Class / Patent application number | Description | Number of patent applications / Date published |
257793000 | Including epoxide | 35 |
20080224334 | Molded Beam for Optoelectronic Sensor Chip Substrate - A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the shape of a trapezoid, “T” or “L”, and may be formed on the top or bottom surface of the substrate. | 09-18-2008 |
20080258318 | Semiconductor device - Disclosed herewith is a semiconductor device capable of suppressing the peeling-off that might occur between an island and a resin layer due to a difference of the shrinkage between those items, thereby the reliability of the semiconductor device is improved. The semiconductor device of the present invention includes an island, a semiconductor chip mounted on the island, and a resin layer that seals the island and the semiconductor chip respectively. And at the interface between the island and the resin layer is provided a buffer film having an elastic modulus lower than that of the resin layer. | 10-23-2008 |
20090096114 | Epoxy Resin Composition and Semiconductor Device - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 04-16-2009 |
20090166897 | ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR DEVICE MADE WITH THE SAME, AND PROCESS FOR PRODUCING THE SAME - An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at most 5 gf/5 mmφ, and the melt viscosity at 130° C. is at least 0.01 Pa·s and at most 1.0 Pa·s; a preapplied encapsulated component and semiconductor device using the composition, and a process of fabrication thereof. The resin composition is less susceptible to air entrapment during provisional placement of semiconductor chips, and excels in workability and reliability. | 07-02-2009 |
20090230570 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME - The present invention provides a resin composition for sealing a semiconductor device. The resin composition is in liquid state at room temperature, and can be supplied from a dispenser. The composition is advantageous in regard to molding time, viscosity, moldability and adhesion. This resin composition indispensably comprises a bisphenol type epoxy resin having a polymerization degree of 3 or less, a particular phenol resin or a particular acid anhydride, a catalyst (A) such as 1-cyanoethyl-2-undecylimidazolium trimellitate, a catalyst (B) such as 1-cyanoethyl-2-ethyl-4-methylimidazol, and spherical fused silica particles. The weight ratio (A/B) between the catalysts (A) and (B) is in the range of 9/1 to 4/6. | 09-17-2009 |
20090261484 | LIQUID RESIN COMPOSITION, SEMI-CONDUCTOR DEVICE, AND PROCESS OF FABRICATING THE SAME - A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part. | 10-22-2009 |
20100148379 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME - An epoxy resin composition for semiconductor encapsulation, which comprises: (A) an epoxy resin having at least two epoxy groups in a molecule thereof; (B) a compound having at least two phenolic hydroxyl groups in a molecule thereof; and (C) particles of a compound represented by general formula (1), the particles having a maximum particle diameter of not greater than 30 μm and a standard deviation of not greater than 5 μm, the particles being dispersed in the epoxy resin composition: | 06-17-2010 |
20100148380 | THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: | 06-17-2010 |
20100164127 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof. | 07-01-2010 |
20100308477 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, which includes the following components (A) to (E): (A) a bifunctional epoxy resin, (B) a curing agent, (C) an imidazole compound represented by the formula (1), in which R | 12-09-2010 |
20110163461 | ELECTRONIC PACKAGING - Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1): wherein R | 07-07-2011 |
20110198762 | PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC - A method of panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die units in place, which are then encapsulated. The cured dielectric film is then patterned utilizing a mask-less patterning technique. | 08-18-2011 |
20110241228 | EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF - An epoxy resin composition for a underfilling of a semiconductor comprising an epoxy resin, an acid anhydride, a curing accelerator and a flux agent as essential components, wherein the curing accelerator is a quaternary phosphonium salt, as well as a semiconductor device and manufacturing method employing the same. | 10-06-2011 |
20110241229 | ENCAPSULATED NANOPARTICLES - In various embodiments, the present invention relates to production of encapsulated nanoparticles by dispersing said nanoparticles and an encapsulating medium in a common solvent to form a first solution system and applying a stimulus to said first solution system to induce simultaneous aggregation of the nanoparticles and the encapsulating medium. | 10-06-2011 |
20110272829 | EPOXY RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL-SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for optical-semiconductor element encapsulation, including the following ingredients (A), (B) and (C): (A) an epoxy resin; (B) a curing agent including a phenol resin (b1) represented by the following general formula (1), and an acid anhydride (b2) in which R represents -phenyl- or -biphenyl-, and n is 0 or a positive integer; and (C) a curing accelerator, in which a ratio between the number of hydroxyl groups of the ingredient (b1) and the number of hydroxyl groups of the ingredient (b2), in the ingredient (B) is 99.99/0.01 to 50/50 in terms of b1/b2. | 11-10-2011 |
20120001350 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C≧4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 01-05-2012 |
20120061861 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 03-15-2012 |
20120074599 | METHOD OF FORMING WAFER LEVEL MOLD USING GLASS FIBER AND WAFER STRUCTURE FORMED BY THE SAME - According to example embodiments, a wafer level mold may be formed by a method including attaching a substrate to a lower side of a wafer on which a semiconductor chip is arranged, applying molding liquid to an upper and at least one lateral side of the semiconductor chip and an upper side of the wafer where the semiconductor chip is not arranged, loading a fiber onto the applied liquid, forming a mold layer by compression-molding and curing the liquid loaded with the fiber, and separating the substrate from the wafer. | 03-29-2012 |
20120080810 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer. | 04-05-2012 |
20120153513 | THERMOSETTING ENCAPSULATION ADHESIVE SHEET - A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device ( | 06-21-2012 |
20120168969 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH AN ENCAPSULANT PREPARED FROM THE COMPOSITION - An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device, the composition including an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an additive, wherein the epoxy resin includes an epoxy resin represented by Formula 1: | 07-05-2012 |
20120181710 | Semiconductor Chip and Method for Fabricating the Same - A semiconductor chip includes a first main face and a second main face opposed to the first main face. Side faces connect the first and second main faces. The side faces are at least partially covered with an anti-EBO compound and/or a surface energy reducing compound. | 07-19-2012 |
20120199992 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MOLD RELEASING AGENT - Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an α-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms. | 08-09-2012 |
20120319306 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME - Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation. | 12-20-2012 |
20130062790 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler; (D) a compound represented by the following formula (1) in which R | 03-14-2013 |
20130099396 | WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE - A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation. | 04-25-2013 |
20130119564 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 05-16-2013 |
20130127071 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; (D) an inorganic filler; (E) a hydrotalcite compound; and (F) a carboxyl group-containing wax having an acid value of 10 to 100 mg KOH/g. | 05-23-2013 |
20130134610 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 05-30-2013 |
20130187296 | RESIN COMPACT, METHOD FOR PRODUCING RESIN COMPACT, RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE - The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity. | 07-25-2013 |
20140008822 | LIQUID COMPRESSION MOLDING ENCAPSULANTS - Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials. | 01-09-2014 |
20150035175 | ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): | 02-05-2015 |
20150054180 | RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME - The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition. | 02-26-2015 |
20160056086 | Temporary Bonding Scheme - A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer. | 02-25-2016 |
20160099190 | UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF THERMAL EXPANSION AND TENSILE MODULUS - Embodiments of the present disclosure are directed toward underfill material including block copolymer. In one embodiment, an underfill material includes epoxy material and a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material. | 04-07-2016 |