Tatsuta Electric Wire & Cable Co., Ltd.
|Tatsuta Electric Wire & Cable Co., Ltd. Patent applications|
|Patent application number||Title||Published|
|20160007444||REINFORCING MEMBER FOR FLEXIBLE PRINTED WIRING SUBSTRATE, FLEXIBLE PRINTED WIRING SUBSTRATE, AND SHIELD PRINTED WIRING SUBSTRATE - A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.||01-07-2016|
|20150352278||Infusion Speed Measurement Instrument - An infusion speed measurement instrument||12-10-2015|
|20150250080||SHIELD FILM AND SHIELD PRINTED WIRING BOARD - Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (||09-03-2015|
|20140138126||METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY - In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.||05-22-2014|
|20120128296||THREE-WAVELENGTH OPTICAL MULTIPLEXER - Disclosed is a three-wavelength optical multiplexer which is compact, and which multiplexes light having different wavelength incident to three single-mode optical fibers, particularly light of red, green, and blue at transmittance above a certain reference. Specifically disclosed is a three-wavelength optical multiplexer (||05-24-2012|
|20100238539||OPTICAL SIGNAL AMPLIFYING APPARATUS - An optical signal amplifying apparatus feeding back surrounding light to perform negative feedback optical amplification of a semiconductor optical amplifier is provided that enables a coupling structure to be simplified and miniaturized between the semiconductor optical amplifier and an optical fiber transmitting the output light from the semiconductor optical amplifier by using a fiber grating device. Since a first optical fiber grating device FGD||09-23-2010|
Patent applications by Tatsuta Electric Wire & Cable Co., Ltd.