SUPER FLOWER COMPUTER INC.
SUPER FLOWER COMPUTER INC. Patent applications | ||
Patent application number | Title | Published |
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20120300400 | HEAT DISSIPATION ARRANGEMENT FOR POWER SUPPLY OF COMPUTER - The power supply includes a seat, a circuit module, a fan unit and a cover. The seat has a front panel and a rear panel with through holes. The circuit module is placed on a bottom of the seat. The fan unit is arranged in the seat, is electrically connected to the circuit module, and has a vent corresponding to the through holes in position. The cover fastened to the seat. | 11-29-2012 |