Class / Patent application number | Description | Number of patent applications / Date published |
148679000 | Copper(Cu) or copper base alloy | 50 |
20110048590 | PRODUCTION METHOD OF THERMOELECTRIC SEMICONDUCTOR ALLOY, THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC POWER GENERATING DEVICE - The present invention provides a method for producing a half Heuslar alloy including quench-solidifying a molten alloy at a cooling rate of 1×10 | 03-03-2011 |
20140124106 | SILVER-WHITE COPPER ALLOY AND METHOD OF PRODUCING SILVER-WHITE COPPER ALLOY - Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%. | 05-08-2014 |
148680000 | With working above 400`C or nonspecified hot working | 19 |
20080202653 | Extrusion of a Metal Alloy Containing Copper and Zinc - The invention relates to a method for producing a metal alloy product ( | 08-28-2008 |
20110056596 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY COPPER ALLOY TUBE AND METHOD FOR PRODUCING THE SAME - A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. | 03-10-2011 |
20080202653 | Extrusion of a Metal Alloy Containing Copper and Zinc - The invention relates to a method for producing a metal alloy product ( | 08-28-2008 |
20110056596 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY COPPER ALLOY TUBE AND METHOD FOR PRODUCING THE SAME - A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. | 03-10-2011 |
148681000 | Multiple working steps | 16 |
20120273097 | SPUTTERING TARGETS, SPUTTER REACTORS, METHODS OF FORMING CAST INGOTS, AND METHODS OF FORMING METALLIC ARTICLES - The invention encompasses a method of forming a metallic article. An ingot of metallic material is provided, and such ingot has an initial thickness. The ingot is subjected to hot forging. The product of the hot forging is quenched to fix an average grain size of less than 250 microns within the metallic material. The quenched material can be formed into a three dimensional physical vapor deposition target. The invention also includes a method of forming a cast ingot. In particular aspects, the cast ingot is a high-purity copper material. The invention also includes physical vapor deposition targets, and magnetron plasma sputter reactor assemblies. | 11-01-2012 |
20140166164 | COPPER ALLOY SHEET AND METHOD OF MANUFACTURING COPPER ALLOY SHEET - A copper alloy sheet according to one aspect contains 28.0 mass % to 35.0 mass % of Zn, 0.15 mass % to 0.75 mass % of Sn, 0.005 mass % to 0.05 mass % of P, and a balance consisting of Cu and unavoidable impurities, in which relationships of 44≧[Zn]+20×[Sn]≧37 and 32≦[Zn]+9×([Sn]−0.25) | 06-19-2014 |
20140174611 | COPPER ALLOY SHEET, AND METHOD OF PRODUCING COPPER ALLOY SHEET - One aspect of this method of producing a copper alloy sheet includes: a hot rolling process; a cold rolling process; a recrystallization heat treatment process; and a finish cold rolling process in this order, wherein a hot rolling initiation temperature is 800° C. to 940° C., a cooling rate from a temperature after final rolling or 650° C. to 350° C. is 1° C./second or more, and a cold working rate is 55% or more. In the recrystallization heat treatment process, 550≦Tmax≦790, 0.04≦tm≦2, and 460≦{Tmax−40×tm | 06-26-2014 |
20140202602 | COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING COPPER ALLOY SHEET - An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfied a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70 % or more. | 07-24-2014 |
20140209221 | Cu-Mg-P-BASED COPPER ALLOY SHEET HAVING EXCELLENT FATIGUE RESISTANCE CHARACTERISTIC AND METHOD OF PRODUCING THE SAME - The fatigue resistance characteristics, particularly, fatigue resistance characteristics after retention at 150° C. for 1000 hours are improved while maintaining the characteristics in the related art. Provided is a copper alloy sheet having a composition containing 0.2% by mass to 1.2% by mass of Mg, and 0.001% by mass to 0.2% by mass of P, the balance being Cu and unavoidable impurities. When X-ray diffraction intensity of a {110} crystal plane is set as I{110}, and X-ray diffraction intensity of {110} crystal plane of a pure copper standard powder is set as I | 07-31-2014 |
20140261923 | PROCESS FOR THE CREATION OF UNIFORM GRAIN SIZE IN HOT WORKED SPINODAL ALLOY - Processes for producing a uniform grain hot worked spinodal alloy are disclosed. The processes generate a uniform grain spinodal alloy without cracking and without the need for a homogenization step. The processes include providing an as-cast spinodal alloy, heating the as-cast spinodal alloy between 1200 and 1300° F. for approximately 12 hours and hot working, allowing the spinodal alloy to cool, performing a second hot work on the as-cast spinodal alloy after it has been heated to 1700° F. for a defined time period, exposing the alloy to a third temperature, performing a second hot work reduction, and cooling the alloy again. | 09-18-2014 |
20150122380 | COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL - A copper alloy sheet for terminal and connector materials contains 4.5 mass % to 12.0 mass % of Zn, 0.40 mass % to 0.9 mass % of Sn, 0.01 mass % to 0.08 mass % of P, and 0.20 mass % to 0.85 mass % of Ni with a remainder being Cu and inevitable impurities, a relationship of 11≦[Zn]+7.5×[Sn]+16×[P]+3.5×[Ni]≦19 is satisfied, a relationship of 7≦[Ni]/[P]≦40 is satisfied in a case in which the content of Ni is in a range of 0.35 mass % to 0.85 mass %, an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm, an average particle diameter of circular or elliptical precipitates is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more, an electric conductivity is 29% IACS or more, a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance, bending workability is R/t≦0.5 at W bending, solderability is excellent, and a Young's modulus is 100×10 | 05-07-2015 |
148682000 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening | 9 |
20090025840 | Cu-Ni-Si-Co-Cr Copper Alloy for Electronic Materials and Method for Manufacturing Same - The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09-about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4≦[Ni+Co]/Si≦about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5≦Ni/Co≦about 2, and wherein Pc is equal to or less than about 15/1000 μm | 01-29-2009 |
20100139822 | Cu-Ti-based copper alloy sheet material and method of manufacturing same - Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 μm. | 06-10-2010 |
20100193092 | COPPER ALLOY FOR ELECTRICAL/ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME - A copper alloy for an electrical and electronic device in accordance with the present invention is characterized in that the copper alloy for an electrical and electronic device includes: nickel (Ni) between 1.5 mass % and 5.0 mass %; silicon (Si) between 0.4 mass % and 1.5 mass %; and a remaining portion formed of Cu and an unavoidable impurity, wherein a mass ratio between Nickel (Ni) and Silicon (Si) as Ni/Si is not smaller than two and not larger than seven, an average crystalline grain diameter is not smaller than 2 μm and not larger than 20 μm, and a standard deviation of the crystalline grain diameter is not larger than 10 μm. | 08-05-2010 |
20100224292 | Copper alloy material and a method for fabricating the same - A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n≧1), {11m} (m is an integer, m≧1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: | 09-09-2010 |
20110146855 | Cu-Mg-P based copper alloy material and method of producing the same - A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm | 06-23-2011 |
20110240182 | Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR - Disclosed is a Ni—Si—Co copper alloy that is suitable for use for various kinds of electronic parts and has particularly good uniform plating adhesion properties. The copper alloy for electronic materials comprises Ni: 1.0-2.5 mass %, Co: 0.5-2.5 mass % and Si: 0.3-1.2 mass % and the remainder is made of Cu and unavoidable impurities. For the copper alloy for electronic materials, the mean crystal size, at the plate thickness center, is 20 μm or less, and there are five or fewer crystal particles that contact the surface and have a long axis of 45 μm or greater per 1 mm rolling direction length. The copper alloy may comprise a maximum of 0.5 mass % Cr and may comprise a maximum in total of 2.0 mass % of one, two or more selected from a group comprising Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag. | 10-06-2011 |
20130167988 | Cu-Ni-Si-BASED COPPER ALLOY PLATE HAVING EXCELLENT DEEP DRAWING WORKABILITY AND METHOD OF MANUFACTURING THE SAME - The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm | 07-04-2013 |
20140116583 | Cu-Ni-Co-Si BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME - A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×10 | 05-01-2014 |
20150357074 | HIGH STRENGTH Cu-Ni-Co-Si BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND CURRENT CARRYING COMPONENT - A copper alloy sheet material comprises (by mass %) from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM, from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles (particle diameter of 5 mm or more) is 10 per mm | 12-10-2015 |
148683000 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening | 1 |
20130319584 | Cu-Zr-BASED COPPER ALLOY PLATE AND PROCESS FOR MANUFACTURING SAME - Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm | 12-05-2013 |
148684000 | With working | 22 |
20080210353 | High-strength copper alloys with excellent bending workability and terminal connectors using the same - The invention aims at providing high-strength copper alloy, especially phosphor bronze, with excellent bending workability. The excellently bendable high-strength copper alloy is obtained through grain size control whereby a finally cold rolled copper alloy with a tensile strength and 0.2% yield strength different by not more than 80 MPa is allowed to have characteristics such that its mean grain size (mGS) after annealing at 425° C. for 10,000 seconds is not more than 5 μm and the standard deviation of the mean grain size (σGS) is not more than ⅓×mGS. Improvements in characteristics presumably attributable to the synergistic effect of grain-boundary strengthening and dislocation strengthening are stably achieved by the adjustments of cold rolling and annealing conditions and by the study of the correlation between pertinent characteristic values after the final rolling. The method of processing the alloy comprises cold rolling to a reduction percentage of at least 45%, final annealing to the extent that the mean grain size (mGS) is not more than 3 μm and the standard deviation of the mean grain size (σGS) is not more than 2 μm, and final cold rolling to a reduction percentage of 10-45%. | 09-04-2008 |
20090014102 | Copper-based alloy and method of manufacturing same - This invention is a copper-based alloy for use in connectors, lead frames, switches and relays and the like that has a superior balance of conductivity, tensile strength and workability in bending and method of manufacturing same. The alloy is manufactured by taking an ingot of a copper-based alloy containing Ni, Sn, P and also at least one or more elements selected from a group consisting of Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al in a total amount of 0.01-30 wt. % with the remainder being Cu and unavoidable impurities, performing a combination process of cold rolling followed by annealing at least one time and then performing cold rolling at a percent reduction Z that satisfies the following Formula (1): | 01-15-2009 |
20100037996 | COPPER ALLOY MATERIAL AND METHOD OF MAKING SAME - A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2. | 02-18-2010 |
20110247735 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME - A copper alloy material for electric/electronic parts, containing: Sn 3.0 to 13.0 mass %, any one or both of Fe and Ni 0.01 to 2.0 mass % in total, and P 0.01 to 1.0 mass %, with the balance being Cu and unavoidable impurities, wherein an average diameter of grains is 1.0 to 5.0 μm, wherein a compound X having an average diameter of 30 nm or more and 300 nm or less is dispersed in density 10 | 10-13-2011 |
20130048162 | COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE - One aspect of this copper alloy for an electronic device is composed of a binary alloy of Cu and Mg which includes Mg at a content of 3.3 to 6.9 atomic %, with a remainder being Cu and inevitable impurities, and a conductivity σ (% IACS) is within the following range when the content of Mg is given as A atomic %, | 02-28-2013 |
20130056116 | COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE - A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities. | 03-07-2013 |
20130255845 | HEAT TREATMENT METHOD OF UNLEADED BRASS ALLOY - A heat treatment method for unleaded brass alloy is provided to improve processability, cracking resistance, wear resistance and anti-corrosive property of unleaded brass alloy containing no lead or containing a very small amount of lead. The heat treatment method includes full annealing an unleaded brass alloy material, mechanical processing the material after full annealing and soft annealing the material after mechanical processing. | 10-03-2013 |
20130284327 | COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE - A copper alloy for an electric device contains Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities. A method of producing a copper alloy includes: performing heating of a copper material to a temperature of not lower than 500° C. and not higher than 1000° C.; performing quenching to cool the heated copper material to 200° C. or lower with a cooling rate of 200° C./min or more; and performing working of the cooled copper material, wherein the copper material is composed of a copper alloy containing Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less. | 10-31-2013 |
20140096877 | COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES - An aspect of this copper alloy contains: Mg at a content of 3.3 at % or more to less than 6.9 at %; and either one or both of Cr and Zr at respective contents of 0.001 at % to 0.15 at %, with the balance being Cu and inevitable impurities, wherein when the content of Mg is represented by A at %, a conductivity σ (% IACS) satisfies the following Expression (1), | 04-10-2014 |
20140261924 | PROCESSES FOR IMPROVING FORMABILITY OF WROUGHT COPPER-NICKEL-TIN ALLOYS - Disclosed are processes for improving the formability of a copper-nickel-tin alloy having a 0.2% offset yield strength that is above 115 ksi. The alloy includes about 14.5 to about 15.5 wt % nickel, about 7.5 to about 8.5 wt % tin, and the remaining balance is copper. The copper-nickel-tin alloy is mechanically cold worked to undergo between 5% and 15% plastic deformation. The alloy is then heat treated at elevated temperatures of about 450° F. to about 550° F. for a period of about 3 hours to about 5 hours. The alloy is then subsequently mechanically cold worked again to undergo between 4% and 12% plastic deformation. The alloy is then further heated to an elevated temperature of about 700° F. to about 850° F. for a period between about 3 minutes and about 12 minutes to relieve stress. The resulting alloy has a combination of good formability ratio and good yield strength. | 09-18-2014 |
20140261925 | ULTRA HIGH STRENGTH COPPER-NICKEL-TIN ALLOYS - The present disclosure relates to ultra high strength wrought copper-nickel-tin alloys and processes for improving the yield strength of the copper-nickel-tin alloy such that the resulting 0.2% offset yield strength is at least 175 ksi. The alloy includes about 14.5 wt % to about 15.5% nickel, about 7.5 wt % to about 8.5% tin, and the remaining balance is copper. The steps include cold working the copper-nickel-tin alloy wherein the alloy undergoes between 50%-75% plastic deformation. The alloy is heat treated at elevated temperatures between about 740° F. and about 850° F. for a time period of about 3 minutes to 14 minutes. | 09-18-2014 |
20140283961 | COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC EQUIPMENT, ROLLED COPPER ALLOY MATERIAL FOR ELECTRONIC EQUIPMENT, AND PART FOR ELECTRONIC EQUIPMENT - This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is given as X at %, an electrical conductivity σ (% IACS) is in a range of σ≦{1.7241/(−0.0347×X | 09-25-2014 |
20140283962 | COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD OF MANUFACTURING COPPER ALLOY FOR ELECTRONIC DEVICES, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC DEVICES, AND COMPONENT FOR ELECTRONIC DEVICES - A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic devices including a terminal, a connector, a relay and a lead frame. Also a method of manufacturing a copper alloy utilizes a copper alloy plastic working material for electronic devices, and a component for electronic devices. The copper alloy includes Mg at 3.3 to 6.9 at %, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is X at %, an electrical conductivity σ (% IACS) is in a range of σ≦{1.7241/(−0.0347×X | 09-25-2014 |
148685000 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening | 9 |
20090120544 | Strengthened Alpha Brass and Method for Manufacturing the Same - An object of the present invention is to provide a strengthened alpha brass having a good balance between high offset yield strength and formability without deteriorated stress relaxation resistance in comparison with conventional brass and a manufacturing method of the strengthened alpha brass. In order to achieve this object, a strengthened alpha brass having a composition of 63 wt % to 75 wt % copper, incidental impurities and the balance zinc; the strengthened alpha brass which is obtained by using a starting plate material subjected to a re-crystallization annealing to have a grain size from 1-micron meter to 2-micron meter followed by cold rolling in 5% to 40% reduction, then the plate material is low temperature annealed at a temperature equal to or higher than the temperature at which a 0.2% offset yield strength exhibits a maximum value to adjust the 0.2% offset yield strength ([Sigma] | 05-14-2009 |
20100000637 | Cu-ni-si system alloy - The present invention provides Cu—Ni—Si system alloys for electronic material that with the addition of other alloy elements minimized, simultaneously exhibits enhanced electric conductivity, strength, bendability and stress relaxation performance. There are provided Cu—Ni—Si system alloys comprising 1.2 to 3.5 mass % Ni, Si in a concentration (mass %) of ⅙ to ¼ of Ni concentration (mass %) and the balance Cu and impurities whose total amount is 0.05 mass % or less, the Cu—Ni—Si system alloys having its configuration of crystal grains and width of a precipitate-free zone regulated so as to fall within appropriate ranges by controlling solution treatment conditions, aging treatment conditions and degree of a reduction ratio. Thus, there can be provided copper alloys strip of 55 to 62% IACS electric conductivity and 550 to 700 MPa tensile strength, being free from cracking at 180° bending test of 0 radius and exhibiting a stress relaxation ratio, as measured on heating at 150° C. for 1000 hr, of 30% or less. | 01-07-2010 |
20100269963 | COPPER ALLOY MATERIAL EXCELLENT IN STRENGTH, BENDING WORKABILITY AND STRESS RELAXATION RESISTANCE, AND METHOD FOR PRODUCING THE SAME - A copper alloy material according to the present invention is characterized in that the same comprises: Ni between 2.8 mass % and 5.0 mass %; Si between 0.4 mass % and 1.7 mass %; S of which content is limited to less than 0.005 mass %; and the balance of the copper alloy material is composed of copper and unavoidable impurity, wherein a proof stress is stronger than or equal to 800 MPa, and the same is superior in bending workability and in stress relaxation resistance. | 10-28-2010 |
20140283963 | Cu-Ti BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND ELECTRIC CURRENT CARRYING COMPONENT - A Cu—Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 10 | 09-25-2014 |
20140332124 | METHOD FOR MANUFACTURING WIRE, APPARATUS FOR MANUFACTURING WIRE, AND COPPER ALLOY WIRE - An apparatus for manufacturing wire comprising: a wire delivering equipment, a wire winding equipment, and an annealing while running equipment installed between the wire delivering equipment and the wire winding equipment, the age-precipitation copper alloy wire being passed in such manner that the wire turns around a plurality of times along a running route in the annealing while running equipment. The current applying equipment to raise a temperature of the age-precipitation copper alloy wire by generated Joule heat may be installed at upstream side of the annealing while running equipment. Another current applying equipment for solution treatment may be installed in tandem at upstream side of the annealing while running equipment. In place of the annealing while running equipment, a current applying equipment may be connected in tandem for age-treatment. By using those equipments, age-precipitation copper alloy wire having the diameter of from 0.03 mm to 3 mm may be obtained. | 11-13-2014 |
20150136281 | COPPER ALLOY WIRE AND COPPER ALLOY WIRE MANUFACTURING METHOD - A copper alloy wire of the present invention consists of a precipitation strengthening type copper alloy containing Co, P, and Sn, wherein an average grain size of precipitates observed through cross-sectional structure observation immediately after performing an aging heat treatment is equal to or greater than 15 nm and a number of precipitates having grain sizes of equal to or greater than 5 nm is 80% or higher of a total number of observed precipitates, and the copper alloy wire is subjected to cold working after the aging heat treatment. | 05-21-2015 |
20150144235 | COPPER ALLOY TROLLEY WIRE AND METHOD FOR MANUFACTURING COPPER ALLOY TROLLEY WIRE - A copper alloy trolley wire includes: 0.12 mass % to 0.40 mass % of Co; 0.040 mass % to 0.16 mass % of P; 0.005 mass % to 0.70 mass % of Sn; and the balance including Cu and unavoidable impurities, wherein precipitates have an average grain size of equal to or greater than 10 nm, and the number of precipitates having a grain size of equal to or greater than 5 nm is 90% or greater of the total number of observed precipitates, and a heat resistance HR defined by HR=TS | 05-28-2015 |
20150357073 | COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL - A copper alloy for an electric and electronic device includes more than 2.0 mass % to 36.5 mass % of Zn, 0.1 mass % to 0.9 mass % of Sn, 0.05 mass % to less than 1.0 mass % of Ni, 0.5 mass ppm to less than 10 mass ppm of Fe, 0.001 mass % to less than 0.10 mass % of Co, 0.001 mass % to 0.10 mass % of P, and a balance including Cu and unavoidable impurities, in which, ratios between the amounts of the respective elements satisfy 0.002≦Fe/Ni<1.5, 3<(Ni+Fe)/P<15, and 0.312-10-2015 | |
20160083826 | METHOD FOR MANUFACTURING COPPER ALLOY AND COPPER ALLOY - A method for manufacturing a copper alloy of the present invention is a method for manufacturing a Cu—Ni—Sn-based copper alloy and includes: a first aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. using a solution treated material; an inter-aging processing step of performing cold working after the first aging treatment step; and a second aging treatment step of performing an aging treatment in a temperature range of 300° C. to 500° C. after the inter-aging processing step. In the first aging treatment step, a peak aging treatment is preferably performed. In addition, in the second aging treatment step, the aging treatment is preferably performed for a short period as compared to that of the aging treatment in the first aging treatment step. In the inter-aging processing step, cold working is preferably performed at a processing rate of more than 60% to 99%. | 03-24-2016 |
148686000 | With ageing, solution treating (i.e., for hardening), precipitation hardening or strengthening | 5 |
20100006191 | HIGH STRENGTH Be/Cu ALLOYS WITH IMPROVED ELECTRICAL CONDUCTIVITY - The electrical conductivity of a wrought processed, high strength, age hardened Be—Cu alloy is enhanced by overaging the alloy in manufacture. | 01-14-2010 |
20100243112 | Beryllium-Free High-Strength Copper Alloys - A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L1 | 09-30-2010 |
20100326573 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An copper alloy material for electric/electronic components
| 12-30-2010 |
20110186192 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS AND METHOD OF PRODUCING THE SAME - A copper alloy material for an electric/electronic part, having a composition comprising Co 0.5 to 2.0 mass % and Si 0.1 to 0.5 mass %, with the balance of Cu and inevitable impurities, in which a copper alloy of a matrix has a grain size of 3 to 35 μm, a precipitate composed of Co and Si has a particle size of 5 to 50 nm, the precipitate has a density of 1×10 | 08-04-2011 |
20150354048 | METAL COMPOSITE COMPRISING ALIGNED PRECIPITATE AND PREPARATION METHOD THEREFOR - The present invention provides a metal composite with an oriented precipitate, in which a solid solution is created by performing solution treatment or homogenization on an alloy, a discontinuous cellular precipitate or lamellar precipitate of 40% or more per unit area of 500 μm×500 μm is forcibly created by aging and oriented by plastic working. | 12-10-2015 |
148680000 | With working above 400C or nonspecified hot working | 2 |
20080202653 | Extrusion of a Metal Alloy Containing Copper and Zinc - The invention relates to a method for producing a metal alloy product ( | 08-28-2008 |
20110056596 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY COPPER ALLOY TUBE AND METHOD FOR PRODUCING THE SAME - A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. | 03-10-2011 |
20080202653 | Extrusion of a Metal Alloy Containing Copper and Zinc - The invention relates to a method for producing a metal alloy product ( | 08-28-2008 |
20110056596 | HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY COPPER ALLOY TUBE AND METHOD FOR PRODUCING THE SAME - A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube. | 03-10-2011 |