SOPHION BIOSCIENCE A/S Patent applications |
Patent application number | Title | Published |
20140353171 | Improved Patch Area Cell Adhesion - The invention provides a chip for use in a microfluidic analysis system, for example a patch-clamp system, said chip having improved cell adhesion through a predetermined pattern of hydrophobic and hydrophilic regions. A method for manufacture of the chips, and a method for improving the adhesion of a cell to a chip are also disclosed. | 12-04-2014 |
20130334062 | HANDHELD DEVICE FOR ELECTROPHYSIOLOGICAL ANALYSIS - A handheld device for analysis of electro-physiological properties of a cellular membrane ion channel in an ion channel containing lipid cellular membrane comprises a handheld body with a pump and an electronic controller, and a disposable pipette tip comprising a pathway for fluid, said pathway connecting an open end of the pipette tip to an analysis substrate comprised in the pipette tip. The substrate is adapted to transmit an electrical current through the ion channel in said ion channel-containing lipid cellular membrane, when said lipid cellular membrane is held at a predetermined site of the substrate, e.g. for patch clamp analysis. The handheld body and the disposable pipette tip are configured to releasably attach the pipette tip to the body, to provide a hydraulic connection between the pump of the handheld body and said pathway, and to provide an electric connection between the electronic controller and at least one of said electrodes of the substrate. The electronic controller of the handheld body is configured to operate the assembled device for micfofluidic analysis of aspirated fluid. | 12-19-2013 |
20130136673 | CHIP ASSEMBLY FOR USE IN A MICROFLUIDIC ANALYSIS SYTEM - A chip assembly for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip having an outer wall, a carrier structure comprising an aperture for receiving the chip, the aperture defining an inner wall, wherein the chip is arranged in the aperture with a liquid tight seal between the outer wall of the chip and the inner wall of the aperture. The chip may be sealed and bonded to the carrier structure by means of a bonding material, such as an UV curing adhesive. A through hole in the chip is aligned with the aperture in the carrier structure. A method for manufacturing the chip assembly is further disclosed. | 05-30-2013 |