SOLID STATE SYSTEM CO., LTD. Patent applications |
Patent application number | Title | Published |
20150147841 | METHOD TO RELEASE DIAPHRAGM IN MEMS DEVICE - A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer. | 05-28-2015 |
20150118780 | MICROELECTROMECHANICAL SYSTEM (MEMS) MICROPHONE WITH PROTECTION FILM AND MEMS MICROPHONECHIPS AT WAFER LEVEL - A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow. | 04-30-2015 |
20140129764 | ALLOCATION STRUCTURE FOR FLASH MEMORY DEVICE - An allocation structure is used for a flash memory device. The flash memory device includes a first memory module and a second memory module. The first memory module and the second memory module respectively have a plurality of groups, and each of the groups of the first memory module has a plurality of physical blocks of the first memory module and each of the groups of the second memory module has a plurality of physical blocks of the second memory module. The allocation structure includes a first zone. The first zone is used to store a first allocation unit, and is formed by a first group of the groups of the first memory module and a first part of a second group of the groups of the second memory module. | 05-08-2014 |
20140077317 | MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND FABRICATION METHOD THEREOF - A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The structural dielectric layer has a space above the cavity of the silicon substrate and holds a plurality of structure elements within the space, including: a conductive backplate, over the silicon substrate, having a plurality of venting holes and a plurality of protrusion structures on top of the conductive backplate; and a diaphragm, located above the conductive backplate by a distance, wherein a chamber is formed between the diaphragm and the conductive backplate, and is connected to the cavity of the silicon substrate through the venting holes. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate and a second side of the diaphragm is exposed to an environment space. | 03-20-2014 |
20130056841 | MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE AND METHOD FOR FABRICATING THE SAME - A MEMS device includes a substrate. The substrate has a plurality of through holes in the substrate within a diaphragm region and optionally an indent space from the second surface at the diaphragm region. A first dielectric structural layer is then disposed over the substrate from the first surface, wherein the first dielectric structural layer has a plurality of openings corresponding to the through holes, wherein each of the through holes remains exposed by the first dielectric structural layer. A second dielectric structural layer with a chamber is disposed over the first dielectric structural layer, wherein the chamber exposes the openings of the first dielectric structural layer and the through holes of the substrate to connect to the indent space. A MEMS diaphragm is embedded in the second dielectric structural layer above the chamber, wherein an air gap is formed between the substrate and the MEMS diaphragm. | 03-07-2013 |
20120306557 | CALIBRATION CIRCUIT AND CALIBRATION METHOD - A calibration circuit and a calibration method are provided. The calibration circuit has a delay circuit, a phase detector, and a controller. The delay circuit delays an input signal to output an output signal, wherein a delay time between the input signal and the output signal is related to an equivalent capacitance and an equivalent resistance of the delay circuit. The phase detector coupled to the delay circuit compares the phases of the input signal and the output signal. The controller coupled to the delay circuit and the phase detector generates a control signal according to the comparison result of the phase detector to adjust the equivalent resistance of the delay circuit. | 12-06-2012 |
20120173791 | CONTROL METHOD AND ALLOCATION STRUCTURE FOR FLASH MEMORY DEVICE - A control method and an allocation structure for a flash memory device are provided herein. The flash memory device has a first memory module and a second memory module. Physical blocks of the first memory module and physical blocks of the second memory module are respectively divided into a plurality of groups, each of which has a plurality of the physical blocks. A first subunit and a second subunit of a first allocation unit are interleavingly written into a first group of the groups of the first memory module and a second group of the groups of the second memory chip respectively. Additionally, a first subunit and a second subunit of a second allocation unit are interleavingly written into a third group of the groups of the first memory module and the second group, respectively. | 07-05-2012 |
20120090398 | MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE - A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings. | 04-19-2012 |
20110302355 | MAPPING AND WRITTING METHOD IN MEMORY DEVICE WITH MULTIPLE MEMORY CHIPS - The invention is directed to a mapping method in a memory device with a plurality of memory chips in a sequence of 0 to K, K≧1. Each of the memory chips has a plurality of data blocks. The mapping method includes setting a block sequence number “(K+1)*n” to the (n+1) | 12-08-2011 |
20110300659 | METHOD FOR FABRICATING MEMS DEVICE - Method for fabricating MEMS device has a first surface and a second surface and having a MEMS region and an IC region. A MEMS structure is formed over the first surface. A structural dielectric layer is formed over the first surface. The structural dielectric layer has a dielectric member and the spaces surrounding the MEMS structure is filled with the dielectric member. The substrate is patterned by etching process from the second surface of the substrate to expose a portion of the dielectric member filled in the space surrounding the MEMS structure. A wettable thin layer is formed to cover an exposed portion of the substrate at the second surface. An etching process is performed on the dielectric member filled in the spaces surrounding the MEMS structure. The MEMS structure is exposed and released by the etching process. The etching process comprises an isotropic etching process with a wet etchant. | 12-08-2011 |
20110183456 | METHOD FOR FABRICATING MEMS DEVICE - A method for fabricating MEMS device includes: providing a single crystal substrate, having first surface and second surface and having a MEMS region and an IC region; forming SCS mass blocks on the first surface in the MEMS region; forming a structural dielectric layer over the first surface of the substrate, wherein a dielectric member of the structural dielectric layer is filled in spaces surrounding the SCS mass blocks in the MEMS region, the IC region has a circuit structure with an interconnection structure formed in the structural dielectric layer; patterning the single crystal substrate by an etching process on the second surface to expose a portion of the dielectric member filled in the spaces surrounding the SCS mass blocks; performing isotropic etching process at least on the dielectric portion filled in the spaces surrounding the SCS mass blocks. The SCS mass blocks are exposed to release a MEMS structure. | 07-28-2011 |
20110165717 | METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) PACKAGE - A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a MEMS sensing element and a first chamber over the MEMS sensing element. The MEMS units include electric connection pads. A plurality of covering units are formed correspondingly over the MEMS units. Each of the covering units provides a second chamber over the MEMS sensing element opposite to the first chamber. The covering units are adhered to the MEMS units by an adhesive material. The MEMS units are diced into singulated units. | 07-07-2011 |
20110156106 | HERMETIC MEMS DEVICE AND METHOD FOR FABRICATING HERMETIC MEMS DEVICE AND PACKAGE STRUCTURE OF MEMS DEVICE - A hermetic microelectromechanical system (MEMS) package includes a CMOS MEMS chip and a second substrate. The CMOS MEMS Chip has a first substrate, a structural dielectric layer, a CMOS circuit and a MEMS structure. The structural dielectric layer is disposed on a first side of the first structural substrate. The structural dielectric layer has an interconnect structure for electrical interconnection and also has a protection structure layer. The first structural substrate has at least a hole. The hole is under the protection structure layer to form at least a chamber. The chamber is exposed to the environment in the second side of the first structural substrate. The chamber also comprises a MEMS structure. The second substrate is adhered to a second side of the first substrate over the chamber to form a hermetic space and the MEMS structure is within the space. | 06-30-2011 |
20110104844 | METHOD FOR FABRICATING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE - A method for fabricating MEMS device includes providing a substrate having a first side and a second side. Then, a structural dielectric layer is formed over the substrate at the first side, wherein a structural conductive layer is embedded in the structural dielectric layer. A multi-stage patterning process is performed on the substrate from the second side, wherein a plurality of regions of the substrate with different levels is formed and a portion of the structural dielectric layer is exposed. An isotropic etching process is performed from the second side of the substrate or from the both side of the substrate to etch the structural dielectric layer, wherein a remaining portion of the structural dielectric layer comprises the structural conductive layer and a dielectric portion enclosed by the structural conductive layer. | 05-05-2011 |
20110082989 | STRUCTURE AND METHOD FOR MAKING A STORAGE CARD - A procedure for reproducing a storage card includes providing a preliminary storage card, wherein the preliminarily storage card has been partitioned into at least a first partitioned region and a second partitioned region and content has been written into the first partitioned region; providing a master storage card without being partitioned; copying the preliminary storage card with at least the first partitioned region and the second partitioned region into the master storage card based on the logic block addressing (LBA) mode, wherein the preliminary storage card is still not partitioned yet; and writing a signature into a DOS file system area of the first partitioned region at a specific signature area, wherein the signature includes a signature ID and a partition information corresponding to at least the first partitioned region and the second partitioned region in the preliminary storage card. | 04-07-2011 |
20110059628 | SECURE DIGITAL CARD WITH TWO MICRO-SD CARDS IN STRIPING DATA ACCESS - The present invention constructs a SD Flash card by plugging two micro-SD cards into a new apparatus that has the same form factor as a SD Flash card. In this new apparatus, there is a controller to bridge the two micro-SD cards of any SD interface speed type (DS, HS, UHS50 or UHS104) to UHS104. The controller performs striping access function to achieve almost double performance in sequential read/write throughput if it is not limited by the target SD interface speed. | 03-10-2011 |
20100332726 | STRUCTURE AND METHOD FOR MANAGING WRITING OPERATION ON MLC FLASH MEMORY - A method for managing a writing operation for a multi-level cell (MLC) nonvolatile memory by a host is provided. The MLC nonvolatile memory has a plurality of MLC blocks, each MLC cell of each MLC block can store multiple logical data bits. The method includes forming a turbo writing unit from the spare block pool; writing a data sent by the host to the turbo writing unit; and changing the role of the turbo writing unit into a turbo data unit. The turbo writing unit is formed with at least one of the MLC blocks, each MLC cell of the at least one of the MLC blocks stores a portion of the logical data bits the MLC cell is capable of storing. | 12-30-2010 |
20100330722 | CMOS MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND FABRICATION METHOD THEREOF - A method for fabricating the MEMS device includes providing a substrate. Then, a structural dielectric layer is formed over the substrate at a first side, wherein a diaphragm is embedded in the structural dielectric layer. The substrate is patterned from a second side to form a cavity in corresponding to the diaphragm and a plurality of venting holes in the substrate. An isotropic etching process is performed from the first side and the second side of the substrate via vent holes to remove a dielectric portion of the structural dielectric layer for exposing a central portion of the diaphragm while an end portion is held by a residue portion of the structural dielectric layer. | 12-30-2010 |
20100277229 | MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE WITH SENSTIVITY TRIMMING CIRCUIT AND TRIMMING PROCESS - A microelectromechanical system (MEMS) device includes a diaphragm capacitor, connected between a capacitor biasing voltage source and a ground. A source follower circuit is coupled to the diaphragm capacitor. An amplifier is coupled to the source follower circuit to amplify the voltage signal as an output voltage signal. A programmable trimming circuit is implemented with the amplifier to trim a gain or implemented with the capacitor biasing voltage source to trim voltage applied on the diaphragm capacitor. Whereby, the output voltage signal has a target sensitivity. | 11-04-2010 |
20100161857 | USB AUDIO CONTROLLER - An USB audio controller includes an USB interface unit, an audio interface unit, a storage interface unit, and a processing unit. The USB interface unit is used to connect to an USB bus for communicating with a host by a communication information. The audio interface unit is used to connect to at least one audio device for communicating with an audio signal. The storage interface unit is used to connect to a memory unit for communicating storage information. The processing unit is for processing the communicating information, storage information, or audio signal. | 06-24-2010 |
20100161856 | USB AUDIO AND MOBILE AUDIO SYSTEM USING USB AUDIO CONTROLLER - A USB audio controller includes an USB interface unit, an audio interface unit, a storage interface unit, and a processing unit. The USB interface unit is used to connect to a USB bus for communicating with a host by a communication information. The audio interface unit is used to connect to at least one audio device for communicating with an audio signal. The storage unit is used to connect to a memory unit for communicating storage information. The processing unit is for processing the communicating information and audio signal. | 06-24-2010 |
20100072561 | METHOD FOR FABRICATING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE - A micro-electro-mechanical system (MEMS) device includes a substrate, having a first side and second side, the second side has a cavity and a plurality of venting holes in the substrate at the second side with connection to the cavity. However, the cavity is included in option without absolute need. A structural dielectric layer has a dielectric structure and a conductive structure in the dielectric structure. The structural dielectric layer has a chamber in connection to the cavity by the venting holes. A suspension structure layer is formed above the chamber. An end portion is formed in the structural dielectric layer in fix position. A diaphragm has a first portion of the diaphragm fixed on the suspension structure layer while a second portion of the diaphragm is free without being fixed. | 03-25-2010 |
20100052082 | MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) PACKAGE AND METHOD FOR FORMING THE MEMS PACKAGE - A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber. | 03-04-2010 |
20090179233 | MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE - The present invention provides a MEMS device, be implemented on many MEMS device, such as MEMS microphone, MEMS speaker, MEMS accelerometer, MEMS gyroscope. The MEMS device includes a substrate. A dielectric structural layer is disposed over the substrate, wherein the dielectric structural layer has an opening to expose the substrate. A diaphragm layer is disposed over the dielectric structural layer, wherein the diaphragm layer covers the opening of the dielectric structural layer to form a chamber. A conductive electrode structure is adapted in the diaphragm layer and the substrate to store nonvolatile charges. | 07-16-2009 |
20090166772 | MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE AND PROCESS FOR FABRICATING THE SAME - A micro-electro-mechanical systems (MEMS) device includes a back-plate substrate, having an intended region formed with a plurality of perforating holes. A first structural dielectric layer, disposed on the back-plate substrate, wherein the dielectric layer having an opening above the intended region. An etching stop layer, disposed over the first structural dielectric layer. A second structural dielectric layer, formed over the back-plate substrate. The etching stop layer and the second structural dielectric layer form at least a part of a micro-machine diaphragm, and cover over the opening of the first structural dielectric layer to form a chamber between the micro-machine diaphragm and the back-plate substrate. | 07-02-2009 |
20090132770 | Data Cache Architecture and Cache Algorithm Used Therein - The present invention provides a data cache architecture interposed between a host and a flash memory, the data cache architecture comprising: a buffer memory, receiving data from the host; a memory controller, deploying the data in the buffer memory; and a data cache memory, controlled by the memory controller according to a cache algorithm. The data cache architecture and the cache algorithm used in the data cache architecture can be used to minimize the program/erase count of the NAND type flash device. | 05-21-2009 |
20090030535 | AUDIO PLAYBACK APPARATUS AND NETHID BASED ON A GENERAL SPI INTERFACE - An audio playback apparatus is based on a pre-defined data communication protocol, and communicating with an external host. The audio playback apparatus includes an audio playback engine, having a plurality of I/O pins based on the pre-defined data communication protocol for communicating with the external host. The pre-defined data communication protocol allows to transmit a communication information between the audio playback engine and the external host. In addition, an audio control command and an audio data stream defined in a pre-defined protocol are treated as the communication information between the audio playback engine and the external host. | 01-29-2009 |
20080225830 | CIRCUIT WITH GENERATING PHONE-CALL RING VIA COMPUTER SYSTEM AND INTERNET PHONE SYSTEM USING THE CIRCUIT - An internet phone system is implemented in a computer system, including an internet-phone software unit, for storing a software used by the computer system to operate as an internet phone. An audio-file storage software unit is for storing a plurality of audio files. A USB (Universal Serial Bus) audio interface software unit is coupled with the internet-phone software unit and the audio-file storage unit. A USB audio apparatus is coupled to the audio interface unit, and comprising at least a microphone and a speaker. Wherein, the USB audio interface unit stores a software for selecting one of the audio files to serve as the phone-call ring, and for driving the speaker in the USB audio apparatus by the computer system for generating ringing sound for an incoming call. | 09-18-2008 |