SANKYO KASEI CO., LTD.
SANKYO KASEI CO., LTD. Patent applications | ||
Patent application number | Title | Published |
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20120107522 | METHOD FOR PRODUCING FORMED CIRCUIT COMPONENT - Disclosed is a method for producing a formed circuit component, wherein the surface of a substrate is roughened by being irradiated with laser ray instead of being etched using a chemical agent, thereby assuring sufficient adhesive strength with an electroless plating. Specifically disclosed is a method for producing a formed circuit component, which comprises: a first step of forming a substrate ( | 05-03-2012 |