Entries |
Document | Title | Date |
20080196827 | Fabrication of Electronic Components In Plastic - A method of forming electronic components in which a thermoplastic substrate is embossed to create a recess for electronic components; the electronic component is placed in the recess; electrical connections and circuitry are deposited over the components on the thermoplastic substrate; and a cover sheet of thermoplastic material is bonded over the circuitry. The process may also be carried out in reverse order. The apparatus used consists of a hot embossing machine having a former shaped for each particular circuit to be assembled; a pick and place machine with standard reel loading of components; and a screen printer for printing the conductive ink circuitry or a station for adhering conductive tape or preprinted film. | 08-21-2008 |
20080202677 | Chip bonding tool and related apparatus and method - A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which spaces the pressing block from the semiconductor chip. | 08-28-2008 |
20080257489 | Method for laser welding - A laser welding method, for resin members, comprising using a kit. | 10-23-2008 |
20090000731 | HERMETICALLY SEALED CONTAINER AND MANUFACTURING METHOD OF IMAGE FORMING APPARATUS USING THE SAME - A manufacturing method of a hermetically sealed container, comprises steps of placing, on a first member, a first bonding material and a second bonding material having a larger compressibility in relation to a pressing force than a compressibility of the first bonding material, such that the first and second bonding materials are arranged side-to-side relationship, and the first bonding material has a height lower than a height of the second bonding material; pressing a second member to the second bonding material; heating and melting sequentially part by part the first bonding material; and cooling the first bonding material to bond together the first and second members. | 01-01-2009 |
20090044906 | METHOD FOR DECORATING SURFACES - The surface of a shaped article produced in a first step, for example by means of rapid prototyping, is subsequently decorated by a method for the production of a surface-decorated shaped article in which
| 02-19-2009 |
20090065137 | Method of manufacturing rotation detector having encapsulated biasing magnet and magnetic sensor - A rotation detector includes a semiconductor chip, a nonmagnetic case body, a biasing permanent magnet and a nonmagnetic cap fixed to the case body, wherein the case body has a joint surface, and the cap has an inside surface in contact with the joint surface. A method of manufacturing the rotation detector includes the following steps: assembling the semiconductor chip, the case body and the biasing permanent magnet into a unit; forming at least one groove adjacent to the joint surface so as to form a space between the joint surface and the inside surface when the cap is fixed to the case body; fixing the cap to the case body so that the inside surface of the cap can be in contact with the joint surface; irradiating a laser beam at portions behind the inside surface of the cap under a prescribed pressure to melt materials of the case body and the cap and to make melted materials flow to the space; and cooling the melted materials to re-crystallize. | 03-12-2009 |
20090090464 | Process for manufacturing a fuel tank - Process for manufacturing a plastic fuel tank provided with at least one accessory ( | 04-09-2009 |
20090126869 | WELDING METHOD AND WELDING APPARATUS FOR RESIN MEMBER - A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam. | 05-21-2009 |
20090145547 | Method and apparatus for manufacturing a tubular product - A method of manufacturing a tubular product comprising the steps of:
| 06-11-2009 |
20090159194 | APPARATUS AND METHOD FOR PRINTING A WEB - A device for printing at least one web that is driven continuously through said device, in addition to a method for printing said web. At least one unit is integrated into the device for the continuous transfer of individual transponders or transponder parts, which operate according to the radio frequency identification principle, from at least one continuous carrier belt to the web. During said process, the running speed of the carrier belt is adapted to the running speed of the web, the latter speed being predetermined by the printing process. A connection device connects the transponders or transponder parts to the web in a predetermined section of the carrier belt and the web, when the speeds have been synchronised. | 06-25-2009 |
20090159195 | Microlens array sheet and method of producing the same - A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the third surface side is larger than another size of each aperture on the fourth surface side. | 06-25-2009 |
20090211699 | NOVEL METHOD TO AFFIX AN OPTICAL ELEMENT - A method for affixing an adjustable optical element in place to allow for tuning an optical device during assembly of the device, but which provides for fixation of the element in place after adjustment. | 08-27-2009 |
20090211700 | Process for laser welding resinous members, apparatus for the same and laser-welded resinous product - A process is for laser-welding resinous members, and includes the steps of overlapping a transparent resinous member on an absorptive resinous material, and irradiating the transparent resinous member with a laser beam, thereby welding an interface between the transparent resinous member and the absorptive resinous member as a strip shape, wherein the energy of the laser beam acting on a side of a major-curvature-radius curved part of the strip-shaped welded interface and the energy of the laser beam acting on a side of a minor-curvature-radius curved part thereof are averaged. | 08-27-2009 |
20090242112 | MATRICES WITH AN IDENTIFICATION FOR PRODUCING DECORATING DRESSINGS - A die for the production of a surface-structured coating (finish) which can be bonded to a sheet-like substrate, in particular a leather, an imitation leather material, a textile material or a wood surface, and which is formed by application of a liquid plastic material to the surface of the die and subsequent solidification of the plastic material, the die having a surface structure corresponding to the surface structure of the coating, the surface comprising, on a substrate, surface structure elements which are arranged in a screen and may be in the form of elevations or depressions, wherein the surface structure of the die has an identification with the surface structure differing from the environment. | 10-01-2009 |
20090294047 | METHOD AND DEVICE FOR WELDING THERMOPLASTIC RESIN ARTICLES - A plurality of thermoplastic articles are superimposed against a support, an infrared transparent solid is superimposed to form a superimposed body and infrared is irradiated to the superimposed body from the side of the infrared transparent solid. For the irradiation source, an Er: YAG laser or fiber laser is used. The interface temperature of the thermoplastic article becomes relatively lower and a high temperature region can be developed within the superimposed body due to the infiltration of laser energy. As a result, degradation of the surface configuration due to thermal damages in the infrared irradiation side surface layer of the thermoplastic articles can be suppressed. | 12-03-2009 |
20090294048 | METHOD OF PRODUCING SHEET JOINED BODY - The present invention relates to a method of producing a sheet joined body, the method enabling an improvement in productivity of the sheet joined body The method of producing a sheet joined body according to the present invention includes blowing gas against sheet members so as to bring the sheet members into tight contact with each other to form tight contact parts and, at the same time, irradiating the tight contact parts with laser light to join the sheet members with each other, thereby producing a sheet joined body | 12-03-2009 |
20090308530 | PROCEDE ET DISPOSITIF D'AUTHENTIFICATION - The authentication process comprises:
| 12-17-2009 |
20100024973 | Method of making a waveguide - A method of making a ceramic waveguide delay line includes the step of providing several slices or slabs of dielectric material, each including a layer of metal material applied to respective opposed side surfaces thereof. The slices are then fired in an oven to fuse the layers of metal material to the slices. The slices are then stacked together to form a core which is then dried and subsequently fired. An area of metal material is applied to the outer surface of the core. The core is subsequently dried and fired in an oven. | 02-04-2010 |
20100032087 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR LASER PROCESSING AND LASER PROCESSING METHOD - In performing the laser processing of a workpiece with laser light, there are provided a pressure-sensitive adhesive sheet for laser processing and a laser processing method that can perform the laser processing of a workpiece easily with good production efficiency by preventing the fusion of a substrate and an adsorption stage. According to the invention, an pressure-sensitive adhesive sheet for laser processing that is used for laser processing of a workpiece with laser light having a wavelength in an ultraviolet region or with laser light that enables light absorption in an ultraviolet region that has passed a multiphoton absorption process, comprising a substrate and an pressure-sensitive adhesive layer disposed on one surface of the substrate, wherein a melting point of the substrate at another surface is 80° C. or higher, and an etching rate (etching speed/energy fluence) in a case of radiating the laser light onto the other surface is 0.1 [(μm/pulse)/(J/cm | 02-11-2010 |
20100032088 | Method for production of a pressure-sensitive adhesive sheet - The present invention relates to a pressure sensitive adhesive sheet | 02-11-2010 |
20100043962 | FABRICATION METHOD OF RIGID-FLEX CIRCUIT BOARD - A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed. | 02-25-2010 |
20100043963 | ALUMINIUM SHOT FOR THIN, PLATE-SHAPED EFFECT PIGMENTS, METHOD FOR THE PRODUCTION THEREOF, AND USE OF SAME - The invention relates to an atomized aluminum powder for thin, platelet-shaped effect pigments having a narrow relative breadth of the thickness distribution. The powder of the invention is characterized by a particle size band of d | 02-25-2010 |
20100051192 | OPTICAL DEVICE PROVIDED WITH POLARIZING PLATE - Disclosed is an optical device which can be formed as a thinner layer by a simplified manufacturing process at a reduced cost. Specifically, the optical device has a multilayer structure wherein a polyvinyl alcohol- or polyvinylene-base polarizing film (b) and protective films (a and c) are directly laminated on top of another without any adhesive layer including a pressure sensitive adhesive layer interposed therebetween. The protective film (c) on one side is composed of a triacetyl cellulose, an alicyclic polyolefin resin, or an alicyclic acrylic resin, and the protective film (a) on the other side is composed of a triacetyl cellulose, a polycarbonate, a polyethylene terephthalate, a polyethylene naphthalate, a (meth)acrylate resin, an alicyclic polyolefin resin, or an alicyclic acrylic resin. | 03-04-2010 |
20100065200 | Tetrabenzodiazadiketoperylene pigments in laser welding - A method method for laser welding a layered article wherein IR irradiation is passed through a composition containing a tetrabenzodiazadiketoperylene pigment or dye to the surface of an underlying substrate which contain an IR absorbing material, generating enough heat at the point of irradiation to melt together the two materials. | 03-18-2010 |
20100096081 | METHOD OF MANUFACTURING INK-JET HEAD - Disclosed is a method of manufacturing an ink-jet head including a reservoir storing ink, an inlet port through which the ink is provided to the reservoir, a chamber provided with the ink from the reservoir, a restrictor linking the reservoir and the chamber, and a nozzle through which the ink in the chamber is discharged. The method in accordance with an embodiment of the present invention includes: processing a first plate in which the inlet port is formed; processing a second plate in which the chamber and the inlet port are formed; bonding the first plate on an upper surface of the second plate; processing a third plate in which the restrictor and the reservoir are formed; processing a fourth plate by irradiating a femtosecond laser such that the nozzle is formed; bonding the fourth plate on a lower surface of the third plate, and bonding the third plate on a lower surface of the second plate. | 04-22-2010 |
20100101720 | Bonding Method of Resin Member - A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member ( | 04-29-2010 |
20100170634 | LASER WELDING METHOD, LASER WELDING APPARATUS, AND METHOD FOR MANUFACTURING IMPELLER FOR BLOWER - A transmissive resin member and an absorptive resin member having lower optical transmittance than the transmissive resin member are superimposed together to form a superimposed part. Laser irradiation is performed from the side of the transmissive resin member while moving the irradiation position with respect to the superimposed part, and a noncombustible gas is blown onto the irradiation position from the side of the transmissive resin member in accordance with the movement of the laser light irradiation position. This laser welding method is particularly suited for manufacturing a resinous impeller for an air blower. A laser welding apparatus for the laser welding method includes a laser irradiation lens unit configured to irradiate resin members with laser light while an irradiation position is moved, and a discharge nozzle mounted on the laser irradiation lens unit and configured to blow a noncombustible gas toward the moving irradiation position. | 07-08-2010 |
20100186891 | NIR-INERT SUBSTRATES COMPRISING BIS-OXODIHYDROINDOLYLEN-BENZODIFURANONES - A method for producing infra-red inert substrates, including moulded polymeric articles, films, fibers and coatings and other organic and inorganic materials, by incorporating into the substrate or onto the surface of the substrate an effective amount of a dispersed bis-oxodihydroindolylen-benzodifuranone colourant. The thus obtained, also claimed substrates so produced are reflective and transparent to much of the near infra red radiation not reflected. There are multiple applications for cases of devices comprising electronic components, outdoor construction elements, outdoor furniture, automotive, marine or aerospace parts, laminates, artificial leather or textile materials, as well as in polychrome printing processes and optical fibers. The thus obtained substrates can also be subjected to laser welding. New bis-oxo-dihydroindolylen-benzodifuranone compounds are also claimed. | 07-29-2010 |
20100193121 | Laser welding of resin members using a ridge for enhancing weld strength - A method of laser welding two resin members includes the steps of: providing a first and a second resin member each having a joining surface; forming a ridge with a length on the joining surface of one of the first and second resin members, the ridge including a base portion and a tip portion that has smaller width and expansion rate in width than those of the base portion; placing one of the first and second resin members on the other so that the joining surfaces of the first and second resin members face each other with the ridge interposed therebetween; pressing one of the first and second resin members against the other so as to completely crush the tip portion of the ridge; and irradiating the base portion of the ridge with a laser beam while continuously pressing one of the first and second resin members against the other. | 08-05-2010 |
20100243149 | METHOD FOR FORMING A CIRCUIT PATTERN - A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer ( | 09-30-2010 |
20100276080 | LASER WELDING METHOD - The invention relates to a method for quick, flexible and quality laser welding of plastic articles. In the method, a laser beam is directed via scanner mirrors at an object being welded. According to the invention, in the method, the movement of the scanner mirrors is controlled and adjusted; and the moving speed of the laser beam is increased by increasing the focal distance to be more than 200 mm; and the moving speed of the laser beam is arranged to be more than 10 m/s; and the laser beam is moved several times along a predetermined welding track. | 11-04-2010 |
20100276081 | METHOD OF INTERCONNECTING ELECTRONIC WAFERS - The invention relates to a method of interconnecting electronic components of a first wafer (T | 11-04-2010 |
20100307676 | METHOD AND APPARATUS FOR LASER WELDING THERMOPLASTIC RESIN MEMBERS - A method and apparatus for laser welding two members made of thermoplastic resin material whereby high welding strength can be achieved and strength variations can be reduced. A first member | 12-09-2010 |
20100319847 | APPLYING CHIPLETS TO SUBSTRATES - A method of providing chiplets over a substrate including providing in sequence a substrate; coating an adhesive in a layer over the substrate; placing a plurality of first chiplets onto the adhesive layer in separated chiplet location(s) to adhere the first chiplets to the adhesive layer, wherein one or more of the first chiplets do not adhere to the adhesive layer, so that first chiplet(s) are adhered to the adhesive layer in adhered chiplet location(s) and first chiplet(s) are not adhered in non-adhered chiplet location(s); locally processing the adhesive layer in the non-adhered chiplet location(s) to condition the adhesive layer in the non-adhered locations to receive second chiplets; placing second chiplet(s) onto the adhesive layer in the conditioned non-adhered chiplet location(s) to adhere the second chiplets in the adhesive layer in the non-adhered locations; and curing the adhesive. | 12-23-2010 |
20100319848 | METHOD FOR CONNECTING A CATHETER BALLOON WITH A CATHETER SHAFT OF A BALLOON CATHETER - A method for connecting a catheter balloon with a catheter shaft of a balloon catheter that improves the welding quality of a weld between the catheter balloon and the catheter shaft of the balloon catheter. Preferably, a welding energy absorbing device is arranged, preferably in the form of a coloured tubing, in the area of a fixation site after attaching a pre-fixation and then to irradiate this welding energy absorbing device with the radiation energy to carry out the welding. After the welding the pre-fixation and the welding energy absorbing device are removed. | 12-23-2010 |
20110000611 | Method and Apparatus for Welding or Adhesively Bonding Together Areal Built-Structure Waterproofing Systems - Roof coverings are formed from underlayment membranes ( | 01-06-2011 |
20110061805 | IMAGE DISPLAY APPARATUS MANUFACTURING METHOD - A bonding step of an image display apparatus manufacturing method includes, after bringing a first or second substrate opposite to a face of a frame member having a bonding material thereon into contact with the bonding material, bonding the first or second substrate opposite to the face of the frame member having the bonding material thereon and the frame member to each other, by irradiating a laser beam to the bonding material through at least a underlying layer. Here, the underlying layer includes a material which absorbs the laser beam easily, and the laser beam is irradiated to a predetermined range. Thus, in bonding of base materials by irradiation of the laser beam, it is possible to reduce damages such as occurrence of disconnection and short circuit in wirings, and achieve reliability and excellent airtightness of the image display apparatus. | 03-17-2011 |
20110079350 | LASER IRRADIATION SYSTEM AND LASER IRRADIATION METHOD - A laser irradiation system includes a laser beam generator to generate laser beams, a laser beam irradiator to radiate the laser beams onto a target, a laser beam guide to detect whether one of the laser beams is reflected back toward the laser beam irradiator, a detector to convert the reflected laser beam into electrical signal data, and a controller to control the output of the laser beam generator, based on the signal data. | 04-07-2011 |
20110094673 | LASER WELDING METHOD - The invention relates to a method for laser welding at least two components ( | 04-28-2011 |
20110139365 | MASK FOR EVAPORATION, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME - Provided is a mask for an evaporation apparatus, which includes a first division mask and a second division mask. The first and second division masks are directly bonded to each other by welding, thereby forming welding portion between the first and the second division masks. A method and apparatus for manufacturing a mask for evaporation are also provided. The division masks according to the embodiment do not use subframes, and are directly bonded to one another by welding, so that a shadow effect does not occur. The apparatus for manufacturing a mask for evaporation includes a work stage, a clamp fixing a first division mask and a second division mask to the work stage, and a laser welding part welding the first division mask to the second division mask. The apparatus may further include a first roller leading the laser welding part and a second roller following the laser welding part. | 06-16-2011 |
20110146903 | LASER HEAD AND METHOD OF CONNECTING TUBULAR PARTS BY THE LASER TRANSMISSION METHOD - The invention relates to a laser head ( | 06-23-2011 |
20110203726 | METHOD FOR MANUFACTURING RESIN MOLDING - A method for manufacturing a resin molding that uses a laser beam can provide a high level of adhesion, an excellent appearance, and can include very strong welded portions. The method can include preparing a light-transmitting resin member having a protruding portion formed on a rear surface of the light-transmitting resin member and having an end surface, the protruding portion having both side surfaces having asymmetric inclination angles with respect to the normal of the end surface of the protruding portion. The method can also include arranging and pressing together the end surface of the protruding portion that is a welded region of the light-transmitting resin member, and a welded region of a corresponding light-absorbing resin member so that they are opposed to each other. A laser beam can be emitted from a laser light source to be incident on a surface of the light-transmitting resin member while the laser beam is refracted. The method can also include repeatedly irradiating the laser beam onto the welded regions to heat and fuse the entire welded regions to weld the light-transmitting resin member and the light-absorbing resin member while opposed to each other and pressed together, wherein the inclination angle of the side surface of the protruding member near the laser light source is equal to or more than a travel angle of the refracted laser beam. | 08-25-2011 |
20110247751 | METHOD AND DEVICE FOR PRODUCING COMPOSITE MATERIAL COMPONENTS AND CONTACT PRESSURE UNIT - In the case of a process for producing composite material components, thermoplastic prepreg tapes ( | 10-13-2011 |
20110253306 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes. | 10-20-2011 |
20110297312 | METHOD OF PRODUCING SHEET JOINED BODY - A method of producing a sheet joined body includes: abutting ends of sheet members against each other, coating an abutted part with a joining member containing a thermoplastic resin, and irradiating a part coated with the joining member, with laser light to join the sheet members with the joining member by welding, thereby joining the ends with each other to manufacture a sheet joined body. | 12-08-2011 |
20120006479 | Rapid Exchange Balloon Catheter and Method for Making Same - A rapid exchange balloon catheter having a proximal end and a distal end, the catheter including a tubular metal shaft body extending from the proximal end along a majority of the total length and having an inflation lumen arranged therein, a plastics distal end portion bonded to the metal body in extension thereof, the distal end portion being provided with an inflation lumen in communication with a balloon, and a guide wire lumen, the guide wire lumen extending from a proximal side port to a distal end opening. To reduce the resistance to kinking, the metal body includes a transitional region having reduced stiffness at the position of bonding to the plastics distal end portion compared to a more proximal position along the metal body. | 01-12-2012 |
20120012248 | METHOD FOR MANUFACTURING FLOOR PANELS, AS WELL AS FLOOR PANEL OBTAINED BY MEANS OF SUCH METHOD - Method for manufacturing floor panels having a top layer having a composition based on a synthetic material. At least at two opposite sides, the floor panels have profiled edge areas that include at least coupling parts. For manufacturing the floor panels, one starts from a board-shaped material, and the floor panels are formed at least partially by way of a laser treatment of the board-shaped material. | 01-19-2012 |
20120024471 | NOZZLE PLATE FOR IMPROVED POST-BONDING SYMMETRY - A nozzle plate for bonding to a chip for configuring a printhead of a printing device is disclosed. The chip comprises a plurality of energizing elements. The nozzle plate comprises a substrate layer, an adhesive layer and a plurality of nozzle holes perforated in the substrate layer and the adhesive layer. The each nozzle hole is capable of being associated with an energizing element of the plurality of energizing elements. The each nozzle hole comprises an asymmetric flow-feature configured by ablating at least a portion of a wall of the each nozzle hole prior to bonding the nozzle plate to the chip. The nozzle plate provides a substantially symmetrical flow-feature for the each nozzle hole on bonding to the chip. | 02-02-2012 |
20120031554 | Process for Producing Papermaker's and Industrial Fabric Seam and Seam Produced by that Method - The invention disclosed herein relates to the use of laser energy to weld or melt selected locations in papermachine clothing (“PMC”) and other industrial and engineered fabrics. The invention also relates to an improved seam for a papermaker or other industrial fabric that has properties such as strength, durability, openness, adequate number of support points, and fiber support index (FSI) essentially the same as the fabric body. The invention also relates to a fabric having a durable seam, wherein the seam width as measured in the MD is a fraction of the width of a normal seam or a seam that is formed using a conventional technique of equal strength. | 02-09-2012 |
20120085491 | Infrared Plastic Welding With Recirculation Of Unabsorbed Infrared Laser Light To Increase Absorption Of Infared Laser Light - Unabsorbed infrared laser light that has passed though plastic parts to be welded with a low absorption TTIr process is recirculated in an infinite loop back to the low absorption weld interface for reabsorption in the process. On each pass in the infinite loop, more infrared laser light is absorbed at the weld interface. | 04-12-2012 |
20120111496 | LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING - A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser. | 05-10-2012 |
20120118499 | MOUNTED OPTICAL COMPONENT, METHOD FOR THE PRODUCTION THEREOF AND USE OF SAME - The invention relates to a mounted optical component and also a method for the production of mounted optical components. Furthermore, the invention relates to the use of mounted optical components. | 05-17-2012 |
20120132353 | Graphene Production Using Laser Heated Crystal Growth - Implementations and techniques for producing graphene are generally disclosed. | 05-31-2012 |
20120132354 | METHOD FOR JOINING COMPONENTS - The invention relates to a method for joining components ( | 05-31-2012 |
20120138221 | REACTION PLATE - A reaction plate includes a welded plastics planar laminate consisting of an aperture plate and a film, the aperture plate having at least one planar surface and a plurality of apertures in the planar surface of the apertured plate and the film being attached to the planar surface of the apertured plate around the or each aperture by welding. The welding is preferably laser or transmission welding. A method of forming such reaction plates using diode laser welding. An apparatus is provided for handling such reaction plates including performing polymerase chain reactions (PCRs) or primer extensions therewith. | 06-07-2012 |
20120186739 | Method of Removing Thermoset Polymer From Piezoelectric Transducers in a Print Head - A method for mounting a piezoelectric transducer layer to a diaphragm layer exposes an electrode for each piezoelectric transducer after thermoset polymer filling the interstitial space between the piezoelectric transducers has been cured. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer, filling areas between the piezoelectric transducers on the diaphragm layer with thermoset polymer, and removing the thermoset polymer from the piezoelectric transducers with a laser to expose a metal electrode on each piezoelectric transducer. | 07-26-2012 |
20120205042 | SEAL FOR A FUEL CELL SUPPORT - A unit for use in a fuel cell stack, the unit comprising a porous metal support with a seal made by local fusion and—having a seal depth that extends from the upper surface of the porous metal support to at least the bottom surface of the porous metal support, and wherein the seal is positioned along the periphery of the porous metal support, the seal being impermeable to gas transported in the plane of the porous metal support. | 08-16-2012 |
20120211154 | Method and Apparatus for Non-Contact Joining of Web Fed Materials - A web processing system for laser welding at least two continuous webs includes a supply station for supplying the webs and a lamination station for laser welding the webs together in a pre-determined pattern. The lamination station includes a platen having a platen surface between leading and trailing ends thereof across which the webs are conveyed and a laser welding apparatus offset from the platen surface and configured to direct a laser beam to said platen surface to laser weld the webs in the pre-determined pattern. In one aspect, the platen surface is arcuate so that the webs are maintained in intimate contact across the platen surface. | 08-23-2012 |
20120305179 | MOLD AND MANUFACTURING METHOD THEREFOR - Providing a mold and a manufacturing method therefor wherein protrusions are easy to be pressed into a resin base material and the protrusions are easy to be pulled out from the resin base material. The present invention provides a mold comprising a stamping surface ( | 12-06-2012 |
20130068384 | Method and Apparatus for Three Dimensional Large Area Welding and Sealing of Optically Transparent Materials - Methods and systems for three dimensional large area welding and sealing of optically transparent materials are disclosed, including generating a beam of ultra-short pulses from an ultra-short pulsed laser; directing the beam to an acoustic-optic modulator to control the repetition rate of the beam; directing the beam to an attenuator after passing through the acoustic-optic modulator to control the energy of the beam; directing the beam to a focusing lens after passing through the attenuator to focus the beam between a top substrate and a bottom substrate in order to weld the top substrate to the bottom substrate, wherein the top substrate and the bottom substrate are in intimate contact; and controlling the position of the top substrate and the bottom substrate relative to the beam using a three-axis stage in order to weld the top substrate to the bottom substrate at different points. Other embodiments are described and claimed. | 03-21-2013 |
20130098546 | METHOD FOR FIXING A CRYSTAL TO THE MIDDLE PART OF A WATCH CASE - Method for fixing a watch crystal ( | 04-25-2013 |
20130098547 | METHOD OF BONDING POLYMER FILM, AND METHOD OF PRODUCING POLARIZING FILM - An object of the present invention is to provide high quality bonding of a polymer film such as a polyvinyl alcohol resin film while use of a light absorbing agent is suppressed. A method of bonding a polymer film, including contacting a surface of a polymer film with a surface of a material to be bonded, and laser welding the interface between the surface of the polymer film and the surface of the material to be bonded, wherein water is absorbed at least in the interface side of the polymer film, the interface side is irradiated with laser light, and the laser light is absorbed by the absorbed water to perform the laser welding. | 04-25-2013 |
20130105075 | DEVICE FOR ASSEMBLING TWO PARTS MADE FROM THERMOPLASTIC MATERIALS BY MEANS OF LASER-TRANSPARENT WELDING, ASSEMBLY METHOD AND ASSOCIATED CLAMPING FITTING | 05-02-2013 |
20130133826 | METHOD OF MANUFACTURING RESISTOR - A method of manufacturing a resistor includes steps of providing a resistance material and two electrode materials, wherein a reflectivity of the resistance material is smaller than a reflectivity of the electrode material; fixing the two electrode materials at opposite sides of the resistance material; and welding two first junctions between the resistance material and the two electrode materials by a first laser from a first side of the resistance material, wherein a beam area from the first laser to the resistance material is larger than a beam area from the first laser to the electrode material. | 05-30-2013 |
20130174978 | METHODS AND APPARATUS TO FORM ELECTRICAL INTERCONNECTS ON OPHTHALMIC DEVICES - Methods and apparatus for forming interconnects on the surfaces of three dimensional substrates, including ophthalmic devices incorporating one or more electrical components may be utilized to provide high quality electrical and mechanical connections. | 07-11-2013 |
20130180654 | MANUFACTURING METHOD OF INKJET HEAD - According to one embodiment, forming an electrode part, in which after an electrode is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of 0.6 μm or less is formed on a surface of the electrode, and then, an electrode protection film having a thickness of 1.0 μm or more is formed on a surface of the smoothed film; bonding a nozzle plate to an opening end face of a pressure chamber in the groove part by an adhesive after the electrode part is formed; and forming, in the nozzle plate, a nozzle communicating with the pressure chamber by laser machining after the nozzle plate is bonded. | 07-18-2013 |
20130233481 | METHOD AND DEVICE FOR THE CONTINUOUS WELDING OF PLASTIC CO - For continuous welding of plastic components ( | 09-12-2013 |
20130240138 | METHOD OF PERMANENTLY JOINING PLASTIC COMPONENTS AND A PLASTIC COMPONENT JOINING ASSEMBLY - A method of permanently joining plastic components is provided. The method includes orienting a first plastic component having at least one first rib in close proximity to a second plastic component having at least one second rib. Also included is positioning a plurality of fiber-optic cables in a location between the first plastic component and the second plastic component, wherein each of the plurality of fiber-optic cables include a first end and a second end. Further included is generating a laser beam that is directed into the first end of the plurality of fiber-optic cables and terminating proximate the second end of the plurality of fiber-optic cables. | 09-19-2013 |
20130306235 | METHOD FOR MANUFACTURING DISPLAY PANEL - A manufacturing method of a display panel comprises applying a paste including a sealing material to a substrate by using a nozzle, the nozzle being moved along a display region on the substrate from a start position located in a vicinity of the display region to an end position, so as to surround the display region. In the applying, the paste is applied such that a center line of the paste in an end region is substantially parallel to and separate from a center line of the paste in a start region, and a distance of separation between the center line of the paste in the end region and the center line of the paste in the start region is less than a width of the paste in a region other than the start region and the end region. | 11-21-2013 |
20140102635 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device includes a first substrate, a second substrate and a sealing material. The first substrate includes an active area and a driving circuit. The driving circuit has a first side facing the active area and a second side opposite to the first side. The second substrate includes a mask layer. A projection of the mask layer on the first substrate at least overlaps the driving circuit from the second side to the first side. The sealing material is between the second substrate and the first substrate, used for sealing the second substrate and the first substrate, and located beside the second side of the driving circuit. | 04-17-2014 |
20140116614 | Method for Bonding Substrates, Method for Maufaturing Sealing Structure, and Method for Maufaturing Light-Emitting Device - An object is to improve productivity related to a laser light irradiation step in a bonding technique of substrates using glass frit. A highly airtight sealing structure or a highly airtight light-emitting device, which can be manufactured with high productivity, is provided. When a glass layer by melting glass frit or a sintered body by sintering glass frit is irradiated with laser light, in order to increase the efficiency, a light-absorbing material is attached to a surface of the glass layer. The laser light irradiation is performed on the light-absorbing material and the glass layer. The substrates are fixed with the glass layer therebetween. | 05-01-2014 |
20140138023 | METHOD AND DEVICE FOR WELDING THERMOPLASTIC RESIN ARTICLES - A plurality of thermoplastic articles are superimposed against a support, an infrared transparent solid is superimposed to form a superimposed body and infrared is irradiated to the superimposed body from the side of the infrared transparent solid. For the irradiation source, an Er: YAG laser or fiber laser is used. The interface temperature of the thermoplastic article becomes relatively lower and a high temperature region can be developed within the superimposed body due to the infiltration of laser energy. As a result, degradation of the surface configuration due to thermal damages in the infrared irradiation side surface layer of the thermoplastic articles can be suppressed. | 05-22-2014 |
20140216645 | Method for Forming Glass Layer and Method for Manufacturing Sealed Structure - To form a glass layer with high productivity over a substrate provided with a material whose upper temperature limit is low. A method for forming the glass layer includes a first step of providing a frit paste including a glass frit and a binder over a substrate, and a second step of relatively moving a laser light irradiation portion over the frit paste not to overlap with a laser light irradiation start portion. A track of the laser light irradiation portion in the second step has an intersection in an intersection portion. | 08-07-2014 |
20140216646 | LASER WELDING METHOD - A laser welding method includes positioning two resin molded products that are in contact with each other to a laser head having a mirror, and welding a contact surface of the resin molded products by a laser energy by allowing the laser beam to scan the resin molded products along a welding line with the mirror. The contact surface of the resin products has a first part on which the laser beam is incident at a first angle and a second part on which the laser beam is incident at a second angle larger than the first angle. The welding the contact surface includes controlling a luminous intensity of the laser beam so that the first part and the second part receive a substantially equal quantity of laser energy. | 08-07-2014 |
20140216647 | Welding Method for Substrate and Membrane of Membrane Mobile Polymer Microfluidic Chip - The present invention discloses a welding method for substrate and membrane of membrane mobile polymer microfluidic chip, which relates to the manufacturing technology of membrane mobile polymer microfluidic chip and comprises the following steps: before the welding, the substrate is fixed, the surface of the substrate is covered with the membrane; the membrane is pressed against the surface of the substrate, and in the course of welding, the laser irradiates the welding area on the substrate through the membrane, and the welding area fuses and then welds the substrate and membrane together. The present invention realizes the firm welding between membrane and substrate of membrane mobile polymer microfluidic chip, and ensures that the weld face is flat and uniform. | 08-07-2014 |
20140216648 | METHOD AND APPARATUS FOR LASER WELDING OF TWO JOINING MEMBERS OF PLASTIC MATERIAL - In a method and an apparatus for laser welding of two joining members of plastic material in which a focussed laser beam is emitted into a welding zone in the region of the boundary surfaces of the joining members arranged in such a way as to face one another so as to form a weld seam having a particular seam depth between the joining members, it is provided that the laser power density is modulated during the welding process in a direction of the seam depth in the welding zone. | 08-07-2014 |
20140238592 | SELECTIVE LASER-ASSISTED TRANSFER OF DISCRETE COMPONENTS - Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement. | 08-28-2014 |
20140283986 | RESIN MEMBER WELDING METHOD - A method for welding laser-impermeable resin members. The resin members are overlapped with each other at least partially, with a light absorber capable of absorbing laser light being interposed therebetween, so as to form an overlapping portion. The light absorber in the overlapping portion is irradiated directly with laser light, and is heated and melted thereby. Heat from the melted light absorber is transferred to the resin members in the overlapping portion, and therefore the resin members are melted in the overlapping portion. The melted overlapping portion is cooled and solidified, whereby the overlapping portion is integrally bonded. | 09-25-2014 |
20140283987 | METHOD AND APPARATUS TO APPLY A FILL MATERIAL TO A SUBSTRATE - A method for rapidly adhering thermoplastic polyurethane (TPU) material to a void in a metallic surface, the method comprising placing a solid volume of a TPU over metallic surface; directing a laser toward the TPU; applying pressure on the TPU; and irradiating the TPU material until the material melts and adheres to the metallic surface. Some embodiments make use of a hand-held near-infrared radiation laser tool to irradiate the TPU material, the laser tool comprising a laser optics and fiber; a housing for holding said laser optics and fiber and maintaining a desired distance and orientation of the laser relative to the fastener to be filled; electronics for controlling said laser; a collimator; a beam expander; a laser shield; and a conformal dome or a flat pressure head for holding a solid portion of a filler material in place while the beam is used to melt the material and for applying pressure to the melted filler material. | 09-25-2014 |
20140305581 | RESIN WELDED BODY AND METHOD FOR MANUFACTURING THE SAME - A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity. | 10-16-2014 |
20140332156 | LASER INDUCED THERMAL IMAGING APPARATUS AND LASER INDUCED THERMAL IMAGING METHOD USING THE SAME - A laser induced thermal imaging apparatus includes a nozzle part disposed over a donor film in a vacuum chamber so as to be spaced apart from the donor film, and configured to spray an inactive gas onto an upper surface of the donor film. Also included is a shielding layer disposed on the upper surface of the donor film to make contact with the donor film and shaped so as to be positioned along a circumference or outer edge of the donor film. | 11-13-2014 |
20140332157 | Laser Joining Method - The present invention provides a method for stably and robustly laser-welding transparent resins together without compromising transparency. Before laser welding, the joining surface of at least a second transparent resin is subjected to photooxidation, thereby reducing the laser transmittance without reducing the visible light transmittance. A laser beam in the ultraviolet region at a wavelength of 400 nm or less, or a laser beam with a pulse width of 10 ps or less is irradiated while the second transparent resin is pressurized to perform laser welding. | 11-13-2014 |
20150013895 | SEALING APPARATUS AND METHOD FOR FABRICATING DISPLAY DEVICE USING THE SAME - A sealing apparatus for sealing a first substrate and a second substrate by a sealant includes: a stage which supports the first and second substrates, where the sealant is interposed between the first and second substrates along edges of the first and second substrates, and the stage includes a concave portion defined to correspond to the sealant; and an optical head configured to irradiate light onto the sealant, where the first substrate and the second substrate are fixed together by the light irradiated onto the sealant such that a space surrounded by the sealant between the first substrate and the second substrate is sealed. | 01-15-2015 |
20150013896 | Graphene Nanoribbons and Methods - Methods are provided for fabricating graphene nanoribbons. The methods rely on laser irradiation that is applied to a carbon nanotube film to unzip one or more carbon nanotubes of the carbon nanotube film. Graphene nanoribbons can be cross-linked via laser irradiation to form a graphene nanoribbon network. | 01-15-2015 |
20150034240 | METHOD OF BONDING GLASS SUBSTRATE AND METAL SUBSTRATE - A bonding method for glass and metal requires a glass substrate and a metallic oxide film to be coated on a side of the glass substrate. A plurality of metallic oxide beads are impressed on a side of a metal substrate to be bonded. The glass substrate is placed on the metal substrate so the metallic oxide film makes contact with the metallic oxide beads, and the metallic oxide beads are heated to a melted state via a focusing laser, all the elements being pressed together at the same time and during slow cooling thereafter. | 02-05-2015 |
20150129125 | PLASTIC FILM JOINING METHOD - Plastic films are prevented from being peeled off from each other at a joining portion. A composite film has superposed external and internal films and is superposed with an additional body. The films and the body are joined with each other to form a first joining portion between the films, and a second joining portion between the internal film and the body. The first joining portion has a first joining width and includes first outer and inner edges. The second joining portion has a second joining width and includes second outer and inner edges. The first or second joining width is adjusted such that the first joining width is less than the second joining width, with the first inner edge formed outwardly of the second inner edge. | 05-14-2015 |
20150136317 | DOUBLE-SIDED ADHESIVE TAPE AND ADHESION METHOD USING DOUBLE-SIDED ADHESIVE TAPE - A double-sided adhesive tape ( | 05-21-2015 |
20150136318 | SYSTEM AND METHOD OF CONTROLLED BONDING MANUFACTURING - A controlled-bonding manufacturing system for creating objects from a material sheet without the use of adhesives. The system comprises a flat base, a laser welding assembly, a feeding element, and a computing element. The flat base is adapted to receive a plurality of layers of the material sheet layered thereon. The laser welding assembly is adapted to move relative to the flat base. The laser welding assembly comprises a welder housing, a substantially transmissive roller rotatably coupled to the welder housing, and a welding laser adapted to emit a laser beam through at least a portion of the transmissive roller. The absence of air, the mechanical pressure, and the emitted laser beam welds at least a portion of a top layer of the material sheet to at least one other layer of the material sheet. | 05-21-2015 |
20150144260 | DEVICE AND METHOD FOR ADHERING DIFFERENT KINDS OF MATERIALS - A device for adhering different kinds of materials is configured to adhere a metal material and a composite material having an adhering hole. The device includes a frame having first and second free ends that face each other. A laser head is provided at the first free end of the frame and irradiates a laser beam to an adhering point of the metal material. An upper tool moves back and forth at the first free end of the frame and presses the metal material. A lower tool is fixed to the second free end of the frame so as to correspond to the upper tool and supports an adhering point of the composite material. An air suction member is connected to the lower tool to suck air between the lower tool and the adhering hole of the composite material. | 05-28-2015 |
20150298391 | Method for joining a joining partner of a thermoplastic material to a joining partner of glass - A method for joining a joining partner made of a thermoplastic material to a joining partner made of glass is provided. The method includes providing a thermoplastic joining partner made of a laser-absorbing thermoplastic material, providing a glass joining partner made of a laser-transmissive glass material, placing the thermoplastic joining partner and the glass joining partner on top of each other while applying a joining force to the joining partners, increasing the temperature of the glass joining partner, in particular using a radiation, and emitting a laser processing beam through the glass joining partner onto the boundary surface of the thermoplastic joining partner and into a joining zone, thus causing the thermoplastic joining partner to melt so as to form an adhesive bond between the two joining partners in the joining zone during the cooling thereof. | 10-22-2015 |
20150306705 | METHOD AND APPARATUS FOR PREPARING A SURFACE FOR BONDING A MATERIAL THERETO - A method for preparing a surface of a substrate for bonding a material to the surface. The apparatus employed includes one or more optical amplification devices (OAD), one or more drivers, the substrate and a base. The one or more OAD and/or the substrate are moveably coupled to the one or more drivers. The one or more OAD is activated to emit a beam of energy. The one or more OAD and/or the substrate move relative to one another while the one or more OAD is activated. The movement of the one or more OAD and/or the substrate relative to one another forms (via the beam of energy) a pattern on the surface of the substrate. The pattern formed on the surface of the substrate allows the material to bond with a greater degree of adhesion. | 10-29-2015 |
20150306815 | SYSTEMS AND METHODS FOR PERFORATING MATERIALS - Systems and methods for manufacturing laser-perforated nanoreinforced materials are disclosed. A honeycomb core may utilize a perforated top sheet and a microperforated overlay film coupled to the perforated top sheet. The perforated top sheet and/or the microperforated film may include thermally conductive nanomaterials. The perforations in the top sheet and the microperforations in the film may be laser drilled. The nanomaterials may dissipate heat generated by the laser drilling, allowing for increased perforation speeds. | 10-29-2015 |
20150316728 | CONDUCTIVE ASSEMBLIES SECURING OPTICAL FIBERS TO FERRULES BY THERMALLY SECURING BONDING AGENTS WITHIN FIBER OPTIC CONNECTOR HOUSINGS, AND RELATED METHODS AND ASSEMBLIES - Conductive assemblies are disclosed for bonding an optical fiber in a ferrule by mounting the ferrule of a fiber optic connector in the conductive assembly and using the conductive assembly to convert laser beam energy to heat and apply the heat to a portion of a fiber optic ferrule sufficient to bond the optical fiber in the ferrule. In an exemplary method, an optical fiber is disposed in a bore of a ferrule. A portion of the ferrule is disposed in a conductive assembly, such that a conductive element contacts a portion of the length of the ferrule. A laser beam absorber absorbs light energy from a laser beam, and converts the energy to heat. The conductive element transfers the heat energy from the laser beam absorber to the ferrule, thereby heating the bonding agent and bonding the optical fiber in the bore of the ferrule. | 11-05-2015 |
20150343701 | METHOD OF LASER WELDING OF AN AUTOMOTIVE LIGHT AND RELATIVE AUTOMOTIVE LIGHT - Method of manufacture of an automotive light comprising the steps of providing a container body delimited by a first perimetral profile, providing a lenticular body, internally delimited by a second perimetral profile and externally by an outer edge corresponding to said second perimetral profile, wherein the container body acts as an absorbent element of the light beam and the lenticular body acts as a transmission element of the light beam, providing optical devices for changing the divergence of the portions of laser beams in output from the fibres, so as to collimate them overall along at least one predetermined optical axis. The method further comprises the steps of directing on a critical portion of the welding interface at least a first laser beam emitted by a respective fibre lying on an optical plane incident with said critical portion of the welding interface. | 12-03-2015 |
20150362679 | LASER-BASED SYSTEMS AND METHODS FOR FIBER-TO-FERRULE BONDING FOR OPTICAL FIBER CONNECTORS - Systems and methods for bonding a bare fiber section within a longitudinal bore of a ferrule are disclosed. The methods include inserting the bare fiber section into the ferrule bore along with a photoactivated adhesive. A diverging beam of activating light is directed into an endface of the bare fiber section at the ferrule front end. The activating light passes through the bare fiber section to expose the surrounding photoactivated adhesive, thereby bonding the bare fiber section within the longitudinal bore. The ferrule and fiber can then be incorporated into an optical fiber connector. | 12-17-2015 |
20160009066 | SYSTEM AND METHOD FOR CUTTING LAMINATED STRUCTURES | 01-14-2016 |
20160023401 | GAS CELL SEALING METHOD - A gas cell sealing method includes bonding step in which a bonding portion of a gas cell main body having an opening and a lid for closing the opening where a sealant for bonding the gas cell main body and the lid is provided is heated by converging a laser beam from a laser light source through an optical element, and the lid is bonded to the gas cell main body by applying pressure in a direction that presses the lid against the gas cell main body, the pressure being applied while the laser beam is being converged to the bonding portion. | 01-28-2016 |
20160059475 | LASER WELDING PLASTIC - The present invention discloses a method for laser welding of plastics, comprising the steps of providing a first plastic material to be welded comprising a compound capable of absorbing near-infrared light, positioning a second plastic material in intimate contact with the first plastic material, and activating a laser source emitting a wave length in the near-infrared spectrum to obtain attachments of the first and the second plastic material. The compound capable of absorbing near-infrared light is a dye derived from croconic acid. | 03-03-2016 |
20160083133 | LABEL PREPARING DEVICE AND LABEL PREPARING METHOD IN LABEL PREPARING DEVICE - There is provided a label preparing device including: a laser cutting section that forms a cutting line, which is an outline of a label piece, on a media by irradiating the media with laser beams; and a print section that applies ink to at least a peripheral part of the label piece after the cutting line is formed. It is preferable that the laser cutting section irradiates the media in an immobile state with laser beams, and the print section applies ink to the media in which the immobile state is maintained. | 03-24-2016 |
20160129227 | BALLOON CATHETER WITH IMPROVED PUSHABILITY - Balloon catheter and methods for making and using balloon catheters are disclosed. An example balloon catheter may include a proximal shaft. A midshaft may be attached to the proximal shaft. The midshaft may have an outer wall. A distal shaft may be attached to the midshaft. A balloon may be coupled to the distal shaft. An inflation lumen may be defined that extends from the proximal shaft, through the midshaft, and into the distal shaft. The inflation lumen may be in fluid communication with the balloon. A core wire may be disposed within the inflation lumen and may be attached to the midshaft. | 05-12-2016 |
20160163914 | SYSTEMS, METHODS AND APPARATUS FOR PRECISION AUTOMATION OF MANUFACTURING SOLAR PANELS - Systems and methods for manufacturing solar panels are disclosed. Solar cells are placed on a conveyor that transports the cells from a start point to an end point. A laser scribing module scribes the cells at a predetermined depth. A paste dispensing module deposits a predetermined amount of conductive paste on the surface of the solar cells. A cleaving apparatus divides the cells into smaller strips. A shingling module creates a string of cells by overlapping the strips. A targeted annealing module cures the paste, and a layup module places the strings on a backsheet. A glass cover is then added to one side of the strings. | 06-09-2016 |
20160381817 | Method for Producing an Electronic Module having an Interlockingly Connected Housing Part Element - A method for producing an electronic module includes arranging a housing part element on a circuit board element after separately producing and preparing the housing part element. The housing part element is formed with a material that can be reversibly plasticized, such as a thermoplastic like polyamide. At least a portion of a surface of the housing part element is reversibly plasticized, for example via local heating or light irradiation. Arranging the housing part element on the circuit board element includes joining the plasticized portion of the surface of the housing part element to a microstructured portion of the circuit board element and then hardening the plasticized portion to form an interlocking and hermetically sealed connection therebetween. | 12-29-2016 |