TAYO YUDEN CO., LTD.
TAYO YUDEN CO., LTD. Patent applications | ||
Patent application number | Title | Published |
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20140210569 | MODULE SUBSTRATE AND MODULE - A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8. | 07-31-2014 |