Class / Patent application number | Description | Number of patent applications / Date published |
029884000 | Forming array of contacts or terminals | 12 |
20080222888 | BALL ATTACHING APPARATUS FOR CORRECTING WARPAGE OF SUBSTRATE AND METHOD OF ATTACHING SOLDER BALLS USING THE SAME - A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum. | 09-18-2008 |
20080229577 | Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures - Embodiments of a process comprising forming one or more micro-electro-mechanical (MEMS) probe on a conductive metal oxide semiconductor (CMOS) wafer, wherein each MEMS probe comprises a cantilever beam with a fixed end and a free end and wherein the CMOS wafer has circuitry thereon; forming an unsharpened tip at or near the free end of each cantilever beam; depositing a silicide-forming material over the tip; annealing the wafer to sharpen the tip; and exposing the sharpened tip. Embodiments of an apparatus comprising a conductive metal oxide semiconductor (CMOS) wafer including circuitry therein; one or more micro-electro-mechanical (MEMS) probes integrally formed on the CMOS wafer, wherein each MEMS probe comprises a cantilever beam with a fixed end and a free end and a sharpened tip at or near the free end, the sharpened tip formed by a process comprising forming an unsharpened tip at or near the free end of each cantilever beam, depositing a silicide-forming material over the unsharpened tip, annealing the wafer to sharpen the unsharpened tip, and exposing the sharpened tip. | 09-25-2008 |
20090025218 | METHOD OF MANUFACTURING ELECTRICAL CONNECTOR - The invention provides a method of manufacturing an electronic connector including the steps of: (a) providing an insulating body made of a fiberboard having a thermal deformation degree which is close to the printed circuit board, and a plurality of terminal receiving apertures penetrating a top surface and a under surface of the insulating body being deposed on the insulating body; (b) forming a plurality of conducting terminals respectively comprising a soldering portion soldering to the printed circuit board and a contacting arm electrically contacting with an electronic device; and (c) setting the conducting terminals into the insulating body. In the method of manufacturing an electronic connector according to the invention, because the thermal deformation degrees of the materials used in the insulating body and the printed circuit board are substantially same, a false soldering phenomenon between the conducting terminals located at four comers of the insulating body and the printed circuit board can be prevented. | 01-29-2009 |
20090119916 | LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES - A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. | 05-14-2009 |
20090144976 | Method for Manufacturing Combined Terminals - A combined terminal is made by combination of first and second terminals. The first terminal has a first plate portion. The second terminal has a second plate portion and a window portion formed in the second plate portion. The first and second terminals are combined so that the first and second plate portions are superposed while the first terminal remains to be linked to a frame by a link portion therebetween. The combined first and second terminals are removed from the frame by cutting the link portion through the window portion. | 06-11-2009 |
20090158586 | METHOD AND APPARATUS FOR ADJUSTING A MULTI-SUBSTRATE PROBE STRUCTURE - A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested. | 06-25-2009 |
20090320282 | LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-TORUS AND OTHER MULTIPLE POINTS OF CONTACT GEOMETRIES - A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. | 12-31-2009 |
20100122458 | PRINTED WIRING BOARD CONNECTOR PIN HAVING AN ACIRCULAR PROFILE - One aspect of this disclosure provides an electrical connector pin for a printed wiring board. This embodiment includes an unmachined, collar having an acircular configuration and including a side wall. This embodiment further includes a machined first cylindrical connector shaft integrally formed with the collar and extending from collar along the longitudinal axis, and a machined second cylindrical connector shaft integrally formed with the collar and extending from the collar and along the longitudinal axis in a direction opposite to that of the first cylindrical connector shaft. | 05-20-2010 |
20100170091 | Jack assembly - The present disclosure relates to a jack assembly including a jack mount having a front side and a rear side. A jack of the assembly is adapted to be slidably mounted in a jack receiving region of the jack mount. The jack assembly also includes a plurality of cross-connect contacts, and a rear interface assembly. The rear interface assembly includes a dielectric cover piece and a plurality of rear connectors that project outward from the dielectric cover piece. | 07-08-2010 |
20140007427 | METHOD AND DEVICE FOR PRODUCING A PLUG - The invention relates to a method for fabricating a plug ( | 01-09-2014 |
20140245606 | USB3.0 CONNECTOR AND METHOD OF MAKING THE SAME - A USB3.0 connector includes an insulative body, a plurality of first and second terminals, and an outer shell covering the insulative body. The insulative body includes a base that has a base upper wall, a base lower wall, and two base sidewalls. The base lower wall has a rear end notched in a frontward direction to form a plurality of alternating shallow and deep notches to position first and second legs of the first and second terminals, which are bent downwardly. The alternating shallow and deep notches space the first legs apart from the second legs, respectively. The number of component parts for assembly is therefore reduced. | 09-04-2014 |
20140345134 | METHOD OF MANUFACTURING AN INSERTION-TYPE CONNECTOR - A method of manufacturing an insertion-type connector having at least two mutually electrically insulated conductor contacts with the conductor contacts cut from a metal sheet in such a way that they are connected together via a connecting part of the metal sheet, the conductor contacts being partly embedded in an electrically insulating material to form an electrically insulating housing which fixes the conductor contacts relative to one another, and the connecting part then separated off. | 11-27-2014 |