Class / Patent application number | Description | Number of patent applications / Date published |
174390000 | Particular shape | 7 |
20080257599 | Electromagnetic Wave Absorber - A conductive pattern basically has a substantially polygonal outline shape which is a polygon and can have a high peak value of the electromagnetic wave absorption amount as compared to a case when the conductive pattern has a circular outline shape. Thus, the conductive pattern is basically a polygon and at least one corner portion is shaped in curve. This reduces or even minimizes the shift of the frequency at which the absorption amount becomes a peak value by the polarization direction of the electromagnetic wave. Accordingly, in at least one embodiment, it is possible to realize an electromagnetic absorber having an excellent electromagnetic wave absorption characteristic exhibiting a high peak value of the absorption amount of the electromagnetic wave and a small shift of frequency at which the absorption amount becomes a peak value by the polarization direction of the electromagnetic wave. | 10-23-2008 |
20100212952 | ELECTROMAGNETIC PROTECTION SHEATH MADE OF TEXTILE - An electromagnetic protection sheath made of textile ( | 08-26-2010 |
20120031663 | HELICAL FINE STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ELECTRIC-WAVE SHIELD OR ABSORBER USING THE HELICAL FINE STRUCTURE - A helical fine structure of the present invention is characterized by including: a phytoplankton having a helical shape and selected from a group of cyanobacteria called | 02-09-2012 |
20130008708 | ELECTRICAL SHIELDING MATERIAL COMPOSED OF METALLIZED ALUMINUM MONOFILAMENTS - A conductive multi-fiber of aluminum/aluminum alloy monofilaments each of which has been completely and substantially uniformly coated with at least one layer of corrosion-resistant metal or metal alloy materials. The monofilaments are less than 150 microns in diameter that have been drawn separately, then bundled together and lightly twisted, for transport through a low tension electroplating process. The multi-fiber creates an RFI/EMI shielding material with low DC resistance and low weight. The metallization process includes a zincating process that prepares the monofilaments for electroplating and an electroplating process that incrementally builds up the metallized layers. | 01-10-2013 |
20130075151 | ELECTRO-MAGNETIC WAVE FILTERING AND IMPEDING BOARDS - An electro-magnetic wave filtering and impeding board is made of metal and includes a first side and a second side. The first side has multiple linear slots and the second side includes multiple concaved geometric holes which communicate with the linear slots. The electro-magnetic waves are impeded by the metallic material and weakened when passing through the linear slots and the geometric holes so as to impede the electro-magnetic waves. | 03-28-2013 |
20130233611 | MOLDED EMI AND THERMAL SHIELD - One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction. | 09-12-2013 |
20140360772 | DEFLECTABLE CONDUCTIVE GASKET WITH ENVIRONMENTAL SEAL - A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components. | 12-11-2014 |