TAIWAN UNION TECHNOLOGY CORPORATION Patent applications |
Patent application number | Title | Published |
20140255711 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises:
| 09-11-2014 |
20140161982 | EPOXY RESIN BLEND - An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent. | 06-12-2014 |
20140072807 | RESIN COMPOSITIONS AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a first filler containing calcium carbonate and hydrated magnesium silicate and a hardener, wherein the first filler has a diameter ranging from about 0.1 μm to about 100 μm; and the amount of the first filler is about 1 part by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin. | 03-13-2014 |
20140044973 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 μm to about 50 μm, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin. | 02-13-2014 |
20140039094 | EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator. | 02-06-2014 |
20130306357 | EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USNG THE SAME - Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler. | 11-21-2013 |
20130252003 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises:
| 09-26-2013 |
20130122308 | RESIN COMPOSITION AND USES OF THE SAME - A resin composition is provided. The resin composition comprises:
| 05-16-2013 |
20130101862 | STABLE SOLUTION OF RING-OPENED POLYMER AND THE USE THEREOF - A stable solution of a ring-opened polymer is provided. The stable solution can be prepared using the following steps:
| 04-25-2013 |
20130011682 | RESIN COMPOSITION, AND PREPEG AND LAMINATE PREPARED USING THE SAME - A resin composition is provided. The resin composition comprises:
| 01-10-2013 |
20120329912 | FUSED FILLER AND ITS MANUFACTURING METHOD AND USE - A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO | 12-27-2012 |
20120097437 | Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same - A resin composition is provided. The resin composition comprises:
| 04-26-2012 |
20120059096 | Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use - A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: | 03-08-2012 |
20120055704 | EPOXY RESIN BLEND - Embodiments of the present disclosure set forth a sintered talc powder. The sintered talc powder comprising a first X-ray diffraction peak from about 29° to about 30° and having a first intensity and a second X-ray diffraction peak from about 25° to about 27° and having a second intensity, wherein the first intensity is greater than the second intensity. | 03-08-2012 |