Class / Patent application number | Description | Number of patent applications / Date published |
257696000 | Bent (e.g., J-shaped) lead | 11 |
20080308924 | Circuit Module Having Force Resistant Construction - Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably folded over compressible material to help absorb applied forces. A gap may be provided between sides of the die and the compressible material to help prevent peeling. A metal reinforcing layer may be bonded to the back of the die. A low modulus material including a patterned gap underneath the die may be used to absorb forces. A dry film adhesive may be placed between at least part of the upper surface of the die and the flexible circuit, preferably to provide further point impact resistance and protection. High and low modulus material may be combined in ruggedizing structures. Consumer devices employing such circuit modules are also taught, as well as module construction methods. | 12-18-2008 |
20090166845 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTENDED CORNER LEADS - An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge. | 07-02-2009 |
20090283897 | SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, AN ELECTRONIC DEVICE, METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE - A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion. | 11-19-2009 |
20110241198 | Power Semiconductor Module - In a power semiconductor module, a semiconductor device including electrode surfaces for connection on its front side and back side is connected on its back side to a first extraction electrode through soldering; a metal surface of one side of a laminated conductor having a laminated structure in which at least two types of metals are laminated is directly, intermetallically connected to the front side of the semiconductor device; a second extraction electrode is connected to a metal surface of another side of the laminated conductor through soldering; and the laminated conductor includes a plurality of arch-like protrusions and a straight section connecting the arch-like protrusions, the straight section is connected with the front side of the semiconductor device, and the protrusions are connected with the second extraction electrode. | 10-06-2011 |
20110260315 | POWER BLOCK AND POWER SEMICONDUCTOR MODULE USING SAME - A power block includes an insulating substrate, a conductive pattern formed on the insulating substrate, a power semiconductor chip bonded onto the conductive pattern by lead-free solder, a plurality of electrodes electrically connected to the power semiconductor chip and extending upwardly away from the insulating substrate, and a transfer molding resin covering the conductive pattern, the lead-free solder, the power semiconductor chip, and the plurality of electrodes, wherein surfaces of the plurality of electrodes are exposed at an outer surface of the transfer molding resin and lie in the same plane as the outer surface, the outer surface being located directly above the conductive pattern. | 10-27-2011 |
20120061816 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Provided are a semiconductor package and method of fabricating the same. The package includes an interconnection substrate, a semiconductor chip mounted on the interconnection substrate, a lateral wire bonded on the interconnection substrate and configured to enclose a side surface of the semiconductor chip, and a metal layer disposed on the semiconductor chip and electrically connected to the lateral wire. | 03-15-2012 |
20130020695 | "L" Shaped Lead Integrated Circuit Package - Various aspects provide for bending a bending a lead frame of a semiconductor device package into a shape of an āLā and mounting the package on a substrate. A horizontal portion of the bent lead-frame is about parallel with a surface of the package. A vertical portion of the bent lead frame is configured to extend the horizontal portion beyond the surface of the package. A device may be mounted between the substrate and the package. | 01-24-2013 |
20130069217 | SEMICONDUCTOR DEVICE AND ELECTRODE TERMINAL - According to one embodiment, a semiconductor device includes a substrate, a semiconductor chip mounted on the substrate, an electrode electrically connected to the semiconductor chip, an electrode terminal having a first terminal at one end portion and a second terminal at the other end portion, and a case covering the substrate, the electrode, the first terminal and the second terminal, wherein the first terminal and the second terminal are bended to direct to a center portion and to be opposed each other in the case, and the first terminal and the second terminal are close to each other to be soldered with the electrode. | 03-21-2013 |
20130264699 | CONTACT ELEMENT, IN PARTICULAR A SOLDER TAB AND PHOTOVOLTAIC JUNCTION BOX WITH CONTACT ELEMENT, IN PARTICULAR A SOLDER TAB - A contact element ( | 10-10-2013 |
20130285232 | SEMICONDUCTOR PACKAGE MODULE - Disclosed herein is a semiconductor package module, including: a circuit board having connection pads formed on one surface thereof; a semiconductor package including lead terminals protruded out of a housing; and an interposer positioned between the circuit board and the semiconductor package, the interposer including a body allowing the circuit board and the semiconductor package to be spaced apart from each other and elastic members contacted with the connection pads and the lead terminals. | 10-31-2013 |
20140110832 | CO-SUPPORT CIRCUIT PANEL AND MICROELECTRONIC PACKAGES - A circuit panel can include contacts exposed at a connection site of a major surface thereof and configured to be coupled to terminals of a microelectronic package. The connection site can define a peripheral boundary on the major surface surrounding a group of the contacts that is configured to be coupled to a single microelectronic package. The group of contacts can include first, second, third, and fourth sets of first contacts. Signal assignments of the first and third sets of first contacts can be symmetric about a theoretical plane normal to the major surface with signal assignments of the respective second and fourth sets of first contacts. Each of the sets of first contacts can be configured to carry identical signals. Each of the sets of first contacts can be configured to carry address information sufficient to specify a location within a memory storage array of the microelectronic package. | 04-24-2014 |