SEMICAPS PTE LTD Patent applications |
Patent application number | Title | Published |
20160093554 | METHOD AND APPARATUS FOR COOLING A SEMICONDUCTOR DEVICE - A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements. | 03-31-2016 |
20130241587 | WAFER STAGE - A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe. | 09-19-2013 |
20100321678 | SOLID IMMERSION LENS OPTICS ASSEMBLY - A solid immersion lens optics assembly, a test station for probing and testing of integrated circuits on a semiconductor wafer, and a method of landing a SIL on an object. The optics assembly comprises an objective lens housing for receiving an objective lens, and a solid immersion lens (SIL) housing for mounting an SIL and adapted for connection to the objective lens housing; wherein a peripheral wall of the SIL housing comprises an integrated spring section adapted to provide a biased support for the SIL. | 12-23-2010 |
20100315617 | WAFER STAGE - A wafer stage and a method of supporting a wafer for inspection. the wafer stage comprises a platform for supporting a wafer such that a backside of the wafer is suspended above a cavity of the platform; and a support structure disposed substantially within the cavity for supporting a portion of the wafer; wherein the wafer stage is adapted for relative movement of the platform with respect to the support structure for alignment of the wafer with respect to a probe. | 12-16-2010 |
20100156451 | METHOD AND SYSTEM FOR MEASURING LASER INDUCED PHENOMENA CHANGES IN A SEMICONDUCTOR DEVICE - A method and system for measuring laser induced phenomena changes of at least one of a resistance, a capacitance and an inductance in a semiconductor device. The method comprises applying a biasing voltage from an emitter-follower circuit to a device under test (DUT); inducing said changes in the DUT; and measuring a voltage change in a collector portion of the emitter-follower circuit as a measure for said changes. | 06-24-2010 |
20090119042 | METHOD OF TESTING AN ELECTRONIC CIRCUIT AND APPARATUS THEREOF - A method of testing an electronic circuit is provided. The method comprises radiating a laser beam onto the electronic circuit, and determining a plurality of samples of a response signal output by the electronic circuit during the period when the laser beam is radiated. The method further comprises accumulating the plurality of samples to generate a value, and generating a test result based on the value. | 05-07-2009 |