20100052161 | Semiconductor wafer with adhesive protection layer - A semiconductor wafer with an adhesive protection layer includes: a wafer body having a first surface and an opposing second surface; a plurality of electrical connection pads formed on the second surface of the wafer body; and the adhesive protection layer formed on the second surface of the wafer body and the plurality of electrical connection pads, wherein the protection layer is made of a material including a photosensitive adhesive, a thermal-setting adhesive and a dielectric material. The protection layer not only isolates circuits on the wafer surface from external moisture and contaminant, but also can be patterned and is adhesive, such that the wafer can be mounted to a circuit substrate in a subsequent process by the protection layer, without having to apply an additional adhesive on the wafer, thereby greatly simplifying the wafer-substrate attachment procedure during package fabrication processes. | 03-04-2010 |