Class / Patent application number | Description | Number of patent applications / Date published |
118699000 | Having timer | 20 |
20090056626 | APPARATUS FOR CYCLICAL DEPOSITING OF THIN FILMS - An apparatus for cyclical depositing of thin films on semiconductor substrates, comprising a process chamber having a gas distribution system with separate paths for process gases and an exhaust system synchronized with operation of valves dosing the process gases into a reaction region of the chamber. | 03-05-2009 |
20090090300 | METHOD FOR USING FILM FORMATION APPARATUS - In a method for using a film formation apparatus for a semiconductor process, process conditions of a film formation process are determined. The process conditions include a preset film thickness of a thin film to be formed on a target substrate. Further, a timing of performing a cleaning process is determined in accordance with the process conditions. The timing is defined by a threshold concerning a cumulative film thickness of the thin film. The cumulative film thickness does not exceed the threshold where the film formation process is repeated N times (N is a positive integer), but exceeds the threshold where the film formation process is repeated N+1 times. The method includes continuously performing first to Nth processes, each consisting of the film formation process, and performing the cleaning process after the Nth process and before an (N+1)th process consisting of the film formation process. | 04-09-2009 |
20090211524 | Sprinicling Head and Method for Sprinkling Powder Patterns on a Transparent Plate; For Preparing a Relief Glass Substrate With a Durable Coloured Pattern - Sprinkling head ( | 08-27-2009 |
20110120371 | METHOD AND APPARATUS FOR CHEMICAL DEPOSITION - Embodiments of the present system and method are useful for chemical deposition, particularly continuous deposition of thin films. Disclosed systems typically comprise a micromixer and a microchannel applicator. A deposition material or materials is applied to a substrate, such as an oxidized silicon substrate, a flexible substrate useful for forming flexible devices, such as flexible transistors, and combinations of different substrates. Uniform and highly oriented surface morphologies of films deposited using disclosed embodiments are clearly improved compared to films deposited by a conventional batch process. The process can be used to tailor the composition and morphology of the material deposited on a substrate. The present process can be used at low temperatures as a post-deposition, high-temperature annealing step is obviated. | 05-26-2011 |
20110174219 | CONTROL FOR AND METHOD OF PULSED GAS DELIVERY - A mole delivery system and method provide pulses of known molar quantities as a function of the time duration of each pulse, which in turn is derived as a function of the ideal gas law. In one embodiment of the system, the system comprises: a chamber of known volume and controlled and known temperature; a pressure sensor to measure the pressure in the chamber; an outlet valve to a process tool; an inlet valve to charge the chamber with the delivery gas; and a control system configured and arranged so as to control the operation of the outlet valve, control the amount of each gas pulse by controlling the timing of the valve to the process tool. | 07-21-2011 |
20110265718 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD - A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism. | 11-03-2011 |
20120006262 | APPARATUS FOR FORMING THIN FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR FILM - An apparatus including a vacuum chamber having a substrate holding unit that holds a substrate and a plasma electrode facing the substrate, a first gas supply unit that supplies a H | 01-12-2012 |
20120042827 | METHOD FOR DISCHARGING DROPLETS AND DROPLET DISCHARGE APPARATUS - A droplet discharge apparatus is configured to move a droplet discharge head and a weight measurement unit relative to each other so that the droplet discharge head is placed in a position that faces the weight measurement unit by controlling a weight measurement unit movement part and a weight measurement unit secondary movement. The droplet discharge apparatus is also configured to control the droplet discharge head to perform a weight measurement discharge for measuring a weight of the liquid material discharged from the droplet discharge head during the feed/removal period, which includes a period for feeding and removing the substrate from the stage, and a period in which the stage is moved in relative fashion by the stage movement unit for performing feeding and removal operations. | 02-23-2012 |
20120291703 | STENT COATING APPARATUS - An apparatus for coating a stent comprises a coating solution reservoir, a stent support for carrying a stent adjacent the reservoir, transducers for generating waves through the coating solution, and a controller that controls timing at which the transducers are powered in order to eject a droplet of the coating solution. | 11-22-2012 |
20130206062 | Micro-Extrusion Printhead With Offset Orifices For Generating Gridlines On Non-Square Substrates - A solar cell extrusion printing system that uses a micro-extrusion printhead to print longer central gridlines and one or more pairs of shorter “side” gridlines such that end points of the gridline sets form step patterns on an octagonal (pseudo-square) substrate. The printhead includes a set of central nozzles that receive ink from a first valve by way of a first flow channel to print the longer central gridlines, and additional sets of side nozzles that receive ink from additional valves by way of additional flow channels to print the shorter “side” gridlines. The central nozzles have outlet orifices that offset in the process direction from side outlet orifices of the side nozzles. A start signal is simultaneously sent to the valves such that ink is substantially simultaneously extruded through both the central and side orifices, whereby the extruded ink produces gridline endpoints having the desired step pattern. | 08-15-2013 |
20130298827 | Mixing Apparatus for Mixing Bonding Adhesive at Die Bonder Before Dispense - A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range. | 11-14-2013 |
20140060430 | SEMICONDUCTOR PROCESSING APPARATUS INCLUDING A PLURALITY OF REACTORS, AND METHOD FOR PROVIDING THE SAME WITH PROCESS GAS - A semiconductor processing apparatus ( | 03-06-2014 |
20150027369 | Apparatus for Treating a Gas Stream - In an apparatus for treating a gas stream, a plasma generator comprises an electrode for energising a source gas to generate a plasma flare by application of a high voltage. An inlet allows the gas stream into the apparatus and directs it into the generated plasma. A scraper is fitted for reciprocating movement from a first position to a second position for scraping a surface to remove solid deposits accumulated on the surface. | 01-29-2015 |
20150107513 | SYSTEMS FOR MODULATING STEP COVERAGE DURING CONFORMAL FILM DEPOSITION - A system for processing a substrate include a processing chamber including a pedestal to support a substrate and a controller configured to a) supply precursor to the processing chamber; b) purge the processing chamber; c) perform radio frequency (RF) plasma activation; d) purge the processing chamber; and e) prior to purging the processing chamber in at least one of (b) or (d), set a vacuum pressure of the processing chamber to a first predetermined pressure that is less than a vacuum pressure during at least one of (a) or (c) for a first predetermined period. | 04-23-2015 |
20150128858 | COATING APPARATUS - A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone. | 05-14-2015 |
20150345311 | APPARATUS AND METHODS FOR FORMING MODIFIED METAL COATINGS - Methods and systems for forming modified metal coatings on a gas turbine engine component. The gas turbine engine component is placed inside a container having a known volume, along with a source material containing a secondary element. The container, gas turbine engine component, and the source material inside the container are placed into an oxygen-depleted space inside a reaction chamber. At least one temperature for the source material is determined based upon the known volume of the container and an amount of the source material. While in the oxygen-depleted space, the source material is heated to the at least one temperature sufficient to release a vapor phase reactant containing the secondary element. The vapor phase reactant is confined inside the container at an approximately constant pressure and the secondary element is deposited from the vapor phase reactant as a layer on the gas turbine engine component. | 12-03-2015 |
118702000 | Sequential timing of plural operations | 3 |
20090205568 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method by which a desired thin film is formed on a substrate by alternately supplying and discharging a plurality of processing gases to and from a process chamber having a space for processing the substrate. In the substrate processing method, a quantity of a chemical species, which exists in the thin film and the film stress of the thin film depends on, is controlled by controlling a supply time of one processing gas among the processing gases, and thus the film stress of the thin film is controlled. | 08-20-2009 |
20100012028 | Optical Lens Coating Apparatus - A light irradiation device ( | 01-21-2010 |
20110203523 | METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION - A high pressure processing system including a chamber configured to house a substrate. A fluid introduction system includes at least one composition supply system configured to supply a first composition and a second composition, and at least one fluid supply system configured to supply a fluid. The fluid supply system is configured to alternately and discontinuously introduce the first composition and the second composition to the chamber within the fluid. | 08-25-2011 |
118703000 | Time delay means | 1 |
20140245954 | PLATING APPARATUS - A plating apparatus is described. The apparatus includes: a substrate holder configured to hold a substrate in a vertical position; at least one processing bath configured to process the substrate held by the substrate holder, a transporter configured to grip and horizontally transport the substrate holder; at least one lifer configured to receive the substrate holder from the transporter, lower the substrate holder to place the substrate holder in the processing bath, elevate the substrate holder from the processing bath after processing of the substrate, and transfer the substrate holder to the transporter; and a controller configured to control operations of the transporter and the lifter. | 09-04-2014 |