Class / Patent application number | Description | Number of patent applications / Date published |
174268000 | With single conductive plane (e.g., tape, cable) | 58 |
20080283289 | PRINTED CIRCUIT BOARDS - The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced. | 11-20-2008 |
20080302564 | CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR PREPARING THE SAME - A substrate for an electronic device package includes an electrically conductive core shaped to define a cavity for receiving an electronic device, a first insulating layer positioned on a first side of the core, and a first contact positioned adjacent to a surface within the cavity. Method of fabricating the substrates is also provided. | 12-11-2008 |
20090020328 | HYBRID ANTENNA STRUCTURE - An electrical component is provided that provides at least a two shot injection molding structure. One of the at least two shots of plastic comprises a laser direct structuring material. Another of the at least two shots of plastic comprises a non-platable plastic. The laser direct structuring material is selectively activated such that a conductive trace can be plated on the laser direct structuring material. | 01-22-2009 |
20090145653 | Substrate pad structure - A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting portion, which has a continuous oblong shape. A space portion is provided between the first pad portion and the second pad portion, and the lead connecting portion includes a non-connected region located at a corresponding position of the space portion. | 06-11-2009 |
20090236140 | WIRELESS POWER RECEIVER MODULE - A charging system comprises a power pad and compatible circuitry on devices to be charged, including contacts in a constellation pattern that interface with conductive strips on the pad to ensure power transfer regardless of orientation. Safety and control circuitry provide spark suppression and short protection. | 09-24-2009 |
20100059267 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer. | 03-11-2010 |
20100187005 | Flat cable fixing structure - The present invention provides a flat cable fixing structure that includes a flexible flat cable (FFC) and a positioning element. The flexible flat cable is connected to a printed circuit board, and the positioning element is provided for fixing the flexible flat cable to the printed circuit board to achieve the effect of securely fixing the flexible flat cable onto the printed circuit board. When the flat cable fixing structure is applied to various types of electronic products, the invention can overcome the shortcomings of the prior art that the flat cable and the printed circuit board may be separately from each other easily by an external force, and the difficulty of aligning soldering points. | 07-29-2010 |
20100193234 | Method for producing an electrical and mechanical connection and an assembly comprising such a connection - A method for producing an electrical and mechanical connection, wherein a solid body comprises a support, on which is disposed an electrical contact zone and an electrically insulating support zone. A flexible, flat cable comprises a support layer made of an electrically insulating material and a strip conductor, with an electrical contacting point and a laterally adjacent insulating cable zone. An adhesive layer is applied on the cable and the contacting point is disposed on the support layer so that the adhesive layer surrounds the contacting point and adheres to the cable. The support and the cable are positioned in a pre-assembly position so that the contacting point of the cable is facing the contact zone of the support and the adhesive layer is facing the electrically insulating support zone. The solid body and the cable are positioned so that the contacting point electrically contacts the contact zone and the adhesive layer adheres to the surface of the solid body. | 08-05-2010 |
20100282504 | HIGH IMPEDANCE TRACE - A microwave conducting structure is described, in which a first electrically conductive layer, a first dielectric substrate with a first dielectric constant being arranged on the first electrically conductive layer, and at least one electrically conductive trace with a first width being arranged on or within the dielectric substrate are provided. A track of a second dielectric substrate having a second width being wider than the first width and a second dielectric constant being lower than the first dielectric constant, is arranged locally between the first dielectric substrate and the conductive trace so as to extend along the conductive trace such that the conductive trace operates electrically as being arranged on the second dielectric substrate. | 11-11-2010 |
20100294556 | Flexible-circuit flat cable with cluster section - Disclosed is a flexible-circuit flat cable with cluster section, including at least one cluster section, at least one slip section, a first connection section, and a second connection section. The first connection section is set at a first end of the cluster section. The slip section has a first end connected to a second end of the cluster section and a second end at which the second connection section is set. The four sections are all provided with a plurality of signal transmission lines corresponding to and connecting each other. The first connection section and the second connection section are selectively provided with a connector or a plugging end. Further, the cluster section includes a cluster structure composed of a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of a flexible circuit board to impose free and independent flexibility for bending to each clustered flat cable component. | 11-25-2010 |
20110061923 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE AND WIRING CIRCUIT BOARD - A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board. | 03-17-2011 |
20110147071 | APPARATUS, A METHOD FOR ESTABLISHING A CONDUCTIVE PATTERN ON A PLANAR INSULATING SUBSTRATE, THE PLANAR INSULATING SUBSTRATE AND A CHIPSET THEREOF - An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web. | 06-23-2011 |
20110147072 | METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER - An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface. | 06-23-2011 |
20110198117 | LAMINATE AND PROCESS FOR PRODUCING THE LAMINATE - A laminate including a resin layer and a metal layer, the resin layer being obtained by modifying at least part of the surface of a resin film including a thermoplastic cyclic olefin resin by ionizing irradiation, and the metal layer being formed on the modified area of the surface of the resin film by plating, a method of producing the same, and an electronic circuit board including a circuit formed by etching the metal layer of the laminate by photolithography, are disclosed. The laminate ensures that the insulating resin layer (flat surface) exhibits high adhesion to the conductor layer. | 08-18-2011 |
20110240358 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion. | 10-06-2011 |
20110297434 | VACUUM HERMETIC ORGANIC PACKAGING CARRIER - A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier. | 12-08-2011 |
20110308851 | Circuit Substrate and Light Emitting Diode Package - A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units. | 12-22-2011 |
20120018210 | PRINTED CIRCUIT BOARD - A printed circuit board includes a reference layer configured to connect to a power or a ground and a dielectric layer stacked on the reference layer. The dielectric layer includes a component surface opposing the reference layer. The component surface forms a differential pairs, a protection runner, and a power runner. The differential pairs include a substantially linear part. The protection runner is intervened between the linear part and the power runner, and is substantially parallel to the differential pairs. The length of the protection runner is approximately equal to that of the linear part. Each of the two ends of the protection runner forms a via that electrically connects the protection runner to the reference layer. | 01-26-2012 |
20120234593 | CONDUCTIVE FOILS HAVING MULTIPLE LAYERS AND METHODS OF FORMING SAME - Embodiments of the invention generally relate to conductive foils having multiple layers for use in photovoltaic modules and methods of forming the same. The conductive foils generally include a layer of aluminum foil having one or more metal layers with decreased contact resistance disposed thereon. An anti-corrosion material and a dielectric material are generally disposed on the upper surface of the metal layer. The conductive foils may be formed on a carrier prior to construction of a photovoltaic module, and then applied to the photovoltaic module as a conductive foil assembly during construction of the photovoltaic module. Methods of forming the conductive foils generally include adhering an aluminum foil to a carrier, removing native oxides from a surface of the aluminum foil, and sputtering a metal onto the aluminum foil. A dielectric material and an anti-corrosion material may then be applied to the upper surface of the sputtered metal. | 09-20-2012 |
20120292094 | METAL CORE BOARD FOR VEHICLE-MOUNTABLE JUNCTION BOX - Provided is a metal core board which has a preferable function for a vehicle-mountable junction box, specifically, is reduced in size or improved in mounting efficiency. A metal core board for a vehicle-mountable junction box, which is mountable on the vehicle-mountable junction box, wherein a core plate forming an intermediate layer of the metal core board has a plurality of slits and an island surrounded by separating connection parts present between the slits; and in the state where the island is held between insulating layers stacked on both of two surfaces of the core plate, through-bores 46 are formed at the separating connection parts to remove the separating connection parts and the island is made electrically independent from a remaining part of the core plate while being held between the insulating layers. Thus, a plurality of circuits can be formed. | 11-22-2012 |
20120305306 | COPPER NANOPARTICLE APPLICATION PROCESSES FOR LOW TEMPERATURE PRINTABLE, FLEXIBLE/CONFORMAL ELECTRONICS AND ANTENNAS - An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed. | 12-06-2012 |
20120325545 | CONDUCTIVE FILM AND METHOD FOR ITS PRODUCTION - To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production. | 12-27-2012 |
20130180773 | CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for manufacturing circuit substrate structure and its product are provided. Firstly, an attached enhancement portion having rough surfaces is formed on a surface of a carrier through a roughing process, and a catalyst is disposed on a surface of the attached enhancement portion. Finally, a metal layer is formed on the attached enhancement portion after reacting with the catalyst through chemical plating reduction. The foregoing manufacturing method can effectively reduce the usage of the catalyst or an accelerator to greatly decrease the using costs of the catalyst and the accelerator. | 07-18-2013 |
20130240260 | METHOD FOR MAKING AN INTERACTIVE INFORMATION DEVICE AND PRODUCT PRODUCED THEREBY - A method and product produced by the method for forming an interactive information device with a conductively coated panel includes forming a reduced contrast increased light transmitting, conductively coated panel by providing a transparent substrate and applying a transparent, conductive layer on at least one surface of the substrate in a predetermined pattern with at least one area having a conductive layer thereon and a second area without a conductive layer. The method further includes applying a transparent layer of a metal oxide such that the metal oxide layer, such as silicon dioxide, overlies both areas whereby visible contrast between the areas is reduced and light transmission through the coated panel is increased. The coated panel is then attached to an electro-optic display for displaying information when electricity is applied thereto. | 09-19-2013 |
20130264107 | CIRCUIT BOARD AND WIRE ASSEMBLY - A circuit board includes a substrate extending from a mounting end to an opposite end. The substrate extends a thickness from an upper side to a lower side. The substrate includes a recess that extends into the mounting end in a direction toward the opposite end. The circuit board includes an internal ground plane held by the substrate such that the internal ground plane extends within the thickness of the substrate. The internal ground plane includes a recess segment that extends, and is exposed, within the recess. | 10-10-2013 |
20130277100 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel includes a transparent substrate, an insulating layer that is formed on the transparent substrate and has an intaglio portion formed thereon, an electrode layer that is embedded in the intaglio portion, and a light absorbing layer that is formed in an inner wall of the intaglio portion to be interposed between the inner wall of the intaglio portion and the electrode layer. In the touch panel, the electrode layer is formed to be embedded, and the light absorbing layer is further included, thereby durability and visibility of the touch panel. | 10-24-2013 |
20130313013 | PRINTED CIRCUIT BOARDS - A printed circuit board comprises at least one microstrip transmission line with a conductive solid reference plane and at least one conductive trace embedded in a dielectric substrate, and further comprises at least one conductive shielding layer having a lattice structure, wherein the conductive trace is arranged between the solid reference plane and the shielding layer. | 11-28-2013 |
20130341079 | TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - The present invention provides a transparent conductive substrate comprising: a transparent substrate, and a conductive pattern provided on the transparent substrate, wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape. The present invention can minimize a moiré phenomenon and a diffraction phenomenon by external light by performing line breakage of a regular or irregular conductive pattern by using the irregular pattern. | 12-26-2013 |
20130341080 | CERAMIC MULTILAYER SUBSTRATE - In a ceramic multilayer substrate including a ceramic laminate including ceramic layers, a surface electrode located on a surface of the ceramic laminate, and a cover ceramic layer that covers a peripheral portion of the surface electrode, a recess portion is provided in a peripheral portion of a surface electrode to extend along the periphery thereof, and the peripheral portion of the surface electrode includes a peripheral end portion thereof and a region in which the recess portion is covered with a cover ceramic layer. A height of a central portion of the surface electrode which is not covered with the cover ceramic layer is lower than a height of a primary surface of the ceramic laminate on which the surface electrode is located. | 12-26-2013 |
20140027169 | ANISOTROPIC CONDUCTIVE FILM - An anisotropic conductive film is disclosed. The anisotropic conductive film includes a substrate, a plurality of insulating resin walls on the substrate and conductive materials. Each insulating resin wall is disposed on the substrate in parallel to each other. The conductive materials are arranged between the insulating resin walls and have conductivity along a direction parallel to the insulating resin walls. | 01-30-2014 |
20140027170 | WIRING SUBSTRATE - A wiring substrate ( | 01-30-2014 |
20140034376 | MULTI-LAYER TRANSMISSION LINES - A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer. | 02-06-2014 |
20140041924 | MICRO-WIRE ELECTRODE PATTERN - A micro-wire electrode includes a substrate and an anisotropically conductive electrode extending in a length direction formed over the substrate. The electrode includes a plurality of electrically connected micro-wires formed in a micro-pattern over the substrate. The micro-pattern includes a plurality of substantially parallel and straight micro-wires extending substantially in the length direction and a plurality of angled micro-wires formed at a non-orthogonal angle to the straight micro-wires electrically connecting the straight micro-wires so that the anisotropically conductive electrode has a greater electrical conductivity in the length direction than in another conductive electrode direction. | 02-13-2014 |
20140138143 | TOUCH WINDOW - A light emitting device according to the embodiment includes touch window including: a substrate; and an electrode part on the substrate, wherein the electrode part includes: a first sub-pattern; an electrode layer on the first sub-pattern; and a second sub-pattern close to the first sub-pattern, and wherein a boundary area between the electrode layer and the first sub-pattern is larger than a boundary area between the substrate and the first sub-pattern. A light emitting device package according to the embodiment includes a touch window including: a substrate; and an electrode part on the substrate; wherein the electrode part includes: a first sub-pattern; an electrode layer on the first sub-pattern; and a second sub-pattern close to the first sub-pattern, and wherein a line width of the first sub-pattern is changed according to a height of the first sub-pattern. | 05-22-2014 |
20140151109 | CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF - The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width. | 06-05-2014 |
20140216803 | CONDUCTIVE COMPONENT AND PREPARATION METHOD THEREOF - A conductive component is disclosed in the present invention, which includes an insulating layer and a metal mesh laid on the insulating layer, the metal mesh defines a plurality of voids arranged in array, a relationship of the aperture ratio K of the voids of the metal mesh, the optical transmittance T | 08-07-2014 |
20140216804 | Transparent Conductive Film - A transparent conductive film includes a substrate defining a mesh-shaped groove, which forms a mesh; and a conductive layer formed by conductive material filled in the mesh. An edge line of the mesh-shaped grooves is a curve or a polyline which increases a contact area between the conductive material and an edge of the mesh-shaped groove. In the transparent conductive film, non-linear edge lines are used, therefore, for the conductive region with the same size, the area of edge of the conductive material in contact with the trench increases, and the friction is increased, which leads to a larger adhesion of the conductive material, and a stable performance of the transparent conductive film is guaranteed. | 08-07-2014 |
20140251676 | STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION - A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings. | 09-11-2014 |
20140291008 | ELECTRODE PATTERN AND TOUCHSCREEN USING THE SAME - A touchscreen electrode pattern constituted by wavy conductive lines, each wavy conductive line includes multiple troughs of wave and multiple crests of waves, wherein an interval between adjacent troughs of waves in each wavy conductive line is larger than 1.5 times of a predetermined value, and an amplitude difference between adjacent trough of waves and crest of waves in each wavy conductive line is smaller than ⅓ times of the predetermined value. | 10-02-2014 |
20140318850 | PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRINTED CIRCUIT BOARD - A printed circuit board on which a component having a plurality of terminals is to be mounted by using a reflow soldering process, includes wiring patterns that are arranged in correspondence with the plurality of terminals and have a size which is smaller in wiring patterns for terminals near the central portion of the component than in wiring patterns for terminals near each end portion of the component. | 10-30-2014 |
20150047893 | PACKAGE - Embodiments of the present packages comprise a package body that is made of an insulating material, has a front surface and a back surface, and has a rectangular shape in plan view, a metal layer that is formed along a peripheral portion of the front surface of the package body and that has a frame shape in plan view, a metal frame that is joined to the metal layer with a brazing material and has a frame shape in plan view. a pair of electrode pads that are formed on the front surface of the package body surrounded by the metal layer and configured to mount a crystal oscillator, and an opening portion of a cavity opened in a position that excludes the pair of electrode pads, wherein the metal layer, the pair of electrode pads, and the opening portion of the cavity are positioned in the same plane. | 02-19-2015 |
20150107889 | CAPACITANCE TOUCH PANEL MODULE AND FABRICATION METHOD THEREOF - A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion. | 04-23-2015 |
20150299478 | CONDUCTIVE PASTE, METHOD FOR FORMING CONDUCTIVE PATTERN, AND OBJECT WITH PRINTED CONDUCTIVE PATTERN - A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste. | 10-22-2015 |
20150342030 | PRINTED WIRING BOARD - To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate ( | 11-26-2015 |
20150359089 | DISPLAY PANEL - A display panel comprising a first substrate, a second substrate and a light shielding layer is provided. The first substrate comprises several display units arranged in a matrix and forming an image display region. The display units comprise m*n pixels arranged in a matrix. The second substrate is opposite to the first substrate. The light shielding layer located between the first substrate and the second substrate comprises several extending portions. The projection of one of the extending portions on the first substrate overlaps at least one of the pixels. Each pixel having the largest overlapping area with the extending portion is a first pixel, and other pixels are second pixels. In each display unit, there is at most one first pixel per column and per row. In the image display region, all of the pixels adjacent to the first pixel are second pixels. | 12-10-2015 |
20150359090 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE - A circuit substrate includes an insulating layer, a conductor layer laminated on the insulating layer and including a plane layer portion, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer. The plane layer portion of the conductor layer has recess portions or opening portions, and the solder resist layer includes recessed portions covering the recess portions or opening portions of the plane layer portion. | 12-10-2015 |
20150359105 | PATTERNED TRANSPARENT CONDUCTORS AND RELATED COMPOSITIONS AND MANUFACTURING METHODS - A manufacturing method of a patterned transparent conductor includes: (1) providing a transparent conductor including nanowires formed of a metal; and (2) applying a percolation-inhibition composition to a portion of the transparent conductor to partially degrade nanowires included in the portion. The percolation-inhibition composition includes a complexing agent for the metal. | 12-10-2015 |
20150366059 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A seed layer and a resist layer are formed on a solder resist layer, and the resist layer is patterned to form connection pads and pad plating layers. Then, the resist layer is removed, and the seed layer exposed to the outside is removed. A device may be mounted on this circuit board, and a connection terminal of the device and the connection pad of the circuit board may be connected to each other by a wire, or the like. | 12-17-2015 |
20150382453 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction. | 12-31-2015 |
20160007438 | SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF - A substrate structure with invisible inner electrode patterns is provided. The substrate structure includes a substrate, an electrode pattern, a first laminated structure, and a passivation layer. The electrode pattern is disposed on the substrate. The first laminated structure is disposed on the electrode pattern, in which the first laminated structure includes a first upper layer, a second upper layer, and a third upper layer. The first upper layer is adjoined to the electrode pattern and the substrate. The first upper layer, the second upper layer, and the third upper layer are stacked sequentially. The passivation layer is disposed on the first laminated structure. The refractive indexes of the electrode pattern, the first upper layer, the second upper layer, the third upper layer, and the passivation layer are decreased sequentially. | 01-07-2016 |
20160007458 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion. | 01-07-2016 |
20160081184 | TRANSPARENT CONDUCTIVE FILM AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM - A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra | 03-17-2016 |
20160113113 | MAGNETO-DIELECTRIC SUBSTRATE, CIRCUIT MATERIAL, AND ASSEMBLY HAVING THE SAME - In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the polymer matrix in an amount and of a type effective to provide a magneto-dielectric substrate having a magnetic constant of greater than or equal to 2.5 from 0 to 500 MHz, or 3 to 8 from 0 to 500 MHz; a magnetic loss of less than or equal to 0.1 from 0 to 500 MHz, or 0.001 to 0.05 over 0 to 500 MHz; and a dielectric constant of 1.5 to 8 or 2.5 to 8 from 0 to 500 MHz. | 04-21-2016 |
20160125971 | RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL AND PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME - A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3). | 05-05-2016 |
20160128189 | METHOD OF MANUFACTURING CONDUCTIVE WIRING AND CONDUCTIVE WIRING - A method of manufacturing conductive wiring includes: printing on an insulated substrate | 05-05-2016 |
20160168715 | ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES | 06-16-2016 |
20160192483 | TRANSPARENT ELECTRODES AND ELECTRONIC DEVICES INCLUDING THE SAME - A transparent electrode includes: a substrate; an electrically conductive layer disposed on the substrate and including a plurality of nano-sized conductors; and an organic/inorganic composite layer directly disposed on the electrically conductive layer and including a cross-linked polymer and nano-sized inorganic oxide particles, wherein the nano-sized inorganic oxide particles are included in an amount of greater than or equal to about 1 part by weight and less than about 35 parts by weight, relative to 100 parts by weight of the cross-linked polymer. Also an electronic device including the same. | 06-30-2016 |
20160205772 | ELECTRONIC ASSEMBLY WITH FIDUCIAL MARKS FOR PRECISION REGISTRATION DURING SUBSEQUENT PROCESSING STEPS | 07-14-2016 |