Semiconductor Technologies & Instruments Pte Ltd Patent applications |
Patent application number | Title | Published |
20150233840 | System and method for inspecting a wafer - An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions. | 08-20-2015 |
20150214085 | MULTIFUNCTION WAFER AND FILM FRAME HANDLING SYSTEM - A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame. | 07-30-2015 |
20120288353 | COMPONENT PANE HANDLER CONFIGURED TO HANDLE COMPONENT PANES OF MULTIPLE SIZES - A component pane handling apparatus configured to handle component panes of multiple different sizes is disclosed. The apparatus includes at least one component pane capture element that can be displaced between a number of different positions, each position corresponding to a particular component pane size. Therefore, the at least one component pane capture element can be positioned to different positions for allowing handling of component panes of corresponding sizes. The apparatus also includes a position alignment mechanism configured to control displacement of the at least one component pane capture element to the different positions. The apparatus can also include one displacement arm coupled to the component pane capture element. The displacement of the component pane capture element can be effectuated by a displacement of at least a portion of the displacement arm. A method for handling component panes of multiple sizes is also included in this disclosure. | 11-15-2012 |
20120288352 | SYSTEM AND METHOD USING MULTIPLE COMPONENT PANE HANDLERS CONFIGURED TO HANDLE AND TRANSFER COMPONENT PANES - A system and method for transferring component panes from a component pane storage station to a vacuum table assembly are disclosed. The system includes a number of component pane handlers, for instance two handlers, and a pick and place mechanism or arm. The handler transfers the component panes from the station to the mechanism. The system includes an alignment module configured to facilitate spatial alignment of the component pane while the component pane is coupled to the handler. The module can be carried by the mechanism. Spatial alignment of the component pane can be substantially completed before transfer of the component pane from the handler to the mechanism. The mechanism includes a set of vacuum elements or pads that enables pick up of the component pane from the handler as well as release and pick up of the component pane at the vacuum table assembly. | 11-15-2012 |
20100232915 | Apparatus For Handling A Semiconductor Component - An apparatus for handling or transferring a semiconductor component. The apparatus comprises a first structure and a second structure coupled thereto. The first structure and the second structure define a vacuum chamber therebetween. The second structure comprises at least one module coupled thereto. Each module comprises a passageway defined therethrough. Vacuum is applied through the passageway for facilitating pick up of the semiconductor component at a first position and for securing the semiconductor component to the module during displacement of the module from the first position to a second position. The apparatus comprises a plunger. Displacement of the plunger from a retracted position to an extended position impedes fluid communication between the passageway of the module and the chamber. Displacement of the plunger to the extended position further causes purging of air through the passageway of the module to thereby detach the semiconductor component from the module. A method for transferring the semiconductor component using the apparatus is also provided by the present invention. | 09-16-2010 |
20100189339 | System and method for inspecting a wafer - A method for inspecting a wafer. The method comprises a training process for creating reference images. The training process comprises capturing a number of images of a first wafer of unknown quality, each of the number of images of the first wafer being captured at a predetermined contrast illumination and each of the number of images of the first wafer comprising a plurality of pixels. The training process also comprises determining a plurality of reference intensities for each of the plurality of pixels of each of the number of images of the first wafer, calculating a plurality of statistical parameters for the plurality of reference intensities of each of the plurality of pixels of each of the number of images of the first wafer, and selecting a plurality of reference images from the plurality of images of the first wafer based on the calculated plurality of statistical parameters. The method for inspecting the wafer further comprises capturing an image of a second wafer, the second wafer being of an unknown quality, selecting a first reference image from the plurality of reference images, and comparing the captured image of the second wafer with the first reference image to thereby determine at least one of presence and type of defect on the second wafer. | 07-29-2010 |
20100188499 | System and method for inspecting a wafer - A method and a system for inspecting a wafer. The system comprises an optical inspection head, a wafer table, a wafer stack, a XY table and vibration isolators. The optical inspection head comprises a number of illuminators, image capture devices, objective lens and other optical components. The system and method enables capture of brightfield images, darkfield images, 3D profile images and review images. Captured images are converted into image signals and transmitted to a programmable controller for processing. Inspection is performed while the wafer is in motion. Captured images are compared with reference images for detecting defects on the wafer. An exemplary reference creation process for creating reference images and an exemplary image inspection process is also provided by the present invention. The reference image creation process is an automated process. | 07-29-2010 |
20100188486 | System and method for inspecting a wafer - An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions. | 07-29-2010 |