SAPA PROFILES, INC.
|SAPA PROFILES, INC. Patent applications|
|Patent application number||Title||Published|
|20100230162||EXTRUDED FRAME STRUCTURES TO HOUSE A CONDUCTOR - Embodiments of the present disclosure provide extruded frame structures to house a conductor and associated techniques and configurations. An apparatus includes an extruded frame structure having a frame profile configured to house a conductor and insulator. Other embodiments may be described and/or claimed.||09-16-2010|