Class / Patent application number | Description | Number of patent applications / Date published |
174546000 | Coated | 10 |
20090260872 | MODULE FOR PACKAGING ELECTRONIC COMPONENTS BY USING A CAP - A module for packaging electronic components includes a carrier, at least one electronic component and a cap. The carrier has a first region and a second region. The electronic component is disposed on the first region of the carrier. The cap is mounted on the second region, and includes an inner layer and an outer layer, wherein the inner layer is made of a non-conductive material, the outer layer is made of a conductive material, and the inner layer made of the non-conductive material covers the electronic components and the whole first region. | 10-22-2009 |
20090277683 | Crash Survivable Memory Unit - A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing. A sacrificial material is disposed between the housing and heat sensitive memory device. The sacrificial material having a lower melting temperature than the first material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and heat sensitive memory device. The first material includes nickel and the sacrificial material includes aluminum. A heat insulating layer is disposed between the sacrificial material and heat sensitive memory device. A second sacrificial material is disposed between the heat insulating layer and heat sensitive memory device. | 11-12-2009 |
20090288876 | Environmental Protection Coating System and Method - A circuit board assembly includes a circuit board having an outer surface that is configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%. | 11-26-2009 |
20100089637 | FILM STRUCTURE AND ELECTRONIC DEVICE HOUSING UTILIZING THE SAME - An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal films. The metal films are non-continuous with a total thickness of the metal films at a predetermined value. The protective film is deposited onto an upper film of the film stack. | 04-15-2010 |
20100206629 | DISPLAY DEVICE WITH DESICCANT - Systems and methods for providing MEMS devices with integrated desiccant are provided. In one embodiment, a dry composition comprising desiccant is impact sprayed onto the backplate or substrate of a MEMS device, and becomes fused with the substrate. In another embodiment, the desiccant is impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet another embodiment, the impact-sprayed surface is impregnated with the desiccant. In still another embodiment, the desiccant is combined with a suitable inorganic binder, then impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet a further embodiment, the desiccant is micronized or pulverized into a powder of desired particle size, and then impact sprayed onto a surface. Thus, the desiccant particles or powder are fused onto the target surface through the impact spraying process. | 08-19-2010 |
20100326720 | HOUSING AND PORTABLE ELECTRONIC DEVICE USING THE SAME - A housing comprise a decorative layer including a transparent base, a first conductive coating, an electrically conductive ink layer having a first electrical interface and a second conductive coating having a second electrical interface. The first conductive coating is formed on the base, the electrically conductive ink layer is laminated with and covers the first conductive coating, the second conductive coating is laminated between the electrically conductive ink layer and the outer surface of the substrate, the first electrical interface of the first conductive coating and the second electrical interface of the second conductive coating are electrically connected to a power source for creating an electrical field between the first conductive coating and the second conductive layer to make the electrically conductive ink layer present a pattern. | 12-30-2010 |
20110061929 | Optimized power package for electrical device - Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case. | 03-17-2011 |
20110186347 | SHELL, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE HAVING THE SAME - A shell for an electronic device is provided. The shell includes a shell body and a pattern layer disposed on an outer surface of the shell body and formed by a curable material. The shell also includes a transparent protective layer disposed on an outer surface of the pattern layer. | 08-04-2011 |
20130087379 | HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD - Disclosed embodiments include a package having an electronic device disposed within a cavity formed by an enclosure that includes a sharp portion. The package may further include a photosensitive layer applied over the enclosure to provide a smooth portion that is adjacent to the sharp portion. Methods for manufacturing the package are also described. Other embodiments may be described and claimed. | 04-11-2013 |
20130213707 | ANTI-CORROSION CONFORMAL COATING COMPRISING MODIFIED POROUS SILICA FILLERS FOR METAL CONDUCTORS ELECTRICALLY CONNECTING AN ELECTRONIC COMPONENT - A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring. | 08-22-2013 |