Entries |
Document | Title | Date |
20080210952 | PHOTO INTERRUPTER, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT USING THE SAME - A photo interrupter has a lead frame assembly that has a lead frame having connector terminals for external connection, a light-emitting mold, a light-receiving mold, and a connector mold. The photo interrupter also has an outer case having a connection section. The connector terminals are adapted to be accommodated in the connector section when the lead frame assembly is accommodated in the outer case. At least one of the outer case or the connector mold is provided with a latching section for latching the connector mold to the outer case. Resin for forming the connector mold may be same as or different from light permeable resin for forming the light-emitting mold and the light-receiving mold. | 09-04-2008 |
20080251795 | Photoelectric element package with temperature compensation - A photoelectric element package with temperature compensation includes a substrate, and a first light-emitting element, a second light-emitting element, a photosensitive element, and a drive element disposed on the substrate, all of which are disposed in an internal space formed by a first casing joined with a second casing. Alternatively, the second light-emitting element and the photosensitive element are disposed in an internal space of a third casing. By adding the second light-emitting element, the photosensitive element can sense the light emitting intensity accurately in the absence of other interferences, so as to feed back the current operating state of the light-emitting element. A temperature compensation function is achieved by a laser driver, so as to reduce the influence of temperature on the light-emitting element, such that the light-emitting element emits light in an accurate intensity. | 10-16-2008 |
20080277672 | Lid structure for microdevice and method of manufacture - A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelength features on a surface of an infrared transmitting substrate, and coating the subwavelength features with an etch stop material. A spacer wafer is then bonded to the infrared transmitting substrate, and a device cavity is etched into the spacer wafer down to the etch stop material, exposing the subwavelength features. The etch stop material may then be removed, and the microdevice enclosed in the device cavity, by bonding the device wafer to the lid. | 11-13-2008 |
20080277673 | CAVITY EXPLORATION WITH AN IMAGE SENSOR - A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads positioned on the respective first and second surfaces of the integrated circuit support, a respective conducting micro-cable is placed in the through-hole, with this micro-cable having a portion which is uninsulated for a length greater than or equal to the thickness of the support. The micro-cable is soldered to the associated first and second conducting pads. Next the micro-cable is glued to the first and second associated conducting pads. The micro-cable is molded in first and second resin layers onto the respective first and second conducting pads, with the resin layers covering the uninsulated portion of the micro-cable. | 11-13-2008 |
20080296589 | Solid-State Lighting Device Package - The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction from the one or more light-emitting elements within the lighting device package. The lighting device package comprises a substrate having a thermally conductive region to which one or more light-emitting elements are thermally connected, wherein the light-emitting elements may be relatively closely packed. An optical system is optically coupled to one or more light emitting elements, and is positioned relative to the substrate such that the optical system substantially encloses the one or more light-emitting elements on the substrate. The optical system is adapted to extract the light from the one or more light-emitting elements. | 12-04-2008 |
20080308817 | Galvanic Isolator Having Improved High Voltage Common Mode Transient Immunity - A galvanic isolator having a transmitter die, a receiver die, and a lead frame is disclosed. The transmitter die includes an LED having first and second contacts for powering the LED, and the receiver die includes a photodetector. The lead frame includes first and second transmitter leads, and first and second receiver leads. The transmitter die is bonded to the first lead, the first contact being connected electrically to the first transmitter lead and the second contact being connected to the second transmitter lead. The receiver die is connected to the first and second receiver leads. The LED and the photodetector are positioned such that light generated by the LED is received by the photodetector. The first and second transmitter leads are capacitively coupled to the first receiver lead. The capacitive couplings are characterized by first and second capacitance values that are substantially the same. | 12-18-2008 |
20080315215 | Semiconductor Module - A semiconductor module (A | 12-25-2008 |
20090057687 | LIGHT EMITTING DIODE MODULE - The present invention relates to a light emitting diode (LED) module ( | 03-05-2009 |
20090127569 | SEMICONDUCTOR LIGHT EMITTING MODULE AND IMAGE READER USING THE SAME - A semiconductor light emitting module is provided with a supporting conductor including a die bonding pad, and with a plurality of semiconductor light emitting elements bonded to the die bonding pad. The semiconductor light emitting elements are arranged in series along an arrangement line extending in a first direction. The die bonding pad includes a portion overlapping alternative die-bonding positions which are symmetrical to positions of the bonded semiconductor light emitting elements with respect to a line of symmetry extending in a second direction different from the first direction. | 05-21-2009 |
20090140266 | PACKAGE INCLUDING ORIENTED DEVICES - An package such as an optocoupler package is disclosed. The optocoupler package includes a leadframe structure comprising a first die attach pad comprising a first die attach pad surface and a second die attach pad with a second die attach pad surface. The optocoupler package further has an optical emitter device on the first die attach pad, and an optical receiver device on second die attach pad. The optical receiver device is oriented at an angle with respect to the optical emitter device, and an optically transmissive medium is disposed between the optical emitter device and the optical receiver device. | 06-04-2009 |
20090146155 | LIGHT-EMITTING DIODE - An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervious encapsulation member mounted on the substrate surface. The light pervious encapsulation member covers the LED chip and the first reflective layer and a portion of the second reflective layer. The LED chip is mounted on the substrate surface and electrically connected with the electrodes. The first reflective layer and the second reflective layer are configured for reflecting the light emitted from the LED chip. | 06-11-2009 |
20090159900 | Infrared Proximity Sensor Package with Reduced Crosstalk - Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter doe is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein. | 06-25-2009 |
20090173953 | PACKAGE WITH OVERLAPPING DEVICES - A die package is disclosed. The die package includes a substrate, a first device attached to the substrate, and a leadframe structure attached to the substrate. The leadframe structure includes a portion disposed over the first device, and a second device is attached to the first portion of the leadframe structure. | 07-09-2009 |
20090200562 | INTEGRATED CIRCUIT DIE, INTEGRATED CIRCUIT PACKAGE, AND PACKAGING METHOD - An integrated circuit package includes an integrated circuit die | 08-13-2009 |
20090261353 | PRODUCTION OF SELF-ORGANIZED PIN-TYPE NANOSTRUCTURES, AND THE RATHER EXTENSIVE APPLICATIONS THEREOF - The invention relates to methods and devices comprising a nanostructure ( | 10-22-2009 |
20090294779 | Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device - An electronic element wafer module according to the present invention is provided, in which a translucent support substrate for covering and protecting a plurality of electronic elements is attached on an electronic element wafer having the plurality of electronic elements formed thereon, and an optical filter is formed corresponding to the electronic elements on at least one surface of the translucent support substrate, where the optical filter is removed to lessen warping along a part or all of dicing lines for individually dividing the electronic element wafer module into a plurality of electronic element modules. | 12-03-2009 |
20090315042 | OPTICAL MODULE AND OPTICAL PICKUP APPARATUS - An optical module includes: a base plate; a light emitting element mounted on the base plate; an integrated circuit element of the light receiving element built-in type mounted on the base plate by bonded wires and having a light receiving portion for receiving returning light originating from light emitted from the light emitting element; and a circuit board having a window for allowing light to pass therethrough and connected to the integrated circuit element in a state wherein the light receiving portion is exposed through the window. | 12-24-2009 |
20100012953 | OPTICAL SEMICONDUCTOR DEVICE - First and second optical semiconductor elements are respectively mounted on first and second mount beds. First and second lead terminals are respectively arranged around the first and the second mount beds. The second lead terminals extend along the first lead terminals. The first and second lead terminals are electrically connected to the first and second optical semiconductor elements through first and second connection conductors, respectively. The second mount bed is arranged at an interval from the first optical semiconductor element, and extends along the first mount bed. The second mount bed has a penetration hole at a portion corresponding to a light emitting or light receiving surface of the first optical semiconductor element. The second lead terminals are bent so as to be laminated on the first lead terminal. The second lead terminals are fixed to the first lead terminal at portions via insulating material. | 01-21-2010 |
20100044723 | PACKAGE FOR PHOTOELECTRIC WIRING AND LEAD FRAME - A package for a photoelectric wiring in which a pair of light emitting and receiving devices are mounted as optical devices on a lead frame having an optical waveguide in which an optical waveguide having a plurality of core portions disposed in parallel and surrounded by a cladding is mounted on a support plate of a lead frame having a mirror section including the support plate for supporting the optical waveguide, mirror sections having a mirror surface portion formed by bending both edges of the support plate at an angle of 45 degrees with respect to a planar direction of the support plate in a side direction, and lead portions to be electrically connected to the optical devices, the support plate, the mirror sections and the lead sections being formed by pressing a metallic material, wherein the light emitting device and the light receiving device are mounted in alignment with an optical path of a light reflected by the mirror surface portion and transmitted through the core portions at one of sides and the other side which interpose the optical waveguide of the package for an optical waveguide wiring therebetween. | 02-25-2010 |
20100065859 | Semiconductor device and method of manufacturing the same - A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operating regions, and the element isolating region is etched to a shallower depth than a thickness of the semiconductor thin film, and is a thinner region than the plurality of discrete operating regions. | 03-18-2010 |
20100096640 | SELF-ASSEMBLED HETEROGENEOUS INTEGRATED OPTICAL ANALYSIS SYSTEM - Optical analysis system fluidically self-assembled using shape-coded freestanding optoelectronic components and a template having shape-coded recessed binding sites connected by an embedded interconnect network. Also includes methods of manufacture and use for optical analyses. | 04-22-2010 |
20100109021 | REFLECTION -TYPE PHOTOINTERRUPTER - A reflection-type photointerrupter of the present invention includes a substrate, a light emitting element and a light receiving element. The substrate includes a first surface, a second surface opposite the first surface, and a first and a second recesses that are open in the first surface side. The light emitting element is arranged in the first recess, while the light receiving element is arranged in the second recess. The light emitting element is capable of emitting light. The light receiving element is capable of receiving the light emitted from the light emitting element and reflected by an object to be detected. | 05-06-2010 |
20100127280 | PHOTO SENSOR AND DISPLAY DEVICE - Provided is a photo sensor that can be downsized while suppressing occurrence of noise caused by a dark current, and a display device including the photo sensor. The photo sensor used includes a plurality of photodiodes ( | 05-27-2010 |
20100181578 | PACKAGE STRUCTURE - A package structure is described. A light emitting element and a light sensing element are disposed on a substrate, and are both wrapped by a package layer. Meanwhile, the light emitting element and the light sensing element are separated by a trench of the package layer, such that lights generated by the light emitting element are blocked, thereby reducing the noise interference on the light sensing element and improving the sensing precision of the light sensing element. | 07-22-2010 |
20100200868 | Semiconductor Light-emitting device - A semiconductor light-emitting device includes a semiconductor light-emitting element including a first multilayer reflector, an active layer having a light-emitting region, and a second multilayer reflector in the stated order; a semiconductor light-detecting element disposed opposite the first multilayer reflector in relation to the semiconductor light-emitting element and including a light-absorbing layer configured to absorb light emitted from the light-emitting region; a transparent substrate disposed between the semiconductor light-emitting element and the semiconductor light-detecting element; a first metal layer having a first opening in a region including a region opposite the light-emitting region and bonding the semiconductor light-emitting element and the substrate; and a second metal layer having a second opening in a region including a region opposite the light-emitting region and bonding the semiconductor light-detecting element and the substrate. | 08-12-2010 |
20100213471 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - A light-emitting device reliably supplying electric power to a light-emitting element on a supporting base and securing heat dissipation, and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a light-emitting element arranged on a first supporting base; a package covering the first supporting base and the light-emitting element therewith, and supporting the first supporting base; and a thermal conductive member having ends which are bonded to the light-emitting element and the package, respectively, so as to also have a wiring function. | 08-26-2010 |
20100219422 | PHOTO-COUPLER - A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip. | 09-02-2010 |
20100308345 | LIGHT SENSING SYSTEM - A light sensing system comprises a first light sensor ( | 12-09-2010 |
20110012134 | IMAGE READING APPARATUS AND MULTILAYER SUBSTRATE - An image reading apparatus includes a light source that irradiates a document with light, the light source including a multilayer substrate and light emitting elements linearly arranged on a first surface of the multilayer substrate; and a light receiver that receives reflected light reflected from the document. The multilayer substrate has at least a pair of through holes each having an inner surface on which a reinforcement member is formed, the at least a pair of through holes being formed so that one of the light emitting elements is interposed therebetween. The reinforcement members contact wiring formed on the first surface of the multilayer substrate and wiring formed on a second surface of the multilayer substrate opposite the first surface. | 01-20-2011 |
20110079796 | NANO STRUCTURED LEDS - An embodiment relates to a nanowire-containing LED device with optical feedback comprising a substrate, a nanowire protruding from a first side the substrate, an active region to produce light, a optical sensor and a electronic circuit, wherein the optical sensor is configured to detect at least a first portion of the light produced in the active region, and the electronic circuit is configured to control an electrical parameter that controls a light output of the active region. Yet, another embodiment relates to an image display having the nanowire-containing LED device with optical feedback. | 04-07-2011 |
20110089438 | OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS - Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar). | 04-21-2011 |
20110163328 | OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion. | 07-07-2011 |
20120018744 | HIGH SPEED, WIDE OPTICAL BANDWIDTH, AND HIGH EFFICIENCY RESONANT CAVITY ENHANCED PHOTO-DETECTOR - A single optical receiver having a photo-detector with a wide optical bandwidth and high efficiency within the wide optical bandwidth, the photo-detector comprising: a first diode region of first doping type for receiving light; a second diode region of second doping type and of second thickness; an active region for converting the received light to an electronic signal, the active region having a third thickness and configured to reside between the first diode region and the second diode region; and a reflector coupled to the second diode region and having a silicon layer with a fourth thickness, the silicon layer residing between silicon oxide layers of fifth thicknesses, wherein the active region is configured to absorb the light of wavelengths of less than 900 nm, and wherein the reflector is configured to reflect the light of wavelengths from a range of 1260 nm to 1380 nm. | 01-26-2012 |
20120025211 | COMPACT SENSOR PACKAGE STRUCTURE - The present invention discloses a compact sensor package structure, which comprises a package body, an LED chip and a sensor chip. The package body has a first room, a second room, a first hole and a second hole. The first and second rooms are independent to each other. The first and second holes interconnect the interiors and the external environments of the first and second rooms. The LED chip is arranged inside the first room, corresponding to the first hole and below the first hole. The LED chip projects light through the first hole. The sensor chip is arranged inside the second room, corresponding to the second hole and above/below the second hole. The sensor chip receives light via the second hole. The present invention features two independent rooms for two chips and prevents interference between the two chips. | 02-02-2012 |
20120086018 | PACKAGE-ON-PACKAGE PROXIMITY SENSOR MODULE - A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing. | 04-12-2012 |
20120086019 | SUBSTRATE FOR DISPLAY PANEL, AND DISPLAY DEVICE - Disclosed is a substrate for display panel that includes, in a pixel, a PIN diode | 04-12-2012 |
20120097982 | Lighting Device - A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting element including an electroluminescence (EL) layer, a housing including a light-emitting element has a terminal electrode electrically connected to the light-emitting element on a peripheral end portion. The terminal electrode provided on the housing so as to be exposed to the outside is in contact with a terminal electrode for the external power supply, so that the external power supply and the light-emitting element are electrically connected to each other and power can be supplied to the lighting device. | 04-26-2012 |
20120286296 | METHOD AND APPARATUS FOR SENSING INFRARED RADIATION - Embodiments of the invention pertain to a method and apparatus for sensing infrared (IR) radiation. In a specific embodiment, a night vision device can be fabricated by depositing a few layers of organic thin films. Embodiments of the subject device can operate at voltages in the range of 10-15 Volts and have lower manufacturing costs compared to conventional night vision devices. Embodiments of the device can incorporate an organic phototransistor in series with an organic light emitting device. In a specific embodiment, all electrodes are transparent to infrared light. An IR sensing layer can be incorporated with an OLED to provide IR-to-visible color up-conversion. Improved dark current characteristics can be achieved by incorporating a poor hole transport layer material as part of the IR sensing layer. | 11-15-2012 |
20120326170 | WAFER LEVEL MOLDED OPTO-COUPLERS - Optocoupler packages and methods of making the same. An exemplary package comprises a substrate having a first surface, a second surface opposite the first surface, and a body of electrically insulating material disposed between the first and second surfaces; a first optoelectronic device embedded in the body of electrically insulating material of the substrate and disposed between the substrate's first and second surfaces, the first optoelectronic device having a first conductive region and a second conductive region; a second optoelectronic device embedded in the body of electrically insulating material of the substrate and disposed between the substrate's first and second surfaces and optically coupled to the first optoelectronic device, the second optoelectronic device having a first conductive region and a second conductive region; and a plurality of electrical traces disposed on one or both surfaces of the substrate and electrically coupled to the conductive regions of the optoelectronic devices. | 12-27-2012 |
20130009173 | OPTICAL ELECTRONIC PACKAGE - An electronic package includes a substrate wafer having front and rear faces and a through passage having a front window and a blind cavity communicating laterally with the front window. A receiving integrated circuit chip is mounted on the rear face and includes an optical sensor situated opposite the blind cavity. A transparent encapsulant extends above the optical sensor and at least partially fills the through passage. An emitting integrated circuit chip, embedded in the transparent encapsulant, includes an optical emitter of luminous radiation. The emitting integrated circuit chip may be mounted to the front face or within the through passage to the receiving integrated circuit chip. The substrate wafer may further include a second through passage. The receiving integrated circuit chip further includes a second optical sensor situated opposite the second through passage. A cover plate is mounted to the front face at the second through passage. | 01-10-2013 |
20130020588 | OPTICAL DEVICE WITH THROUGH-HOLE CAVITY - A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors. | 01-24-2013 |
20130075764 | OPTICAL MODULE PACKAGE STRUCTURE - An optical module package structure includes a light-emitting chip and a light sensor chip respectively installed in a first cavity and a second cavity in a substrate, a reflective layer coated on the periphery of the first cavity, two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively, and a lid integrally formed on the substrate to enhance the airtightness of the whole optical module package structure. | 03-28-2013 |
20130075765 | INFRARED LIGHT-EMITTING DIODE AND TOUCH SCREEN - This invention discloses an infrared light-emitting diode. The infrared light-emitting diode comprises: only one core for emitting infrared light; a packaging body which at least comprises a first surface that is convex and in front of the core and a second surface that is plane and on one side of the core; and leads connected to the core and extending to outside of the packaging body; wherein the infrared light emitted by the core forms at least two beams of infrared light in different directions after being emitted from the packaging body through the first surface and the second surface. With such infrared LED and the touch screen, touch system and interactive display based on the LED, at least two beams of infrared light in different directions can be emitted requiring only one core. | 03-28-2013 |
20130099256 | MULTI-CHIP PACKAGE CROSS-REFERENCE TO RELATED APPLICATIONS - A multi-chip package includes a lower substrate; at least two semiconductor chips stacked over the lower substrate and each defined with a via hole; an upper substrate coupled to a semiconductor chip positioned uppermost among the semiconductor chips; a light emitting part coupled to the lower substrate corresponding to the via hole; an electrowetting liquid lens coupled to a lower surface of the upper substrate for receiving a signal transferred from the light emitting part through the via hole; a light receiving part coupled to a sidewall of the via hole of each semiconductor chip configured to receive a signal from the electrowetting liquid lens. | 04-25-2013 |
20130105822 | INTEGRATED SENSING PACKAGE STRUCTURE | 05-02-2013 |
20130153933 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a sensor region formed in the semiconductor substrate; a light emitting device disposed on the second surface of the semiconductor substrate; at least one first conducting bump disposed on the first surface of the semiconductor substrate and electrically connected to the sensor region; at least one second conducting bump disposed on the first surface of the semiconductor substrate and electrically connected to the light emitting device; and an insulating layer located on the semiconductor substrate to electrically insulate the semiconductor substrate from the at least one first conducting bump and the at least one second conducting bump. | 06-20-2013 |
20130200397 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes an input lead, a light emitting element, an output lead, a light receiving element and a resin molded body. The input lead includes an input inner lead portion, an input outer lead portion and a first silver layer. The light emitting element is provided on the first silver layer. The output lead includes an output inner lead portion, an output outer lead portion and a second silver layer. The second silver layer includes an upper surface portion and a side surface portion. The light receiving element is provided on the second silver layer and is capable of receiving light. The output lead includes a cutting surface extending from the side surface portion of the second silver layer to the side surface of the output inner lead portion. The resin molded body covers the cutting surface. | 08-08-2013 |
20130207127 | Apparatus and Method for Optical Communications - An integrated circuit package includes a substrate having a recess formed along at least a portion of a perimeter of the substrate, and an optical die having opto-electric circuitry, the optical die coupled to the substrate such that a portion of the optical die with the opto-electric circuitry overhangs the recess. The integrated circuit package also includes an optical unit disposed in the recess such that optical signals emitted by the opto-electric circuitry are reflected away from the substrate and incident optical signals are reflected onto the opto-electric circuitry. | 08-15-2013 |
20130221379 | PHOTO COUPLER - According to one embodiment, in a photo coupler, a light emitting device is mounted on a first mount-bed and electrically connected to a pair of first leads. A light receiving device is mounted on a second mount-bed, is electrically connected to a pair of second leads, and receives light emitted from the light emitting device by reflection. A first resin has a first refractive index and covers the light emitting device and the light receiving device. An opaque container has a concave portion to store the light emitting device and the light receiving device, and reflects the light emitted from the light emitting device at the concave portion. A second resin has a second refractive index lower than the first refractive index and fills a space between the first resin and the concave portion of the opaque container. A lid seals the concave portion of the opaque container. | 08-29-2013 |
20130240913 | SEMICONDUCTOR DEVICE - According to an embodiment, a semiconductor device including a first body molded with a first resin, a second body molded with the first resin, and a third body molded with a second resin. The first body includes a first light emitting element, a primary lead, a first light receiving element, and a secondary lead. The second body includes a second light emitting element, a primary lead, a second light receiving element, and a secondary lead. The third body includes the first body and the second body. At least one common lead includes the primary leads or the secondary leads, and a portion extending between the first body and the second body, the portion being covered with a first thin film linked to the first body and a second thin film linked to the second body. | 09-19-2013 |
20130270580 | Flat Panel Display Device and Method of Manufacturing the Same - A flat panel display device and method of manufacturing the display device. The display device comprises a first substrate and a connection pad located along a side of the first substrate. A second substrate overlaps with the first substrate, wherein the second substrate does not overlap with an exposed portion of the first substrate. A first contact pad electrically couples the second substrate and the first substrate. A first distance from the side of the first substrate to a boundary between the exposed portion of the first substrate and the second substrate is greater than a second distance from the side of the first substrate to the first contact pad. The display device may be, for example, a touch capable display device that uses the first contact pad to transfer touch sensing signals from the second substrate to the first substrate. | 10-17-2013 |
20130292706 | Infrared Attenuating Or Blocking Layer In Optical Proximity Sensor - An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a gap. Layers of infrared opaque, attenuating or blocking material are disposed on at least some of the external surfaces forming the gap to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimize optical crosstalk and interference between the light emitter and the light detector. | 11-07-2013 |
20130320360 | DIFFUSION TYPE LED APPARATUS UTILIZING DYE-SENSITIZED SOLAR CELLS - An LED luminaire has a dye-sensitized solar cell for converting light emitted from a light source to electric energy and uses the converted electric energy. Since the dye-sensitized solar cell plays a role of a diffusion plate, the LED luminaire may diffuse light and convert wasted light into power. Further, since energy consumption and green-house gas generation decrease, it is possible to provide an environment-friendly LED luminaire Moreover, if the power generated by the dye-sensitized solar cell is used for cooling the LED luminaire, it is possible to enhance heat dissipation efficiency of the LED luminaire | 12-05-2013 |
20130334544 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, METHOD FOR PRODUCING SAME AND USE OF SUCH A COMPONENT - An opto-electronic component includes a housing, a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. A first cavity and a second cavity are formed in the housing, wherein the radiation-emitting semiconductor chip is arranged in the first cavity and is cast by means of a first casting compound. The radiation-detecting semiconductor chip is arranged in the second cavity and cast by means of a second casting compound, wherein absorber particles are embedded in the second casting compound which are suitable for at least partially absorbing the radiation emitted by the radiation-emitting semiconductor chip. | 12-19-2013 |
20130341650 | PHOTOSENSOR CHIP PACKAGE STRUCTURE - A photosensor chip package structure comprises a substrate, a light-emitting chip and a photosensor chip including an ambient light sensing unit and a proximity sensing unit. The substrate has a first basin, a second basin and a light-guiding channel. The openings of the first and second basins respectively face different directions. One opening of the light-guiding channel and the opening of the first basin face the same direction. The other opening of the light-guiding channel interconnects with the second basin. The light-emitting chip is arranged in the first basin. The photosensor chip is arranged in the second basin. The light-guiding channel conducts the light generated by the light-emitting chip and the ambient light to the photosensor chip. The photosensor chip operates as soon as it receives the light generated by the light-emitting chip and/or the ambient light. | 12-26-2013 |
20140021491 | MULTI-COMPOUND MOLDING - In certain embodiments, a semiconductor package includes a leadframe, a light emitter die disposed on the leadframe, and a light detector die disposed on the leadframe adjacent to the light emitter die. In some embodiments, a first transparent molding compound is disposed over the light emitter die and a second transparent molding compound is disposed over the light detector die. The first and second transparent molding compound may be disposed such that a space between them forms a cavity between the die and above the leadframe. In other embodiments a transparent molding compound is disposed simultaneously over the light emitter and light detector die and a subsequent material removal process forms a cavity within the compound between the die. In both embodiments, an opaque molding compound is disposed in the cavity between the die, and is configured to block optical cross-talk between the light emitter and light detector die. | 01-23-2014 |
20140054614 | SEMICONDUCTOR DEVICE HAVING OPTICALLY-COUPLED ELEMENT - According to one embodiment, a semiconductor device includes a light-emitting element, a light-receiving element, a primary side lead electrically connected to the light-emitting element, a secondary side lead electrically connected to the light-receiving element and a molded body. The molded body includes an internal resin, an external resin and a light shielding layer. The internal resin covers a portion fixed with the light-emitting element of the primary side lead and a portion fixed with the light-receiving element of the secondary side lead. The external resin covers the internal resin, and shields external light to which the light-receiving element is sensitive. The light shielding layer is provided at a position closer to the second surface than any of the light-emitting element, the light-receiving element, the primary side lead, and the secondary side lead, and shielding the external light. | 02-27-2014 |
20140061678 | SEMICONDUCTOR DEVICE - According to an embodiment, a semiconductor device includes a primary side lead, a light-emitting element electrically connected to the primary side lead, and a thyristor-type light-receiving element. The light-receiving element includes a first face for detecting light emitted from the light-emitting element, and a second face provided on an opposite side of the first face. The light-receiving element includes an anode electrode, a cathode electrode, and a gate electrode that are provided on the first face. The device further includes a secondary side first lead electrically connected to the anode electrode, a secondary side second lead electrically connected to the cathode electrode, and a secondary side third lead electrically connected to the gate electrode. The secondary side third lead is connected to the second face of the light-receiving element. | 03-06-2014 |
20140077233 | Input output LED apparatus - A multi-functional optoelectronic apparatus which comprises an integrated circuit (IC) wafer, respective optoelectronic components which has one or more Input port(s) to receive external command signals to drive the optoelectronic apparatus. Examples of some of the optoelectronic apparatus include an IOLED (Input/Output Light Emitting Diode including visible light and invisible light), IOPD (Input/Output Photo Diode), IOPT (Input/Output Photo Transistor), IOLS (Input/Output Light Sensor), IORS (Input/Output Reflective Sensor), IOPI (Input/Output Photo Interrupter) and IORM (Input/Output Receiver Module). The multi-functional optoelectronic apparatus may drive external peripheral(s) such as speakers, motors or other devices. This invention eliminates the need for Printed Circuit Boards for holding the IC and remove the need for unnecessary encapsulation materials, and may be structured as Pin Packaging having three or more supporting legs and/or SMD (Surface Mount Device) Packaging having no supporting leg but having three or more connecting pads. The invention also employs double bonding agents for affixing and operatively coupling the IC wafer. | 03-20-2014 |
20140084305 | PHOTOCOUPLER AND SEMICONDUCTOR LIGHT EMITTING ELEMENT - A photocoupler includes: a light emitting element; a light receiving element; and a bonding layer. The light emitting element includes a semiconductor stacked body, and a first and a second electrode. The semiconductor stacked body includes a light emitting layer. The light receiving element includes a first and a second electrode on a side of a light receiving surface. The bonding layer bonds the light emitting element and the light receiving surface, and has transparency and insulating property. | 03-27-2014 |
20140084306 | SEMICONDUCTOR DEVICE - According to an embodiment, a semiconductor device including a first body molded with a first resin, a second body molded with the first resin, and a third body molded with a second resin. The first body includes a first light emitting element, a primary lead, a first light receiving element, and a secondary lead. The second body includes a second light emitting element, a primary lead, a second light receiving element, and a secondary lead. The third body includes the first body and the second body. At least one common lead includes the primary leads or the secondary leads, and a portion extending between the first body and the second body, the portion being covered with a first thin film linked to the first body and a second thin film linked to the second body. | 03-27-2014 |
20140084307 | OPTOELECTRONIC DEVICE - An optoelectronic device having an optoelectronic component that receives or generates radiation and has a main radiation passage surface, wherein the component is assigned an aperture which defines a radiation cone for radiation passing through the main radiation passage surface, and the aperture has an inner surface having a region inclined away from the main radiation passage surface. | 03-27-2014 |
20140097451 | PROXIMITY SENSOR AND CIRCUIT LAYOUT METHOD THEREOF - A proximity sensor and a circuit layout method thereof are disclosed. The proximity sensor includes a light sensor and a light emitting unit. The light sensor includes a semiconductor substrate and a bonding pad. The semiconductor substrate has a first circuit region. At least one semiconductor device is disposed in the first circuit region. The bonding pad is disposed above the first circuit region and a gap is existed between the bonding pad and the at least one semiconductor device. The bonding pad is connected to the semiconductor substrate out of the first circuit region. The light emitting unit is disposed on the bonding pad of the light sensor. | 04-10-2014 |
20140117383 | Optocoupler Having Lens Layer - An optocoupler having optical lens layer is disclosed. The optocoupler may comprise an optical emitter, an optical receiver, an isolation layer, a lens layer and a substantially transparent encapsulant. The lens layer may be integrally formed within the optical receiver. Alternatively, the lens layer may be formed integrally with the isolation layer, or the lens layer may be an optical film attached on the optical receiver. The substantially transparent encapsulant may encapsulate at least partially the optical emitter, the optical receiver and the isolation layer. The isolation layer may be inserted to the substantially transparent encapsulant, making the substantially transparent encapsulant into two compartments. In another embodiment, an electronic system having optocoupler is disclosed. | 05-01-2014 |
20140175462 | Method for Producing a Plurality of Optoelectronic Semiconductor Components in Combination, Semiconductor Component Produced in Such a Way, and Use of Said Semiconductor Component - A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified. | 06-26-2014 |
20140191253 | OPTOELECTRONIC DEVICE AND METHOD FOR PRODUCING OPTOELECTRONIC DEVICES - An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component. | 07-10-2014 |
20140209928 | LIGHT SOURCE ASSEMBLY AND A PROCESS FOR PRODUCING A LIGHT SOURCE ASSEMBLY - A light source assembly, including one or more light emitting diodes disposed within a hermetically sealed enclosure, wherein the light emitting diodes are in the form of one or more unpackaged planar semiconductor dies mounted on an inner surface of a wall of the enclosure, wherein the wall of the enclosure includes electrically conductive tracks that connect electrical contacts of the unpackaged planar semiconductor dies to corresponding electrical contacts external of the sealed enclosure. | 07-31-2014 |
20140239314 | PHOTOCOUPLER - A photocoupler includes: a light emitting element; a first photodiode array; a second photodiode array; a third photo diode array; an enhancement-mode MOSFET; a first depletion-mode MOSFET; and a second depletion mode MOSFET. The light emitting element converts the input electrical signal into the optical signal. A drain current of the enhancement-mode MOSFET is supplied to the external load when the optical signal is ON. A drain current of the first depletion-mode MOSFET is supplied to the external load when the optical signal is OFF and a voltage passing through the second depletion-mode MOSFET switched to the ON state is supplied to the gate of the first depletion-mode MOSFET. And the drain current of the first depletion-mode MOSFET is larger than a drain current of the first depletion-mode MOSFET when a gate voltage of the first depletion-mode MOSFET is zero. | 08-28-2014 |
20140239315 | PACKAGE STRUCTURE OF OPTICAL TRANSCEIVER COMPONENT - The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level. | 08-28-2014 |
20140284629 | PHOTOCOUPLER - According to one embodiment, a photocoupler includes a light emitting element, a light receiving element, a bonding layer, input terminals, output terminals and a molded resin body. A light emitting element includes a transparent support substrate, a semiconductor stacked body, and first and second electrodes. A light receiving element includes a light reception surface, a first electrode, and a second electrode. A bonding layer is configured to bond the first surface of the support substrate to the light reception surface side of the light receiving element. The bonding layer is transparent and insulative. Input terminals are connected to the first and second electrodes of the light emitting element. Output terminals are connected to the first and second electrodes of the light receiving element. The light reception surface is included in the light emitting surface. An input electrical signal is converted into an output electrical signal. | 09-25-2014 |
20140319548 | PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS - A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings. | 10-30-2014 |
20140353687 | LED MODULE AND IMAGE SENSOR MODULE - An LED module includes first through third LED chips and two Zener diodes for preventing excessive voltage application to the first and the second LED chips. A first lead includes a mount portion on which the first through third LED chips and the two Zener diodes are mounted. A resin package covers part of the first lead and includes an opening for exposing the three LED chips and two Zener diodes. A single insulating layer bonds the first and second LED chips to the first lead. A single conductive layer bonds the third LED chip and two Zener diodes to the first lead. The Zener diodes are arranged between the first, second LED chips and the third LED chip. | 12-04-2014 |
20140374776 | OPTICAL-COUPLING SEMICONDUCTOR DEVICE - The optical-coupling semiconductor device includes: a primary support plate and a secondary support plate facing each other and spaced apart a predetermined distance; a light emitting device situated on the primary support plate; and a light receiving device including a light receiving surface to receive light from a light emitting surface of the light emitting device. The light emitting device is situated on a surface facing the secondary support plate of the primary support plate so that the light emitting surface is oriented toward the secondary support plate. The light receiving device is situated on a surface facing the primary support plate of the secondary support plate so that the light receiving surface faces the light emitting surface of the light emitting device. The light emitting device is on the light receiving surface of the light receiving device. | 12-25-2014 |
20140374777 | LIGHT EMITTING DEVICE AND OPTICAL DEVICE - A light emitting device is capable of enhancing the radiant intensity on a single direction. The light emitting device includes a substrate and an LED chip bonded to the substrate, wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, and the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface; and the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity. | 12-25-2014 |
20150021627 | LIGHT EMITTING APPARATUS, MANUFACTURING METHOD OF LIGHT EMITTING APPARATUS, LIGHT RECEIVING AND EMITTING APPARATUS, AND ELECTRONIC EQUIPMENT - A light emitting apparatus includes a translucent substrate, and a light emitting section and an optical filter section arranged in a first region of the substrate when viewed in a normal direction of a first surface of the substrate. The light emitting section has a laminate structure that includes, on the first surface of the substrate, a dielectric multilayer film, a first electrode, a functional layer with a light emitting layer, and a second electrode having semi-transmissive reflectivity. The optical filter section has a laminate structure that includes, on the first surface of the substrate, the dielectric multilayer film, the functional layer, and the second electrode. The dielectric multilayer film and the functional layer extend over the first region. | 01-22-2015 |
20150028357 | PACKAGE STRUCTURE OF AN OPTICAL MODULE - This invention relates to a package structure of an optical module. A light emitting and light receiving chips are disposed on a light emitting and light receiving region of the substrate, respectively. Two encapsulating gels cover the light emitting chip and the light receiving chip, respectively, and form a first and a second hemispherical lens portions on the light emitting chip and the light receiving chip, respectively. A cover is affixed on the substrate and each of the encapsulating gels and has a light emitting hole and a light receiving hole, wherein the first and the second lens portions are accommodated, respectively. An engaging means is formed on an adjacent surface between each encapsulating gels and the cover in a horizontal direction. Thereby, the package structure of the optical module of the present invention increases the connection region between each encapsulating gels and the cover to enhance the engagement. | 01-29-2015 |
20150028358 | PACKAGE STRUCTURE OF AN OPTICAL MODULE - The present invention relates to a package structure of an optical module. The light emitting chip and the light receiving chip are disposed on the light emitting region and the light receiving region of the substrate, respectively. Two encapsulating gels are coated on the light emitting chip and the light receiving chip to form a first and a second hemispherical lens portions thereon, respectively. A cover is affixed on the substrate and each of the encapsulating gels and has a light emitting hole and a light receiving hole, where the first and second lens portions are accommodated, respectively. In this way, the package structure of an optical module of the present invention can be made with the encapsulating gels of different curvatures according to different needs to improve the luminous efficiency of the light emitting chip effectively and to improve the reception efficiency of the light receiving chip. | 01-29-2015 |
20150028359 | PACKAGE STRUCTURE OF AN OPTICAL MODULE - This invention relates to an optical module package structure. A substrate is defined with a light receiving region and a light emitting region. A light receiving chip and a light emitting chip are disposed on the light receiving region and the light emitting region of the substrate, respectively. An electronic unit is disposed on the substrate and electrically connected to the light emitting chip. Two encapsulating gels are coated on each of the chips and the electronic unit. A cover is disposed on the substrate and has a light emitting hole and a light receiving hole, located above the light emitting chip and the light receiving chip, respectively. In this way, the package structure of the optical module of the present invention integrates passive components, functional ICs or dies into a module, and the optical module provides the functions of current limiting or function adjustment. | 01-29-2015 |
20150028360 | PACKAGE STRUCTURE OF OPTICAL MODULE - A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs. | 01-29-2015 |
20150028361 | OPTOELECTRONIC SEMICONDUCTOR DEVICE - An optoelectronic semiconductor device includes at least one radiation-emitting and/or radiation-receiving semiconductor chip including a radiation passage surface and a mounting surface opposite the radiation passage surface, wherein the mounting surface includes a first electrical contact structure and a second electrical contact structure electrically insulated from the first electrical contact structure, and wherein the radiation passage surface is free of contact structures, a reflective sheath surrounding the at least one semiconductor chip at least in sections, and a protective sheath surrounding the at least one semiconductor chip and/or the reflective sheath at least in sections. | 01-29-2015 |
20150034975 | OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES - Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described. | 02-05-2015 |
20150048386 | IMAGE SENSING MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element. | 02-19-2015 |
20150054001 | Integrated Camera Module And Method Of Making Same - A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface. | 02-26-2015 |
20150054002 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a semiconductor structure includes the following steps. A patterned photoresist layer is formed on a wafer of the wafer structure. The wafer is etched, such that channels are formed in the wafer, and a protection layer of the wafer structure is exposed through the channels. The protection layer is etched, such that openings aligned with the channels are formed in the protection layer. Landing pads in the protection layer are respectively exposed through the openings and the channels, and the caliber of each of the openings is gradually increased toward the corresponding channel. Side surfaces of the wafer surrounding the channels are etched, such that the channels are expanded to respectively form hollow regions. The caliber of the hollow region is gradually decreased toward the opening, and the caliber of the opening is smaller than that of the hollow region. | 02-26-2015 |
20150060891 | OPTOELECTRONICS ASSEMBLY AND METHOD OF MAKING OPTOELECTRONICS ASSEMBLY - An electronics assembly includes a semiconductor die assembly, an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly, and first and second optical elements mounted in the first and second chambers, respectively. The semiconductor die assembly includes a semiconductor die encapsulated in a molded material, an encapsulation layer located on the top surface of the semiconductor die, and at least one patterned metal layer and at least one dielectric layer over the encapsulation layer. Conductive pillars extend through the encapsulation layer for electrical connection to the semiconductor die. The encapsulation layer blocks optical crosstalk between the first and second chambers. A method is provided for making the electronics assembly. | 03-05-2015 |
20150060892 | PHOTOCOUPLER - A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region. | 03-05-2015 |
20150069423 | MOUNTING MEMBER AND PHOTOCOUPLER - A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another. | 03-12-2015 |
20150076525 | LIGHT RECEIVING ELEMENT AND OPTICALLY COUPLED INSULATING DEVICE - A light receiving element includes: a semiconductor layer; a first layer; and a second layer. The semiconductor layer has a first impurity concentration. The first layer of a first conductivity type is provided inward from an upper surface of the semiconductor layer. The first layer has a second impurity concentration higher than the first impurity concentration. The first layer has a surface region on an upper surface of the semiconductor layer side and an inner region being narrower than the first region. The second layer of a second conductivity type is provided inward from the upper surface of the first semiconductor layer. The second layer has a third impurity concentration higher than the first impurity concentration. | 03-19-2015 |
20150076526 | LIGHT RECEIVING ELEMENT AND OPTICALLY COUPLED INSULATING DEVICE - A light receiving element includes: a semiconductor layer; an insulating layer; an interconnect layer; and a film. The semiconductor layer includes a light receiving unit configured to convert a signal light incident on the light receiving unit into an electrical signal. The insulating layer is provided on the semiconductor layer. The interconnect layer is provided on the insulating layer. The film is provided on the insulating layer to cover the light receiving unit and be connected to the interconnect layer, the film being made of a metal or a metal nitride. | 03-19-2015 |
20150091024 | PACKAGE STRUCTURE OF OPTICAL MODULE - A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs. | 04-02-2015 |
20150137148 | OPTICAL SENSOR PACKAGE - One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material. | 05-21-2015 |
20150295121 | SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER - A semiconductor device includes: a sealing resin and a semiconductor element. The sealing resin includes a base resin and a curing agent. The base resin includes isocyanuric acid having an epoxy group. The curing agent includes an acid anhydride having an acid anhydride group. A mole ratio of the acid anhydride group to the epoxy group is not less than 0.67 and not more than 0.8. A semiconductor element is covered with the sealing resin. | 10-15-2015 |
20150303180 | PHOTOCOUPLER - A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region. | 10-22-2015 |
20150340351 | OPTO-ELECTRONIC MODULES INCLUDING FEATURES TO HELP REDUCE STRAY LIGHT AND/OR OPTICAL CROSS-TALK - Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body. | 11-26-2015 |
20150364453 | TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (eWLB) PACKAGE, ASSEMBLY AND METHOD - A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die. | 12-17-2015 |
20160005724 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin. | 01-07-2016 |
20160043064 | PROXIMITY SENSOR HAVING LIGHT-BLOCKING STRUCTURE IN LEADFRAME AND METHOD OF MAKING SAME - A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor. | 02-11-2016 |
20160043811 | PHOTOCOUPLING DEVICE MANUFACTURING METHOD, PHOTOCOUPLING DEVICE, AND POWER CONVERSION SYSTEM - The alignment accuracy between light emitting elements, light receiving elements, and an insulating film is improved. A photocoupling device manufacturing method includes preparing a first lead frame having a first frame part supporting light receiving elements and a second lead frame having a second frame part supporting light emitting elements. The method also includes superposing the first and the second lead frame such that the light receiving elements and the light emitting elements mutually oppose via a first light-transmissive resin covering the light receiving elements, a second light-transmissive resin covering the light emitting elements, and an insulating film sheet positioned between the first and the second light-transmissive resin. The insulating film sheet includes body parts positioned between the light receiving elements and the light emitting elements, joining parts joined to the body parts, and a third frame part fixed between the first and the second frame part. | 02-11-2016 |
20160093595 | OPTICALLY PUMPED SENSORS OR REFERENCES WITH DIE-TO-PACKAGE CAVITIES - An optoelectronic packaged device includes stacked components within a package including a package substrate providing side and a bottom wall. The stacked components includes a comb structure on the bottom wall formed from a material having a thermal resistance >a substrate material for the bottom die providing spaced apart teeth separated by gaps. The bottom die has a top surface including electrical trace(s) and a light source die for emitting light coupled to the electrical trace and a bottom surface on the comb structure. A first cavity die is on the top surface of the bottom die or on legs of the package which extend above the bottom wall. An optics die is on the first cavity die, a second cavity die is on a sealing die which is on the optics die, and a photodetector (PD) die is optically coupled to receive light from the light source die. | 03-31-2016 |
20160104850 | STRETCHABLE FILMS, METHODS OF MANUFACTURING THE SAME AND DISPLAY DEVICES INCLUDING THE SAME - A stretchable film includes a first region including a plurality of first patterns having a concave polygonal shape. The stretchable film also includes a second region including a plurality of second patterns having a concave polygonal shape. The stretchable film further includes a buffer region between the first region and the second region. | 04-14-2016 |
20160111561 | PACKAGE STRUCTURE WITH OPTICAL BARRIER, OPTICAL PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOF - A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material. | 04-21-2016 |
20160126403 | OPTICAL MODULE PACKAGE AND ITS PACKAGING METHOD - An optical module package includes a substrate having a recessed portion, a cover covered on the substrate and defining with the substrate a first chamber and a second chamber therebetween, the cover having a light-emitting hole disposed in communication with the first chamber, a light-receiving hole disposed in communication with the second chamber and a stop wall positioned in the recessed portion to separate the first chamber and the second chamber, a light-emitting chip and a light-receiving chip mounted at the substrate and respectively disposed in the first chamber and the second chamber, and two encapsulation colloids respectively mounted in the first chamber and the second chamber and respectively wrapped about the light-emitting chip and the light-receiving chip. Thus, the optical module package not only can prevent crosstalk but also can greatly reduce the manufacturing cost and the level of difficulty. | 05-05-2016 |
20160141279 | METHODS FOR PERFORMING EXTENDED WAFER-LEVEL PACKAGING (eWLP) AND eWLP DEVICES MADE BY THE METHODS - Embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies and methods of making them are provided. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations. | 05-19-2016 |
20160141440 | OPTICAL SENSOR MODULE - An optical sensor module is disclosed. The optical sensor module can include a housing comprising an air cavity. An optical emitter die can be disposed in the air cavity of the housing. A top surface of the optical emitter die can face a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing. An optical sensor die can be disposed in the air cavity of the housing adjacent the optical emitter die. The optical sensor die can be spaced from the optical emitter die by a lateral distance. A top surface of the optical sensor die can face the first side of the housing. There may be no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die. | 05-19-2016 |
20160155782 | DISPLAY DEVICE | 06-02-2016 |
20160163681 | OPTICAL SENSOR PACKAGE AND OPTICAL SENSOR ASSEMBLY - There is provided an optical sensor package including a semiconductor base layer. A first surface of the semiconductor base layer is formed with a pixel array, a plurality of solder balls and an optical component such that when the optical sensor package is assembled with a substrate, the optical component is accommodated in an accommodation throughhole of the substrate so as to reduce the total thickness. | 06-09-2016 |
20160187530 | OPTICAL MODULE, METHOD OF MAKING THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME - An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space. | 06-30-2016 |
20160190380 | WAFER LEVEL PACKAGING FOR PROXIMITY SENSOR - A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly. | 06-30-2016 |
20160197224 | SEALING RESIN, SEMICONDUCTOR DEVICE, AND PHOTOCOUPLER | 07-07-2016 |
20180026020 | COMPACT OPTOELECTRONIC MODULES | 01-25-2018 |
20180026152 | Displays With Camera Window Openings | 01-25-2018 |
20190148655 | STRETCHABLE FILMS, METHODS OF MANUFACTURING THE SAME AND DISPLAY DEVICES INCLUDING THE SAME | 05-16-2019 |
20220140174 | DISPLAY DEVICE - A display device includes a substrate including a first surface, and a second surface positioned at a side opposite to the first surface; a first light-emitting element located at a lateral side of the substrate; a plurality of light-receiving elements located at a second surface side of the substrate; a plurality of second light-emitting elements located on the first surface of the substrate; and a first drive element controlling driving of the second light-emitting elements based on output of the light-receiving elements. A light-emitting surface of the first light-emitting element is oriented in a first direction. The first direction is parallel to a direction from the first surface toward the second surface. Light-emitting surfaces of the second light-emitting elements are oriented in a second direction. The second direction is from the second surface toward the first surface. | 05-05-2022 |