Optoelectronics Systems Consulting, Inc. Patent applications |
Patent application number | Title | Published |
20140353791 | Miniaturized Implantable Sensor Platform having Multiple Devices and Sub-Chips - This invention describes a hermetically sealed package which can be implanted in the body. The package comprise of stacked substrates where surface of one substrate hosts biosensors which are exposed to body fluids to monitor concentrations of substances selected from analytes, metabolites, and proteins, and body physiological parameters. The structure protects from body fluids devices that interface with the biosensor electrodes for electronic data processing, powering, and wireless communication. Biosensor electrodes are electrically connected to various electronic, optoelectronic, MEM devices using novel partial silicon vias (PSVs) that prevents leakage of body fluids. Various devices are located on different substrates which are stacked to save surface area. One of the substrate forms the cover plate which permits light for powering as well as sending receiving coded data including the analyte levels. | 12-04-2014 |
20130320476 | Miniaturized Implantable Sensor Platform Having Multiple Devices and Sub-Chips - An implantable, miniaturized platform and a method for fabricating the platform is provided, where the e platform includes a top cover plate and a bottom substrate, top cover plate including an epitaxial, Si-encased substrate and is configured to include monolithically grown devices and device contact pads, the Si-encased substrate cover plate including a gold perimeter fence deposited on its Si covered outer rim and wherein the bottom substrate is constructed of Si and includes a plurality of partial-Si-vias (PSVs), electronic integrated circuits, device pads, pad interconnects and a gold perimeter fence, wherein the device pads are aligned with a respective device contact pad on the top cover plate and includes gold bumps having a predetermined height, the top cover plate and the bottom substrate being flip-chip bonded to provide a perimeter seal and to ensure electrical connectivity between the plurality of internal devices and at least one external component. | 12-05-2013 |