Class / Patent application number | Description | Number of patent applications / Date published |
117106000 | With pretreatment or preparation of a base (e.g., annealing) | 24 |
20100139555 | APPARATUS FOR CRYSTAL GROWTH - Apparatus for vapour phase growing of crystals having a single multi-zone heater arranged to heat a heated zone to give a predetermined temperature profile along the length of the heated zone. A generally U-shaped tube having a first limb, a second limb, and a linkage connecting the first and second limbs is located on the heated zone. The first limb contains a source material. The second limb supports a seed such that the source material and seed are spaced longitudinally within the heated zone to provide a predetermined temperature differential between the source and seed. The crystal is grown on the seed. | 06-10-2010 |
20100206218 | Method of making group III nitride-based compound semiconductor - A method of making a group III nitride-based compound semiconductor includes providing a semiconductor substrate comprising group III nitride-based compound semiconductor, polishing a surface of said semiconductor substrate such that said polished surface includes an inclined surface that has an off-angle θ of 0.15 degrees or more and 0.6 degrees or less to one of an a-face, a c-face and an m-face of the semiconductor substrate, providing a stripe-shaped specific region on the polished surface, the specific region comprising a material that prevents the growth of the group III nitride-based compound semiconductor on its surface, and growing a semiconductor epitaxial growth layer of group III nitride-based compound semiconductor on the polished surface of the semiconductor substrate. The specific region is provided on the polished surface such that the longitudinal direction of the specific region intersects with the longitudinal direction of a step portion that is formed with an atom-layer height on the polished surface by introducing the off-angle θ. | 08-19-2010 |
20100294197 | Methods For Producing Epitaxially Coated Silicon Wafers - Epitaxially coated silicon wafers are produced by placing a wafer polished on its front side on a susceptor in an epitaxy reactor, first pretreating under a hydrogen atmosphere and in a second and a third step with addition of an etching medium to the hydrogen atmosphere, and subsequently providing an epitaxial layer, wherein during the first and second steps the hydrogen flow rate is 20-100 slm, during the second and third steps the flow rate of the etching medium is 0.5-1.5 slm, during the second step the average temperature in the reactor chamber is 950-1050° C., and the power of heating elements above and below the susceptor is regulated such that there is a temperature difference of 5-30° C. between a radially symmetrical region encompassing the central axis of and a part lying outside this region; and during the third step the hydrogen flow rate is reduced to 0.5-10 slm. In a second method, during the third pretreatment step the flow rate of the etching medium is increased to 1.5-5 slm, while the hydrogen flow rate does not have to be reduced. | 11-25-2010 |
20100307405 | Method for Growing AlxGa1-xN Single Crystal - Affords a method of growing large-scale, high-quality Al | 12-09-2010 |
20100319614 | Compound Semiconductor Single-Crystal Manufacturing Device and Manufacturing Method - A compound semiconductor single-crystal manufacturing device ( | 12-23-2010 |
20110114016 | AlGaN BULK CRYSTAL MANUFACTURING METHOD AND AlGaN SUBSTRATE MANUFACTURING METHOD - There is provided an AlGaN bulk crystal manufacturing method for manufacturing a high-quality AlGaN bulk crystal having a large thickness. Also, there is provided an AlGaN substrate manufacturing method for manufacturing a high-quality AlGaN substrate. The AlGaN bulk crystal manufacturing method includes the following steps: First, a support substrate composed of Al | 05-19-2011 |
20110132255 | METHOD FOR PRODUCING EPITAXIAL SILICON WAFER - Since vapor-phase growth of an epitaxial film is performed on the surface of a mirror surface silicon wafer which is not subjected to final polishing, and the surface of the epitaxial film is thereafter subjected to HCl gas etching, the mirror polishing step is simplified, and the productivity is improved, that enables a reduction in cost, and it is possible to suppress the surface roughness of the epitaxial film as well. | 06-09-2011 |
20110155050 | CLAD TEXTURED METAL SUBSTRATE FOR FORMING EPITAXIAL THIN FILM THEREON AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a oriented substrate for forming an epitaxial thin film thereon, having a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The clad textured metal substrate includes a metallic layer and a copper layer bonded to at least one face of the above described metallic layer, wherein the above described copper layer has a {100}<001> cube texture in which a deviating angle Δφ of crystal axes satisfies Δφ≦6 degree. The substrate has an intermediate layer on the surface of the copper layer, to form the epitaxial thin film thereon. | 06-30-2011 |
20110192343 | METHOD OF MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE AND A LAYER DEPOSITED ON ONE OF ITS FACES - A method for manufacturing an electronic, optic, optoelectronic or photovoltaic structure of a substrate having a thin layer on one face thereof, by forming an embrittled substrate having first and second faces and an embrittlement zone therebetween, the embrittlement zone defining the substrate and a remainder; depositing a thin layer of material on both the first and second faces of the embrittled substrate; and cleaving the embrittled substrate at the embrittlement zone to obtain the structure having the thin layer of deposited material on one face and one face that is exposed. | 08-11-2011 |
20120006255 | METHOD OF MANUFACTURING SINGLE CRYSTAL - A seed crystal having a frontside surface and a backside surface is prepared. Surface roughness of the backside surface of the seed crystal is increased. A coating film including carbon is formed on the backside surface of the seed crystal. The coating film and a pedestal are brought into contact with each other with an adhesive interposed therebetween. The adhesive is cured to fix the seed crystal to the pedestal. A single crystal is grown on the seed crystal. Before the growth is performed, a carbon film is formed by carbonizing the coating film. | 01-12-2012 |
20120017826 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A supporting portion ( | 01-26-2012 |
20120060751 | MANUFACTURING METHOD OF SILICON CARBIDE SINGLE CRYSTAL - A manufacturing method of a SiC single crystal includes growing a SiC single crystal on a surface of a SiC seed crystal, which satisfies following conditions: (i) the SiC seed crystal includes a main growth surface composed of a plurality of sub-growth surfaces; (ii) among directions from an uppermost portion of a {0001} plane on the main growth surface to portions on a periphery of the main growth surface, the SiC seed crystal has a main direction in which a plurality of sub-growth surfaces is arranged; and (iii) an offset angle θ | 03-15-2012 |
20120073495 | MANUFACTURING METHOD OF SILICON CARBIDE SINGLE CRYSTAL - In a manufacturing method of a silicon carbide single crystal, a seed crystal made of silicon carbide is prepared. The seed crystal has a growth surface and a stacking fault generation region and includes a threading dislocation that reaches the growth surface. The growth surface is inclined at a predetermined angle from a (0001) plane. The stacking fault generation region is configured to cause a stacking fault in the silicon carbide single crystal when the silicon carbide single crystal is grown. The stacking fault generation region is located at an end portion of the growth surface in an offset direction that is a direction of a vector defined by projecting a normal vector of the (0001) plane onto the growth surface. The seed crystal is joined to a pedestal, and the silicon carbide single crystal is grown on the growth surface of the seed crystal. | 03-29-2012 |
20120132132 | MANUFACTURING METHOD OF SILICON CARBIDE SINGLE CRYSTAL - A manufacturing method of a SiC single crystal includes a first growth process and a re-growth process. In the first growth process, a first seed crystal made of SiC is used to grow a first SiC single crystal. In the re-growth process, a plurality of growth steps is performed for (n−1) times. In a k-th growth step, a k-th seed crystal is cut out from a grown (k−1)-th SiC single crystal, and the k-th seed crystal is used to grow a k-th SiC single crystal (n≧2 and 2≦k≦n). When an offset angle of a growth surface of the k-th seed crystal is defined as θ | 05-31-2012 |
20120152165 | APPARATUS AND METHOD FOR MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL - An apparatus for manufacturing a silicon carbide single crystal grows the silicon carbide single crystal on a surface of a seed crystal made from a silicon carbide single crystal substrate by supplying a material gas for silicon carbide from below the seed crystal. The apparatus includes a base having a first side and a second side opposite to the first side. The seed crystal is mounded on the first side of the base. The apparatus further includes a purge gas introduction mechanism for supporting the base and for supplying a purge gas to the base from the second side of the base. The base has a purge gas introduction path for discharging the supplied purge gas from the base toward an outer edge of the seed crystal. | 06-21-2012 |
20120304919 | Method For Growing Germanium Epitaxial Films - A method for growing germanium epitaxial films is disclosed. Initially, a silicon substrate is preconditioned with hydrogen gas. The temperature of the preconditioned silicon substrate is then decreased, and germane gas is flowed over the preconditioned silicon substrate to form an intrinsic germanium seed layer. Next, a mixture of germane and phosphine gases can be flowed over the intrinsic germanium, seed layer to produce an n-doped germanium seed layer. Otherwise, a mixture of diborane and germane gases can be flowed over the intrinsic germanium seed layer to produce a p-doped germanium seed layer. At this point, a hulk germanium layer can be grown on top of the doped germanium seed layer. | 12-06-2012 |
20130000547 | METHOD FOR FIXING SILICON CARBIDE SEED CRYSTAL AND METHOD FOR PRODUCING SINGLE CRYSTAL SILICON CARBIDE - The object of the present invention is to provide a method for fixing a silicon carbide seed crystal and a method for producing a silicon carbide single crystal which can produce a silicon carbide single crystal having high quality and no penetration defects, and the present invention provides a method for fixing a silicon carbide seed crystal on a pedestal including: a step of mirror polishing a surface of a pedestal on which a silicon carbide seed crystal is to be fixed; a step of irradiating atoms or ions to at least one of a seed crystal-side surface of the pedestal on which the silicon carbide seed crystal is to be fixed and a pedestal side-surface of the silicon carbide seed crystal which is to be fixed on the pedestal, in a vacuum; and a step of directly connecting the seed crystal side-surface of the pedestal and the pedestal side-surface of the silicon carbide seed crystal by bringing them into close contact and applying pressure to them in a vacuum. | 01-03-2013 |
20130239881 | METHOD AND DEVICE FOR MANUFACTURING SILICON CARBIDE SINGLE-CRYSTAL - A method for manufacturing a silicon carbide single-crystal having a diameter of more than 100 mm and a maximum height of 20 mm or more using a sublimation method includes the following steps. That is, there are prepared a seed substrate made of silicon carbide and a silicon carbide source material. By sublimating the silicon carbide source material, the silicon carbide single-crystal is grown on a growth surface of the seed substrate. In the step of growing the silicon carbide single-crystal, a first carbon member provided at a position facing a side wall of the seed substrate is etched at a rate of 0.1 mm/hour or less. By suppressing a change in growth condition for the silicon carbide single-crystal in the crucible, there can be provided a method for manufacturing a silicon carbide single-crystal so as to stably grow the silicon carbide single-crystal. | 09-19-2013 |
20130255567 | METHOD FOR MAKING EPITAXIAL BASE - A method for making an epitaxial base includes the following steps. A plurality of grooves and a plurality of bulges are formed on an epitaxial growth surface of a substrate by etching the epitaxial growth surface. A carbon nanotube layer is located on the epitaxial growth surface, wherein the carbon nanotube layer defines a first part attached on top surface of bulges, and a second part suspended on the grooves. The second part of the carbon nanotube layer is attached on bottom surface of the grooves by treating the carbon nanotube layer. | 10-03-2013 |
20130255568 | METHOD FOR MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL - A method for manufacturing silicon carbide single crystal having a diameter larger than 100 mm by sublimation includes the following steps. A seed substrate made of silicon carbide and silicon carbide raw material are prepared. Silicon carbide single crystal is grown on the growth face of the seed substrate by sublimating the silicon carbide raw material. In the step of growing silicon carbide single crystal, the maximum growing rate of the silicon carbide single crystal growing on the growth face of the seed substrate is greater than the maximum growing rate of the silicon carbide crystal growing on the surface of the silicon carbide raw material. Thus, there can be provided a method for manufacturing silicon carbide single crystal allowing a thick silicon carbide single crystal film to be obtained, when silicon carbide single crystal having a diameter larger than 100 mm is grown. | 10-03-2013 |
20140190402 | APPARATUS AND METHOD FOR MANUFACTURING INGOT - Disclosed are an apparatus and a method for fabricating an ingot. The apparatus includes a crucible receiving source materials therein; a holder fixing a seed located above the source materials; and an adhesive layer interposed between the holder and the seed and chemically bonded to the seed. | 07-10-2014 |
20140290566 | Process of Surface Treatment for Wafer - Disclosed is a process of surface treatment of a substrate. The method of treating a surface of a substrate comprises preparing the substrate, and performing an etching process with respect to a surface of the substrate. The etching process comprises a step of introducing etching gas to the surface of the substrate, and the etching gas comprises a halogen compound and a silane compound. | 10-02-2014 |
20150020731 | DEFECT REDUCTION IN SEEDED ALUMINUM NITRIDE CRYSTAL GROWTH - Bulk single crystal of aluminum nitride (AlN) having an areal planar defect density≦100 cm | 01-22-2015 |
20160032486 | METHOD FOR MANUFACTURING SIC WAFER FIT FOR INTEGRATION WITH POWER DEVICE MANUFACTURING TECHNOLOGY - A method for producing silicon carbide substrates fit for epitaxial growth in a standard epitaxial chamber normally used for silicon wafers processing. Strict limitations are placed on any substrate that is to be processed in a chamber normally used for silicon substrates, so as to avoid contamination of the silicon wafers. To take full advantage of standard silicon processing equipment, the SiC substrates are of diameter of at least 150 mm. For proper growth of the SiC boule, the growth crucible is made to have interior volume that is six to twelve times the final growth volume of the boule. Also, the interior volume of the crucible is made to have height to width ratio of 0.8 to 4.0. Strict limits are placed on contamination, particles, and defects in each substrate. | 02-04-2016 |