Entries |
Document | Title | Date |
20080290430 | Stress-Isolated MEMS Device and Method Therefor - A stress-isolated MEMS device ( | 11-27-2008 |
20090261431 | PRE-RELEASED STRUCTURE DEVICE - A pre-released structure device comprising:
| 10-22-2009 |
20090261432 | Interconnection system on a plane adjacent to a solid-state device structure - An interconnection system is provided for a solid-state device. The solid-state that includes, a first layer, multiple devices and a first face. A second layer is bonded to the first face at a bonded face of the second layer that faces the first face. Electrically conductive bonds are between the first and second faces. Conductive paths are on the bonded face of the second layer and connect two or more of the conductive bonds. | 10-22-2009 |
20100109103 | MEMS PACKAGE - The invention provides a MEMS package including: a MEMS chip including a first surface, a second surface, a first cavity, and a sensing device, the sensing device defining a first end of the first cavity; a leadframe including a second cavity and being electrically connected to the first surface of the MEMS chip, the second cavity being adjacent to the sensing device of the MEMS chip; a conductive layer disposed on the second surface of the MEMS chip to define a second end of the first cavity and grounded via the leadframe that is electrically connected to the conductive layer so as to provide electromagnetic shielding to the MEMS chip; and an encapsulant covering the MEMS chip, the leadframe, and the conductive layer to define an shape of the MEMS package and allowing outer surfaces of the leadframe to emerge from the MEMS package. | 05-06-2010 |
20100148286 | CONTACT-FORCE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME - Provided are a contact-force sensor package and a method of fabricating the same. The contact-force sensor package includes an elastic layer comprising a side that contacts a source of a contact-force; and a substrate layer adhered to the opposing side of the elastic layer from the side that contacts the source of the contact-force and comprising a cantilever beam separated from the elastic layer and deformed due to the contact-force, a pillar extending from a free end portion of the cantilever beam to the elastic layer and transferring the contact-force from the elastic layer to the cantilever beam, and a deformation sensing element for generating an electrical signal that is proportional to a degree of deformation of the cantilever beam. | 06-17-2010 |
20100164026 | PREMOLD HOUSING HAVING INTEGRATED VIBRATION ISOLATION - A premold housing for accommodating a chip structure in which a part of the housing that is connected to the chip structure is connected in a manner that permits elastic deflection to another part of the housing which is attached to the supporting structure bearing the entire housing, the two housing parts not contacting one another. | 07-01-2010 |
20100219490 | SEMICONDUCTOR SENSOR AND METHOD OF MANUFACTURING THE SAME - A semiconductor sensor has a first semiconductor layer as a base, an insulating layer formed on the first semiconductor layer, and a second semiconductor layer formed on the insulating layer. A recess is formed from a bottom surface of the first semiconductor layer up to a top surface of the insulating layer. The second semiconductor layer is covered with the insulating layer in an outer circumference of a top surface of the recess. A sensitive region of the second semiconductor layer is exposed in a region except the outer circumference of the top surface of the recess. | 09-02-2010 |
20100301433 | Triple-Axis MEMS Accelerometer - An integrated circuit structure includes a triple-axis accelerometer, which further includes a proof-mass formed of a semiconductor material; a first spring formed of the semiconductor material and connected to the proof-mass, wherein the first spring is configured to allow the proof-mass to move in a first direction in a plane; and a second spring formed of the semiconductor material and connected to the proof-mass. The second spring is configured to allow the proof-mass to move in a second direction in the plane and perpendicular to the first direction. The triple-axis accelerometer further includes a conductive capacitor plate including a portion directly over, and spaced apart from, the proof-mass, wherein the conductive capacitor plate and the proof-mass form a capacitor; an anchor electrode contacting a semiconductor region; and a transition region connecting the anchor electrode and the conductive capacitor plate, wherein the transition region is slanted. | 12-02-2010 |
20100301434 | MEMS Devices and Methods of Manufacture Thereof - Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall. | 12-02-2010 |
20100320549 | Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices - Microelectromechanical systems (MEMS) packages, packaged MEMS devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. The method further may include forming a packaging layer above the chamber sacrificial layer. The method additionally may include forming one or more openings through the packaging layer. The method also may include removing the chamber sacrificial layer through the one or more openings. The method may include forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity. | 12-23-2010 |
20110012214 | MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT WITH CAVITY STRUCTURE AND METHOD FOR PRODUCING THE SAME - One aspect of the invention relates to a semiconductor component with cavity structure and a method for producing the same. The semiconductor component has an active semiconductor chip with the microelectromechanical structure and a wiring structure on its top side. The microelectromechanical structure is surrounded by walls of at least one cavity. A covering, which covers the cavity, is arranged on the walls. The walls have a photolithographically patterned polymer. The covering has a layer with a polymer of identical type. In one case, the molecular chains of the polymer of the walls are crosslinked with the molecular chains of the polymer layer of the covering layer to form a dimensionally stable cavity housing. | 01-20-2011 |
20110024852 | MEMS DEVICE AND MEMS SPRING ELEMENT - A micro electromechanical system (MEMS) spring element is disposed on a substrate, and includes a fixing portion and a moveable portion. The fixing portion is fixed on the substrate, and includes an insulating layer, a plurality of metal-fixing layers and a plurality of supporting-fixing layers. The insulating layer is disposed on the substrate. The metal-fixing layers are disposed above the insulating layer. The supporting-fixing layers are connected between the metal-fixing layers. The moveable portion has a first end and a second end. The first end is connected with the fixing portion, and the second end is suspended above the substrate. The moveable portion includes a plurality of metal layers and at least a supporting layer. The supporting layer is connected between the adjacent metal layers, and a hollow region is formed between the supporting layer and the adjacent metal layers. The deformation of the MEMS spring element generated because of the different thermal expansion may be avoided and the working performance of the MEMS spring element can be improved. | 02-03-2011 |
20110079864 | Low Profile Human Interface Device - A human interface device is provided, having a substrate. A strain sensitive die is coupled to the substrate wherein the die is capable of providing an electrical signal indicative of a force applied to the strain sensitive die. A force transfer element is positioned adjacent to the strain sensitive die and coupled to the strain sensitive die. A translation element is mechanically coupled to the force transfer element. An elastic element is at least partially surrounding the translation element and the force transfer element, wherein the elastic element provides the mechanical coupling between the translation element and the force transfer element. A force applied to the translation element causes stretching of the elastic element, wherein the stretching of the elastic element causes a force to be applied to the force transfer element; and wherein the force applied to the force transfer element by the elastic element is then applied to the strain sensitive die. | 04-07-2011 |
20110115038 | PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PHYSICAL QUANTITY SENSOR - A physical quantity sensor includes: the fixed arm section includes a first side surface insulating film disposed on a side surface of the laminate structure, a first side surface conductor film disposed on a surface of the first side surface insulating film, and a first connection electrode section provided to the upper insulating layer, and electrically connected to the first side surface conductor film, the movable arm section includes a second side surface insulating film disposed on a side surface of the laminate structure, a second side surface conductor film disposed on a surface of the second side surface insulating film, and a second connection electrode section provided to the upper insulating layer, and electrically connected to the second side surface conductor film, and the first side surface conductor film and the second side surface conductor film are disposed so as to be opposed to each other. | 05-19-2011 |
20110127625 | RESONATOR - A resonator comprising a beam formed from a first material having a first Young's modulus and a first temperature coefficient of the first Young's modulus, and a second material having a second Young's modulus and a second temperature coefficient of the second Young's modulus, a sign of the second temperature coefficient being opposite to a sign of the first temperature coefficient at least within operating conditions of the resonator, wherein the ratio of the cross sectional area of the first material to the cross sectional area of the second material varies along the length of the beam, the cross sectional areas being measured substantially perpendicularly to the beam. | 06-02-2011 |
20110140214 | PATTERN ARRANGEMENT METHOD, SILICON WAFER AND SEMICONDUCTOR DEVICE - A pattern arrangement method including using a stepper to arrange a plurality of chip patterns arranged parallel to a first direction and a second direction on a silicon wafer using a reticule which includes a plurality of patterns expanded in the first direction and the second direction which intersects the first direction and arranged linearly and intermittently, wherein the stepper adjusts the position of the reticule and the silicon wafer which faces the reticule so that an axis in which a cleavage plane of the silicon wafer and a surface arranged with the pattern on the silicon wafer intersect, and the first direction are different. | 06-16-2011 |
20110147862 | MICROMECHANICAL COMPONENT HAVING AN INCLINED STRUCTURE AND CORRESPONDING MANUFACTURING METHOD - In a micromechanical component having an inclined structure and a corresponding manufacturing method, the component includes a substrate having a surface; a first anchor, which is provided on the surface of the substrate and which extends away from the substrate; and at least one cantilever, which is provided on a lateral surface of the anchor, and which points at an inclination away from the anchor. | 06-23-2011 |
20110147863 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element has a wiring pattern portion facing the sensor element. The wiring pattern portion connects an outer periphery of the surface of the sensor element and the sensor structure so that the sensor structure is electrically coupled with an external element via the outer periphery. The sensor element does not have a complicated multi-layered structure, so that the sensor element is simplified. Further, the dimensions of the device are reduced. | 06-23-2011 |
20110156180 | PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRICATION METHOD THEREOF - Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above. | 06-30-2011 |
20110169109 | CAPACITIVE SENSOR DEVICE AND A METHOD OF SENSING ACCELERATIONS - The invention relates to a capacitive sensor device | 07-14-2011 |
20110175179 | PACKAGE STRUCTURE HAVING MEMS ELEMENT - A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect. | 07-21-2011 |
20110175180 | Micrometer-scale Grid Structure Based on Single Crystal Silicon and Method of Manufacturing the Same - The present invention discloses a micrometer-scale grid structure based on single crystal silicon consists of periphery frame | 07-21-2011 |
20110186944 | Micromechanical Structure and Method for Setting the Working Gap Width of a Micromechanical Structure - A micromechanical structure, includes at least two structure sections configured to bound a working gap, the at least two structure sections being movable relative to one another, and a working gap width setting device configured to broaden the at least one working gap by movement of a first structure section of the at least two structure sections relative to a second structure section of the at least two structure section, the first structure section is stationary relative to a reference point during operation of the micromechanical structure and (ii) the second structure section is movable relative to the reference point during operation. | 08-04-2011 |
20110221015 | METHOD FOR PRODUCING AN ELECTRO-MECHANICAL MICROSYSTEM - A production method with release of movable mechanical parts of an electro-mechanical microsystem is disclosed. The method is characterized in that porous zones are formed on the front face of a first water of a semiconductor material. Patterns of a material able to constitute the movable mechanical parts of the electro-mechanical microsystem are then formed on the front face of the first water at the level of the porous zones and encapsulated in a sacrificial layer. Then a layer of a material withstanding an attack by a solvent of the sacrificial layer is deposited. The release of the movable mechanical parts is then executed by the rear face of the first water, through the porous zones, using a solvent of the sacrificial layer. | 09-15-2011 |
20110233694 | MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR - A manufacturing method of an electronic device package includes: forming concave portions that later form the cavities in one surface of a cover substrate; forming a first metal film on the cover substrate on a surface opposite to the surface in which the concave portions are formed; forming a second metal film on the cover substrate on the surface in which the concave portions are formed; bonding a base substrate and the cover substrate together via the second metal film. It thus becomes possible to provide an electronic device package in which the base substrate and the cover substrate are boned together via the metal film in a stable manner by minimizing warping of the substrate even when the substrate is made thinner. | 09-29-2011 |
20110298066 | MICRO STRUCTURE, MICRO ELECTRO MECHANICAL SYSTEM THEREWITH, AND MANUFACTURING METHOD THEREOF - A micro structure includes a base member; a supporting unit disposed on a surface of the base member; a graphene unit which covers at least a portion of the supporting unit and at least a portion of an empty space adjacent to the supporting unit; and a structure unit disposed on at least a portion of the graphene unit over the supporting unit. | 12-08-2011 |
20110316101 | PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a plurality of discrete wires on a substrate. The method further includes forming a sacrificial cavity layer on the discrete wires. The method further includes forming trenches in an upper surface of the sacrificial cavity layer. The method further includes filling the trenches with dielectric material. The method further includes depositing metal on the sacrificial cavity layer and on the dielectric material to form a beam with at least one dielectric bumper extending from a bottom surface thereof. | 12-29-2011 |
20120001277 | METHODS FOR MAKING IN-PLANE AND OUT-OF-PLANE SENSING MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) - A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate has a first major surface adjacent to the first insulating layer. The insulating layer is attached to the isolated conductive region. The conductive substrate is thinned to form a second conductive layer. A second opening is formed through the second conductive layer and the first insulating layer to the isolated conductive region. The second opening is filled with a conductive plug wherein the conductive plug contacts the isolated conductive region. The second conductive region is etched to form a movable finger over the isolated conductive region. A portion of the insulating layer under the movable finger is removed. | 01-05-2012 |
20120018821 | MICRO FORCE SENSOR PACKAGE FOR SUB-MILLINEWTON ELECTROMECHANICAL MEASUREMENTS - A force sensor package includes the following main parts: a MEMS force sensor, an interface circuit converting a change of capacitance into an analog or digital sensor output signal, and a substrate on which the MEMS force sensor and the IC are attached. The interface circuit is a die in order to minimize the size of the force sensor. The MEMS force sensor and the interface circuit are attached to the substrate by an adhesive, e.g. glue. Electrical contacts are then realized by wire-bonding. Alternatively, the two parts may also be attached to the substrate by a flip-chip process using solder. A protective cover may be placed over the assembly. | 01-26-2012 |
20120068277 | Semiconductor Manufacturing and Semiconductor Device with semiconductor structure - Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted. | 03-22-2012 |
20120068278 | PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE - The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode. | 03-22-2012 |
20120091547 | RESONATOR AND PRODUCTION METHOD THEREOF - A resonator using the MEMS technology is provided which improves the accuracy of a shape of electrodes so as avoid a short circuit that would otherwise be caused between input and output electrodes to thereby increase the reliability thereof. A resonator includes a substrate | 04-19-2012 |
20120126351 | Interconnection system on a plane adjacent to a solid-state device structure - A MEMS device is provided, which includes a silicon substrate with a face surface that has a pattern of recesses which define functional elements of the MEMS device, leaving sharp-edged, highly doped ridges, and a cover with a mating surface coupled to the face surface. The cover includes patterns of metal films that engage the ridges to form surface-to-surface electrical connections as well as hermetic surface-to-surface sealing and/or bonding between the silicon ridges of the face surface and the metal film on the mating surface, wherein the metal film on the mating surface comes into atomic contact with the silicon ridges. | 05-24-2012 |
20120133006 | OXIDE MEMS BEAM - In one embodiment, a semiconductor structure includes a beam positioned within a sealed cavity, the beam including: an upper insulator layer including one or more layers; and a lower insulator layer including one or more layers, wherein a composite stress of the upper insulator layer is different than a composite stress of the lower insulator layer, such that the beam bends. | 05-31-2012 |
20120235257 | VIBRATION TRANSDUCER - Vibration beams are provided on a substrate in parallel with the substrate and in parallel with each other, and provided in vacuum chambers formed by a shell and the substrate. Each of vibration beams has a sectional shape with a longer sectional thickness in a direction perpendicular to a surface of the substrate than a sectional thickness in a direction parallel to the surface of the substrate. A first electrode plate is provided in parallel with the surface of the substrate and connected to one end of each of the vibration beams. A second electrode plate is provided in parallel with the surface of the substrate and between the vibration beams. Third and fourth electrode plates are provided on opposite sides of the vibration beams. Asperities are provided in opposed side wall portion surfaces of the vibration beams and the second, third and fourth electrode plates. | 09-20-2012 |
20130099333 | MICRO-ELECTRO-MECHANICAL SYSTEM HAVING MOVABLE ELEMENT INTEGRATED INTO LEADFRAME-BASED PACKAGE - A MEMS may integrate movable MEMS parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, leaving the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package may be a leadframe-based plastic molded body having an opening through the thickness of the body. The movable part may be anchored in the body and extend at least partially across the opening. The chip may be flip-assembled to the leads to span across the foil, and may be separated from the foil by a gap. The leadframe may be a prefabricated piece part, or may be fabricated in a process flow with metal deposition on a sacrificial carrier and patterning of the metal layer. The resulting leadframe may be flat or may have an offset structure useful for stacked package-on-package devices. | 04-25-2013 |
20130134531 | FULLY EMBEDDED MICROMECHANICAL DEVICE, SYSTEM ON CHIP AND METHOD FOR MANUFACTURING THE SAME - A fully embedded micromechanical device and a system on chip is manufactured on an SOI-substrate. The micromechanical device comprises a moveable component having a laterally extending upper and lower surface and vertical side surfaces. The upper surface is adjacent to an upper gap which laterally extends over at least a part of the upper surface and results from the removal of a shallow trench insulation material. The lower surface is adjacent to a lower gap which laterally extends over at least a part of the lower surface and results from the removal of the buried silicon oxide layer. The side surfaces of the movable component are adjacent to side gaps which surround at least a part of the vertical side surfaces of the moveable component and result from the removal of a deep trench insulation material. | 05-30-2013 |
20130193535 | MICRO-ELECTROMECHANICAL DEVICE AND USE THEREOF - The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter. | 08-01-2013 |
20130270660 | SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS - One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit. | 10-17-2013 |
20130277777 | MEMS Device Structure and Methods of Forming Same - A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material. | 10-24-2013 |
20130307096 | HYBRID INTERGRATED COMPONENT - A hybrid integrated component including an MEMS element and an ASIC element is refined to improve the capacitive signal detection or activation. The MEMS element is implemented in a layered structure on a semiconductor substrate. The layered structure of the MEMS element includes at least one printed conductor level and at least one functional layer, in which the micromechanical structure of the MEMS element having at least one deflectable structural element is implemented. The ASIC element is mounted face down on the layered structure and functions as a cap for the micromechanical structure. The deflectable structural element of the MEMS element is equipped with at least one electrode of a capacitor system. At least one stationary counter electrode of the capacitor system is implemented in the printed conductor level of the MEMS element, and the ASIC element includes at least one further counter electrode of the capacitor system. | 11-21-2013 |
20130328143 | Semiconductor Manufacturing and Semiconductor Device with semiconductor structure - Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted. | 12-12-2013 |
20130334628 | PROCESS FOR MANUFACTURING ELECTRO-MECHANICAL SYSTEMS - A method of avoiding stiction during vapor hydrofluoride (VHF) release of a microelectromechanical system (MEMS) or nanoelectromechanical system (NEMS) composed of a mechanical device and a substrate is described. A silicon nitride layer is provided between the substrate and a sacrificial oxide layer and/or between a device layer and the sacrificial oxide layer, and/or on a side of the device layer facing away from the sacrificial oxide layer, and converted to thicker ammonium hexafluorosilicate with VHF while simultaneously removing a portion of the sacrificial oxide. The ammonium hexafluorosilicate acts as a temporary support, shim, wedge, or tether which limits device movement during fabrication and is later removed by sublimation under heat and/or reduced pressure. | 12-19-2013 |
20140015072 | ELECTRONIC DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME - The electronic device package includes a package substrate including a frame portion and a cantilever portion surrounded by the frame portion, at least one semiconductor chip mounted on the cantilever portion, and a molding member disposed on the package substrate to cover the at least one semiconductor chip. The cantilever portion has a first edge connected to the frame portion and declines from the first edge toward a second edge located opposite to the first edge. Related methods are also provided. | 01-16-2014 |
20140027868 | MECHANICAL QUANTITY MEASURING DEVICE - In a mechanical quantity measuring device ( | 01-30-2014 |
20140103467 | SENSOR DEVICE, MOTION SENSOR, AND ELECTRONIC DEVICE - A sensor device includes a first electrode disposed on active surface side of a silicon substrate, an external connecting terminal electrically connected to the first electrode, at least one stress relaxation layer disposed between the silicon substrate and the external connecting terminal, a connecting terminal disposed on the active surface side of the silicon substrate, and a vibration gyro element having weight sections as mass adjustment sections, the vibration gyro element is held by the silicon substrate due to connection between the connection electrode and the external connecting terminal, and a meltage protection layer formed in an area where the stress relaxation layer and the mass adjustment section overlap each other in a plan view is provided. | 04-17-2014 |
20140117475 | HYBRID INTEGRATED COMPONENT - A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap. | 05-01-2014 |
20140183672 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface. | 07-03-2014 |
20140231938 | MICRO-ELECTRO-MECHANICAL DEVICE WITH BURIED CONDUCTIVE REGIONS, AND MANUFACTURING PROCESS THEREOF - A MEMS device formed by a body; a cavity, extending above the body; mobile and fixed structures extending above the cavity and physically connected to the body via anchoring regions; and electrical-connection regions, extending between the body and the anchoring regions and electrically connected to the mobile and fixed structures. The electrical-connection regions are formed by a conductive multilayer including a first semiconductor material layer, a composite layer of a binary compound of the semiconductor material and of a transition metal, and a second semiconductor material layer. | 08-21-2014 |
20140332913 | MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURES AND DESIGN STRUCTURES - Dummy Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a bumper extending from a Micro-Electro-Mechanical System (MEMS) beam structure provided within a cavity structure. The method further includes forming a dummy landing structure on an opposing side of the cavity structure from the MEMS beam, which is laterally offset from the bumper when the MEMS beam is in a non-actuated state. | 11-13-2014 |
20140339658 | DEVICE COMPRISING A SPRING AND AN ELEMENT SUSPENDED THEREON, AND METHOD FOR MANUFACTURING SAME - The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure. | 11-20-2014 |
20140374856 | Apparatus and Method for Preventing Stiction of MEMS Devices Encapsulated by Active Circuitry - One or more stopper features (e.g., bump structures) are formed in a standard ASIC wafer top passivation layer for preventing MEMS device stiction vertically in integrated devices having a MEMS device capped directly by an ASIC wafer. A TiN coating may be used on the stopper feature(s) for anti-stiction. An electrical potential may be applied to the TiN anti-stiction coating of one or more stopper features. | 12-25-2014 |
20140374857 | CANTILEVER BEAM STRUCTURE WHERE STRESS IS MATCHED AND METHOD OF MANUFACTURING THE SAME - A cantilever beam structure where stress is matched and a method of manufacturing the same are provided. An example method may comprise depositing a first sub-layer of a first material with a first deposition menu and depositing a second sub-layer of the first material with a second deposition menu different from the first deposition menu. The first sub-layer and the second sub-layer can be disposed adjacent to each other to form a first layer. The method may further comprise depositing a second layer of a second material different from the first material. The first layer and the second layer can be disposed adjacent to each other. The method may further comprise matching stress between the first layer and the second layer by adjusting at least one of thicknesses of the respective sub-layers of the first layer and a thickness of the second layer. | 12-25-2014 |
20150008545 | TECHNIQUE FOR FORMING A MEMS DEVICE - An apparatus is formed on a substrate including at least one semiconductor device. The apparatus includes a microelectromechanical system (MEMS) device comprising at least one of a portion of a first structural layer and a portion of a second structural layer formed above the first structural layer. The second structural layer has a thickness substantially greater than a thickness of the first structural layer. In at least one embodiment, the MEMS device includes a first portion of the second structural layer and a second portion of the second structural layer. In at least one embodiment, the MEMS device further comprises a gap between the first portion of the second structural layer and the second portion of the second structural layer. In at least one embodiment, the gap has a width at least one order of magnitude less than the thickness of the second structural layer. | 01-08-2015 |
20150041932 | PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes forming an insulator layer over the first sacrificial cavity layer. The method further includes performing a reverse damascene etchback process on the insulator layer. The method further includes planarizing the insulator layer and the first sacrificial cavity layer. The method further includes venting or stripping of the first sacrificial cavity layer to a planar surface for a first cavity of the MEMS. | 02-12-2015 |
20150054100 | MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode. The method further includes forming a MEMS beam above the wiring layer. The method further includes forming at least one spring attached to at least one end of the MEMS beam. The method further includes forming an array of mini-bumps between the wiring layer and the MEMS beam. | 02-26-2015 |
20150084139 | DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICONDUCTOR PACKAGE - Techniques and mechanisms for providing precisely fabricated structures of a semiconductor package. In an embodiment, a build-up carrier of the semiconductor package includes a layer of porous dielectric material. Seed copper and plated copper is disposed on the layer of porous dielectric material. Subsequent etching is performed to remove copper adjacent to the layer of porous dielectric material, forming a gap separating a suspended portion of a MEMS structure from the layer of porous dielectric material. In another embodiment, the semiconductor package includes a copper structure disposed between portions of an insulating layer or portions of a layer of silicon nitride material. The layer of silicon nitride material couples the insulating layer to another insulating layer. One or both of the insulating layers are each protected from desmear processing with a respective release layer structure. | 03-26-2015 |
20150123222 | Sensor Protective Coating - A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer. | 05-07-2015 |
20150298967 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - An electronic device includes a first functional element including a first movable element capable of moving in a first axis direction, and a first dummy electrode; a second functional element including a second movable element capable of moving in a second axis direction intersecting with the first axis direction, and a second dummy electrode; and a first wiring interconnecting the first dummy electrode and the second dummy electrode. | 10-22-2015 |
20150338435 | Methods and Apparatus for MEMS Devices with Increased Sensitivity - Methods and apparatus for forming MEMS devices. An apparatus includes at least a portion of a semiconductor substrate having a first thickness and patterned to form a moveable mass; a moving sense electrode forming the first plate of a first capacitance; at least one anchor patterned from the semiconductor substrate and having a portion that forms the second plate of the first capacitance and spaced by a first gap from the first plate; a layer of semiconductor material of a second thickness patterned to form a first electrode forming a first plate of a second capacitance and further patterned to form a second electrode overlying the at least one anchor and forming a second plate spaced by a second gap that is less than the first gap; wherein a total capacitance is formed that is the sum of the first capacitance and the second capacitance. Methods are disclosed. | 11-26-2015 |
20150353345 | Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure - Method for on-chip stress decoupling to reduce stresses in a vertical hybrid integrated component including MEMS and ASIC elements and to mechanical decoupling of the MEMS structure. The MEMS/ASIC elements are mounted above each other via at least one connection layer and form a chip stack. On the assembly side, at least one connection area is formed for the second level assembly and for external electrical contacting of the component on a component support. At least one flexible stress decoupling structure is formed in one element surface between the assembly side and the MEMS layered structure including the stress-sensitive MEMS structure, in at least one connection area to the adjacent element component of the chip stack or to the component support, the stress decoupling structure being configured so that the connection material does not penetrate into the stress decoupling structure and flexibility of the stress decoupling structure is ensured. | 12-10-2015 |
20150368089 | MEMS DEVICE - A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft. | 12-24-2015 |
20150375995 | MEMS Fabrication Process with Two Cavities Operating at Different Pressures - A method and apparatus are described for fabricating a high aspect ratio MEMS sensor device having multiple vertically-stacked inertial transducer elements ( | 12-31-2015 |
20160009551 | MEMS Device Structure and Methods of Forming Same | 01-14-2016 |
20160031698 | REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS - Certain microelectromechanical systems (MEMS) devices, and methods of creating them, are disclosed. The method may include forming a structural layer over a substrate; forming a mask layer over the structural layer, wherein the mask layer is formed with a material selective to an etching process; forming a plurality of nanoclusters on the mask layer; and etching the structural layer using at least the etching process. | 02-04-2016 |
20160031703 | METHOD FOR MANUFACTURING A MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH DIFFERENT ELECTRICAL POTENTIALS AND AN ETCH STOP - A semiconductor structure for a microelectromechanical systems (MEMS) device is provided. A first substrate region includes an electrical isolation layer arranged over a top surface of the first substrate region. A second substrate region is arranged over the electrical isolation layer and includes a MEMS device structure arranged within the second substrate region. The MEMS device structure includes a fixed mass and a proof mass. A dielectric region is arranged over the electrical isolation layer around the fixed mass. A fixed mass electrode is arranged around the dielectric region, and extends through the second substrate region to the electrical isolation layer. An isolated electrode extends through the second substrate region and the electrical isolation layer to the first substrate region on an opposite side of the proof mass as the fixed mass electrode. The method of forming the semiconductor structure is also provided. | 02-04-2016 |
20160052776 | MEMS DEVICE - A MEMS device includes a fixed electrode and a movable electrode arranged isolated and spaced from the fixed electrode by a distance. The movable electrode is suspended against the fixed electrode by one or more spacers including an insulating material, wherein the movable electrode is laterally affixed to the one or more spacers. | 02-25-2016 |
20160083245 | PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending. | 03-24-2016 |
20160090292 | METHOD TO IMPROVE CANTILEVER PROCESS PERFORMANCE - A method of manufacturing a cantilever structure includes providing a semiconductor substrate, forming a recess in the semiconductor substrate, forming a sacrificial layer in the recess, forming a cantilever structure layer on the semiconductor substrate and the sacrificial layer, performing an etching process to remove a portion of the cantilever structure layer until a surface of the sacrificial layer is exposed to form a cantilever structure and an opening, and removing a portion of the sacrificial layer to form a void below the cantilever structure so that the cantilever structure is suspended in the void. The cantilever structure thus formed has good morphological properties to ensure that the cantilever structure is free of residues at the bottom and has excellent suspension even if the width of the cantilever structure is relatively large. | 03-31-2016 |
20160096721 | PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES - A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending. | 04-07-2016 |
20160096724 | STRESS ISOLATION FOR MEMS DEVICE - A microelectromechanical systems (MEMS) die includes a substrate having a recess formed therein and a cantilevered platform structure. The cantilevered platform structure has a platform and an arm extending from the platform, wherein the platform and arm are suspended over the recess. The arm is fixed to the substrate and is a sole attachment point of the platform to the substrate. A MEMS device resides on the platform. Fabrication methodology entails forming the recess in the substrate, with the recess extending inwardly from a surface of the substrate, and attaching a structural layer over the recess and over the surface of the substrate. The MEMS device is formed on the structural layer and the structural layer is removed around a perimeter of the platform and the arm to form the cantilevered platform structure. | 04-07-2016 |
20160107879 | ELECTRONIC DEVICE WITH SUSPENDED MASS - An electronic device is based on a single crystal semiconductor substrate. A cavity is formed in the semiconductor substrate. Further, a movably suspended mass is defined by one or more trenches extending from one side of the semiconductor substrate to the cavity. A first electrode layer is provided on the suspended mass. Further, a cover layer covering the suspended mass is provided. The cover layer includes a second electrode layer arranged opposite to the first electrode layer and spaced therefrom by a gap. | 04-21-2016 |
20160107881 | INTERNAL ELECTRICAL CONTACT FOR ENCLOSED MEMS DEVICES - A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises providing a MEMS substrate which includes forming one or more cavities in a first semiconductor layer; forming a second semiconductor layer; and providing a dielectric layer between the first semiconductor layer and the second semiconductor layer The MEMS substrate providing step further includes bonding the first semiconductor layer to a second semiconductor layer; etching at least one via through the second semiconductor layer and the dielectric layer; and depositing a first conductive material onto the second semiconductor layer surface and filling the at least one via. The MEMS substrate providing step also includes depositing a second conductive material on top of the first conductive material; etching the second conductive material and the first conductive material to form at least one stand-off; the second semiconductor layer to define one or more MEMS structures; and the first semiconductor layer to create an opening to separate the first semiconductor layer into a first portion and a second portion. The method further comprises bonding the MEMS substrate to a base substrate using a eutectic bond between the second conductive material and metal pads of the base substrate. | 04-21-2016 |
20160137491 | MICRO-ELECTROMECHANICAL APPARATUS WITH MULTIPLE CHAMBERS AND METHOD FOR MANUFACTURING THE SAME - A micro-electromechanical apparatus with multiple chambers and a method for manufacturing the same are provided, wherein various micro-electromechanical sensors are integrated into a single apparatus. For example, the micro-electromechanical apparatus in this disclosure may have two independent hermetically sealed chambers with different pressures, such that a micro-electromechanical barometer and a micro-electromechanical accelerometer can be operated in an optimal pressure circumstance. | 05-19-2016 |
20160185594 | SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENSOR STRUCTURES - Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the sensors. In an embodiment, a sensor device comprises a substrate; a first trench in the substrate; a first moveable element suspended in the first trench by a first plurality of support elements spaced apart from one another and arranged at a perimeter of the first moveable element; and a first layer arranged on the substrate to seal the first trench, thereby providing a first cavity containing the first moveable element and the first plurality of support elements. | 06-30-2016 |
20160194198 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD THEREOF | 07-07-2016 |
20190144264 | MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT | 05-16-2019 |