STRASBAUGH Patent applications |
Patent application number | Title | Published |
20150118826 | METHOD OF GRINDING WAFER STACKS TO PROVIDE UNIFORM RESIDUAL SILICON THICKNESS - A method of processing a device wafer in a wafer stack by chucking the wafer stack device side down and grinding the exposed side of the carrier wafer to parallel with the device wafer, and thereafter flipping the wafer stack and chucking the wafer stack carrier side down and grinding residual silicon from the device wafer. | 04-30-2015 |
20140287657 | CMP RETAINING RING WITH SOFT RETAINING RING INSERT - A method of polishing a wafer with a wafer carrier adapted to further reduce the edge effect and allow a wafer to be uniformly polished across its entire surface, with a retaining ring made from very hard materials such as PEEK, PET or polycarbonate with a hardness in the range of 80 to 85 Shore D, while the inner surface or insert is made of polyurethane or other material with a hardness in the range of 85 to 95 Shore A. | 09-25-2014 |
20140134927 | METHODS AND SYSTEMS FOR USE IN GRIND SPINDLE ALIGNMENT - A grinding engine includes a work spindle; a work chuck cooperated with the work spindle; a grind spindle; a grind wheel cooperated with the grind spindle; and a plurality of alignment adjustment systems positioned relative to and around the grind spindle, wherein adjustment from any one of the alignment adjustment systems is configured to cause a change in alignment between the work spindle and the grind spindle. | 05-15-2014 |
20140134923 | METHODS AND SYSTEMS FOR USE IN GRIND SHAPE CONTROL ADAPTATION - A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module. | 05-15-2014 |
20130130593 | SYSTEMS AND METHODS OF PROCESSING SUBSTRATES - Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold. | 05-23-2013 |
20130114090 | System and Method for In Situ Monitoring of Top Wafer Thickness in a Stack of Wafers - A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding. | 05-09-2013 |
20130102227 | SYSTEMS AND METHODS OF WAFER GRINDING - Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle. | 04-25-2013 |
20130078812 | Wafer Carrier with Flexible Pressure Plate - A wafer carrier with a wafer mounting plate disposed under a plenum which can be pressurized and depressurized to alter the shape of the wafer mounting plate and a plenum, formed with the wafer mounting plate and the wafer itself, to which vacuum can be applied to hold the wafer to the wafer mounting plate during polishing | 03-28-2013 |