PI R&D CO., LTD.
|PI R&D CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20150249251||CONDUCTIVE AGENT FOR BATTERY ELECTRODE, ELECTRODE CONTAINING THE SAME, AND BATTERY - Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a π-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.||09-03-2015|
|20130310482||POLYIMIDE RESIN COMPOSITION FOR USE IN FORMING REVERSE REFLECTING LAYER IN PHOTOVOLTAIC CELL AND METHOD OF FORMING REVERSE REFLECTING LAYER IN PHOTOVOLTAIC CELL USED THEREWITH - Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.||11-21-2013|
|20130233381||POLYIMIDE RESIN COMPOSITION FOR USE IN FORMING INSULATION FILM IN PHOTOVOLTAIC CELL AND METHOD OF FORMING INSULATION FILM IN PHOTOVOLTAIC CELL USED THEREWITH - Disclosed is a polyimide resin composition for forming an insulation layer in a solar cell, which has an optimal rheological characteristics for screen printing and the like, which has an improved wetting property with various coating substrates, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a predetermined area. A method of forming an insulation layer in a solar cell and a solar cell having the insulation layer formed by this method are also disclosed. The polyimide resin composition for forming an insulation layer in a solar cell contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a heat-resistant polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.||09-12-2013|
|20130224653||CROSSLINKED POLYIMIDE, COMPOSITION COMPRISING THE SAME AND METHOD FOR PRODUCING THE SAME - A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.||08-29-2013|
|20120189859||RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD - The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 μm to 3.0 μm and a lightness value of not more than 30 on one surface of an electrolytic copper foil, and form a layer of a resin composition containing a block copolymerized polyimide resin having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.||07-26-2012|
|20120097439||MODIFIED POLYIMIDE AND METHOD FOR PRODUCING MODIFIED POLYIMIDE - The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof. According to the method in which an isocyanate-terminated oligomer comprising a polycarbonate component having excellent flexibility is allowed to react with a tetracarboxylic dianhydride to synthesize a tetracarboxylic dianhydride oligomer comprising the polycarbonate component and the thus obtained oligomer is then further allowed to react with an aromatic diamine and aromatic tetracarboxylic dianhydride to produce a polyimide block copolymer, by selecting the aromatic diamine from a wide range of selectable aromatic diamines, an excellent modified polyimide satisfying all of the above-described various characteristics can be produced.||04-26-2012|
|20120097435||PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF - Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.||04-26-2012|
|20110189540||CONDUCTIVE AGENT FOR BATTERY ELECTRODE, ELECTRODE CONTAINING THE SAME, AND BATTERY - Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a π-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.||08-04-2011|
|20090267239||POSITIVE PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition comprising parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more armatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.||10-29-2009|
Patent applications by PI R&D CO., LTD.