Class / Patent application number | Description | Number of patent applications / Date published |
228203000 | With pretreating other than heating or cooling of work part of filler prior to bonding and any application of filler | 59 |
20080210742 | METAL ENCAPSULATION - A process for encapsulating metal microparticles in a pH sensitive polymer matrix using a suspension containing the polymer. The process first disperses the metal particles in a polymeric solution consisting of a pH sensitive polymer. The particles are then encapsulated in the form of micro-spheres of about 5-10 microns in diameter comprising the pH sensitive polymer and the metal ions (Ni | 09-04-2008 |
20080230591 | DEVICE AND METHOD FOR PRETREATING ELECTRONIC COMPONENTS PRIOR TO SOLDERING - A device and method are provided for reflow soldering workpieces wherein a plasma device for an atmospheric plasma treatment of the workpiece is upstream of a solder application and/or upstream of a soldering zone, and wherein the method subjects the workpiece to an atmospheric plasma treatment with the aid of a plasma device prior to the application of the solder and/or prior to the soldering process. | 09-25-2008 |
20080265006 | Method for bonding electronic components finished with electroless NiXP for preventing brittle fracture - A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly. | 10-30-2008 |
20090001138 | Method for preventing void formation in a solder joint - In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint. | 01-01-2009 |
20090001139 | METHOD FOR MANUFACTURING A PRINTED WIRING BOARD - A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small diameter metal balls, which includes a small-diameter aperture area that corresponds to the small-diameter aperture on the solder resist layer. A metal ball having a second diameter larger than the first diameter is mounted in the large-diameter aperture by using a mask for large diameter metal balls, which includes a large-diameter aperture area that corresponds to the large-diameter aperture on the solder resist layer. A small-diameter bump is formed from the metal ball having a first diameter and a large-diameter bump is formed from the metal ball having a second diameter by heating each of the metal ball with a first diameter and the metal ball with a second diameter to at least their respective reflow temperatures. | 01-01-2009 |
20090166398 | SOLDERING APPARATUS AND SOLDERING METHOD - A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered. | 07-02-2009 |
20090184156 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR - A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump. | 07-23-2009 |
20090242616 | REFLOW SOLDER OVEN WITH COOLING DIFFUSER - A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate. | 10-01-2009 |
20090242617 | Permanent Magnet Temporary Demagnetization Temperature Rise Technique and Their Application for Soldering - A method for raising a demagnetization temperature of a permanent magnet is disclosed. The method provides a ferromagnetic arrangement around the magnet to increase demagnetization thresholds for the duration of soldering, or any other process requiring high temperatures. Using the method disclosed, it is possible to apply high levels of heat directly to permanent magnets without demagnetization, and more particularly to create permanent magnetic assemblies fit for any environment. | 10-01-2009 |
20090250507 | Soldering method and system thereof - A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided. | 10-08-2009 |
20090261147 | Dross Removal - This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue. | 10-22-2009 |
20090261148 | PRODUCTION METHOD OF SOLDER CIRCUIT BOARD - A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting the solder particle to form a bump part which corresponds to the tacky part and to which an electronic part is to be connected and forming a solder circuit. | 10-22-2009 |
20090283574 | SOLDER BALL MOUNTING APPARATUS AND WIRING BOARD MANUFACTURING METHOD - A wiring board includes an insulating layer having a plurality of through holes formed therein, a base substrate layer positioned below the insulating layer, and a plurality of electrodes disposed on the base substrate layer, each electrode having an exposed surface exposed from a respective through hole, each exposed surfaces being coated with a flux. A plurality of solder balls are disposed on the fluxes in the through holes, respectively. An apparatus for mounting the solder balls on the plurality of electrodes includes: a solder ball removing unit configured to remove a first plurality of solder balls located other than in the through holes; and a solder ball pressing unit configured to press a second plurality of solder balls individually disposed in the through holes towards respective electrodes and into respective flux. | 11-19-2009 |
20100065615 | METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD - A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder. | 03-18-2010 |
20100122997 | Method of manufacturing irregular shapes of solder wires and product thereof - A method of manufacturing irregular shapes of solder wires comprising the steps of: (a) acquiring materials of solder wire; (b) placing the materials into wire manufacturing machines to form solder wires into specifically designed profiles; (c) transporting the resulted solder wires to forming equipment and tools to form solder wires into specific shapes. The invention also provides products made with above-mentioned methods of manufacturing irregular shapes of solder wires. | 05-20-2010 |
20100147930 | Dross Removal - This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue. | 06-17-2010 |
20100193573 | Method of Improving the Solderability of a Printed Circuit Board - A process for producing a coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer. The article is characterized in that the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer (iii) containing the conductive polymer. | 08-05-2010 |
20100276474 | METHOD OF FORMING AN INTERCONNECT JOINT - A method of forming an interconnect joint includes providing a first metal layer ( | 11-04-2010 |
20110114707 | Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures - A method for making thermally conductive high aspect ratio large area contact between devices with different coefficients of thermal expansion. The method of the invention includes the creation or placement of sparse structures on at least one of two surfaces or between the surfaces to maintain enough thickness that an interposed bonding material remains sufficiently compliant that relative thermal motion of the two devices can occur without damage to the devices or the bond during changes in temperature. | 05-19-2011 |
20110204123 | Method for the Removal of Surface Oxides by Electron Attachment - Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode. | 08-25-2011 |
20110226842 | WATER HEATER THREADED WELD FITTING HAVING IMPROVED WELD INTEGRITY - A threaded weld fitting and a method of welding a threaded weld fitting to the tank wall of a water storage tank are provided. The threaded weld fitting comprises a body defining an aperture and having a facing surface configured to be positioned facing the tank wall. A female thread is formed along the aperture. A first beveled surface portion of the facing surface extends from an edge of the body. A landing surface portion of the facing surface extends from the first beveled surface portion toward a longitudinal axis of the aperture. A second beveled surface portion of the facing surface extends from the landing surface and to the female thread. The landing surface portion and the second beveled surface portion together define an open annular area positioned to receive a portion of a weld formed by welding the threaded weld fitting to the tank wall. | 09-22-2011 |
20120074209 | ELECTROLYTIC DEPOSITON AND VIA FILLING IN CORELESS SUBSTRATE PROCESSING - Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a dielectric material on the core. The method also includes forming vias in the dielectric material, the vias positioned to expose metal regions. The method also performing an electrolytic plating of metal into the vias and on the metal regions, wherein the core is electrically coupled to a power supply during the electrolytic plating of metal into the vias and delivers current to the metal regions. The method also includes removing the metal core after the electrolytic plating of metal into the vias. Other embodiments are described and claimed. | 03-29-2012 |
20120111927 | ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY - A method of forming an electronic device bond pad includes providing an electronic device substrate having an Al bond pad located thereover. An aluminum layer is formed over the Al bond pad. A metal layer is formed located between the Al bond pad and the aluminum layer. The metal layer comprises one or more of Ni, Pd and Pt and has a total concentration of Ni, Pd and/or Pt of at least about 50 wt. %. A gold bond wire may be attached to the aluminum layer. | 05-10-2012 |
20120153009 | METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS COMPOSITION - Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight. | 06-21-2012 |
20120298729 | Polymer Composition for Microelectronic Assembly - Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components. | 11-29-2012 |
20120305633 | INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES - Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head. | 12-06-2012 |
20120318855 | IMS (INJECTION MOLDED SOLDER) WITH TWO RESIST LAYERS FOR FORMING SOLDER BUMPS ON SUBSTRATES - A photoresist layer is applied over a solder resist layer on a substrate such as a wafer. Openings in the solder resist and photoresist layers are filled with flux-free molten solder using IMS. The process is applicable to fine pitch applications and chip size packaging substrates. A protection layer may be employed to facilitate removal of the photoresist layer from the substrate. An oversized substrate including an adhesive layer on a peripheral area may be employed for providing greater adhesion of a dry film layer to the peripheral area of the substrate than the central portion thereof. The peripheral area is removed following IMS. | 12-20-2012 |
20120325899 | Dross Removal - This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue. | 12-27-2012 |
20130008938 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate. | 01-10-2013 |
20130037603 | Method of Forming a Bonded Structure - In an embodiment, a method of forming a bonded structure is provided. The method may include forming at least one first under bump metallurgy (UBM) structure on a first substrate, forming a first gold layer on the at least one first under bump metallurgy structure; forming a tin layer on the first gold layer, forming an indium layer on the tin layer, forming an inhibition layer configured to inhibit oxygen penetration on the indium layer, and forming at least one second under bump metallurgy structure on a second substrate, forming s second gold layer on the at least one second under bump metallurgy structure; and bringing the inhibition layer into contact with the second gold layer at a predetermined temperature to form a resultant intermetallic structure between the first substrate and the second substrate thereby bonding the first substrate to the second substrate and forming the bonded structure. | 02-14-2013 |
20130062398 | Method for Reliably Soldering Microwave Dielectric Ceramics with Metal - A method for reliably soldering microwave dielectric ceramics with metal adopting the way of vapor soldering, a strict process of heating up, then soldering under heat preservation and finally cooling is provided. Therefore, thermal stress generated during the soldering of dielectric ceramics and metal material is reduced, reliability of a solder structure is ensured, porosity of the soldering side is effectively lowered, soldering quality is improved, soldering cost is reduced, and the demand of large-scale production can be met. | 03-14-2013 |
20140312101 | MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING - Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening. | 10-23-2014 |
20140374468 | WATER REMOVING METHOD, OPTICAL FIBER SOLDERING METHOD, AND SEMICONDUCTOR LASER MODULE MANUFACTURING METHOD - A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light. | 12-25-2014 |
20150069115 | DEVICE AND METHOD FOR BONDING SUBSTRATES - A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space, | 03-12-2015 |
20150090774 | BRAZING METHOD - According to this brazing method, a first base member having a non-plated surface, a metal layer for functioning as a diffusion barrier layer, a brazing foil, and a second base member having a surface are arranged in this order so that the non-plated surface of the first base member and the surface of the second base member are faced with each other. The first base member and the second base member are brazed by using the brazing foil. The cost of providing a diffusion barrier layer between the first base member and the brazing foil is thereby reduced. | 04-02-2015 |
228205000 | Cleaning | 11 |
20090020592 | Method of joining and method of fabricating an organic light emitting diode display device using the same - A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer. | 01-22-2009 |
20090039141 | BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME - A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded. | 02-12-2009 |
20100252615 | JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT - A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. | 10-07-2010 |
20110272453 | METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE - A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell. | 11-10-2011 |
20130105561 | DRY ICE CLEANING OF METAL SURFACES TO IMPROVE WELDING CHARACTERISTICS | 05-02-2013 |
228206000 | Chemical | 6 |
20120160903 | METHOD OF JOINING METAL - The present invention provides a method of joining a metal that can join coppers at a relatively low temperature by a simple technique while maintaining connection reliability. | 06-28-2012 |
20120199635 | TIN-SILVER BONDING AND METHOD THEREOF - A Sn—Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin(Sn) and silver(Ag) is larger than the stress released by diffusion and bonding of conventional gold-silver bonding. Moreover, a Sn—Ag bonding method of the present invention forms Sn—Ag bonding at low temperature and releases more stress so as to reduce thermal stress generated during wafer bonding effectively. And after wafer bonding, the high temperature processes can be performed. | 08-09-2012 |
20140263586 | Integrate Rinse Module in Hybrid Bonding Platform - A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. | 09-18-2014 |
20150076216 | REDUCING FORMATION OF OXIDE ON SOLDER - In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder. | 03-19-2015 |
228207000 | Applying flux | 2 |
20140374469 | Process for Flux Coating Braze Preforms and Discrete Parts - Systems and methods for evenly applying a flux coating to any number of different shaped parts with a single machine are described. The systems and methods provide advantages in that the flux coating may be applied accurately within 2% to 4% of desired thickness with 85% to 95% of the total yield of flux being applied, this minimizing waste. Thousands of parts may be batch treated with a single, machine without operator input. | 12-25-2014 |
20150122876 | SYSTEM AND METHOD FOR FLUX COAT, REFLOW AND CLEAN - The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion. | 05-07-2015 |
228208000 | Applying preliminary bond facilitating metal coating | 11 |
20090140030 | BRAZE FORMULATIONS AND PROCESSES FOR MAKING AND USING - A braze formulation for superalloys including nickel, chromium, optionally, cobalt, optionally, aluminum, optionally, boron, hafnium and tantalum, said braze formulation having a solidus temperature of no greater than about 1180° C. and a liquidus temperature of no greater than about 1250° C. Methods for brazing are also provided. The brazing formulations are robust with good ductility and have minimal embrittled phases or otherwise decreased braze integrity. | 06-04-2009 |
20090250508 | Antioxidant Joint Compound and Method for Forming an Electrical Connection - A joint compound for electrical connections is disclosed which includes an antioxidant base material and a quantity of stainless steel grit mixed with the antioxidant base material to provide improved mechanical pullout strength. The joint compound has a weight ratio of antioxidant to stainless steel grit in the range of from about 30:70 to about 90:10, preferably, from about 40:60 to about 70:30, and more preferably about 50:50. The stainless steel grit is cut wire having a diameter within the range of from about 0.012 inches to about 0.125 inches, with a preferred diameter within the range of from about 0.012 inches to about 0.030 inches, and 0.017 inches being a more preferred stainless steel grit diameter. | 10-08-2009 |
20100001045 | SOLDER STANDOFFS FOR INJECTION MOLDING OF SOLDER - A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs. | 01-07-2010 |
20100001046 | SELECTIVE SOLDERING BATH - A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering. | 01-07-2010 |
20110248073 | HIGH TEMPERATURE SEAL FOR JOINING CERAMIC COMPONENTS SUCH AS CELLS IN A CERAMIC OXYGEN GENERATOR - A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation. | 10-13-2011 |
20120006885 | Multipath Soldered Thermal Interface Between a Chip and its Heat Sink - A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process. | 01-12-2012 |
20120037688 | METHOD FOR PRODUCING A HIGH-TEMPERATURE AND TEMPERATURE-CHANGE RESISTANT CONNECTION BETWEEN A SEMICONDUCTOR MODULE AND A CONNECTION PARTNER - The invention relates to a method for producing a connection between a semiconductor component and semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process, wherein a metal powder suspension is applied to the areas of the semiconductor module to be connected later; the suspension layer is dried, outgassing the volatile components and generating a porous layer; the porous layer is pre-sealed without complete sintering taking place throughout the suspension layer; and, in order to obtain a solid electrically and thermally conductive connection of a semiconductor module to a connection partner from the group of: substrate, further semiconductor or interconnect device, the connection is a sintered connection generated without compression by increasing the temperature and made of a dried metal powder suspension that has undergone a first transport-safe contact with the connection partner in a pre-compression step and has been solidified at zero pressure using temperature sintering. | 02-16-2012 |
20120043371 | WIRING SUBSTRATE MANUFACTURING METHOD - A wiring substrate includes a conductor layer and a resin insulating layer stacked alternately, solder resist layers formed on outermost surfaces on a first principal surface side and an opposing second principal surface side respectively, and outermost conductor layers exposed from opening portions formed in the respective solder resist layers. A method of manufacturing the wiring substrate includes: forming a first underlying layer and a second underlying layer on the respective outermost conductor layers; supplying a first solder onto the first underlying layer, and a second solder onto the second underlying layer; and connecting the first solder to the first underlying layer and the second solder to the second underlying layer respectively, by heating the first solder and the second solder simultaneously. | 02-23-2012 |
20130206821 | METAL BONDING METHOD - After a first coating portion formed on a bonding face of a first bonding portion and a second coating portion formed on a bonding face of a second bonding portion are removed by reverse sputtering, copper sputtering is performed to form first and second copper films. The gap between the oxide film on the outermost face of the first copper film and the oxide film on the outermost face of the second copper film is filled with a solution into which copper oxide can be eluted, thereby eluting copper oxide contained in the oxide film in the solution. By applying pressure and heat, the components contained in the solution are removed except for copper, thereby bonding the outermost face of the first copper film and the outermost face of the second copper film to each other by means of copper solid-phase diffusion. | 08-15-2013 |
228209000 | Chemical deposition | 2 |
20090127319 | METHOD FOR SOLDERING MAGNESIUM ALLOY WORKPIECE - A method for soldering a magnesium alloy workpiece is provided. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt % of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux. | 05-21-2009 |
20100012708 | OILFIELD TOOLS COMPRISING MODIFIED-SOLDERED ELECTRONIC COMPONENTS AND METHODS OF MANUFACTURING SAME - Oilfield tools, assemblies and methods of manufacturing same are described comprising a modified-soldered electronic component, wherein the modified-solder includes a high-melting metal matrix and from about 0.1 to about 20 weight percent, based on total weight of the modified solder, of a strength-reinforcing additive dispersed in the metal matrix, the additive comprising a polyhedral oligomeric silsesquioxane. Methods of using the oilfield tools and assemblies in oilfield operations are also described. | 01-21-2010 |
228211000 | Chemical | 2 |
20120273558 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided. | 11-01-2012 |
20130181040 | SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - Provided is a semiconductor device manufacturing system according to the present disclosure which manufactures a semiconductor device using a chip stack. The system includes a chip reducing apparatus and a chip bonding apparatus, the chip reducing apparatus includes a reduction chamber, an oxide film of the surface of the terminal of each chip is reduced in the reduction chamber, the chip bonding apparatus includes a reflow chamber isolated from the reduction chamber, a solder ball is bonded to the terminal of each chip in the reflow chamber, and the chip bonding apparatus is installed separately from the chip reducing apparatus. | 07-18-2013 |