TAIFLEX SCIENTIFIC CO., LTD.
|TAIFLEX SCIENTIFIC CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20150257296||COVER LAYER WITH HIGH THERMAL RESISTANCE AND HIGH REFLECTIVITY FOR A PRINTED CIRCUIT BOARD - A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.||09-10-2015|
Patent applications by TAIFLEX SCIENTIFIC CO., LTD.