TAZMO CO., LTD.
|TAZMO CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20150321347||LINK-TYPE TRANSFER ROBOT - The present invention provides a transfer robot which has a simple structure and a small occupied area in an operation.||11-12-2015|
|20150298162||COATING APPARATUS AND COATING METHOD - This coating device according to the present invention comprises a slit nozzle (||10-22-2015|
|20140348622||WAFER TRANSPORT APPARATUS - An object is to make it possible to adequately reduce the wafer transport time and to contribute to size-reduction of the semiconductor processing system.||11-27-2014|
|20140321957||WAFER TRANSPORT ROBOT - An object is to transmit an operation of a first parallel link to a second parallel link through a plurality of rotatably supported arms, to prevent the second parallel link from meandering or rolling so that a wafer can be transported smoothly.||10-30-2014|
|20140186537||METHOD FOR CONTROLLING A FLOW RATE OF A PUMP AND METHOD FOR FORMING A COATED FILM - A method for controlling a flow rate of a pump (||07-03-2014|
|20140138590||PHOSPHOR FOR DISPERSION-TYPE EL, DISPERSION-TYPE EL DEVICE, AND METHOD OF MANUFACTURING THE SAME - Provided is a phosphor for a dispersion-type EL that may be manufactured in a simple process and may provide stable, high brightness and light emission efficiency. The phosphor for a dispersion-type EL according to the present invention includes a mixture of an electron-accepting phosphor particle (||05-22-2014|
|20140056679||WAFER EXCHANGE APPARATUS AND WAFER SUPPORTING HAND - A wafer exchange apparatus is provided that is compact with excellent accessibility. The wafer exchange apparatus of the present invention includes a first and a second hands (||02-27-2014|
|20140042124||FILM REMOVING METHOD, NOZZLE FOR REMOVING FILM, AND FILM REMOVING DEVICE - A film in a dry state is efficiently dissolved and removed. A film removing method includes steps of moving a nozzle head (||02-13-2014|
|20130252432||PATTERNING METHOD - Provided is a patterning method that can greatly reduce process costs and environmental load. The patterning method includes: a film forming step of forming a functional film (||09-26-2013|
|20120288635||SUBSTRATE COATING DEVICE AND SUBSTRATE COATING METHOD - A substrate coating device (||11-15-2012|
|20120085282||SUBSTRATE COATING DEVICE - A substrate coating device is provided which is capable of reducing non-uniform film thickness areas that take place in a coating start portion and a coating end portion during coating using a slit nozzle coater.||04-12-2012|
|20120000420||SUBSTRATE COATING DEVICE - The substrate coating device (||01-05-2012|
Patent applications by TAZMO CO., LTD.