Class / Patent application number | Description | Number of patent applications / Date published |
257791000 | Including polysiloxane (e.g., silicone resin) | 45 |
20090051053 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS - The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties. According to the present invention, there is provided an epoxy resin composition for semiconductor encapsulation which comprises, as essential components, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m | 02-26-2009 |
20090091045 | Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device - A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2). The content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol %: | 04-09-2009 |
20090146323 | RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYALUMINOSILOXANE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME - The present invention relates to a resin for optical-semiconductor-element encapsulation which comprises a polyaluminosiloxane obtained by reacting a silicon compound with an aluminum compound, and an optical semiconductor device obtained with the resin. The resin has satisfactory light-transmitting properties and low hygroscopicity and suffers no discoloration when used at a high temperature. | 06-11-2009 |
20090146324 | Phenoxyphenyl polysiloxane composition and method for making and using same - A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed. | 06-11-2009 |
20090236759 | CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE - A curable silicone rubber composition, comprising: (A) an organopolysiloxane containing two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, (C) a metal-based condensation reaction catalyst, (D) a platinum group metal-based addition reaction catalyst, and (E) an adhesion-imparting agent, wherein among the refractive indices of component (A), a mixture of component (A) and component (B), and component (E), the difference between the maximum refractive index and the minimum refractive index is not more than 0.03. | 09-24-2009 |
20100019399 | POLYORGANOSILOXANE COMPOSITION - Disclosed is a polyorganosiloxane composition containing the following components (a)-(c). (a) 100 parts by mass of a polyorganosiloxane obtained by mixing at least one silanol compound represented by the general formula (1) below, at least one alkoxysilane compound represented by the general formula (2) below, and at least one catalyst selected from the group consisting of compounds represented by the general formula (3) below, compounds represented by the general formula (4) below and Ba(OH) | 01-28-2010 |
20100123259 | PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition comprising a photosensitive silicone compound of specified molecular weight having any of specified photosensitive substituents and a photopolymerization initiator in any of specified proportions is used. Thus, there can be obtained a resin composition containing a photosensitive silicone compound that provides a material suitable for a rewiring layer or a buffer coat material of LSI chip, less in a film loss between before and after curing and improved in the stickiness of pre-exposure stage. Further, there can be obtained a resin insulating film utilizing the resin composition. | 05-20-2010 |
20100148378 | THERMOSETTING SILICONE RESIN COMPOSITION, SILICONE RESIN, SILICONE RESIN SHEET AND USE THEREOF - The present invention relates to a thermosetting silicone resin composition including a condensation reactable substituent group-containing silicon compound and an addition reactable substituent group-containing silicon compound; a silicone resin; a silicone resin sheet obtained from the thermosetting silicone resin composition or the silicone resin, and a use thereof. | 06-17-2010 |
20100213623 | Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby - A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching. | 08-26-2010 |
20100225010 | COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for a thermosetting silicone resin, the composition including: (A) an organohydrogenpolysiloxane; (B) an alkenyl group-containing epoxy compound; (C) an alkenyl group-containing cyclic siloxane; and (D) a hydrosilylation catalyst, a thermosetting silicone resin composition obtained by reacting the composition and a production method thereof, a photosemiconductor element-encapsulating material including the thermosetting silicone resin composition, and a photosemiconductor device including a photosemiconductor element encapsulated with the resin composition or the photosemiconductor element-encapsulating material. | 09-09-2010 |
20110089580 | SEMICONDUCTOR DEVICE COMPRISING HIGH PERFORMANCE ENCAPSULATION RESINS - A semiconductor device comprising curable polyorganosiloxane composites is provided where the composites contain at least 0.1 wt % of the 4 | 04-21-2011 |
20110147955 | SILICONE RESIN COMPOSITION AND A CURED PRODUCT THEREOF - The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom, (C) a catalyst comprising a platinum group metal, (D) fine silicone particles, and (E) a (meth)acrylate compound. The present silicone resin composition cures in a short time to form a cured product having excellent adhesion strength with solder resists and copper substrates. | 06-23-2011 |
20110163460 | Thermally Conductive Silicone Composition And Semiconductor Device - A thermally conductive silicone composition comprises (A) an organopolysiloxane having a viscosity equal to or greater than 100 mPa·s at 25° C.; (B) aluminum powder having an average size of particles ranging from 0.1 to 100 μm; (C) zinc oxide powder having an average size of particles ranging from 0.05 to 50 μm; (D) (i) an organopolysiloxane containing univalent hydrocarbon groups which have unsaturated aliphatic bonds, (ii) an organopolysiloxane containing hydrocarbon groups which are free of unsaturated aliphatic bonds, or a mixture of constituents (i) and (ii); and (E) a silane compound or a product of partial hydrolyzation and condensation of said silane compound. The composition has high conductivity and excellent handleability. | 07-07-2011 |
20110227235 | Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device - A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition. | 09-22-2011 |
20110272828 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following ingredients A to E: A: an epoxy resin; B: a silicone mixture containing the following ingredients b1 and b2, with a weight ratio of the ingredients b1 and b2 being from 5/95 to 25/75 in terms of b1/b2: b1: a silicone compound having an amino group in both ends thereof and having a weight average molecular weight of from 600 to 900, and b2: a silicone compound having an amino group in both ends thereof and having a weight average molecular weight of from 10,000 to 20,000; C: a phenol resin; D: a curing accelerator; and E: an inorganic filler containing the following ingredients e1 and e2: e1: a crystalline silica, and e2: a fused silica. | 11-10-2011 |
20120038066 | ENCAPSULATION METHODS AND DIELECTRIC LAYERS FOR ORGANIC ELECTRICAL DEVICES - The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices. | 02-16-2012 |
20120126435 | CURABLE COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION - Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst. | 05-24-2012 |
20120139132 | OLEFIN COMPOSITION - Provided are an olefin composition, filler and an optoelectronic device. One illustrative olefin composition may be effectively used as a filling material for various optoelectronic devices. | 06-07-2012 |
20120153512 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE OBTAINED USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E):(A) an epoxy resin; (B) a phenol resin other than component (C); (C) a silane-modified phenol resin represented by Formula (1) as defined in the specification; (D) a curing accelerator; and (E) an inorganic filler; wherein the component (C) is contained in an amount of 0.8 to 30.0% by weight based on a total weight of organic components in the epoxy resin composition. | 06-21-2012 |
20120161339 | FIBER-CONTAINING RESIN SUBSTRATE, SEALED SUBSTRATE HAVING SEMICONDUCTOR DEVICE MOUNTED THEREON, SEALED WAFER HAVING SEMICONDUCTOR DEVICE FORMED THEREON, A SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - A fiber-containing resin substrate for collectively sealing a semiconductor devices mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor devices forming surface of a wafer having semiconductor devices formed thereon, includes: a resin-impregnated fiber base material obtained by impregnating a fiber base material with a thermosetting resin and semi-curing or curing the thermosetting resin; and an uncured resin layer containing an uncured thermosetting resin and formed on one side of the resin-impregnated fiber base material. There can be a fiber-containing resin substrate that enables suppressing warp of a wafer and delamination of semiconductor devices even though a large-diameter wafer or a large-diameter substrate made of a metal and the like is sealed, enables collectively sealing a semiconductor devices mounting surface of the substrate or a semiconductor devices forming surface of the wafer, and has excellent heat resistance or moisture resistance after sealing. | 06-28-2012 |
20120193817 | EPOXY RESIN COMPOSITION, DIE ATTACH METHOD USING SAME, AND SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT THEREOF - An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 μm, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product. | 08-02-2012 |
20120306107 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET - A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without containing an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation inhibitor. | 12-06-2012 |
20130099395 | SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE - A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. | 04-25-2013 |
20130105997 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET | 05-02-2013 |
20130105998 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING EACH | 05-02-2013 |
20130134609 | Curable Organopolysiloxane Composition And Optical Semiconductor Device - A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness. | 05-30-2013 |
20130154130 | METHOD FOR COATING AN OPTOELECTRONIC CHIP-ON-BOARD MODULE AND OPTOELECTRONIC CHIP-ON-BOARD MODULE - A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone. | 06-20-2013 |
20130193592 | Coating Method for an Optoelectronic Chip-on-Board Module - A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone. | 08-01-2013 |
20130241087 | SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME - A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus. | 09-19-2013 |
20130241088 | CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC DEVICE - A curable silicone resin composition is provided comprising (A) a linear organopolysiloxane having at least two aliphatic unsaturated radicals and optionally, an organopolysiloxane of branched or three-dimensional network structure, (B) an organohydrogenpolysiloxane having at least two SiH radicals and free of aliphatic unsaturation, (C) a hydrosilylation catalyst, and (D) silicone powder having an average particle size of 0.5-100 μm. The composition is suitable for LED encapsulation. | 09-19-2013 |
20130277867 | EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE - The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 μm or less, and the ratio of particles having a particle diameter in excess of 20 μm is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound. An electronic component device in which an electronic component is sealed by a cured product of the aforementioned epoxy resin composition for sealing is provided. | 10-24-2013 |
20140103546 | SILICONE POLYMERS WITH HIGH REFRACTIVE INDICES AND EXTENDED POT LIFE - Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions comprise a mixture of two silicone polymers, a catalyst, and an inhibitor for the catalyst. The preferred catalyst comprises platinum. Unlike prior art silicone systems, the inventive composition can be provided in a one-part form due to a substantially improved pot life. The compositions can be spin- or spray-applied, followed by baking to crosslink the polymers and form a cured layer. The inventive cured layers have high refractive indices and light transmissions. | 04-17-2014 |
20140124963 | SEMICONDUCTOR WAFERS RECRYSTALLIZED IN A PARTIALLY SURROUNDING THIN FILM CAPSULE - An original wafer, typically silicon, has the form of a desired end PV wafer. The original may be made by rapid solidification or CVD. It has small grains. It is encapsulated in a clean thin film, which contains and protects the silicon when recrystallized to create a larger grain structure. The capsule can be made by heating a wafer in the presence of oxygen, or steam, resulting in silicon dioxide on the outer surface, typically 1-2 microns. At least one support element supports the wafer at the time the capsule is provided and blocks only minimal surface area from contact with the film forming atmosphere. There may be a plurality of support elements, or a surface may provide such support. The capsule contains the molten material during recrystallization, and protects against impurities. Recrystallization may be in air. After recrystallization, the capsule is removed. | 05-08-2014 |
20140138857 | ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction. | 05-22-2014 |
20140217622 | Semiconductor Package Resin Composition and Usage Method Thereof - A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator. | 08-07-2014 |
20140291872 | Gel Having Improved Thermal Stability - A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form. | 10-02-2014 |
20140332987 | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF - Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound. | 11-13-2014 |
20150014867 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - Provided is a resin composition for encapsulation including: a curing resin; and an inorganic filler, in which the resin composition encapsulates a semiconductor element provided over a substrate and fills a gap between the substrate and the semiconductor element, and when a particle diameter at a cumulative frequency of 5% in order from the largest particle diameter in a volume particle diameter distribution of particles contained in the inorganic filler is represented by R | 01-15-2015 |
20150130086 | Gel Having Improved Thermal Stability - A gel has improved thermal stability and is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a phthalocyanine. The (D) phthalocyanine is present in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel has a hardness of less than about 1500 grams as measured after heat ageing at 225° C. for 1000 hours that is calculated as a weight required to insert a TA-23 probe into the gel to a depth of 3 mm. | 05-14-2015 |
20150315427 | HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING - The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal. | 11-05-2015 |
20150340299 | CURABLE RESIN COMPOSITION, AND CURED PRODUCT OF SAME - Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance, transparency, and flexibility and, in particular, offers superior reflow resistance and barrier properties to a corrosive gas. | 11-26-2015 |
20150344636 | Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device - The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) a straight-chain organopolysiloxane having at least two alkenyl groups and not having silicon-bonded hydrogen atoms in a molecule; (C) an organopolysiloxane having a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group; and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handling and processability and can form a cured product with a high refractive index and low gas permeability. | 12-03-2015 |
20160122586 | SILICONE RESIN, RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND MAKING METHOD - A silicone resin comprising constitutional units represented by formula (1) and having a Mw of 3,000-500,000 contains 10-50 wt % of (A-1) a first silicone resin having a silicone content of 10-40 wt % and (A-2) a second silicone resin having a silicone content of 50-80 wt %. A resin composition comprising the silicone resin can be formed in film form, and it possesses satisfactory covering or encapsulating performance to large size/thin wafers. The resin composition or resin film ensures satisfactory adhesion, low warpage, and wafer protection. The resin film is useful in wafer-level packages. | 05-05-2016 |
20160177055 | EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | 06-23-2016 |
20160187776 | COMPOUND FOR SEMICONDUCTOR PACKAGE, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR PACKAGE STRUCTURE THEREOF - A compound represented by Formula 1, a photosensitive resin composition including the compound represented by Formula 1, and a semiconductor package structure using the photosensitive resin are disclosed, wherein the Formula 1 is as follows, and n is an integer of 1 to 15: | 06-30-2016 |