX SHAPE ELECTRONIC SENSOR BY LOW-PRESSURE INJECTION OF REACTIVE RESIN - A method of sealing, by low-pressure injection of reactive resin, an electronic sensor placed in a housing consisting of at least two attached elements, includes the following steps:
| 05-06-2010 |
20100155992 | MOLD RESIN MOLDING METHOD AND MOLD RESIN MOLDING APPARATUS - A mold resin molding method is provided with: providing a semiconductor device including a first wiring board and a second wiring board electrically connected to the first wiring board through a solder ball; providing a metal mold including a die plate which is independently provided to enable an approach/separation to/from the second wiring board; inserting the semiconductor device into a cavity of the metal mold; abutting the die plate on a surface side of the second wiring board through a release film; injecting a mold resin in a void between the first wiring board and the second wiring board while applying a first pressure from the die plate to the second wiring board; and further injecting the mold resin in the void while applying a second pressure which is higher than the first pressure from the die plate to the second wiring board. | 06-24-2010 |
20100264563 | ENCAPSULATION METHOD AND ENCAPSULATION APPARATUS FOR A FIELD CIRCUIT PROVIDED WITHIN A ROTOR BODY - The invention relates to a potting method and a device ( | 10-21-2010 |
20110156306 | IMPLANTABLE LEADS WITH A UNITARY SILICONE COMPONENT - A method of manufacturing a medical electrical lead includes molding a lead body pre-form, stringing an electrode onto the pre-form and overmolding the pre-form with a polymer to form a lead body portion. The pre-form has a proximal end, a distal end and at least one lumen extending between the proximal and distal ends. At least one asymmetric region of the pre-form has a transverse cross-section that has a non-circular outer dimension. The overmolding causes the asymmetric region to become substantially circular. | 06-30-2011 |
20120018920 | RESIN SUPPLY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a resin supply device is configured to supply granular resins to a resin mold device including a first mold provided with a cavity and a second mold mated to the first mold. The resin supply device includes a first mechanism and a second mechanism. The first mechanism is configured to juxtapose multiple granular resins on an adsorption surface by adsorbing the multiple granular resins on the adsorption surface larger than the granular resins, and form an adsorbed resin body with a uniform thickness. The adsorbed resin body is made of the adsorbed multiple granular resins on the adsorption surface. The second mechanism is configured to drop the multiple granular resins adsorbed on the adsorption surface into the cavity by adsorption-release of the adsorption surface. | 01-26-2012 |
20120161362 | Method for Producing an Electronic Component - A method for producing an electronic component includes: providing at least one carrier element having a microcomponent receptacle configured for contacting at least one microcomponent, injection molding a housing around the carrier element, the microcomponent receptacle being situated in a cavity of the housing that is open on at least one side, introducing the microcomponent into the microcomponent receptacle in the cavity to contact the microcomponent to the carrier element, and injecting the cavity using a filler material to fix the microcomponent in the housing and in the microcomponent receptacle. | 06-28-2012 |
20130062810 | INSERT MOLDING METHOD FOR CONNECTOR - To provide an insert molding method for a connector which enables terminals to be inserted easily into insertion destination places for the terminals. An insert-molding method for insert molding a connector | 03-14-2013 |
20130147088 | METHOD FOR FABRICATING BATTERY SHELL - A non-contact input apparatus for computer peripheral includes an induction module and a pointing module. The induction module includes an electric supply coil and an induction element, and the pointing module includes an energy coil and a non-linear element. The electric supply coil is used to send a first oscillation signal. The energy coil receives the first oscillation signal. The non-linear element converts the first oscillation signal to be a second oscillation signal having multiple higher harmonics. The induction element generates a control signal based on the second oscillation signal. | 06-13-2013 |
20130228951 | Wafer-Level Underfill and Over-Molding - A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes. | 09-05-2013 |
20130307184 | Implantable Medical Electrical Device Connector Module Assemblies and Methods - Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator. | 11-21-2013 |
20130307185 | METHOD AND PROCESS FOR MANUFACTURING A TERMINAL BLOCK - A method of manufacturing a terminal block for a telecommunication cable is disclosed, which includes: positioning at least one electrical connector in a mold, the at least one electrical connector comprising a first end adapted to receive a first electrical wire and a second end adapted to receive a second electrical wire; connecting at least one insulated electrical wire to the first end of each of the at least one electrical connectors; and injecting a dielectric material by a force of greater than 1 g into the mold containing the at least one electrical connector and the at least one electrical wire, wherein the dielectric material surrounds at least the first end of the electrical connector and the at least one electrical wire. | 11-21-2013 |
20130313753 | ELECTRIC TERMINALS SEALED WITH MICROENCAPSULATED POLYMERS - A method for sealing a terminal to a hole through a plastic body includes applying a microencapsulated polymer to a portion of the terminal that is to be sealed to the hole, the microencapsulated polymer including a plurality of microcapsules where each microcapsule includes a capsule wall with reactants within the capsule wall. The method also includes surrounding the portion of the terminal with the hole after applying the microencapsulated polymer. The capsule walls are ruptured to release the reactants and seal the terminal to the hole. | 11-28-2013 |
20130334736 | ELECTRONIC DEVICE CASE, EMTHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNCATIONS TERMINAL - An electronic device case having an antenna pattern embedded therein includes: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame. | 12-19-2013 |
20140048976 | METHOD AND SYSTEM FOR DETERMINING AND DISPENSING RESIN FOR A COMPRESSION MOLDING PROCESS FLOW - The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound. | 02-20-2014 |
20150130111 | Wafer-Level Underfill and Over-Molding - A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes. | 05-14-2015 |
20150322258 | RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC PARTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC PARTS, AND SEALED ELECTRICAL ELECTRONIC PARTS - Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D). | 11-12-2015 |
20150375432 | ARRANGEMENT FOR MANUFACTURING A HEAT WINDING CAP - The present disclosure relates to an arrangement for manufacturing a head winding cap of an electric machine, comprising a container for accommodating a moulding compound, the container is attachable to two winding arms adjacent to a clip connecting the winding arms and enclosing the winding arms, the container projecting perpendicular to the winding arms when attached, and the container creating a tight inclusion for the moulding compound, whereas the cap is filled with a dielectric compound. | 12-31-2015 |
20160005652 | INSERTABLE APERTURE MOLDING - Top and bottom ferrous carrier plates have a plurality of pairs of mating window cavities. Pairs of mating nonferrous pre-molded inserts with mating mold cavities snap into mating window cavities with a rubberized retainer ring therebetween to create floating mating pre-molded insert molds in multiple material carrier plate assemblies. Liquefied material is dispensed through pot bushings and plungers in each top pre-molded insert. The liquefied material flows though gate openings located in each insert top surface filling the mold cavities. The liquefied material then solidifies to its permanent shape in the mold cavities. | 01-07-2016 |
20160020572 | METHOD FOR MOLDING ELECTRICAL CONNECTOR - A method for molding an electrical connector, includes: S1: providing a row of first terminals, and integrally wrapping an insulating block on the first terminals by insert molding, wherein the insulating block wraps a part of each first terminal, and the insulating block and the row of first terminals together form a first terminal module; S2: providing a middle shielding sheet; and S3: integrally wrapping an insulating body around the middle shielding sheet and the first terminal module by insert molding. | 01-21-2016 |
20160105972 | ELECTRICAL PRODUCT MANUFACTURING METHOD - A method for preventing a molded body made of low melting point resin from being thermally damaged when external connection terminals provided on the molded body and external connection terminals provided on a flexible sheet are joined together via soldering. The method includes arranging the connection terminal of the molded body and the connection terminal of the flexible sheet such that the connection terminals face each other, and an electromagnetic induction heating performing electromagnetic induction heating after the arranging. | 04-14-2016 |
20160181755 | ELECTRICAL PLUGS WITH INTEGRATED STRAIN RELIEF AND METHOD OF MANUFACTURE | 06-23-2016 |