Entries |
Document | Title | Date |
20080197514 | DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY - A semiconductor packaging stress relief technique with enhanced reliability. Reliability is enhanced over conventional post wirebond assembly die coating processes by forming a peripheral wall on the semiconductor die isolating the stress sensitive area from remaining area in the semiconductor die, and depositing die coat material constraining the flow of the die coat material in the stress sensitive area of the semiconductor die. The peripheral wall, by constraining flow of the die coat material, prevents stress on the package bond wires caused by mismatch in coefficient of thermal expansion between the die coat and the package bond wires which are encased in the plastic molding compound. | 08-21-2008 |
20080211115 | Semiconductor structure and an apparatus and a method for producing a semiconductor structure - In a method of forming an insulating layer on a silicon substrate, the silicon substrate is arranged inside a process chamber. An oxide layer is formed on the substrate's surface. An electrical field is applied and an oxygen particles containing plasma is provided above the substrate's surface. The electrical field accelerates the oxygen particles in the direction of the surface so that the oxygen particles penetrate inside the substrate and form said oxide layer. Thereafter, the stoichiometry of the oxide layer is modified. A nitrogen particles containing plasma is provided above the substrate's surface. The electrical field accelerates the nitrogen particles in the direction of the surface so that the nitrogen particles penetrate inside the oxide layer and modify the stoichiometry of the oxide layer. The step of forming the oxide layer and the step of modifying the stoichiometry are carried out inside the same process chamber. | 09-04-2008 |
20080237896 | Wafer level packages capable of reducing chipping defect and manufacturing methods thereof - A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate. | 10-02-2008 |
20080237897 | Microelectronic device having liquid crystalline epoxy resins - Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140° C. and may be liquid crystalline at a temperature greater than 150° C. | 10-02-2008 |
20080265444 | THIN-FILM ALUMINUM NITRIDE ENCAPSULANT FOR METALLIC STRUCTURES ON INTEGRATED CIRCUITS AND METHOD OF FORMING SAME - An aluminum nitride (AlN) thin-film is applied over thin-film metallic circuitry such as an environmental sensor, on the side edges of electrode pads, and/or over some or all of the surface area of a substrate. The thin-film acts to protect the encapsulated structures from exposure to oxidation and from reducing and vacuum environments, electrically insulates the encapsulated structures from other structures, and helps to securely adhere the structures to the substrate surface. The AlN thin-film can also enable multiple IC layers to be stacked on top of each other, with AlN thin-film interlayers employed between IC layers such that each IC layer is separated and electrically insulated from adjacent layers. | 10-30-2008 |
20080277805 | Semiconductor Device - Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250° C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like. | 11-13-2008 |
20090051052 | Semiconductor device - A semiconductor device includes a molding resin layer and a semiconductor element encapsulated with the molding resin layer. The molding resin layer has an opening. A surface of the semiconductor element is partially exposed outside the molding resin layer through the opening. A groove is located in the surface of the semiconductor element around the opening of the molding resin layer. The groove is filled with the molding resin layer to produce anchor effect that enhances adhesive force of the molding resin layer to the surface of the semiconductor element around the opening. | 02-26-2009 |
20090283922 | INTEGRATING HIGH STRESS CAP LAYER IN HIGH-K METAL GATE TRANSISTOR - In some embodiments an etchstop layer is deposited over a transistor that has been encapsulated by a high-K film, a silicon nitride is deposited over the deposited etchstop layer, the silicon nitride is removed, and the etchstop layer is removed. Other embodiments are described and claimed. | 11-19-2009 |
20100001415 | LIQUID EPOXY RESIN COMPOSITION - A liquid epoxy resin composition comprising
| 01-07-2010 |
20100044888 | BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT - A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature. | 02-25-2010 |
20100164126 | RESIN COMPOSITION, RESIN SPACER FILM, AND SEMICONDUCTOR DEVICE - The present invention provides a resin composition. The resin composition is used for a resin spacer provided in a semiconductor device. The semiconductor device comprises of a substrate, a semiconductor element mounted on an interposer so as to face the substrate, and the resin spacer provided between the substrate and the interposer or the semiconductor element for bonding them together in a state that a space is formed between the substrate and the semiconductor element. The resin composition comprises an alkali solubility resin, a photopolimerization resin, and a particulate filler. An average particle size of the particulate filler is in the range of 0.05 to 0.35 μm. An amount of the particulate filler contained in the resin composition is in the range of 1 to 40 wt %. Further, the present invention also provides a resin spacer film. The resin spacer film is constituted of the resin composition described above. | 07-01-2010 |
20100176517 | Electronic device - Differences in contraction forces of a sealing resin can be alleviated and strain on a package can be reduced even when electronic components are unevenly positioned on a substrate. An electronic device ( | 07-15-2010 |
20100193971 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM, AND SEMICONDUCTOR DEVICE - A positive photosensitive resin composition for spray coating of the present invention is used for forming a coating film onto a substrate such as a semiconductor element mounting substrate, a ceramics substrate or an aluminium substrate by spray coating. The positive photosensitive resin composition is characterized by containing (A) an alkali soluble resin, (B) a compound which generates an acid by the action of light and (C) a solvent, and having a viscosity of 2 to 200 cP. | 08-05-2010 |
20100201003 | Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture - Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first electronic component. | 08-12-2010 |
20100201004 | CARBON/EPOXY RESIN COMPOSITION AND METHOD OF PRODUCING A CARBON-EPOXY DIELECTRIC FILM USING THE SAME - A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition. | 08-12-2010 |
20100213622 | SEMICONDUCTOR DEVICE - A semiconductor device carries a semiconductor component on a substrate and having an underfill resin applied in a gap between the substrate and the semiconductor component. The semiconductor device comprises: a lyophilic area in a portion of a region of one or both of the substrate and the semiconductor component which is in contact with the underfill resin. The lyophilic area is processed to exhibit lyophilicity with respect at least to the liquid underfill resin in comparison with an ambient region of the lyophilic area. | 08-26-2010 |
20100244285 | Semiconductor device and method of manufacturing the same - In a semiconductor device, corner portions of a inner insulating film are chamfered, and hence a damage is less likely to reach the corner portion of the inner insulating film, though the corner portion of an outer insulating film is damaged. Therefore, a hermeticity of a semiconductor element can be effectively maintained, and the yield of semiconductor pellets can be improved. Moreover, since it is not necessary to chamfer the corner portion of the outer insulating film, the structure remains simple and the productivity can be improved. | 09-30-2010 |
20110037181 | UNDERFILL METHOD AND CHIP PACKAGE - A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material. | 02-17-2011 |
20110121469 | PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INTEGRITY IN PACKAGED ASSEMBLIES - A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material. | 05-26-2011 |
20110221077 | WATER REPELLANT COMPOSITION FOR SUBSTRATE TO BE EXPOSED, METHOD FOR FORMING RESIST PATTERN, ELECTRONIC DEVICE PRODUCED BY THE FORMATION METHOD, TREATMENT METHOD FOR IMPARTING WATER REPELLENCY TO SUBSTRATE TO BE EXPOSED, WATER REPELLANT SET FOR SUBSTRATE TO BE EXPOSED, AND TREATMENT METHOD FOR IMPARTING WATER REPELLENCY TO SUBSTRATE TO BE EXPOSED USING THE SAME - It is an object of the present invention to provide a water repellant composition for a substrate to be exposed which inhibits the back side of a substrate to be exposed from being contaminated by an immersion liquid, can improve adhesion between a film to be processed and an organic film directly overlying that film to inhibit film peeling, and has excellent workability, a method for forming a resist pattern, an electronic device produced by the formation method, a treatment method for imparting water repellency to a substrate to be exposed, a water repellent set for a substrate to be exposed, and a treatment method for imparting water repellency to a substrate to be exposed using the same. A water repellent composition for a substrate to be exposed including at least an organosilicon compound represented by the following general formula (1) and a solvent is used. | 09-15-2011 |
20110254178 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance. | 10-20-2011 |
20110260342 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - Disclosed is a granular resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, satisfying the following requirements (a) to (c) on condition that ion viscosity is measured with a dielectric analyzer under a measurement temperature of 175° C. and a measurement frequency of 100 Hz:
| 10-27-2011 |
20110272827 | Adhesive Flexible Barrier Film, Method Of Forming Same, And Organic Electronic Device Including Same - An adhesive flexible barrier film comprises a substrate and a barrier layer disposed on the substrate. The barrier layer is formed from a barrier composition comprising an organosilicon compound. The adhesive flexible barrier film also comprises an adhesive layer disposed on the barrier layer and formed from an adhesive composition. A method of forming the adhesive flexible barrier film comprises the steps of disposing the barrier composition on the substrate to form the barrier layer, disposing the adhesive composition on the barrier layer to form the adhesive layer, and curing the barrier layer and the adhesive layer. The adhesive flexible barrier film may be utilized in organic electronic devices. | 11-10-2011 |
20110309530 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free. | 12-22-2011 |
20120025405 | LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME - Disclosed is a liquid encapsulating resin composition containing an epoxy resin (A), an amine type curing agent (B), and a basic compound (C), wherein, in case that the liquid encapsulating resin composition is filled between a semiconductor element and a substrate connected to each other by solder bumps, the residue of a fluxing agent used for forming the solder bump connection is removed. | 02-02-2012 |
20120032355 | ENCAPSULATION FILM, PACKAGE STRUCTURE UTILIZING THE SAME, AND METHOD FOR FORMING THE PACKAGE STRUCTURE - Disclosed is an encapsulation film. An inorganic oxide film is formed on an organic sealing layer by an atomic layer deposition (ALD) to form the encapsulation film, wherein the organic sealing layer is a polymer containing hydrophilic groups. The organic sealing layer and the inorganic oxide layer have covalent bondings therebetween. The encapsulation film can solve the moisture absorption problem of conventional organic sealing layers, thereby being suitable for use as a package of optoelectronic devices. | 02-09-2012 |
20120056338 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER - The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other. | 03-08-2012 |
20120074598 | CHIP, METHOD FOR PRODUCING A CHIP AND DEVICE FOR LASER ABLATION - In various embodiments, a chip may include a substrate; a coating, the coating covering the substrate at least partially and the coating being designed for being stripped at least partially by means of laser ablation; wherein between the substrate and the coating, a laser detector layer is arranged at least partially, the laser detector layer being designed for generating a detector signal for ending the laser ablation. | 03-29-2012 |
20120126434 | LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME - Disclosed are a liquid resin composition which contains a (A) liquid epoxy resin, (B) an amine hardener, (C) core-shell rubber particles, and (D) an inorganic filler, wherein the content of the solid components with respect to the total liquid resin composition is equal to or more than 65% by weight, and a semiconductor device using the liquid resin composition. | 05-24-2012 |
20120133059 | RADIATION CURABLE INK JET COMPOSITION, RECORDED MATTER, AND INK JET RECORDING METHOD - The invention provides a radiation curable ink jet ink composition including: a monomer equal to or more than 20% by mass and equal to or less than 50% by mass with respect to the total mass of the ink composition, which is represented by the following formula (I); and N-vinylcaprolactam equal to or more than 5% by mass and equal to or less than 15% by mass with respect to the total mass of the ink composition: | 05-31-2012 |
20120133060 | RADIATION-CURABLE INK JET COMPOSITION, RECORDING MATTER, AND INK JET RECORDING METHOD - A radiation-curable ink jet ink composition contains a polymerizable compound, an photopolymerization initiator and polysiloxane, in which the ink composition is used for recording on a package substrate as a recording medium; the polymerizable compound contains one or more kinds of compound having a pentaerythritol skeleton; an HLB value of the polysiloxane is 5 to 12; and the polysiloxane content is 0.1 to 2% by mass with respect to the total amount of the ink composition. | 05-31-2012 |
20120161338 | Printable Composition of a Liquid or Gel Suspension of Two-Terminal Integrated Circuits and Apparatus - An exemplary printable composition of a liquid or gel suspension of two-terminal integrated circuits comprises: a plurality of two-terminal integrated circuits, each two-terminal integrated circuit of the plurality of two-terminal integrated circuits less than about 75 microns in any dimension; a first solvent; a second solvent different from the first solvent; and a viscosity modifier; wherein the composition has a viscosity substantially about 50 cps to about 25,000 cps at about 25° C. | 06-28-2012 |
20120168968 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE, METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device, the composition including an epoxy resin; a curing agent; a curing accelerator; an inorganic filler; and a flame retardant; wherein the flame retardant includes boehmite, and is present in an amount of about 0.1 to 20% by weight (wt %), based on a total weight of the epoxy resin composition. | 07-05-2012 |
20120181709 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME - Disclosed is a photosensitive adhesive composition including:
| 07-19-2012 |
20120205822 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION - Disclosed are a resin composition for encapsulating a semiconductor containing a phenol resin (A), an epoxy resin (B) and an inorganic filler (C), wherein the phenol resin (A) contains a polymer (a1) having a structure represented by the general formula (1), and the epoxy resin (B) contains at least one kind of epoxy resin selected from the group consisting of a triphenol methane type epoxy resin, a naphthol type epoxy resin and a dihydroanthracene type epoxy resin, and a semiconductor device, obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. | 08-16-2012 |
20120256325 | SILICONE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION - A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst. | 10-11-2012 |
20120319305 | PROCESS FOR PRODUCING A SHEET OF A CIRCUIT SUBSTRATE - A process for producing a sheet of a circuit substrate which includes (i) providing a sheet for a circuit substrate which contains a layer of a polymer material of an energy ray hardening type for embedding circuit chips and is used for displays, the layer before being hardened by irradiating an energy ray having a storage modulus of 10 | 12-20-2012 |
20130026660 | LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME - A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) an epoxy resin, (B) an imidazole compound, and (C) a maleimide compound, a semiconductor device encapsulated by the liquid epoxy resin composition, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and a semiconductor die. | 01-31-2013 |
20130026661 | LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME - A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and semiconductor die. | 01-31-2013 |
20130026662 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler, and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30. | 01-31-2013 |
20130113122 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 05-09-2013 |
20130154129 | ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE SAME - A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst. | 06-20-2013 |
20130181361 | THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND ENCAPSULATED SEMICONDUCTOR DEVICE - A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable. | 07-18-2013 |
20130214435 | EPOXY ENCAPSULATING AND LAMINATION ADHESIVE AND METHOD OF MAKING SAME - An adhesive includes an epoxy resin and a hardener. The hardener includes trioxdiamine, diaminodicyclohexylmethane, toluene diamine, and bisphenol-A dianhydride. | 08-22-2013 |
20130241086 | CURABLE EPOXY RESIN COMPOSITION - Disclosed is a liquid curable epoxy resin composition which includes a cycloaliphatic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a silica (B); and a phosphite ester (C). The liquid curable epoxy resin composition preferably includes, for example, 5 to 80 parts by weight of the cycloaliphatic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; 20 to 95 parts by weight of the silica (B); and 0.001 to 5.0 parts by weight of the phosphite ester (C), per 100 parts by weight of the total amount of the components (A) and (B). | 09-19-2013 |
20130270720 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip. | 10-17-2013 |
20130300003 | Enhanced Hydrogen Barrier Encapsulation Method for the Control of Hydrogen Induced Degradation of Ferroelectric Capacitors in an F-RAM Process - A method of encapsulating a ferroelectric capacitor or ferroelectric memory cell includes forming encapsulation materials adjacent to a ferroelectric capacitor. forming a ferroelectric oxide (FEO) layer over the encapsulated ferroelectric capacitor, and forming an FEO encapsulation layer over the ferroelectric oxide to provide additional protection from hydrogen induced degradation. | 11-14-2013 |
20140138855 | PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) wafer; The wafer has a topside surface and an back-side surface, and a plurality of device die having electrical contacts on the topside surface. The method comprises back-grinding, to a thickness, the back-side surface the wafer. A protective layer of a thickness is molded onto the backside of the wafer. The wafer is mounted onto a sawing foil; along saw lanes of the plurality of device die, the wafer is sawed, the sawing occurring with a blade of a first kerf and to a depth of the thickness of the back-ground wafer. Again, the wafer is sawed along the saw lanes of the plurality of device die, the sawing occurring with a blade of a second kerf, the second kerf narrower than the first kerf, and sawing to a depth of the thickness of the protective layer. The plurality of device die are separated into individual device die. Each individual device die has a protective layer on the back-side, the protective layer having a stand-off distance from a vertical edge of the individual device die. | 05-22-2014 |
20140167295 | COATINGS FOR RELATIVELY MOVABLE SURFACES - A device comprises a MEMS component comprising at least one surface and a coating disposed on at least a portion of the surface. The coating comprises a compound of the formula M(C | 06-19-2014 |
20140217621 | ENCAPSULATION FILM - The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 08-07-2014 |
20140264957 | ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PACKAGES AND ITS EXTENDIBILITY AS A BARRIER MATERIAL FOR THERMAL AND SEALANT MATERIALS - Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. | 09-18-2014 |
20140264958 | SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF AND MOLDING COMPOUND - A semiconductor package is disclosed, which includes: a substrate body; a semiconductor element disposed on the substrate body; and a molding compound forms on the substrate body for encapsulating the semiconductor element. The molding compound contains a metal oxide so as to have a high insulation impedance and a high heat dissipating rate and be capable of suppressing electromagnetic interference. | 09-18-2014 |
20140264959 | HARDENING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC DEVICE USING THE SEALING MATERIAL - A hardening resin composition includes a base resin and a hardening agent. The base resin contains a maleimide compound having two or more maleimide groups in one molecule, and the hardening agent contains a diamine compound expressed by a general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. | 09-18-2014 |
20140367868 | SEALING COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POLYMER AND METHOD OF PRODUCING THE SAME - In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis. | 12-18-2014 |
20150325492 | SEMICONDUCTOR PACKAGE - A semiconductor package comprises an integrated device, a front side of a material A and a back side of a material B opposite to the front side. Side walls link the front side and the back side. Each side wall is coated with a coating material to at least 80% of its area, wherein the coating material is different from the material A and different from the material B. | 11-12-2015 |
20160126196 | PRINTED CIRCUIT MODULE HAVING A SEMICONDUCTOR DEVICE WITH A PROTECTIVE LAYER IN PLACE OF A LOW-RESISTIVITY HANDLE LAYER - A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and at least one deep well within the at least one device layer. A protective layer is disposed over the at least one deep well, wherein the protective layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 10 | 05-05-2016 |
20160149131 | COMPOSITION FOR ENCAPSULATION FILM, ENCAPSULATION FILM, AND ELECTRONIC DEVICE COMPRISING THE SAME (As Amended) - There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film. | 05-26-2016 |
20160181172 | COMPOSITIONS AND METHODS FOR SEMICONDUCTOR PROCESSING AND DEVICES FORMED THEREFROM | 06-23-2016 |
20190148251 | SEMICONDUCTOR DEVICE | 05-16-2019 |