UNIVERSAL INSTRUMENTS CORPORATION Patent applications |
Patent application number | Title | Published |
20130269184 | PICK AND PLACE NOZZLE - A vacuum nozzle for a pick and place machine that includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of wood. The tip may also be made of a material that is at least one of polar and porous. Further, a method of picking up and placing a light emitting diode includes providing a pick and place machine having a vacuum nozzle, wherein the vacuum nozzle includes a tip having a portion that is configured to interface with a component, wherein at least the portion of the tip is made of a material that is at least one of polar and porous. The method includes picking up the light emitting diode and placing the light emitting diode on an electronic assembly. | 10-17-2013 |
20120218402 | COMPONENT PLACEMENT PROCESS AND APPARATUS - A pick and place machine is described which uses an imprint left in a layer of fluid by a component that has been dipped in the fluid to guide a placement process. An apparatus for placing a component is disclosed, which includes a surface that receives a layer of fluid, an imprint of a component in the layer of fluid, and a camera that captures an image of the imprint in the fluid. A method of placing a component with a pick and place machine is disclosed which includes dipping a component in a layer of fluid, capturing an image of the layer of fluid, analyzing the image of the layer of fluid, and placing the component based on results of the analysis of the image of the layer of fluid. The image can be used to determine the status of the component or where to place the component. | 08-30-2012 |
20120152358 | METHOD AND APPARATUS FOR APPLYING FLUID DURING A PLACEMENT CYCLE - A component placement machine that includes a movable housing that is adapted for movement in an X and a Y axis above a printed circuit board. The housing includes a rotatable frame having at least one pick and place head configured to pick up a component and place the component on the printed circuit board. The housing further includes a fluid application station configured to apply fluid to the component after being picked up by the pick and place head and before being placed on the printed circuit board. | 06-21-2012 |
20100199791 | TETRAHEDRON RACK AND PINION DRIVE - A spindle assembly drive system that includes a rack unit, a drive gear, a motor, and a plurality of bearings, such that said rack unit laterally moves in a first axis with little or no movement in or rotation about any other axis. | 08-12-2010 |
20090214323 | SUBSTRATE CARRIER SYSTEM - A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems. | 08-27-2009 |
20090146355 | FLEXIBLE SUBSTRATE TENSIONER - Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus. | 06-11-2009 |