WALSIN LIHWA CORPORATION Patent applications |
Patent application number | Title | Published |
20150308649 | LIGHT SOURCE MODULE AND ILLUMINATION DEVICE USING THE SAME - An illumination device comprising a reflector and a light source module is provided. The light source module comprises a column, a first light-emitting diode (LED) light source, and a second LED light source. The column has a front end and a side. The first LED light source fixed to the front end of the column is configured to emit a first light beam for forming a first illumination area on a projection plane. The second LED light source fixed to the side of the column is configured to emit a second light beam for forming a second illumination area partly overlapping the first illumination area on the projection plane. | 10-29-2015 |
20150308646 | LIGHT-EMITTING DIODE ARRAY AND LIGHT SOURCE MODULE USING THE SAME - A light source module comprising a substrate and a light-emitting diode (LED) array is provided. The LED array comprises a first LED sub-array, a second LED sub-array, and a third LED sub-array disposed on the substrate along a horizontal axis. The first LED sub-array is configured to emit a first light beam. The second LED sub-array is configured to emit a second light beam. The third LED sub-array disposed between the first and second LED sub-arrays is configured to emit a third light beam. The first, second, and third light beams jointly forms a light area. Luminance of the third light beam is less than luminance of the first light beam or luminance of the second light beam. | 10-29-2015 |
20140103382 | HIGH EFFICIENCY LIGHT EMITTING DIODE DEVICE - A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material. | 04-17-2014 |
20140063836 | Laser Lighting Device - A laser lighting device, including a laser light source and a light pipe, is disclosed. The laser light source can produce a laser beam with a diffusion angle not larger than 30 degrees. The light pipe is disposed in a light path of the laser beam, and has a light incident surface, a light exiting surface and several cut planes. The light incident surface is opposite to the laser light source, and the cut planes are located between the light incident and light exiting surfaces. Each of the cut planes is normal to the longitudinal direction of the light pipe, and has an area smaller than that of the light exiting surface but larger than that of the light incident surface. The areas of the cut planes increase sequentially along the longitudinal direction. The laser beam will be effectively collimated by the light pipe after passing through the light pipe. | 03-06-2014 |
20140017831 | METHOD FOR ENHANCING ELECTRICAL INJECTION EFFICIENCY AND LIGHT EXTRACTION EFFICIENCY OF LIGHT-EMITTING DEVICES - A method for enhancing electrical injection efficiency and light extraction efficiency of a light-emitting device is disclosed. The method includes the steps of: providing a site layer on the light-emitting device; placing a protection layer on the site layer; forming a cavity through the protection layer and the site layer; and growing a window layer in the cavity. The shape of the window layer can be well controlled by adjusting reactive temperature, reactive time, and N | 01-16-2014 |
20130320387 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) and a manufacturing method thereof are provided. The LED comprises a semiconductor composite layer and an electrode. The semiconductor composite layer provides holes and electrons and allows the holes and the electrons to be combined to emit light. The electrode is formed on the semiconductor composite layer, wherein the electrode contains 30%˜98% of aluminum. | 12-05-2013 |
20130313965 | Light Emitting Diode Unit - A light emitting diode unit comprising a light emitting diode chip, a reflecting unit, and a light condenser is provided in this invention. The light emitting diode chip is disposed on a substrate for providing a plurality of first light beams. The reflecting unit is installed on the substrate, surrounding the light emitting diode chip for reflecting the first light beams emitted from the light emitting diode chip, and sufficiently directing the first light beams upward. The light condenser is provided above the light emitting diode chip, having a light-incident pattern and a light-emitting flat plane, wherein the light-incident pattern faces to the light emitting diode chip for sufficiently receiving and guiding the first light beams upward via the light-emitting flat plane. | 11-28-2013 |
20130242569 | Substrate for Carrying Light Emitting Diodes and Manufacturing Method Thereof - A substrate for carrying light emitting diodes and a manufacturing method thereof are provided. The substrate includes a bottom portion, a side portion and a reflective element. The side portion is disposed on the bottom portion. An upper surface of the bottom portion and an inner surface of the side portion define a recess where the light emitting diodes and the reflective element are disposed. More specifically, the light emitting diodes are disposed on the upper surface, while the reflective element is disposed along the inner surface of the recess. With the above-mentioned arrangements, the light extraction efficiency of the light emitting diodes can be increased. | 09-19-2013 |
20130233710 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGING LENS AND LIGHT EMMITING DIODE PACKAGE - A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source. | 09-12-2013 |
20130214297 | HIGH VOLTAGE LIGHT EMITTING DIODE CHIP AND ITS MANUFACTURING METHOD - A high voltage light emitting diode chip and its manufacturing method are provided. The high voltage light emitting diode chip can be manufactured by forming a plurality of light emitting diode units on a substrate and electrically connecting the light emitting diode units, wherein a trench with a width of about 0.5 μm to about 7 μm is present between every two adjacent light emitting diode units to isolate the light emitting diode units. The procedure for manufacturing the high voltage light emitting diode chip is simple and the high voltage light emitting diode chip that is produced can exhibit satisfying luminous efficiency. | 08-22-2013 |
20130169164 | DEVICE AND METHOD FOR PROTECTING EYES - A device and method, which are utilized in an optical apparatus, for protecting eyes are disclosed. The optical apparatus includes a scanning-mirror component and a visible light source which is optically coupled to the scanning-mirror component. The optical apparatus emits a visible light beam to the scanning-mirror component by using the visible light source. The scanning-mirror component then reflects the visible light beam to emit the visible light beam to a scanning region. The device and the method for protecting eyes can determine at least one eye region in the scanning region, and then make the optical apparatus stop emitting the visible light beam at least within the eye region. | 07-04-2013 |
20130122610 | Apparatus and Method for Die Bonding - A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate. | 05-16-2013 |
20130105852 | PACKAGE STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | 05-02-2013 |
20130100098 | Micro-Projector, Control Signal for a Micro-Projector and Method for Generating the Same - A micro-projector, a control signal for a micro-projector and a method for generating the same are disclosed. The micro-projector includes a scanning module and a control module. The scanning module includes a micro reflection mirror and at least one scan axis connected to the micro reflection mirror. The control module connected to the scanning module outputs at least one scan axis control signal to the scanning module. The scan axis control signal is a periodic signal and has a waveform which includes a substantially linear portion and a non-linear portion. The proportion of the substantially linear portion to the waveform is larger than that of the non-linear portion to the waveform. In this manner, the unwanted vibration occurring in the micro reflection mirror of the micro-projector can be prevented. | 04-25-2013 |
20130027975 | LIGHT GUIDE PLATE WITH ADJUSTABLE ILLUMINATION ANGLE, ILLUMINATION DEVICE WITH ADJUSTABLE ILLUMINATION ANGLE, AND METHOD FOR ADJUSTING ILLUMINATION ANGLE THEREOF - A light guide plate with an adjustable illumination angle and an illumination device using the same are provided. The light guide plate has a first surface and a second surface opposite to the first surface. The second surface further has a plurality of deformable microstructures thereon. The deformable microstructures will be deformed when an external force is applied to the deformable microstructures. The illumination device has a light source and a light guide plate that is disposed next to the light source. A light beam emitted from the light source enters into the light guide plate and leaves the light guide plate via reflecting or refracting by the deformable microstructures. By applying a different external force to the light guide plate, the deformation of the deformable microstructures will be varied. Therefore, the illumination angle of the light beam could be changed according to the deformation of the deformable microstructures. | 01-31-2013 |
20130026911 | LIGHT EMITTING DIODE DEVICE - A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material. | 01-31-2013 |
20130026524 | LIGHT EMITTING DIODE - A light emitting diode (LED) is provided. The LED comprises a semiconductor composite layer stacked laterally and a phosphor substrate. The phosphor substrate covers a lateral surface of the semiconductor composite layer. | 01-31-2013 |
20120327661 | ALIGNMENT STRUCTURE, LASER LIGHTING SOURCE MODULE AND OPTICAL ALIGNMENT METHOD - An alignment structure, a laser lighting source module and an optical alignment method are provided. The laser lighting source module includes a substrate and a laser carrier. The substrate includes a first body and a first surface structure. The first surface structure is disposed on a surface of the first body. The laser carrier is used for carrying a laser emitter which includes a second body and a second surface structure. The second surface structure is disposed on a surface of the second body. At least a portion of the second surface structure is correspondingly engaged with at least a portion of the first surface structure so that the laser carrier may be aligned on the substrate. | 12-27-2012 |
20120318851 | CHIP BONDING PROCESS - A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip and/or the carrier, and a positive pressure is applied onto the at least one chip. | 12-20-2012 |
20120318850 | CHIP BONDING APPARATUS - A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier. | 12-20-2012 |
20120241719 | Light Emitting Diode and Method for Manufacturing the Same - A light emitting diode (LED) is provided. The LED includes a carrying substrate, a semiconductor composite layer and an electrode. The semiconductor composite layer is disposed on the carrying substrate, and an upper surface of the semiconductor composite layer includes a patterned surface and a flat surface. The electrode is disposed on the flat surface. A method for manufacturing the light emitting diode is provided as well. | 09-27-2012 |
20120241718 | HIGH PERFORMANCE LIGHT EMITTING DIODE - A vertical light emitting diodes (LEDs) with new construction for reducing the current crowding effect and increasing the light extraction efficiency (LEE) of the LEDs is provided. By providing at least one current blocking portion corresponded to an electrode, the current flows from the electrode may be diffused or distributed more laterally instead of straight downward directly under the electrode and the current crowding effect could be reduced thereby. By providing at least one current blocking portion covered by a mirror layer to form an omni-directional reflective (ODR) structure, the internal light of the LEDs may be reflected by the ODR structure and the LEE could be increased thereby. | 09-27-2012 |
20120161175 | VERTICAL STRUCTURE LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - A vertical structure light emitting diode (LED) and a method of manufacturing the same are disclosed. The vertical structure LED includes a metal layer as an electrode; a number of luminescent layers formed on the metal layer for providing light beams; a spreading layer formed on the luminescent layers; a medium layer provided on the spreading layer, having an opening formed therethrough to expose the spreading layer and a roughed surface. The spreading layer facilitates diffusion of current produced by the electrode. | 06-28-2012 |
20120129283 | LIGHT EMITTING DEVICE AND METHOD FOR ENHANCING LIGHT EXTRACTION THEREOF - A method for enhancing light extraction of a light emitting device is disclosed. The method includes the steps of: providing a site layer on the light emitting device; placing a protection layer on the site layer; forming an array of pores through the protection layer and the site layer; and growing on the site layer an oxide layer, having a plurality of rods, each of which is formed in one of the pores. The shapes of the rods can be well controlled by adjusting reactive temperature, time and N | 05-24-2012 |
20120111096 | INTEGRATION MANUFACTURING PROCESS FOR MEMS DEVICE - A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures. | 05-10-2012 |
20120012856 | GaN Light Emitting Diode and Method for Increasing Light Extraction on GaN Light Emitting Diode Via Sapphire Shaping - A method for enhancing light extraction efficiency of GaN light emitting diodes is disclosed. By cutting off a portion from each end of bottom of a sapphire substrate or forming depressions on the bottom of the substrate and forming a reflector, light beams emitted to side walls of the substrate can be guided to the light emitting diodes. | 01-19-2012 |
20110312112 | LIGHT EMITTING DIODE - A light emitting diode having a substrate, an electron injection layer, an active layer, a hole injection layer, a first pad electrically connected to the hole injection layer, and a second pad electrically connected to the electron injection layer. The hole injection layer includes an activated region and a patterned non-activated region. The first pad is disposed upon the non-activated region and the first pad and the non-activated region are overlapping in the vertical direction. | 12-22-2011 |
20110284892 | LIGHT EMITTING DIODE APPARATUS AND METHOD FOR ENHANCING LUMINOUS EFFICIENCY THEREOF - A light emitting diode apparatus with enhanced luminous efficiency is disclosed in the present invention. The light emitting diode apparatus includes a light emitting diode chip for providing a first light beam; a substrate, having a cross-section of a trapezoid, for supporting the light emitting diode chip, which is transparent to the first light beam; and an encapsulating body, containing a phosphor and encapsulating the light emitting diode chip and the substrate, for fixing the light emitting diode chip and the substrate and providing a second light beam when the phosphor is excited by the first light beam. Due to the shape of the substrate, contact area of the substrate with the phosphor is enlarged. Luminous efficiency is enhanced as well. | 11-24-2011 |
20110222024 | ILLUMINATION SYSTEM FOR PROJECTION DISPLAY - An illumination system for a projection display is disclosed in the present invention. The illumination system has three light sources for providing three primary color rays, two collimators for collimating the rays into light beams, and two beam splitters for reflecting and passing the light beams to make white light available. It can also include three light sources, one collimator and three individual beam splitters. The illumination system has a compact size and low manufacturing cost. Its lighting efficiency is better than that of a conventional illumination system. Hence, it is suitable for small size projectors. | 09-15-2011 |
20110221663 | EDGE TYPE BACKLIGHTING MODULE - An edge type backlighting module is disclosed in the present invention. The edge type backlighting module includes at least one light source array for providing light beams; at least one reflecting mirror, rotating within a specified angle, for reflecting the light beams; and a light adjusting medium for adjusting outgoing directions of the reflected light beams. It further has at least one infrared sensor for detecting light beams reflected from a surface of the light adjusting medium when a user touches the surface and generating a signal representing a touch location. | 09-15-2011 |
20110198619 | LIGHT EMITTING DIODE ASSEMBLY HAVING IMPROVED LIGHTING EFFICIENCY - A light emitting diode assembly is disclosed in the present invention. The light emitting diode assembly has a substrate and several light emitting diode units. It can also include several light emitting diode units fabricated on cavities formed in the substrate. Any light emitting diode unit is composed of a light emitting diode chip covered with a phosphor layer for providing light beams, and a reflecting unit installed or formed on the substrate, coated with a reflective film, surrounding the light emitting diode chip for reflecting the light beams emitted from the light emitting diode chip, and directing the light beams upward. The light emitting diode unit further includes a light condenser provided above the light emitting diode chip for guiding the light beams upward. The assembly can collect all light beams emitted laterally. Hence, lighting efficiency for the light emitting diode assembly can be improved. | 08-18-2011 |
20110164223 | MICROMINIATURIZED PROJECTION MODULE FOR PROJECTING IMAGE ONTO OBJECT - A microminiaturized projection module for projecting an image onto an object is disclosed in the present invention. The module includes a number of light units each for providing red, green, and blue beams; an image processing unit for receiving the image, dividing the image into n×m image signals, and transforming each of the image signals into a modulating signal and a direction signal, where n and in are integrals not less than 2, respectively; a number of modulation units for modulating the beams from one light unit according to the modulating signal received from the image processing unit and sending out the modulated beams simultaneously; and an array of n×m mirrors for projecting the modulated beams to form the image onto the object according to the direction signal received from the image processing unit. The invention has advantages that can reduce modulation speed, undergo slight shock and be free from raster pinch effect. | 07-07-2011 |
20110163679 | AC LIGHT EMITTING DIODE DEVICE HAVING INTEGRATED PASSIVE DEVICE - A light emitting diode device is disclosed in the present invention. The device includes a substrate, an integrated passive device, at least four rectifying diodes and several light emitting diodes. The rectifying diodes form a bridge rectifier to rectify an external alternating current (AC) inputted into a direct current so that the light emitting diodes can lighten. Furthermore, the light emitting diode device has a Zener diode, formed on the substrate and connected with the integrated passive device for regulating the direct current. It can also have a varistor, connected with the Zener diode in parallel, for protecting the light emitting diode device from surges. | 07-07-2011 |
20110143466 | METHOD OF FORMING VERTICAL STRUCTURE LIGHT EMITTING DIODE WITH HEAT EXHAUSTION STRUCTURE - The present invention is to provide a method of forming a vertical structure light emitting diode with a heat exhaustion structure. The method includes steps of: a) providing a sapphire substrate; b) depositing a number of protrusions on the sapphire substrate, each of which has a height of p; c) forming a buffer layer having a number of recesses, each of which has a depth of q smaller than p so that when the protrusions are accommodated within the recesses of the buffer layer, a number of gaps are formed therebetween for heat exhaustion; d) growing a number of luminescent layers on the buffer layer, having a medium layer formed between the luminescent layers and the buffer layer; e) etching through the luminescent layers and the buffer layer to form a duct for heat exhaustion; f) removing the sapphire substrate and the protrusions by excimer laser lift-off (LLO); g) roughening the medium layer; and h) depositing electrodes on the roughened medium layer. | 06-16-2011 |
20110127551 | Method for enhancing electrical injection efficiency and light extraction efficiency of light-emitting devices - A method for enhancing electrical injection efficiency and light extraction efficiency of a light-emitting device is disclosed. The method includes the steps of: providing a site layer on the light-emitting device; placing a protection layer on the site layer; forming a cavity through the protection layer and the site layer; and growing a window layer in the cavity. The shape of the window layer can be well controlled by adjusting reactive temperature, reactive time, and N | 06-02-2011 |
20110095314 | Light emitting device and method for enhancing light extraction thereof - A method for enhancing light extraction of a light emitting device is disclosed. The method includes the steps of: providing a site layer on the light emitting device; placing a protection layer on the site layer; forming an array of pores through the protection layer and the site layer; and growing on the site layer an oxide layer, having a plurality of rods, each of which is formed in one of the pores. The shapes of the rods can be well controlled by adjusting reactive temperature, time and N | 04-28-2011 |
20110089398 | Method for improving internal quantum efficiency of Group-III nitride-based light emitting device - A method for improving internal quantum efficiency of a group-III nitride-based light emitting device is disclosed. The method includes the steps of: providing a group-III nitride-based substrate having a single crystalline structure; forming on the group-III nitride-based substrate an oxide layer, having a plurality of particles, without absorption of visible light, size, shape, and density of the particles are controlled by reaction concentration ratio of nitrogen/hydrogen, reaction time and reaction temperature; and growing a group-III nitride-based layer over the oxide layer; wherein the oxide layer prevents threading dislocation of the group-III nitride-based substrate from propagating into the group-III nitride-based layer, thereby improving internal quantum efficiency of the group-III nitride-based light emitting device. | 04-21-2011 |
20110080108 | Color tunable light emitting diode - A color tunable light emitting diode is disclosed in the present invention. At least two light emitting chip groups each has a number of light emitting chips mixed with at least one phosphor to produce light with a specific correlated color temperature. By supplying tunable currents to the light emitting chip groups, properly arranging the light emitting chips and providing a suitable substrate, the color tunable light emitting diode can be achieved. The present invention provides a simple and workable method to manufacture tunable light emitting diodes which fulfill the requirement of compact design of modern electronic products. | 04-07-2011 |
20110068356 | Method of manufacturing light emitting diode packaging lens and light emmiting diode package - A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source. | 03-24-2011 |
20100308323 | Method for improving light extraction efficiency of group-III nitride-based light emitting device - A method for improving light extraction efficiency of a group-III nitride-based light emitting device is disclosed. The method includes the steps of: providing a group-III nitride-based light emitting device having a top surface; disposing a seed layer on the top surface for increasing adhesion of the group-III nitride-based light emitting device; and forming a patterned oxide layer, having a plurality of nanostructure particles, without absorption of visible light on the seed layer. The size and shape of the nanostructure particles are controlled by reaction concentration, time and temperature during the patterned oxide layer formation, thereby improving light extraction efficiency of the group-III nitride-based light emitting device without damaging the group-III nitride-based light emitting device. | 12-09-2010 |